Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX53IEC
Rev. 4, 11/2011
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 2
© 2011 Freescale Semiconductor, Inc. All rights reserved.
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
1 Introduction
The i.MX53 processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 800 MHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories.
The flexibility of the i.MX53 architecture allows for its
use in a wide variety of applications. As the heart of the
application chipset, the i.MX53 processor provides all
the interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, hard drive, camera sensors,
and dual displays.
Features of the i.MX53 processor include the following:
Applications processor—The i.MX53xD
processors boost the capabilities of high-tier
portable applications by satisfying the ever
increasing MIPS needs of operating systems and
games. Freescale’s Dynamic Voltage and
Frequency Scaling (DVFS) provides significant
power reduction, allowing the device to run at
lower voltage and frequency with sufficient
MIPS for tasks such as audio decode.
i.MX53 Applications
Processors for Industrial
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16
4.2. Power Supply Requirements and Restrictions . . . 22
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4. Output Buffer Impedance Characteristics . . . . . . 32
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43
4.7. External Peripheral Interfaces Parameters . . . . . . 65
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144
6. Package Information and Contact Assignments . . . . . 145
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 164
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
i.MX53 Applications Processors for Industrial Products, Rev. 4
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Multilevel memory system—The multilevel memory system of the i.MX53 is based on the L1
instruction and data caches, L2 cache, internal and external memory. The i.MX53 supports many
types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3, NOR
Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND
including eMMC up to rev 4.4.
Smart speed technology—The i.MX53 device has power management throughout the IC that
enables the rich suite of multimedia features and peripherals to consume minimum power in both
active and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product requiring levels of power far lower than industry expectations.
Multimedia powerhouse—The multimedia performance of the i.MX53 processor ARM core is
boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision
floating point support) and vector floating point coprocessors. The system is further enhanced by
a multi-standard hardware video codec, autonomous image processing unit (IPU), and a
programmable smart DMA (SDMA) controller.
Powerful graphics acceleration— The i.MX53 processors provide two independent, integrated
graphics processing units: an OpenGL® ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s,
and 800 Mpix/s z-plane performance) and an OpenVG™ 1.1 2D graphics accelerator
(200 Mpix/s).
Interface flexibility—The i.MX53 processor supports connection to a variety of interfaces,
including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go
with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed
MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces
(PATA, UART, I2C, and I2S serial audio, among others).
Advanced security—The i.MX53 processors deliver hardware-enabled security features that
enable secure e-commerce, digital rights management (DRM), information encryption, secure
boot, and secure software downloads. For detailed information about the i.MX53 security features
contact a Freescale representative.
The i.MX53 application processor is a follow-on to the i.MX51, with improved performance, power
efficiency, and multimedia capabilities.
1.1 Ordering Information
Table 1 provides ordering information.
Table 1. Ordering Information
Part Number1
1Part numbers with a PC prefix indicate non production engineering parts.
Mask Set Features Notes Package2
2Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3.
MCIMX537CVV8C N78C 800 MHz, full feature set 19 x 19 mm, 0.8 mm pitch BGA
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1.2 Features
The i.MX53 multimedia applications processor (AP) is based on the ARM Platform, which has the
following features:
MMU, L1 instruction and L1 data cache
Unified L2 cache
Maximum frequency of the core (including Neon, VFPv3 and L1 cache): 800 MHz
Neon coprocessor (SIMD media processing architecture) and vector floating point (VFP-Lite)
coprocessor supporting VFPv3
The memory system consists of the following components:
Level 1 cache:
Instruction (32 Kbyte)
Data (32 Kbyte)
Level 2 cache:
Unified instruction and data (256 Kbyte)
Level 2 (internal) memory:
Boot ROM, including HAB (64 Kbyte)
Internal multimedia/shared, fast access RAM (128 Kbyte)
Secure/non-secure RAM (16 Kbyte)
External memory interfaces:
16/32-bit DDR2-800, LV-DDR2-800 or DDR3-800 up to 2 Gbyte
32-bit LPDDR2
8/16-bit NAND SLC/MLC Flash, up to 66 MHz, 4/8/14/16-bit ECC
8/16-bit NOR Flash, PSRAM, and cellular RAM.
32-bit multiplexed mode NOR Flash, PSRAM & cellular RAM.
8-bit Asynchronous (DTACK mode) EIM interface.
All EIM pins are muxed on other interfaces (data with NFC pins). I/O muxing logic selects EIM
port, as primary muxing at system boot.
Samsung OneNAND™ and managed NAND including eMMC up to rev 4.4 (in muxed I/O
The i.MX53 system is built around the following system on chip interfaces:
64-bit AMBA AXI v1.0 bus—used by ARM platform, multimedia accelerators (such as VPU, IPU,
GPU3D, GPU2D) and the external memory controller (EXTMC) operating at 200 MHz.
32-bit AMBA AHB 2.0 bus—used by the rest of the bus master peripherals operating at 133 MHz.
32-bit IP bus—peripheral bus used for control (and slow data traffic) of the most system peripheral
devices operating at 66 MHz.
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The i.MX53 makes use of dedicated hardware accelerators to achieve state-of-the-art multimedia
performance. The use of hardware accelerators provides both high performance and low power
consumption while freeing up the CPU core for other tasks.
The i.MX53 incorporates the following hardware accelerators:
VPU, version 3—video processing unit
GPU3D—3D graphics processing unit, OpenGL ES 2.0, version 3, 33 Mtri/s, 200 Mpix/s, and
800 Mpix/s z-plane performance, 256 Kbyte RAM memory
GPU2D—2D graphics accelerator, OpenVG 1.1, version 1, 200 Mpix/s performance,
IPU, version 3M—image processing unit
ASRC—asynchronous sample rate converter
The i.MX53 includes the following interfaces to external devices:
Not all interfaces are available simultaneously, depending on I/O
multiplexer configuration.
Hard disk drives:
PATA, up to U-DMA mode 5, 100 MByte/s
SATA I, 1.5 Gbps
Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/s, 24 bpp. Up to two
interfaces may be active at once.
Two parallel 24-bit display ports. The primary port is up to 165 Mpix/s (for example,
UXGA at 60 Hz).
LVDS serial ports: one dual channel port up to 165 Mpix/s or two independent single channel
ports up to 85 MP/s (for example, WXGA at 60 Hz) each.
TV-out/VGA port up to 150 Mpix/s (for example, 1080p60).
