application INFO available UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 Low-Power BiCMOS Current-Mode PWM FEATURES DESCRIPTION * 100A Typical Starting Supply Current The UCC1800/1/2/3/4/5 family of high-speed, low-power integrated circuits contain all of the control and drive components required for off-line and DC-to-DC fixed frequency current-mode switching power supplies with minimal parts count. * 500A Typical Operating Supply Current * Operation to 1MHz These devices have the same pin configuration as the UC1842/3/4/5 family, and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input. * Internal Soft Start * Internal Fault Soft Start * Internal Leading-Edge Blanking of the Current Sense Signal * 1 Amp Totem-Pole Output * 70ns Typical Response from Current-Sense to Gate Drive Output * 1.5% Tolerance Voltage Reference * Same Pinout as UC3842 and UC3842A Part Number UCCx800 UCCx801 UCCx802 UCCx803 UCCx804 UCCx805 The UCC1800/1/2/3/4/5 family offers a variety of package options, temperature range options, choice of maximum duty cycle, and choice of critical voltage levels. Lower reference parts such as the UCC1803 and UCC1805 fit best into battery operated systems, while the higher reference and the higher UVLO hysteresis of the UCC1802 and UCC1804 make these ideal choices for use in off-line power supplies. o o The UCC180x series is specified for operation from -55 C to +125 C, o o the UCC280x series is specified for operation from -40 C to +85 C, and o o the UCC380x series is specified for operation from 0 C to +70 C. Maximum Duty Cycle 100% 50% 100% 100% 50% 50% Reference Voltage 5V 5V 5V 4V 5V 4V Turn-On Threshold 7.2V 9.4V 12.5V 4.1V 12.5V 4.1V Turn-Off Threshold 6.9V 7.4V 8.3V 3.6V 8.3V 3.6V BLOCK DIAGRAM UDG92009-3 SLUS270C - MARCH 1999 - REVISED JANUARY 2005 UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 CONNECTION DIAGRAMS ABSOLUTE MAXIMUM RATINGS (Note 1) VCC Voltage (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0V VCC Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 30.0mA OUT Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0A OUT Energy (Capacitive Load) . . . . . . . . . . . . . . . . . . . 20.0J Analog Inputs (FB, CS) . . . . . . . . . . . . . . . . . . . . -0.3V to 6.3V Power Dissipation at TA < +25C (N or J Package) . . . . . 1.0W Power Dissipation at TA < +25C (D Package). . . . . . . . 0.65W Power Dissipation at TA < +25C (L Package) . . . . . . . 1.375W Storage Temperature Range. . . . . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . +300C Note 1: Values beyond which damage may occur. All voltages are with respect to GND. All currents are positive into the specified terminal. Consult Unitrode databook for information regarding thermal specifications and limitations of packages. Note 2: In normal operation VCC is powered through a current limiting resistor. Absolute maximum of 12V applies when VCC is driven from a low impedance source such that ICC does not exceed 30mA (which includes gate drive current requirement). The resistor should be sized so that the VCC voltage, under operating conditions is below 12V but above the turn off threshold. TSSOP-8 (Top View) PW Package 1 COMP REF 8 2 FB VCC 7 3 CS OUT 6 4 RC GND 5 DIL-8, SOIC-8 (Top View) J or N, D Package COMP 1 8 REF FB 2 7 VCC CS 3 6 OUT RC 4 5 GND TEMPERATURE AND PACKAGE SELECTION UCC180X UCC280X UCC380X Temperature Range -55C to +125C -40C to +85C 0C