SEMICONDUCTOR TECHNICAL DATA High-Performance Silicon-Gate CMOS The MC74HC151 is identical in pinout to the LS151. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device selects one of the eight binary Data Inputs, as determined by the Address Inputs. The Strobe pin must be at a low level for the selected data to appear at the outputs. If Strobe is high, the Y output is forced to a low level and the Y output is forced to a high level. The HC151 is similar in function to the HC251 which has 3-state outputs. N SUFFIX PLASTIC PACKAGE CASE 648-08 16 1 1 * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 132 FETs or 33 Equivalent Gates ORDERING INFORMATION MC74HCXXXN MC74HCXXXD DATA INPUTS 4 D1 3 D2 2 D3 1 5 Y 6 Y 1 16 D2 2 15 VCC D4 D1 3 14 D5 D0 4 13 D6 Y 5 12 D7 Y 6 11 A0 STROBE 7 10 A1 GND 8 9 A2 FUNCTION TABLE Inputs Outputs A2 A1 A0 Strobe Y Y X L L L L H H H H X L L H H L L H H X L H L H L H L H H L L L L L L L L L D0 D1 D2 D3 D4 D5 D6 D7 H D0 D1 D2 D3 D4 D5 D6 D7 A0 11 10 A1 A2 9 STROBE D3 DATA OUTPUTS D4 15 D5 14 D6 13 D7 12 ADDRESS INPUTS Plastic SOIC PIN ASSIGNMENT LOGIC DIAGRAM D0 D SUFFIX SOIC PACKAGE CASE 751B-05 16 7 PIN 16 = VCC PIN 8 = GND D0, D1, ..., D7 = the level of the respective D input. 10/95 Motorola, Inc. 1995 1 REV 6 IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIII IIIIII III IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIII IIIIII III IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII MC74HC151 MAXIMUM RATINGS* Symbol VCC Parameter DC Supply Voltage (Referenced to GND) Value Unit - 0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) - 1.5 to VCC + 1.5 V Vout DC Output Voltage (Referenced to GND) - 0.5 to VCC + 0.5 V DC Input Current, per Pin 20 mA Iout DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 50 mA PD Power Dissipation in Still Air 750 500 mW Tstg Storage Temperature - 65 to + 150 _C Iin TL Plastic DIP SOIC Package This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. v v _C Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) 260 * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII IIIIII IIIIIIIIIIIIIII IIIIIIIIIIIII IIIIIIIII IIII IIIIIIIIIIIIII IIIIII IIIIII IIIIIIIII IIIIIIIIIIIII IIIIIIIII IIII IIII IIII III IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII III IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII III v v IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII v IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII v IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) Min Max Unit 2.0 6.0 V 0 VCC V - 55 + 125 _C 0 0 0 1000 500 400 ns DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V - 55 to 25_C 85_C 125_C Unit VIH Minimum High-Level Input Voltage Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low-Level Input Voltage Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 V Minimum High-Level Output Voltage Vin = VIH or VIL |Iout| 20 A 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 VOH Vin = VIH VOL Maximum Low-Level Output Voltage |Iout| |Iout| Vin = VIH or VIL |Iout| 20 A Vin = VIH or VIL |Iout| |Iout| Iin ICC 4.0 mA 5.2 mA 4.0 mA 5.2 mA V Maximum Input Leakage Current Vin = VCC or GND 6.0 0.1 1.0 1.0 A Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 A 6.0 8 80 160 A NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). MOTOROLA 2 High-Speed CMOS Logic Data DL129 -- Rev 6 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII III IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII III IIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII v IIII v III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII MC74HC151 AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Guaranteed Limit VCC V - 55 to 25_C 85_C 125_C tPLH, tPHL Maximum Propagation Delay, Input D to Output Y or Y (Figures 1, 3 and 6) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns tPLH, tPHL Maximum Propagation Delay, Input A to Output Y or Y (Figures 2 and 6) 2.0 4.5 6.0 205 41 35 255 51 43 310 62 53 ns tPLH, tPHL Maximum Propagation Delay, Strobe to Output Y or Y (Figures 4, 5 and 6) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 6) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Maximum Input Capacitance -- 10 10 10 pF Symbol Cin Parameter Unit NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Package)* 36 pF * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). PIN DESCRIPTIONS INPUTS Strobe (Pin 7) D0, D1, ... , D7 (Pins 4, 3, 2, 1, 15, 14, 13, 12) Data inputs. Data on any one of these eight binary inputs may be selected to appear on the output. Strobe. This input pin must be at a low level for the selected data to appear at the outputs. If the Strobe pin is high, the Y output is forced to a low level and the Y output is forced to a high level. CONTROL INPUTS OUTPUTS A0, A1, A2 (Pins 11, 10, 9) Y, Y (Pins 5, 6) Address inputs. The data on these pins are the binary address of the selected input (see the Function Table). Data outputs. The selected data is presented at these pins in both true (Y output) and complemented (Y output) forms. High-Speed CMOS Logic Data DL129 -- Rev 6 3 MOTOROLA MC74HC151 SWITCHING WAVEFORMS tr tf VALID 90% 50% 10% INPUT D VCC 50% INPUT A GND GND tPLH tPLH tPHL 90% 50% 10% OUTPUT Y tPHL OUTPUT Y OR Y 50% tTHL tTLH Figure 1. Figure 2. tr tf tf VCC 90% 50% 10% INPUT D VALID VCC GND tPLH tPLH 90% 50% 10% OUTPUT Y VCC 90% STROBE 50% 10% GND tPHL tPHL 90% 50% 10% Y tTHL tr tTLH tTLH tTHL Figure 4. Figure 3. TEST POINT tr tf VCC 90% 50% STROBE 10% GND tPHL Y OUTPUT DEVICE UNDER TEST tPLH 90% 50% 10% tTHL CL* tTLH * Includes all probe and jig capacitance Figure 5. MOTOROLA Figure 6. Test Circuit 4 High-Speed CMOS Logic Data DL129 -- Rev 6 MC74HC151 EXPANDED LOGIC DIAGRAM D0 D1 4 3 D2 2 D3 1 DATA INPUTS 5 Y D4 15 6 Y D5 14 DATA OUTPUTS D6 13 D7 12 A0 11 ADDRESS INPUTS A1 10 A2 STROBE 9 7 High-Speed CMOS Logic Data DL129 -- Rev 6 5 MOTOROLA MC74HC151 OUTLINE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R -A - 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S -T - SEATING PLANE K H D 16 PL 0.25 (0.010) M M J G T A M D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -A - 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B - 1 P 8 PL 0.25 (0.010) 8 M B M G K F R X 45 C -T SEATING - PLANE J M D 16 PL 0.25 (0.010) M T B S A S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0 0 10 10 0.020 0.040 0.51 1.01 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MOTOROLA CODELINE 6 *MC74HC151/D* MC74HC151/D High-Speed CMOS Logic Data DL129 -- Rev 6