Camera sensors:
Two parallel 20-bit camera ports. Primary up to 180-MHz peak clock frequency, secondary up
to 120-MHz peak clock frequency.
Expansion cards:
Four SD/MMC card ports: three supporting 416 Mbps (8-bit i/f) and one enhanced port
supporting 832 Mbps (8-bit, eMMC 4.4).
High-speed (HS) USB 2.0 OTG (up to 480 Mbps), with integrated HS USB PHY
Three USB 2.0 (480 Mbps) hosts:
High-speed host with integrated on-chip high-speed PHY
Two high-speed hosts for external HS/FS transceivers through ULPI/serial, support IC-USB
Miscellaneous interfaces:
One-wire (OWIRE) port
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Three I2S/SSI/AC97 ports, supporting up to 1.4 Mbps, each connected to audio multiplexer
(AUDMUX) providing four external ports.
Five UART RS232 ports, up to 4.0 Mbps each. One supports 8-wire, the other four support
Two high speed enhanced CSPI (ECSPI) ports plus one CSPI port
Three I2C ports, supporting 400 kbps
Fast Ethernet controller, IEEE1588 V1 compliant, 10/100 Mbps
Sony Phillips Digital Interface (SPDIF), Rx and Tx
Key pad port (KPP)
Two pulse-width modulators (PWM)
GPIO with interrupt capabilities
The system supports efficient and smart power control and clocking:
Supporting DVFS (dynamic voltage and frequency scaling) technique for low power modes
Power gating SRPG (State Retention Power Gating) for ARM core and Neon
Support for various levels of system power modes
Flexible clock gating control scheme
On-chip temperature monitor
On-chip oscillator amplifier supporting 32.768 kHz external crystal
On-chip LDO voltage regulators for PLLs
Security functions are enabled and accelerated by the following hardware:
ARM TrustZone including the TZ architecture (separation of interrupts, memory mapping, and so
Secure JTAG controller (SJC)—Protecting JTAG from debug port attacks by regulating or blocking
the access to the system debug features
Secure real-time clock (SRTC)—Tamper resistant RTC with dedicated power domain and
mechanism to detect voltage and clock glitches
Real-time integrity checker, version 3 (RTICv3)—RTIC type1, enhanced with SHA-256 engine
SAHARAv4 Lite—Cryptographic accelerator that includes true random number generator
Security controller, version 2 (SCCv2)—Improved SCC with AES engine, secure/non-secure
RAM and support for multiple keys as well as TZ/non-TZ separation
Central security unit (CSU)—Enhancement for the IIM (IC Identification Module). CSU is
configured during boot by e-fuses, and determines the security level operation mode as well as the
TrustZone (TZ) policy
Advanced High Assurance Boot (A-HAB)—HAB with the following embedded enhancements:
SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization
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Architectural Overview
The actual feature set depends on the part number as described in Table 1.
Functions such as video hardware acceleration with 2D and 3D hardware
graphics acceleration may not be enabled for specific part numbers.
2 Architectural Overview
The following subsections provide an architectural overview of the i.MX53 processor system.
2.1 Block Diagram
Figure 1 shows the functional modules in the i.MX53 processor system.
Figure 1. i.MX53 System Block Diagram
Application Processor
Smart DMA
Shared Peripherals
AP Peripherals
ARM Cortex A8
ARM Cortex A8
UART (4)
PWM (2)
EPIT (2)
GPIOx32 (7)
WDOG (2)
SSI (2)
Fuse Box
Image Processing
3 HS Ports
Memory I/F
144 KB
Domain (AP)
Composite CVBS/ S-Video
Component RGB, YCC
(HD TV-Out / VGA)
Neon, VFPv3
L2 cache 256 KB
L1 I/D cache
Keypad Access.
FlexCAN (2)
CAN i/f
eSDHCv2 (3)
Proc. Unit
3D Graphics
Proc. Unit
256 KB
2D Graphics
Proc. Unit
AXI and AHB Switch Fabric
Battery Ctrl
64 KB
Clock and Reset
PLL (4)
CAMP (2)
Display (2)
+ Temp Mon
Modules List
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The numbers in brackets indicate number of module instances. For example,
PWM (2) indicates two separate PWM peripherals.
3 Modules List
The i.MX53 processor contains a variety of digital and analog modules. Table 2 describes these modules
in alphabetical order.
Table 2. i.MX53 Digital and Analog Blocks
Mnemonic Block Name Subsystem Brief Description
ARM ARM Platform ARM The ARM CortexTM A8 platform consists of the ARM processor version r2p5
(with TrustZone) and its essential sub-blocks. It contains the 32 Kbyte L1
instruction cache, 32 Kbyte L1 data cache, Level 2 cache controller and a
256 Kbyte L2 cache. The platform also contains an event monitor and
debug modules. It also has a NEON coprocessor with SIMD media
processing architecture, a register file with 32/64-bit general-purpose
registers, an integer execute pipeline (ALU, Shift, MAC), dual
single-precision floating point execute pipelines (FADD, FMUL), a
load/store and permute pipeline and a non-pipelined vector floating point
(VFP Lite) coprocessor supporting VFPv3.
ASRC Asynchronous
Sample Rate
The asynchronous sample rate converter (ASRC) converts the sampling
rate of a signal associated to an input clock into a signal associated to a
different output clock. The ASRC supports concurrent sample rate
conversion of up to 10 channels of about -120 dB THD+N. The sample rate
conversion of each channel is associated to a pair of incoming and outgoing
sampling rates. The ASRC supports up to three sampling rate pairs.
AUDMUX Digital Audio
The AUDMUX is a programmable interconnect for voice, audio, and
synchronous data routing between host serial interfaces (for example,
SSI1, SSI2, and SSI3) and peripheral serial interfaces (audio and voice
codecs). The AUDMUX has seven ports (three internal and four external)
with identical functionality and programming models. A desired connectivity
is achieved by configuring two or more AUDMUX ports.
Clock Amplifier Clocks,
Resets, and
Power Control
Clock amplifier
Clock Control
Global Power
System Reset
Resets, and
Power Control
These modules are responsible for clock and reset distribution in the
system, as well as for system power management.
The system includes four PLLs.
SPI, Enhanced
Full-duplex enhanced synchronous serial interface, with data rates
16-60 Mbit/s. It is configurable to support master/slave modes. In Master
mode it supports four slave selects for multiple peripherals.