to +70C Available Packages J, L N, D, PW N, D, PW LCC-20 (TOP VIEW) L Package ORDERING INFORMATION UCC 80 P ACKAGE P RODUCT OP TION TEMP ERATURE RANGE 2 PACKAGE PIN FUNCTION FUNCTION PIN N/C 1 Comp 2 N/C 3-4 FB 5 N/C 6 CS 7 N/C 8-9 RC 10 N/C 11 PWR GND 12 GND 13 N/C 14 OUT 15 N/C 16 VCC 17 N/C 18-19 REF 20 UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for -55C TA +125C for UCC180x; -40C TA +85C for UCC280x; 0C TA +70C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC; CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ. PARAMETER TEST CONDITIONS UCC180X UCC280X MIN TYP UCC380X MAX MIN UNITS TYP MAX TJ=+25C, I=0.2mA, UCCx800/1/2/4 4.925 5.00 5.075 4.925 5.00 5.075 TJ=+25C, I=0.2mA, UCCx803/5 3.94 4.00 4.06 10 25 mV Reference Section Output Voltage 4.00 4.06 10 30 3.94 V Load Regulation 0.2mA<I<5mA Line Regulation TJ=+25C, VCC=10V to Clamp (IVCC=25mA) 1.9 1.9 mV/V TJ=-55C to +125C, VCC=10V to Clamp (IVCC=25mA) 2.5 2.1 mV/V Total Variation UCCx800/1/2/4 (Note 7) 4.88 5.00 5.10 4.88 5.00 5.10 V UCCx803/5 (Note 7) 3.90 4.00 4.08 3.90 4.00 4.08 V Output Noise Voltage 10Hz f 10kHz, TJ=+25C (Note 9) Long Term Stability TA=+125C, 1000 Hours (Note 9) Output Short Circuit 130 130 V 5 5 mV -5 -35 -5 46 52 40 31 36 26 -35 mA 46 52 kHz 31 36 kHz Oscillator Section Oscillator Frequency Temperature Stability UCCx800/1/2/4 (Note 4) 40 UCCx803/5 (Note 4) 26 (Note 9) 2.5 Amplitude peak-to-peak 2.25 Oscillator Peak Voltage 2.40 2.5 2.55 2.25 2.45 2.40 % 2.55 2.45 V V Error Amplifier Section Input Voltage COMP=2.5V; UCCx800/1/2/4 2.44 2.50 2.56 2.44 2.50 2.56 COMP=2.0V; UCCx803/5 1.95 2.0 2.05 1.95 2.0 2.05 1 -1 Input Bias Current -1 Open Loop Voltage Gain 60 COMP Sink Current FB=2.7V, COMP=1.1V 0.3 COMP Source Current FB=1.8V, COMP=REF-1.2V -0.2 Gain Bandwidth Product (Note 9) 80 -0.5 60 3.5 0.4 -0.8 -0.2 2 1 80 A dB 2.5 -0.5 V -0.8 2 mA mA MHz PWM Section Maximum Duty Cycle Minimum Duty Cycle UCCx800/2/3 97 99 100 97 99 100 UCCx801/4/5 48 49 50 48 49 50 COMP=0V 0 % 0 % Current Sense Section Gain (Note 5) 1.10 1.65 1.80 1.10 1.65 1.80 V/V Maximum Input Signal COMP=5V (Note 6) 0.9 1.0 1.1 0.9 1.0 1.1 V -200 Input Bias Current CS Blank Time Over-Current Threshold COMP to CS Offset CS=0V 3 200 -200 200 nA 50 100 150 50 100 150 ns 1.42 1.55 1.68 1.42 1.55 1.68 V 0.45 0.90 1.35 0.45 0.90 1.35 V UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for -55C TA +125C for UCC180x; -40C TA +85C for UCC280x; 0C TA +70C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC; CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ. PARAMETER TEST CONDITIONS UCC180X UCC280X UCC380X UNITS Output Section OUT Low Level I=20mA, all parts 0.1 0.4 0.1 0.4 V I=200mA, all parts 0.35 0.90 0.35 0.90 V I=50mA, VCC=5V, UCCx803/5 0.15 0.40 0.15 0.40 V I=20mA, VCC=0V, all parts 0.7 1.2 0.7 1.2 V I=-20mA, all parts 0.15 0.40 0.15 0.40 V I=-200mA, all parts 1.0 1.9 1.0 1.9 V I=-50mA,VCC=5V, UCCx803/5 0.4 0.9 0.4 0.9 V Rise Time CL=1nF 41 70 41 70 ns Fall Time CL=1nF 44 75 44 75 ns OUT High VSAT (VCC-OUT) Undervoltage Lockout Section Start Threshold (Note 8) Stop Threshold (Note 8) UCCx800 6.6 7.2 7.8 6.6 7.2 7.8 V UCCx801 8.6 9.4 10.2 8.6 9.4 10.2 V UCCx802/4 11.5 12.5 13.5 11.5 12.5 13.5 V UCCx803/5 3.7 4.1 4.5 3.7 4.1 4.5 V UCCx1800 6.3 6.9 7.5 6.3 6.9 7.5 V UCCx1801 6.8 7.4 8.0 6.8 7.4 8.0 V UCCx802/4 7.6 8.3 9.0 7.6 8.3 9.0 V UCCx803/5 3.2 3.6 4.0 3.2 3.6 4.0 V Undervoltage Lockout Section (cont.) Start