SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Key Features
Small size and
light weight
Suitable for
both wave and
reflow
soldering
techniques
Supplied on
tape
Pulse Rated
7 different
package sizes
Terminal finish
matte Sn over
Ni
Type CRGP Series
TE Connectivity is pleased to introduce this SMD Pulse withstand thick film Chip
resistor, suitable for auto placement in volume and for most applications.
Available in five different packages and supplied on tape and reel for automatic
insertion processes. Standard values – E24 Series
Characteristics – Electrical
Type
CRGP0402
CRGP0805
CRGP1206
Power Rating @ 70°C
0.125W
0.33W
0.5W
Max. Working Voltage
50V
150V
200V
Max. Overload Voltage
100V
300V
400V
Dielectric Withstand
100V
500V
500V
Temperature Range
-55°C ~ +155°C
Ambient Temperature
70°C
Type
CRGP1210
CRGP2010
CRGP2512
Power Rating @ 70°C
0.75W
1.25W
2W
Max. Working Voltage
200V
400V
500V
Max. Overload Voltage
500V
800V
1000V
Dielectric Withstand
500V
500V
500V
Temperature Range
-55°C ~ +155°C
Ambient Temperature
70°C
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Power derating curve
Power rating based on continuous load operation in ambient temperature of
70°C. For resistors operated in ambient temperatures above 70°C, power
rating must be derated in accordance with this curve.
Dimensions:
Type
Dimension (mm)
L
W
H
ℓ
ℓ
CRGP0402
1.10±0.10
0.50±0.05
0.35±0.05
0.20±0.10
0.25±0.10
CRGP0603
1.60±0.10
0.80±0.10
0.45±0.10
0.30±0.20
0.30±0.20
CRGP0805
2.00±0.15
1.25+0.15
-0.10
0.55±0.10
0.40±0.20
0.40±0.20
CRGP1206
3.10±0.15
1.55+0.15
-0.10
0.55±0.10
0.45±0.20
0.45±0.20
CRGP1210
3.10±0.10
2.60±0.20
0.55±0.10
0.55±0.25
0.50±0.20
CRGP2010
5.00±0.10
2.50±0.20
0.55±0.10
0.60±0.25
0.50±0.20
CRGP2512
6.35±0.10
3.20±0.20
0.55±0.10
0.60±0.25
0.50±0.20
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Construction:
Power Rating and Resistance Range:
Type
Power Rating
@ 70°C
Tolerance
Resistance
Range
Standard
Series
CRGP0402
0.125W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP0603
0.25W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP0805
0.33W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP1206
0.5W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP1210
0.75W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP2010
1.25W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
CRGP2512
2W
±1%
1R0 – 10M
E24
E96 by
negotiation
±5%
Marking:
E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of
resistance and third digit denotes number of zeros thereafter. EG
222
=
2K2
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant
figures of resistance and fourth digit denotes number of zeros thereafter. EG.
1000
=
100R
For ohi alues elo R letter R deotes deial poit. EG
1R80
=
R8 / .8Ω
0402 size chips are not marked
0603 E96 3 digit marking.
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Marking for E96 series 0603 size with no marking code marked as
per E24 values.
Pulse withstand capacity
The single impulse graph is the result of 50 impulses of rectangular shape
applied at one-minute intervals. The limit of acceptance was a shift in
resistance of less than 1% from the initial value. The power applied was
subject to the restrictions of the maximum permissible impulse voltage
graph shown.
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Performance Specification:
Characteristic
Limits
Test Methods
(JIS C 5201-1)
Temperature
Coefficient
±100PPM/°C
*0402:
Ω-Ω : ±  PPM/℃
Ω-Ω : ± 200 PPM/℃
>Ω : ±  PPM/℃
Natural resistance change per temp.
degree centigrade
R1-R2
--------- x⁶ PPM/°C
R1(t2-t1)
R1 resistance value at room temperature
(t1)
R2 Resistance value at room temperature
+100°C (t2)
(Sub-clause 4.8)
Short term
overload
Resistance change rate is
±% : ±.% ±.Ω Max.
±% : ±.% ±.Ω Max.
Permanent resistance change after the
application of a potential of 2.5 times
RCWV for 5 seconds
Sub-clause 4.13
Terminal
Bending
± .% ±.Ω Max.
Twist of Test Board :
Y/X = 5/90 mm for 10 seconds
(Sub-clause 4.33)
Insulation
Resistance
,MΩ or ore
Apply 500V DC between protective coating
and termination for 1 min, then measure
(Sub-clause 5.6)
Dielectric
Withstand
Voltage
No evidence of flashover,
mechanical damage, arcing
or insulation breakdown.
Apply 500V AC between protective coating
and termination for 1 minute
(Sub-clause 4.7)
Soldering Heat
Resistance change rate is
±.%+.Ω Max.
Dip the resistor into a solder bath having a
temperature of 260°C±3°C and hold it for
10±1 seconds
(Sub-clause 4.18)
Solderability
95% coverage Min.
Test temperature of solder : 245 ± 3 ℃
Dwell time in solder : 2 ~ 3 seconds
(Sub-clause 4.17)
Solder Temp.
Reference
Electrical characteristics
shall be satisfied without
distinct deformation in
appearance.
(95% coverage Min.)