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Modules List
CSU Central Security
Security The central security unit (CSU) is responsible for setting comprehensive
security policy within the i.MX53 platform, and for sharing security
information between the various security modules. The security control
registers (SCR) of the CSU are set during boot time by the high assurance
boot (HAB) code and are locked to prevent further writing.
DEBUG Debug System System
The debug system provides real-time trace debug capability of both
instructions and data. It supports a trace protocol that is an integral part of
the ARM Real Time Debug solution (RealView).
Real-time tracing is controlled by specifying a set of triggering and filtering
resources, which include address and data comparators, three
cross-system triggers (CTI), counters, and sequencers.
debug access port (DAP)— The DAP provides real-time access for the
debugger without halting the core to system memory, peripheral register,
debug configuration registers and JTAG scan chains.
EXTMC External Memory
The EXTMC is an external and internal memory interface. It performs
arbitration between multi-AXI masters to multi-memory controllers, divided
into four major channels, fast memories (DDR2/DDR3/LPDDR2) channel,
slow memories (NOR-FLASH / PSRAM / NAND-FLASH etc.) channel,
internal memory (RAM, ROM) channel and graphical memory (GMEM)
In order to increase the bandwidth performance, the EXTMC separates the
buffering and the arbitration between different channels so parallel
accesses can occur. By separating the channels, slow accesses do not
interfere with fast accesses.
EXTMC Features:
64-bit and 32-bit AXI ports
Enhanced arbitration scheme for fast channel, including dynamic master
priority, and taking into account which pages are open or closed and
what type (read or write) was the last access
Flexible bank interleaving
Support 16/32-bit DDR2-800 or DDR3-800 or LPDDR2.
Support up to 2 GByte DDR memories.
Support NFC, EIM signal muxing scheme.
Support 8/16/32-bit Nor-Flash/PSRAM memories (sync and async
operating modes), at slow frequency. (8-bit is not supported on
Support 4/8/14/16-bit ECC, page sizes of 512-B, 2-KB and 4-KB
Nand-Flash (including MLC)
Multiple chip selects (up to 4).
Enhanced DDR memory controller, supporting access latency hiding
Support watermark for security (internal and external memories)
Periodic Interrupt
Each EPIT is a 32-bit “set and forget” timer that starts counting after the
EPIT is enabled by software. It is capable of providing precise interrupts at
regular intervals with minimal processor intervention. It has a 12-bit
prescaler for division of input clock frequency to get the required time
setting for the interrupts to occur, and counter values can be programmed
on the fly.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
Modules List
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ESAI Enhanced Serial
Audio Interface
The enhanced serial audio interface (ESAI) provides a full-duplex serial port
for serial communication with a variety of serial devices, including
industry-standard codecs, SPDIF transceivers, and other processors.
The ESAI consists of independent transmitter and receiver sections, each
section with its own clock generator.
The ESAI has 12 pins for data and clocking connection to external devices.
ESDHCV3-3 Ultra-High-
Speed eMMC /
SD Host
Ultra high-speed eMMC / SD host controller, enhanced to support eMMC
4.4 standard specification, for 832 MBps.
Port 3 is specifically enhanced to support eMMC 4.4 specification, for
double data rate (832 Mbps, 8-bit port).
ESDHCV3 is backward compatible to ESDHCV2 and supports all the
features of ESDHCV2 as described below.
Multi-Media Card
Secure Digital
Host Controller
Enhanced multimedia card / secure digital host controller
Ports 1, 2, and 4 are compatible with the “MMC System Specification”
version 4.3, full support and supporting 1, 4 or 8-bit data.
The generic features of the eSDHCv2 module, when serving as SD / MMC
host, include the following:
Can be configured either as SD / MMC controller
Supports eSD and eMMC standard, for SD/MMC embedded type cards
Conforms to SD Host Controller Standard Specification, version 2.0, full
Compatible with the SD Memory Card Specification, version 1.1
Compatible with the SDIO Card Specification, version 1.2
Designed to work with SD memory, miniSD memory, SDIO, miniSDIO,
SD Combo, MMC and MMC RS cards
Configurable to work in one of the following modes:
—SD/SDIO 1-bit, 4-bit
—MMC 1-bit, 4-bit, 8-bit
Full/high speed mode.
Host clock frequency variable between 32 kHz to 52 MHz
Up to 200 Mbps data transfer for SD/SDIO cards using 4 parallel data
Up to 416 Mbps data transfer for MMC cards using 8 parallel data lines
FEC Fast Ethernet
The Ethernet media access controller (MAC) is designed to support both
10 Mbps and 100 Mbps Ethernet/IEEE Std 802.3™ networks. An external
transceiver interface and transceiver function are required to complete the
interface to the media.
The i.MX53 also consists of HW assist for IEEE1588™ standard. See, TSU
and CE_RTC (IEEE1588) section for more details.
FIRI Fast Infrared
Fast infrared interface
Controller Area
The controller area network (CAN) protocol was primarily, but not
exclusively, designed to be used as a vehicle serial data bus. Meets the
following specific requirements of this application: real-time processing,
reliable operation in the EXTMC environment of a vehicle,
cost-effectiveness and required bandwidth. The FLEXCAN is a full
implementation of the CAN protocol specification, Version 2.0 B (ISO
11898), which supports both standard and extended message frames at
1 Mbps.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
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Modules List
General Purpose
I/O Modules
These modules are used for general purpose input/output to external ICs.
Each GPIO module supports up to 32 bits of I/O.
GPT General Purpose
Each GPT is a 32-bit “free-running” or “set and forget” mode timer with a
programmable prescaler and compare and capture register. A timer counter
value can be captured using an external event, and can be configured to
trigger a capture event on either the leading or trailing edges of an input
pulse. When the timer is configured to operate in “set and forget” mode, it is
capable of providing precise interrupts at regular intervals with minimal
processor intervention. The counter has output compare logic to provide the
status and interrupt at comparison. This timer can be configured to run
either on an external clock or on an internal clock.
GPU3D Graphics
Processing Unit
The GPU, version 3, provides hardware acceleration for 2D and 3D
graphics algorithms with sufficient processor power to run desk-top quality
interactive graphics applications on displays up to HD1080 resolution. It
supports color representation up to 32 bits per pixel. GPU enables
high-performance mobile 3D and 2D vector graphics at rates up to 33
Mtriangles/s, 200 Mpix/s, 800 Mpix/s (z).