to Stop Hysteresis UCCx800 0.12 0.3 0.48 0.12 0.3 0.48 V UCCx801 1.6 2 2.4 1.6 2 2.4 V UCCx802/4 3.5 4.2 5.1 3.5 4.2 5.1 V UCCx803/5 0.2 0.5 0.8 0.2 0.5 0.8 V 4 10 4 10 ms Soft Start Section COMP Rise Time FB=1.8V, Rise from 0.5V to REF-1V Overall Section Start-up Current VCC < Start Threshold 0.1 0.2 0.1 0.2 mA Operating Supply Current FB=0V, CS=0V 0.5 1.0 0.5 1.0 mA VCC Internal Zener Voltage ICC=10mA (Note 8), (Note 10) 12 13.5 15 12 13.5 15 V 0.5 1.0 0.5 1.0 VCC Internal Zener Voltage Minus UCCx802/4 (Note 8) Start Threshold Voltage Note 3: Adjust VCC above the start threshold before setting at 10V. Note 4: Oscillator frequency for the UCCx800, UCCx802 and UCCx803 is the output frequency. Oscillator frequency for the UCCx801, UCCx804 and UCCx805 is twice the output frequency. VCOMP Note 5: Gain is defined by: A = 0 VCS 0.8V . VCS Note 6: Parameter measured at trip point of latch with Pin 2 at 0V. Note 7: Total Variation includes temperature stability and load regulation. Note 8: Start Threshold, Stop Threshold and Zener Shunt Thresholds track one another. Note 9: Guaranteed by design. Not 100% tested in production. Note 10: The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current. 4 V UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 PIN DESCRIPTIONS COMP: COMP is the output of the error amplifier and the input of the PWM comparator. performance, keep the timing capacitor lead to GND as short and direct as possible. If possible, use separate ground traces for the timing capacitor and all other functions. Unlike other devices, the error amplifier in the UCC3800 family is a true, low output-impedance, 2MHz operational amplifier. As such, the COMP terminal can both source and sink current. However, the error amplifier is internally current limited, so that you can command zero duty cycle by externally forcing COMP to GND. The frequency of oscillation can be estimated with the following equations: UCCx800/1/2/4: The UCC3800 family features built-in full cycle Soft Start. Soft Start is implemented as a clamp on the maximum COMP voltage. F= UCCx803, UCCx805: 1.5 R *C F= 10 . R *C where frequency is in Hz, resistance is in ohms, and capacitance is in farads. The recommended range of timing resistors is between 10k and 200k and timing capacitor is 100pF to 1000pF. Never use a timing resistor less than 10k. CS: CS is the input to the current sense comparators. The UCC3800 family has two different current sense comparators: the PWM comparator and an over-current comparator. The UCC3800 family contains digital current sense filtering, which disconnects the CS terminal from the current sense comparator during the 100ns interval immediately following the rising edge of the OUT pin. This digital filtering, also called leading-edge blanking, means that in most applications, no analog filtering (RC filter) is required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller effective CS to OUT propagation delay. Note, however, that the minimum non-zero On-Time of the OUT signal is directly affected by the leading-edge-blanking and the CS to OUT propagation delay. To prevent noise problems, bypass VCC to GND with a ceramic capacitor as close to the VCC pin as possible. An electrolytic capacitor may also be used in addition to the ceramic capacitor. REF: REF is the voltage reference for the error amplifier and also for many other functions on the IC. REF is also used