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SLOS414E − M AY 2003 − REVISED JUNE 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DQualification in Accordance With
AEC-Q100
DQualified for Automotive Applications
DCustomer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
DESD Protection Exceeds 500 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
DLow Supply-Current Drain Independent of
Supply Voltage . . . 0.7 mA Typ
DCommon-Mode Input Voltage Range
Includes Ground, Allowing Direct Sensing
Near Ground
DDifferential Input Voltage Range Equal to
Maximum-Rated Supply Voltage:
− Non-V Devices . . . ±26 V
− V-Suffix Devices...±32 V
Contact factory for details. Q100 qualification data available on
request.
DLow Input Bias and Offset Parameters:
− Input Offset Voltage ...3 mV Typ
− Input Offset Current ...2 nA Typ
− Input Bias Current . . . 20 nA Typ
DOpen-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
DInternal Frequency Compensation
description/ordering information
This device consists of two independent, high-gain, frequency-compensated operational amplifiers designed
to operate from a single supply over a wide range of voltages. Operation from split supplies is possible as long
as the difference between the two supplies is 3 V to 26 V (3 V to 32 V for V-suffix devices), and VCC is at least
1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the
magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,
these devices can be operated directly from the standard 5-V supply used in digital systems and easily provide
the required interface electronics without additional ±5-V supplies.
The LM2904Q is manufactured to demanding automotive requirements.
ORDERING INFORMATION
TAVIOmax
AT 25°CMAX VCC PACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
7 mV 26 V SOIC (D) Tape and reel LM2904QDRQ1 2904Q1
7 mV 26 V TSSOP (PW) Tape and reel LM2904QPWRQ1 2904Q1
−40°C to 125°C
7 mV 32 V SOIC (D) Tape and reel LM2904VQDRQ1 2904VQ1
−40
°
C to 125
°
C
7 mV 32 V TSSOP (PW) Tape and reel LM2904VQPWRQ1 2904VQ1
2 mV 32 V SOIC (D) Tape and reel LM2904AVQDRQ1 2904AVQ
2 mV 32 V TSSOP (PW) Tape and reel LM2904AVQPWRQ1 2904AVQ
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
    !"   #!$% &"'
&!   #" #" (" "  ") !"
&& *+' &! #", &"  ""%+ %!&"
",  %% #""'
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
D OR PW PACKAGE
(TOP VIEW)
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SLOS414E − M AY 2003 − REVISED JUNE 2004
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
symbol (each amplifier)
IN+
IN− OUT
+
schematic (each amplifier)
VCC+
OUT
GND (or VCC−)
To Other Amplifier
IN−
IN+
6-µA
Current
Regulator
6-µA
Current
Regulator
100-µA
Current
Regulator
50-µA
Current
Regulator
Epi-FET
Diodes
Resistors
Transistors
Capacitors
COMPONENT COUNT
1
2
7
51
2
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SLOS414E − M AY 2003 − REVISED JUNE 2004
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, VCC (see Note 1): Non-V devices 26 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V-suffix devices 32 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2): Non-V devices ±26 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V-suffix devices ±32 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input): Non-V devices −0.3 V to 26 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V-suffix devices −0.3 V to 32 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (one amplifier) to ground at (or below) 25°C
free-air temperature (VCC 15 V) (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 4 and 5):D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA −40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground
terminal.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
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SLOS414E − M AY 2003 − REVISED JUNE 2004
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONSTAMIN TYP§MAX UNIT
VCC = 5 V to
Non-A devices
25°C 3 7
VIO
Input offset voltage
V
CC
= 5 V to
MAX,
Non-A devices Full range 10
mV
VIO Input offset voltage
MAX,
VIC = VICR(min)
,
VO = 1.4 V
A-suffix devices
25°C 1 2 mV
VIC = VICR(min),
VO = 1.4 V A-suffix devices Full range 4
aVIO Average temperature coefficient of
input offset voltage Full range 7µV/°C
Non-V devices
25°C 2 50
IIO
Input offset current
VO = 1.4 V
Non-V devices Full range 300
nA
IIO Input offset current VO = 1.4 V
V-suffix devices
25°C 5 50 nA
V-suffix devices Full range 150
aIIO Average temperature coefficient of
input offset current Full range 10 pA/°C
IIB
Input bias current
VO = 1.4 V
25°C −20 −250
nA
IIB Input bias current VO = 1.4 V Full range −500 nA
IBDrift Full range 50 pA/°C
VICR
Common-mode input voltage range
VCC = 5 V to MAX
25°C0 to
VCC−1.5
V
VICR Common-mode input voltage range VCC = 5 V to MAX Full range 0 to
VCC−2
V
RL 10 k25°C VCC−1.5
VCC = MAX,
RL = 2 k
Full range
22
V
OH
High-level output voltage
VCC = MAX,
Non-V devices RL 10 kFull range 23 24 V
VOH
High-level output voltage
VCC = MAX,
RL = 2 k
Full range
26
V
VCC = MAX,
V-suffix devices RL 10 kFull range 27 28
VOL Low-level output voltage RL 10 kFull range 5 20 mV
AVD
Large-signal differential
VCC = 15 V, VO = 1 V to 11 V,
25°C 25 100
V/mV
AVD
Large-signal differential
voltage amplification
VCC = 15 V, VO = 1 V to 11 V,
RL = 2 kFull range 15 V/mV
CMRR Common-mode rejection ratio VCC = 5 V to MAX,
VIC = VICR(min) 25°C 65 80 dB
kSVR Supply-voltage rejection ratio
(VDD/VIO)VCC = 5 V to MAX 25°C 65 100 dB
VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB
VCC = 15 V, VID = 1 V, VO = 0
25°C −20 −30
VCC = 15 V, VID = 1 V, VO = 0 Full range −10
mA
I
O
Output current
VCC = 15 V, VID = −1 V, VO = 15 V
25°C 10 20 mA
IO
Output current
VCC = 15 V, VID = −1 V, VO = 15 V Full range 5
VID = −1 V, VO = 200 mV 25°C 12 40 µA
IOS Short-circuit output current VCC at 5 V, GND at −5 V, VO = 0 25°C±40 ±60 mA
ICC
Supply current (two amplifiers)
VO = 2.5 V, No load
Full range
0.7 1.2
mA
I
CC
Supply current (two amplifiers)
VCC = MAX, VO = 0.5 VCC, No load
Full range
1 2
mA
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for non-V devices and 32 V for V-suffix devices.
Full range is −40°C to 125°C for LM2904Q.S
§All typical values are at TA = 25°C.
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SLOS414E − M AY 2003 − REVISED JUNE 2004
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
operating conditions, VCC = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain RL = 1 M, CL = 30 pF, VI = ±10 V
(see Figure 1) 0.3 V/µs
B1Unity-gain bandwidth RL = 1 M, CL = 20 pF (see Figure 1) 0.7 MHz
VnEquivalent input noise voltage RS = 100 , VI = 0 V, f = 1 kHz
(see Figure 2) 40 nV/Hz
CL
VO
VI
+
RL
VCC+
VCC−
Figure 1. Unity-Gain Amplifier
VO
+
100
VCC+
VCC−
RS
900
VI = 0 V
Figure 2. Noise-Test Circuit
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LM2904AVQDRQ1 ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904AVQPWRQ1 ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-250C-UNLIM
LM2904QDRQ1 ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904QPWRQ1 ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-250C-UNLIM
LM2904VQDRQ1 ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904VQPWRQ1 ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Mar-2005
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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