GPU2D Graphics
The GPU2D version 1, provides hardware acceleration for 2D graphic
algorithms with sufficient processor power to run desk-top quality
interactive graphics applications on displays up to HD1080 resolution.
I2C Controller Connectivity
I2C provides serial interface for controlling peripheral devices. Data rates of
up to 400 kbps are supported.
IIM IC Identification
Security The IC identification module (IIM) provides an interface for reading,
programming, and/or overriding identification and control information stored
in on-chip fuse elements. The module supports electrically programmable
poly fuses (e-Fuses). The IIM also provides a set of volatile
software-accessible signals that can be used for software control of
hardware elements not requiring non-volatility. The IIM provides the primary
user-visible mechanism for interfacing with on-chip fuse elements. Among
the uses for the fuses are unique chip identifiers, mask revision numbers,
cryptographic keys, JTAG secure mode, boot characteristics, and various
control signals requiring permanent non-volatility. The IIM also provides up
to 28 volatile control signals. The IIM consists of a master controller, a
software fuse value shadow cache, and a set of registers to hold the values
of signals visible outside the module.
IIM interfaces to the electrical fuse array (split to banks). Enabled to set up
boot modes, security levels, security keys and many other system
i.MX53A consists of 4 x 256-bit + 1 x 128-bit fuse-banks (total 1152 bits)
through IIM interface.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
Modules List
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IOMUXC IOMUX Control System
This module enables flexible I/O multiplexing. Each I/O pad has default as
well as several alternate functions. The alternate functions are software
IPU Image
Processing Unit
Version 3M IPU enables connectivity to displays, relevant processing and
synchronization. It supports two display ports and two camera ports,
through the following interfaces:
Legacy parallel interfaces
Single/dual channel LVDS display interface
Analog TV or VGA interfaces
The processing includes:
Image enhancement—color adjustment and gamut mapping, gamma
correction and contrast enhancement
Video/graphics combining
Support for display backlight reduction
Image conversion—resizing, rotation, inversion and color space
Hardware de-interlacing support
Synchronization and control capabilities, allowing autonomous
KPP Keypad Port Connectivity
The KPP supports an 8 ×8 external keypad matrix. The KPP features are
as follows:
Open drain design
Glitch suppression circuit design
Multiple keys detection
Standby key press detection
LDB LVDS Display
LVDS display bridge is used to connect the IPU (image processing unit) to
external LVDS display interface. LDB supports two channels; each channel
has following signals:
1 clock pair
4 data pairs
On-chip differential drivers are provided for each pair.
OWIRE One-Wire
One-wire support provided for interfacing with an on-board EEPROM, and
smart battery interfaces, for example, Dallas DS2502.
PATA Parallel ATA Connectivity
The PATA block is a AT attachment host interface. Its main use is to interface
with hard disk drives and optical disc drives. It interfaces with the ATA-6
compliant device over a number of ATA signals. It is possible to connect a
bus buffer between the host side and the device side.
Pulse Width
The pulse-width modulator (PWM) has a 16-bit counter and is optimized to
generate sound from stored sample audio images. It can also generate
tones. The PWM uses 16-bit resolution and a 4 x 16 data FIFO to generate
INTRAM Internal RAM Internal
Internal RAM, shared with VPU.
The on-chip memory controller (OCRAM) module, is an interface between
the system’s AXI bus, to the internal (on-chip) SRAM memory module. It is
used for controlling the 128 KB multimedia RAM, through a 64-bit AXI bus.
BOOTROM Boot ROM Internal
Supports secure and regular boot modes.
The ROM controller supports ROM patching.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
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Modules List
RTIC Run-Time
Integrity Checker
Security Protecting read only data from modification is one of the basic elements in
trusted platforms. The run-time integrity checker, version 3 (RTIC) block is
a data-monitoring device responsible for ensuring that the memory content
is not corrupted during program execution. The RTIC mechanism
periodically checks the integrity of code or data sections during normal OS
run-time execution without interfering with normal operation. The purpose
of the RTIC is to ensure the integrity of the peripheral memory contents,
protect against unauthorized external memory elements replacement and
assist with boot authentication.
Security SAHARA (symmetric/asymmetric hashing and random accelerator),
version 4, is a security coprocessor. It implements symmetric encryption
algorithms, (AES, DES, 3DES, RC4 and C2), public key algorithms (RSA
and ECC), hashing algorithms (MD5, SHA-1, SHA-224 and SHA-256), and
a hardware true random number generator. It has a slave IP Bus interface
for the host to write configuration and command information, and to read
status information. It also has a DMA controller, with an AHB bus interface,
to reduce the burden on the host to move the required data to and from
SATA Serial ATA Connectivity
SATA HDD interface, includes the SATA controller and the PHY. It is a
complete mixed-signal IP solution for SATA HDD connectivity.
SCCv2 Security
Controller, ver. 2
Security The security controller is a security assurance hardware module designed
to safely hold sensitive data, such as encryption keys, digital right
management (DRM) keys, passwords and biometrics reference data. The
SCCv2 monitors the system’s alert signal to determine if the data paths to
and from it are secure, that is, it cannot be accessed from outside of the
defined security perimeter. If not, it erases all sensitive data on its internal
RAM. The SCCv2 also features a key encryption module (KEM) that allows
non-volatile (external memory) storage of any sensitive data that is
temporarily not in use. The KEM utilizes a device-specific hidden secret key
and a symmetric cryptographic algorithm to transform the sensitive data
into encrypted data.
SDMA Smart Direct
Memory Access
The SDMA is multi-channel flexible DMA engine. It helps in maximizing
system performance by off loading various cores in dynamic data routing.
The SDMA features list is as follows:
Powered by a 16-bit instruction-set micro-RISC engine
Multi-channel DMA supports up to 32 time-division multiplexed DMA
48 events with total flexibility to trigger any combination of channels
Memory accesses including linear, FIFO, and 2D addressing
Shared peripherals between ARM and SDMA
Very fast context-switching with two-level priority-based preemptive
DMA units with auto-flush and prefetch capability
Flexible address management for DMA transfers (increment, decrement,
and no address changes on source and destination address)
DMA ports can handle unidirectional and bidirectional flows (copy mode)
Up to 8-word buffer for configurable burst transfers to / from the EXTMC
Support of byte swapping and CRC calculations
A library of scripts and API is available
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
Modules List
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 13
SECRAM Secure /
Non-secure RAM
Secure / non-secure Internal RAM, controlled by SCC.
