Copyright © 2003, Texas Instruments Incorporated
Data sheet acquired from Harris Semiconductor
SCHS109B – Revised June 2003
The CD4059A-series types are supplied in
24-lead dual-in-line plastic packages
(E suffix), and 24-lead small-outline
packages (M and M96 suffixes).
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CD4059AD3 ACTIVE CDIP SB JD 24 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 CD4059AD/3
CD4059AE ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4059AE
CD4059AEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4059AE
CD4059AM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4059AM
CD4059AME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4059AM
CD4059AMG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4059AM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4059A, CD4059A-MIL :
Catalog: CD4059A
Military: CD4059A-MIL
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
N (R–PDIP–T24) PLASTIC DUAL–IN–LINE
0.020 (0,51) MIN
0.021 (0,53)
0.015 (0,38)
0.100 (2,54)
1
24
0.070 (1,78) MAX 12
13
1.222 (31,04) MAX
0.125 (3,18) MIN
0’–15’
0.010 (0,25) NOM
0.425 (10,80) MAX
Seating Plane
0.200 (5,08) MAX
0.360 (9,14) MAX
0.010 (0,25)
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
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