- Zener voltages from : 2.4V - 39V
- Planar die construction
- Ideally suited for automated assembly processes
- Moisture sensitivity : Level 1 per J-STD-020
MECHANICAL DATA
- Case : SOT-23, molding plastic
- Case material - UL flammibility rating 94V-0
- Polarity : See diagram
- Lead free plating
- Marking : Marking code
- Weight : 0.008 g (approximately)
SYMBO UNIT
P
D
mW
V
F
V
(Note 1) R
θJA o
C/W
T
J
, T
STG o
C
Document Number: DS_S1408014 Version: C14
Junction and Storage Temperature Range - 65 to +150
Note 1: Valid provided that device terminals are kept at ambient temerature .
Power Dissipation 300
Forward Voltage I
F
= 10 mA 0.9
Thermal Resistance (Junction to Ambient) 417
SOT-23
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER VALUE
BZX84C2V4 thru BZX84C39
Taiwan Semiconductor
Small Si gnal Product
Surface Mount Zener Diode
FEATURES
ELECTRICAL CHARACTERISTICS ( T
A
= 25
o
C unless otherwise noted )
I
ZT
I
R
V
R
Nom Min Max mA Ohms mA μAVMinMax
BZX84C2V4 Z11 2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0
BZX84C2V7 Z12 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0
BZX84C3V0 Z13 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0
BZX84C3V3 Z14 3.3 3.1 3.5 5 95 600 1.0 5.0 1.0 -3.5 0
BZX84C3V6 Z15 3.6 3.4 3.8 5 90 600 1.0 5.0 1.0 -3.5 0
BZX84C3V9 Z16 3.9 3.7 4.1 5 90 600 1.0 3.0 1.0 -3.5 0
BZX84C4V3 Z17 4.3 4.0 4.6 5 90 600 1.0 3.0 1.0 -3.5 0.0
BZX84C4V7 Z1 4.7 4.4 5.0 5 80 500 1.0 3.0 2.0 -3.5 0.2
BZX84C5V1 Z2 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2
BZX84C5V6 Z3 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2.0 2.5
BZX84C6V2 Z4 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7
BZX84C6V8 Z5 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5
BZX84C7V5 Z6 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3
BZX84C8V2 Z7 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.1
BZX84C9V1 Z8 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0
BZX84C10 Z9 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0
BZX84C11 Y1 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0
BZX84C12 Y2 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6 10.0
BZX84C13 Y3 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7 11.0
BZX84C15 Y4 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0
BZX84C16 Y5 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0
BZX84C18 Y6 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0
BZX84C20 Y7 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0
BZX84C22 Y8 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0
BZX84C24 Y9 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0
BZX84C27 Y10 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3
BZX84C30 Y11 30 28 32 2 80 300 0.5 0.1 21.0 24.4 29.4
BZX84C33 Y12 33 31 35 2 80 325 0.5 0.1 23.1 27.4 33.4
BZX84C36 Y13 36 34 38 2 90 350 0.5 0.1 25.2 30.4 37.4
BZX84C39 Y14 39 37 41 2 130 350 0.5 0.1 27.3 33.4 41.2
Document Number: DS_S1408014 Version: C14
BZX84C2V4 thru BZX84C39
Taiwan Semiconductor
Small Signal Product
V
Z
@ I
ZT
Maximum Reverse
Current
Typical Temperature
Coefficient @ I
ZT
(mV/
o
C)
Z
ZT
@ I
ZT
Ohms
Z
ZK
@ I
ZK
Type Number
(Note 1)
Marking
code
Zener Voltage Range
(Note 2)
Maximum Zener Impedance
(Note 3)
Notes: 1. Valid provided that device terminals are kept at ambient temerature .
2. Tested with pulses period = 5 ms, pulse width = 300 μs
3. f = 1KHz
(TA=25℃ unless otherwise noted)
Document Number: DS_S1408014 Version: C14
Small Signal Product
BZX84C2V4 thru BZX84C39
Taiwan Semiconductor
RATINGS AND CHARACTERISTICS CURVES
0
10
20
30
40
50
012345678910
IZ , Zener Current (mA)
VZ- Zener Voltage (V)
Fig. 2 Zener Breakdown Characteristics
10
100
1000
1.0 10.0 100.0
CJ, Junction Capacitance (pF)
VZ- Nominal Zener Voltage (V)
Fig. 4 Junction Capacitance VS. Nomial Zener Voltage
0
100
200
300
400
500
0 100 200
PD- Power Passipation (mW)
TA , Ambient Temperature (oC)
Fig. 1 Power Derating Curve
0
10
20
30
0 10203040
IZ, Zener Current (mA)
VZ- Zener Voltage (V)
Fig. 3 Zener Breakdown Characteristics
Tj=25oC
See Note 1
Tj=25oC
Test Current
IZ
C2V7
C3V3
C3V9
C4V7
C5V6
C6V8 C8V2
Test Current
IZ
Tj=25oCC10
C12
C15
C18
C22
C27
C33 C36 C39
Test Current
IZ
VR = 1 V
VR = 2 V
VR = 1 V
VR = 2 V
Small Signal Product
PART NO.
Note 1: "xxx" defines voltage from 2.4V (BZX84C2V4) to 39V (BZX84C39)
PART NO.
BZX84C39
BZX84C39
Min Max Min Max
A 2.70 3.10 0.106 0.122
B 1.10 1.50 0.043 0.059
C 0.30 0.51 0.012 0.020
D 1.78 2.04 0.070 0.080
E 2.10 2.64 0.083 0.104
F 0.89 1.30 0.035 0.051
G
H
Z
X
Y
C
E
Document Number: DS_S1408014 Version: C14
PACKAGE OUTLINE DIMENSION
RF 3K / 7" Reel
SUGG EST PAD LAYOUT
BZX84C39 RFG R0 G Green compound
BZX84C39-D0 RFG D0 R0 G Green compound
Note 2: Manufacture special control, if empty means no special control requirement.
EXAMPLE
PREFERRED P/N MANUFACTURE
CODE PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
BZX84Cxxx
(Note1) (Note 2) G SOT-23
BZX84C2V4 thru BZX84C39
Taiwan Semiconductor
ORDERING INFORMATION
MANUFACTURE
CODE PACKING CODE GREEN COMPOUND
CODE PACKAGE PACKING
2.00 0.079
1.35 0.053
2.90 0.114
0.80 0.031
0.90 0.035
0.004 REF
DIM. Unit (mm) Unit (inch)
Typ. Typ.
DIM. Unit (mm) Unit (inch)
0.55 REF 0.022 REF
0.10 REF
Small Signal Product
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1408014 Version: C14
BZX84C2V4 thru BZX84C39
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