JTAG manipulation is a known hacker’s method of executing unauthorized
program code, getting control over secure applications, and running code in
privileged modes. The JTAG port provides a debug access to several
hardware blocks including the ARM processor and the system bus.
The JTAG port must be accessible during platform initial laboratory
bring-up, manufacturing tests and troubleshooting, as well as for software
debugging by authorized entities. However, in order to properly secure the
system, unauthorized JTAG usage should be strictly forbidden.
In order to prevent JTAG manipulation while allowing access for
manufacturing tests and software debugging, the i.MX53 processor
incorporates a mechanism for regulating JTAG access. SJC provides four
different JTAG security modes that can be selected through an e-fuse
SPBA Shared
Peripheral Bus
SPBA (shared peripheral bus arbiter) is a two-to-one IP bus interface (IP
bus) arbiter.
SPDIF Sony Philips
Digital Interface
A standard digital audio transmission protocol developed jointly by the Sony
and Philips corporations. Both transmitter and receiver functionalists are
SRTC Secure Real
Time Clock
Security The SRTC incorporates a special system state retention register (SSRR)
that stores system parameters during system shutdown modes. This
register and all SRTC counters are powered by dedicated supply rail
NVCC_SRTC_POW. The NVCC_SRTC_POW can be energized
separately even if all other supply rails are shut down. This register is helpful
for storing warm boot parameters. The SSRR also stores the system
security state. In case of a security violation, the SSRR mark the event
(security violation indication).
The SSI is a full-duplex synchronous interface used on the i.MX53A
processor to provide connectivity with off-chip audio peripherals. The SSI
interfaces connect internally to the AUDMUX for mapping to external ports.
The SSI supports a wide variety of protocols (SSI normal, SSI network, I2S,
and AC-97), bit depths (up to 24 bits per word), and clock/frame sync
Each SSI has two pairs of 8 x 24 FIFOs and hardware support for an
external DMA controller in order to minimize its impact on system
performance. The second pair of FIFOs provides hardware interleaving of
a second audio stream, which reduces CPU overhead in use cases where
two time slots are being used simultaneously.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
i.MX53 Applications Processors for Industrial Products, Rev. 4
14 Freescale Semiconductor
Modules List
Precision Time
The IEEE 1588-2002 (version 1) standard defines a precision time protocol
(PTP) - which is a time-transfer protocol that enables synchronization of
networks (for example, Ethernet), to a high degree of accuracy and
The IEEE1588 hardware assist is composed of the two blocks: time stamp
unit and real time clock, which provide the timestamping protocol’s
functionality, generating and reading the needed timestamps.
The hardware-assisted implementation delivers more precise clock
synchronization at significantly lower CPU load compared to purely
software implementations.
(Part of SATA
The temperature sensor is an internal module to the i.MX53 that monitors
the die temperature. The monitor is capable in generating SW interrupt, or
trigger the CCM, to reduce the core operating frequency.
TVE TV Encoder Multimedia The TV encoder, version 2.1 is implemented in conjunction with the image
processing unit (IPU) allowing handheld devices to display captured still
images and video directly on a TV or LCD projector. It supports composite
PAL/NTSC, VGA, S-video, and component up to HD1080p analog video
TZIC TrustZone Aware
ARM/Control The TrustZone interrupt controller (TZIC) collects interrupt requests from all
i.MX53 sources and routes them to the ARM core. Each interrupt can be
configured as a normal or a secure interrupt. Software Force Registers and
software Priority Masking are also supported.
UART Interface Connectivity
Each of the UART blocks supports the following serial data transmit/receive
protocols and configurations:
7 or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd,
or none)
Programmable bit-rates up to 4 Mbps. This is a higher max baud rate
relative to the 1.875 Mbps, which is specified by the TIA/EIA-232-F
32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud
IrDA 1.0 support (up to SIR speed of 115200 bps)
Option to operate as 8-pins full UART, DCE, or DTE
USB USB Controller Connectivity
USB supports USB2.0 480 MHz, and contains:
One high-speed OTG sub-block with integrated HS USB PHY
One high-speed host sub-block with integrated HS USB PHY
Two identical high-speed Host modules
The high-speed OTG module, which is internally connected to the HS USB
PHY, is equipped with transceiver-less logic to enable on-board USB
connectivity without USB transceivers
All the USB ports are equipped with standard digital interfaces (ULPI, HS
IC-USB) and transceiver-less logic to enable onboard USB connectivity
without USB transceivers.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
Modules List
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 15
VPU Video Processing
A high-performing video processing unit (VPU) version 3, which covers
many SD-level video decoders and SD-level encoders as a multi-standard
video codec engine as well as several important video processing such as
rotation and mirroring.
VPU Features:
MPEG-2 decode, Mail-High profile, up to 1080i/p resolution, 40 Mbps bit
MPEG4/XviD decode, SP/ASP profile, up to 1080 i/p resolution, 40 Mbps
bit rate
H.263 decode, P0/P3 profile, up to 16CIF resolution, 20 Mbps bit rate
H.264 decode, BP/MP/HP profile, up to 1080 i/p resolution, 40 Mbps bit
VC1 decode, SP/MP/AP profile, up to 1080 i/p resolution, 40 Mbps bit
RV10 decode, 8/9/2010 profile, up to 1080 i/p resolution, 40 Mbps bit rate
DivX decode, 3/4/5/6 profile, up to 1080 i/p resolution, 40 Mbps bit rate
MJPEG decode, Baseline profile, up to 8192 x 8192 resolution,
40 Mpixel/s bit rate for 4:4:4 format
1 encode, Main-Main profile, up to D1 resolution, 15 Mbps bit
MPEG4 encode, Simple profile, up to 720p resolution, 12 Mbps bit rate2
H.263 encode, P0/P3 profile, up to 4CIF resolution, 8 Mbps bit rate2
H.264 encode, Baseline profile, up to 720p resolution, 14 Mbps bit rate2
MJPEG encode, Baseline profile, up to 8192 x 8192 resolution,
80 Mpixel/s bit rate for 4:2:2 format
WDOG-1 Watch Dog Timer
The watch dog timer supports two comparison points during each counting
period. Each of the comparison points is configurable to evoke an interrupt
to the ARM core, and a second point evokes an external event on the
WDOG line.