Wave soldering condition: (2 cycles Max.)
Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.
Peak temp.: 260 ℃
Reflow soldering condition: (2 cycles Max.)
Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.
Suggestion solder temp.: 235 ~ 255 ℃, 20 ~
40 sec.
Peak temp.: 260 ℃
Hand Soldering 300°C 5 seconds
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Performance Specification (continued)
Characteristic
Limits
Test Methods
(JIS C 5201-1)
Temperature
Cycling
Resistance change rate is:
±5%: ±%±.Ω Max.
±%: ±.%±.Ω Max.
Resistance change after continuous 5
cycles for duty specified below:
Step
Temperature
Time
1
-55°C±3°C
30 mins.
2
Room Temp.
10~15 mins.
3
+155°C±2°C
30 mins.
4
Room Temp.
10~15 mins.
(Sub-clause 4.19)
Humidity
Resistance change rate is:
± .% + .Ω Max.
Temporary resistance change after
240 hours exposure in a humidity test
chamber controlled at 40±2°C and 90-
95% relative humidity
(Sub-clause 4.24)
Load Life In
Humidity
Resistance change rate is:
±% : ±.% ±.Ω Max.
±% : ±.% ±.Ω Max.
Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at
RCWV in a humidity chamber
controlled at 40℃ ± 2℃ and 90 to 95
% relative humidity.
(Sub-clause 4.24.2.1)
Load Life
Resistance change rate is:
±% : ±.% ±.Ω Max.
±% : ±.% ±.Ω Max.
Permanent resistance change after
1,000 hours operating at RCWV, with
duty cycle of (1.5 hours "on", 0.5 hour
"off") at 70℃ ± 2℃ ambient
(Sub-clause 4.25.1
Packaging Specification
Paper taping
Type
A ±
0.2
B ±
0.2
C ±
0.05
ØD +0.1
-0
E ±
0.1
F ±
0.05
G ±
0.1
W ±
0.2
T ±
0.1
0402
0.65
1.15
2.0
1.5
1.75
3.5
4.0
8.0
0.45
0603
1.10
1.90
2.0
1.5
1.75
3.5
4.0
8.0
0.67
0805
1.65
2.40
2.0
1.5
1.75
3.5
4.0
8.0
0.81
1206
2.00
3.60
2.0
1.5
1.75
3.5
4.0
8.0
0.81
1210
2.80
3.50
2.0
1.5
1.75
3.5
4.0
8.0
0.75
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Embossed Taping
Type
A
±0.2
B
±0.2
C
±0.05
ØD
+0.1
-0
ØD1
+0.1
-0
E
±0.1
F
±0.05
G
±0.1
W
±0.2
T ±
0.1
2010
2.90
5.60
2.0
1.5
1.5
1.75
5.5
4.0
12.0
1.0
2512
3.50
6.70
2.0
1.5
1.5
1.75
5.5
4.0
12.0
1.0
Peeling strength of cover tape:
Test condition: 0.1 to 0.7 N at a peel off speed of 300mm / min.
Reel Dimensions (mm):
Type
Tape
Reel
Qty
A ± 0.5
B ± 0.5
C ± 0.5
D ± 1
M ± 2
W ± 1
0402
Paper
10,000
2
13
21
60
178
10
0603
Paper
5,000
2
13
21
60
178
10
0805
Paper
5,000
2
13
21
60
178
10
1206
Paper
5,000
2
13
21
60
178
10
1210
Paper
5,000
2
13
21
60
178
10
2010
Embossed
4,000
2
13
21
60
178
13.8
2512
Embossed
4,000
2
13
21
60
178
13.8
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Label:
A. TE Product Number B. Product Description
C. Quantity D. Lot Number
E. RoHS Statement
Example:
Environment Related Substance
This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and
Halogen free.
Ozone layer depleting substances.
Ozone depleting substances are not used in our manufacturing process of this
product.
This product is not manufactured using Chloro fluorocarbons (CFCs),
Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other
ozone depleting substances in any phase of the manufacturing process.
Storage Condition
The performance of these products, including the solderability, is guaranteed for a
year from the date of arrival at your company, provided that they remain packed as
they were when delivered and stored at a temperature of 25°C ± 10°C and a relative
humidity of 60%RH ± 10%RH, chemical and dust free atmosphere
Even within the above guarantee periods, do not store these products in the
following conditions otherwise, their electrical performance and/or solderability may
be deteriorated, and the packaging materials (e.g. taping materials) may be deformed
or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S,
NH3, SO2, or NO2
2. In direct sunlight
SMD Precision Pulse Thick Film Chip Resistor
9-1773463-9 CIS WR 03/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Solder Profile
Wave soldering condition: (2 cycles Max.)
Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.
Peak temp.: 260 ℃
Reflow soldering condition: (2 cycles Max.)
Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.
Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec.
Peak temp.: 260 ℃
Hand Soldering condition: The Soldering iron tip should be less than 300°C
and maximum contact time should be 5 seconds
How To Order
CRGP
0603
J
10K
Common Part
Size
Tolerance
Resistance Value
CRGP – Pulse
Withstand Thick
Film Chip Resistor
0402
0603
0805
1206
1210
2010
2512
F - ±1%
J - ±5%
 oh Ω R
K oh Ω K
K oh Ω
100K
M oh Ω M