Watch Dog
The TrustZone watchdog (TZ WDOG) timer module protects against
TrustZone starvation by providing a method of escaping normal mode and
forcing a switch to the TZ mode. TZ starvation is a situation where the
normal OS prevents switching to the TZ mode. This situation should be
avoided, as it can compromise the system’s security. Once the TZ WDOG
module is activated, it must be serviced by TZ software on a periodic basis.
If servicing does not take place, the timer times out. Upon a time-out, the
TZ WDOG asserts a TZ mapped interrupt that forces switching to the TZ
mode. If it is still not served, the TZ WDOG asserts a security violation
signal to the CSU. The TZ WDOG module cannot be programmed or
deactivated by a normal mode SW.
XTALOSC 24 MHz Crystal
Clocking Provides a crystal oscillator amplifier that supports a 24-MHz external
32.768 kHz
Crystal Oscillator
Clocking Provides a crystal oscillator amplifier that supports a 32.768-kHz external
1Video partially performed in hardware accelerator (70%) and partially in software.
2VPU can generate higher bit rate than the maximum specified by the corresponding standard.
Table 2. i.MX53 Digital and Analog Blocks (continued)
Mnemonic Block Name Subsystem Brief Description
i.MX53 Applications Processors for Industrial Products, Rev. 4
16 Freescale Semiconductor
Electrical Characteristics
3.1 Special Signal Considerations
The package contact assignments can be found in Section 6, “Package Information and Contact
Assignments. Signal descriptions are defined in the i.MX53 Reference Manual. Special signal
considerations information is contained in Chapter 1 of i.MX53 System Development User's Guide
4 Electrical Characteristics
This section provides the device and module-level electrical characteristics for the i.MX53 processor.
4.1 Chip-Level Conditions
This section provides the device-level electrical characteristics for the IC. See Table 3 for a quick reference
to the individual tables and sections.
4.1.1 Absolute Maximum Ratings
Stresses beyond those listed under Table 4 may affect reliability or cause
permanent damage to the device. These are stress ratings only. Functional
operation of the device at these or any other conditions beyond those
indicated in the Operating Ranges table is not implied.
Table 3. i.MX53 Chip-Level Conditions
For these characteristics, … Topic appears …
Absolute Maximum Ratings Table 4 on page 16
TEPBGA-2 Package Thermal Resistance Data Table 5 on page 17
i.MX53 Operating Ranges Table 6 on page 18
External Clock Sources Table 7 on page 20
Maximal Supply Currents Table 8 on page 20
USB Interface Current Consumption Table 9 on page 22
Table 4. Absolute Maximum Ratings
Parameter Description Symbol Min Max Unit
Peripheral Core Supply Voltage VCC -0.3 1.35 V
ARM Core Supply Voltage VDDGP -0.3 1.4 V
Supply Voltage UHVIO Supplies denoted as I/O Supply -0.5 3.6 V
Supply Voltage for non UHVIO Supplies denoted as I/O Supply -0.5 3.3 V
Electrical Characteristics
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 17
4.1.2 Thermal Resistance TEPBGA-2 Package Thermal Resistance
Table 5 provides the TEPBGA-2 package thermal resistance data.
Input voltage on USB_OTG_DP, USB_OTG_DN,
USB_H1_DP, USB_H1_DN pins
USB_DP/USB_DN -0.3 3.631V
Input/Output Voltage Range Vin/Vout -0.5 OVDD +0.32V
ESD Damage Immunity: Vesd V
Human Body Model (HBM)
Charge Device Model (CDM)
Storage Temperature Range TSTORAGE -40 150 oC
1USB_DN and USB_DP can tolerate 5 V for up to 24 hours.
2The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in
Table 111 on page 149. The maximum range can be superseded by the DC tables.
Table 5. TEPBGA-2 Package Thermal Resistance Data
Rating Board Symbol Value Unit
Junction to Ambient (natural convection)1, 2
1Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
2Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Single layer board
RθJA 28 °C/W
Junction to Ambient (natural convection)1, 2, 3
3Per JEDEC JESD51-6 with the board horizontal.
Four layer board
RθJA 16 °C/W
Junction to Ambient (at 200 ft/min)1, 3 Single layer board
RθJMA 21 °C/W
Junction to Ambient (at 200 ft/min)1, 3 Four layer board
RθJMA 13 °C/W
Junction to Board4
4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Junction to Case5
5Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
Junction to Package Top (natural convection)6
6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Table 4. Absolute Maximum Ratings (continued)
Parameter Description Symbol Min Max Unit
i.MX53 Applications Processors for Industrial Products, Rev. 4
18 Freescale Semiconductor
Electrical Characteristics
4.1.3 Operating Ranges
Table 6 provides the operating ranges of i.MX53 processor.
Table 6. i.MX53 Operating Ranges
Symbol Parameter Minimum1Nominal2Maximum1Unit
VDDGP3ARM core supply voltage
fARM 400 MHz
0.9 0.95 1.05 V
ARM core supply voltage
fARM 800 MHz
1.05 1.1 1.15 V
ARM core supply voltage
Stop mode
0.8 0.85 1.15 V
VCC Peripheral supply voltage41.25 1.3 1.35 V
Peripheral supply voltage—Stop mode 0.9 0.95 1.35 V
VDDA5Memory arrays voltage 1.25 1.30 1.35 V
Memory arrays voltage—Stop mode 0.9 0.95 1.35 V
VDDAL15L1 Cache Memory arrays voltage 1.25 1.30 1.35 V
L1 Cache Memory arrays voltage—Stop mode 0.9 0.95 1.35 V
VDD_DIG_PLL6PLL Digital supplies—external regulator option 1.25 1.3 1.35 V
VDD_ANA_PLL7PLL Analog supplies—external regulator option 1.75 1.8 1.95 V
NVCC_CKIH ESD protection of the CKIH pins, FUSE read Supply
and 1.8V bias for the UHVIO pads
1.65 1.8 1.95 V
GPIO digital power supplies 1.65 1.8 or
3.1 V
NVCC_LVDS LVDS interface Supply 2.25 2.5 2.75 V
NVCC_LVDS_BG LVDS Band Gap Supply 2.25 2.5 2.75 V
NVCC_EMI_DRAM DDR Supply DDR2 range 1.7 1.8 1.9 V
DDR Supply LPDDR2 range 1.14 1.2 1.3
DDR Supply LV-DDR2 range
1.47 1.55 1.63
1.42 1.5 1.58
DDR Supply DDR3 range 1.42 1.5 1.58
VDD_FUSE8Fusebox Program Supply (Write Only) 3.0 3.3 V
Ultra High voltage I/O (UHVIO) supplies: V
UHVIO_L 1.65 1.8 1.95
UHVIO_H 2.5 2.775 3.1
UHVIO_UH 3.0 3.3 3.6
Electrical Characteristics
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 19
TVE digital and analog power supply, TVE-to-DAC
level shifter supply, cable detector supply, analog
power supply to RGB channel
2.69 2.75 2.91 V
For GPIO use only, when TVE is not in use 1.65 1.8 or
3.1 V
NVCC_SRTC_POW SRTC Core and slow I/O Supply (GPIO)10 1.25 1.3 1.35 V
NVCC_RESET LVIO 1.65 1.8 or
3.1 V
USB_PHY analog supply, oscillator amplifier analog
2.25 2.5 2.75 V
USB PHY I/O analog supply 3.0 3.3 3.6 V
VBUS See Ta b l e 4 on page 16 and Ta bl e 1 0 4 on page 141
for details. Note that this is not a power supply.
VDD_REG12 Power supply input for the integrated linear
2.37 2.5 2.63 V
VP SATA PHY core power supply 1.25 1.3 1.35 V
VPH SATA PHY I/O supply voltage 2.25 2.5 2.75 V
TJJunction temperature -40 10513 125 oC
1Voltage at the package power supply contact must be maintained between the minimum and maximum voltages. The design
must allow for supply tolerances and system voltage drops.
2The nominal values for the supplies indicate the target setpoint for a tolerance no tighter than ± 50 mV. Use of supplies with
a tighter tolerance allows reduction of the setpoint with commensurate power savings.
3A voltage transition is allowed for the required supply ramp up to the nominal value prior to achieving a clock speed increase.
Similarly, to accommodate a frequency reduction, a voltage transition is allowed for a supply ramp down to the nominal value
after the frequency is decreased.
4For BSDL mode, the minimum operating temperature is 20 oC and the maximum operating temperature is the maximum
temperature specified for the particular part grade.
5VDDA and VDDAL1 can be driven by the VDD_DIG_PLL internal regulator using external connections. When operating in this
configuration, the regulator is still operating at the default 1.2 V, as bootup start. During bootup initialization, software should
increase this regulator voltage to match VCC (1.3 V nominal) in order to reduce internal leakage current.
6By default, VDD_DIG_PLL is driven from internal on-die 1.2 V linear regulator (LDO). In this case, there is no need driving this
supply externally. LDO output to VDD_DIG_PLL should be configured by software after power-up to 1.3 V output. A bypass
capacitor of minimal value 22 μF should be connected to this pad in any case whether it is driven internally or externally. Use
of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.
7By default, the VDD_ANA_PLL is driven from internal on-die 1.8 V linear regulator (LDO). In this case there is no need driving
this supply externally. A bypass capacitor of minimal value 22 μF should be connected to this pad in any case whether it is
driven internally or externally. Use of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.
8After fuses are programmed, Freescale strongly recommends the best practice of reading the fuses to verify that they are
written correctly. In Read mode, VDD_FUSE should be floated or grounded. Tying VDD_FUSE to a positive supply (3.0 V–3.3
V) increases the possibility of inadvertently blowing fuses and is not recommended in read mode.
9If not using TVE module or other pads in this power domain for the product, the TVDAC_DHVDD and TVDAC_AHVDDRGB
can remain floating.
10 GPIO pad operational at low frequency
Table 6. i.MX53 Operating Ranges (continued)
Symbol Parameter Minimum1Nominal2Maximum1Unit
i.MX53 Applications Processors for Industrial Products, Rev. 4
20 Freescale Semiconductor
Electrical Characteristics
4.1.4 External Clock Sources
The i.MX53 device has four external input system clocks, a low frequency (CKIL), a high frequency
(XTAL), and two general purpose CKIH1 and CKIH2 clocks.
The CKIL is used for low-frequency functions. It supplies the clock for wake-up circuit, power-down real
time clock operation, and slow system and watch-dog counters. The clock input can be connected to either
external oscillator or a crystal using internal oscillator amplifier.
The system clock input XTAL is used to generate the main system clock. It supplies the PLLs and other
peripherals. The system clock input can be connected to either external oscillator or a crystal using internal
oscillator amplifier.
CKIH1 and CKIH2 provide additional clock source option for peripherals that require specific and
accurate frequencies.
Table 7 shows the interface frequency requirements. See Chapter 1 of i.MX53 System Development
User's Guide (MX53UG) for additional clock and oscillator information.
4.1.5 Maximal Supply Currents
Table 8 represents the maximal momentary current transients on power lines, and should be used for power
supply selection. Maximal currents higher by far than the average power consumption of typical use cases.
For typical power consumption information, refer to i.MX53 power consumption application note.
11 The analog supplies should be isolated in the application design. Use of series inductors is recommended.
12 VDD_REG is power supply input for the integrated linear regulators of VDD_ANA_PLL and VDD_DIG_PLL when they are
configured to the internal supply option. VDDR_REG still has to be tied to 2.5 V supply when VDD_ANA_PLL and
VDD_DIG_PLL are configured for external power supply mode although in this case it is not used as supply source.
13 Lifetime of 87,600 hours based on 105 oC junction temperature at nominal supply voltages.
Table 7. External Input Clock Frequency
Parameter Description Symbol Min Typ Max Unit
CKIL Oscillator1
1External oscillator or a crystal with internal oscillator amplifier.
fckil 32.7682/32.0
2Recommended nominal frequency 32.768 kHz.
CKIH1, CKIH2 Operating
See Table 32, "CAMP Electrical Parameters (CKIH1,
CKIH2)," on page 44
XTAL Oscillator fxtal 22 24 27 MHz
Table 8. Maximal Supply Currents
Power Line Conditions Max Current Unit
VDDGP 800 MHz ARM clock 1450 mA
VCC 800 mA
Electrical Characteristics
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 21
VP 20 mA
VDD_REG 325 mA
VDD_FUSE Fuse Write Mode
120 mA
1.8V (DDR2) 800 mA
1.5V (DDR3) 650 mA
1.2V (LPDDR2) 250 mA
50 mA
20 mA
VPH 60 mA
NVCC_CKIH Use maximal I/O Eq1, N=4
NVCC_CSI Use maximal I/O Eq1, N=20
NVCC_EIM_MAIN Use maximal I/O Eq1, N=39
NVCC_EIM_SEC Use maximal I/O Eq1, N=16
NVCC_EMI_DRAM Use maximal I/O Eq1, N=78
NVCC_FEC Use maximal I/O Eq1, N=11
NVCC_GPIO Use maximal I/O Eq1, N=13
NVCC_JTAG Use maximal I/O Eq1, N=6
NVCC_KPAD Use maximal I/O Eq1, N=11
NVCC_LCD Use maximal I/O Eq1, N=29
NVCC_LVDS Use maximal I/O Eq1, N=20
NVCC_LVDS_BG Use maximal I/O Eq1, N=1
NVCC_NANDF Use maximal I/O Eq1, N=8
NVCC_PATA Use maximal I/O Eq1, N=29
Table 8. Maximal Supply Currents (continued)
Power Line Conditions Max Current Unit
i.MX53 Applications Processors for Industrial Products, Rev. 4
22 Freescale Semiconductor
Electrical Characteristics
4.1.6 USB-OH-3 (OTG + 3 Host ports) Module and the Two USB PHY (OTG
and H1) Current Consumption
Table 9 shows the USB interface current consumption.
4.2 Power Supply Requirements and Restrictions
The system design must comply with power-up sequence, power-down sequence and steady state
guidelines as described in this section to guarantee the reliable operation of the device. Any deviation from
these sequences may result in the following situations:
Excessive current during power-up phase
NVCC_REST Use maximal I/O Eq1, N=5
NVCC_SD1 Use maximal I/O Eq1, N=6
NVCC_SD2 Use maximal I/O Eq1, N=6
NVCC_XTAL Use maximal I/O Eq1, N=2
1General Equation for estimated, maximal power consumption of an I/O power supply:
Imax = N x C x V x (0.5 x F)
N - Number of I/O pins supplies by the power line
C - Equivalent external capacitive load
V - I/O voltage
(0.5 x F) - Data change rate. Up to 0.5 of the clock rate (F).
Table 9. USB Interface Current Consumption
Parameter Conditions Typical at 25 °C Max Unit
Analog Supply 3.3 V
Full Speed
RX 5.5 6 mA
TX 7 8
High Speed
RX 5 6
TX 5 6
Analog Supply 2.5 V
Full Speed
RX 6.5 7 mA
TX 6.5 7
High Speed
RX 12 13
TX 21 22
Digital Supply
VCC (1.2 V)
Full Speed
RX 8 mA
TX 8
High Speed
RX 8
TX 8
Table 8. Maximal Supply Currents (continued)
Power Line Conditions Max Current Unit
Electrical Characteristics
i.MX53 Applications Processors for Industrial Products, Rev. 4
Freescale Semiconductor 23
Prevention of the device from booting
Irreversible damage to the i.MX53 processor (worst-case scenario)
4.2.1 Power-Up Sequence
The following observations should be considered:
•The consequent steps in power up sequence should not start before the previous step supplies have
been stabilized within 90-110% of their nominal voltage, unless stated otherwise.
•NVCC_SRTC_POW should remain powered ON continuously, to maintain internal real-time
clock status. Otherwise, it has to be powered ON together with VCC, or preceding VCC.
•The VCC should be powered ON together, or any time after NVCC_SRTC_POW.
•NVCC_CKIH should be powered ON after VCC is stable and before other I/O supplies
(NVCC_xxx) are powered ON.
•I/O Supplies (NVCC_xxx) below or equal to 2.8 V nom./3.1 V max. should not precede
NVCC_CKIH. They can start powering ON during NVCC_CKIH ramp-up, before it is
stabilized. Within this group, the supplies can be powered-up in any order.
Alternatively, the on-chip regulator VDD_ANA_PLL may be used to power NVCC_CKIH and
NVCC_RESET. In this case, the sequence defined in the “Interfacing the i.MX53 Processor
with LTC3589-1” section of the i.MX53 System Development User's Guide (MX53UG) must be
•I/O Supplies (NVCC_xxx) above 2.8 V nom./3.1 V max. should be powered ON only after
NVCC_CKIH is stable.
•In case VDD_DIG_PLL and VDD_ANA_PLL are powered ON from internal voltage regulator
(default case for i.MX53), there are no related restrictions on VDD_REG, as it is used as their
internal regulators power source.
If VDD_DIG_PLL and VDD_ANA_PLL are powered on externally, to reduce current leakage
during the power-up, it is recommended to activate the VDD_REG before or at the same time
with VDD_DIG_PLL and VDD_ANA_PLL. If this sequencing is not possible, make sure that
the 2.5 V VDD_REG supply shut-off output impedance is higher than 1 kΩ when it is inactive.
•VDD_REG supply is required to be powered ON to enable DDR operation. It must be powered
on after VCC and before NVCC_EMI_DRAM. The sequence should be:
•VDDA and VDDAL1 can be powered ON anytime before POR_B, regardless of any other power
•VDDGP can be powered ON anytime before POR_B, regardless of any other power signal.
•VP and VPH can be powered up together, or anytime after, the VCC. VP and VPH should come
before POR.
•TVDAC_DHVDD and TVDAC_AHVDDRGB should be powered from the same regulator. This
is due to ESD diode protection circuit, that may cause current leakage if one of the supplies is
powered ON before the other.
i.MX53 Applications Processors for Industrial Products, Rev. 4
24 Freescale Semiconductor
Electrical Characteristics
The POR_B input must be immediately asserted at power-up and remain
asserted until after the last power rail reaches its working voltage.
Figure 2 shows the power-up sequence diagram.
Figure 2. Power-Up Detailed Sequence
1If fuse writing is required, VDD_FUSE should be powered ON after NVCC_CKIH is stable.
Need to ensure that there is no back voltage (leakage) from any supply on
the board towards the 3.3 V supply (for example, from the parts that use
both 1.8 V and the 3.3 V supply).
(in any order, after NVCC_CKIH
VCC 90%
(in any order, if needed)
(may remain ON) 90%
I/O Supplies below or equal to
I/O Supplies above 2.8 V nom./3.1 V max
2.8 V nom./3.1 V max.