as the logic power supply for high speed switching logic on the IC. When VCC is greater than 1V and less than the UVLO threshold, REF is pulled to ground through a 5k ohm resistor. This means that REF can be used as a logic output indicating power system status. It is important for reference stability that REF is bypassed to GND with a ceramic capacitor as close to the pin as possible. An electrolytic capacitor may also be used in addition to the ceramic capacitor. A minimum of 0.1F ceramic is required. Additional REF bypassing is required for external loads greater than 2.5mA on the reference. The over-current comparator is only intended for fault sensing, and exceeding the over-current threshold will cause a soft start cycle. FB: FB is the inverting input of the error amplifier. For best stability, keep FB lead length as short as possible and FB stray capacitance as small as possible. GND: GND is reference ground and power ground for all functions on this part. To prevent noise problems with high speed switching transients, bypass REF to ground with a ceramic capacitor very close to the IC package. OUT: OUT is the output of a high-current power driver capable of driving the gate of a power MOSFET with peak currents exceeding 750mA. OUT is actively held low when VCC is below the UVLO threshold. VCC: VCC is the power input connection for this device. In normal operation VCC is powered through a current limiting resistor. Although quiescent VCC current is very low, total supply current will be higher, depending on OUT current. Total VCC current is the sum of quiescent VCC current and the average OUT current. Knowing the operating frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from: The high-current power driver consists of FET output devices, which can switch all of the way to GND and all of the way to VCC. The output stage also provides a very low impedance to overshoot and undershoot. This means that in many cases, external schottky clamp diodes are not required. IOUT = Q g x F . RC: RC is the oscillator timing pin. For fixed frequency operation, set timing capacitor charging current by connecting a resistor from REF to RC. Set frequency by connecting a timing capacitor from RC to GND. For best There should be a minimum of 1.0mF in parallel with a 0.1mF ceramic capacitor from VCC to ground located close to the device 5 UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 The UCC3800/1/2/3/4/5 oscillator generates a sawtooth waveform on RC. The rise time is set by the time constant of RT and CT. The fall time is set by CT and an internal transistor on-resistance of approximately 125 . During the fall time, the output is off and the maximum duty cycle is reduced below 50% or 100% depending on the part number. Larger timing capacitors increase the discharge time and reduce the maximum duty cycle and frequency. Figure 2. Error amplifier gain/phase response. Figure 1. Oscillator. 4.00 1000 Oscillator Freq. (kHz) 3.98 3.96 VREF (V) 3.94 3.92 3.90 3.88 10 0p F 100 20 0p 33 F 0p F 3.86 3.84 1n F 10 3.82 4 4.2 4.4 4.6 4.8 5 5.2 VCC (V) 5.4 5.6 5.8 10 6 100 1000 RT (k ) Figure 3. UCC1803/5 VREF vs. VCC; ILOAD = 0.5mA. Figure 4. UCC1800/1/2/4 oscillator frequency vs. RT and CT. 6 UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 1000 100 Maximum Duty Cycle (%) 0p F 20 0p F 33 0p 98 97.5 97 96.5 F 96 95.5 1n F 10 10 pF 00 =1 CT pF 00 =2 pF 30 =3 10 98.5 CT 100 99 CT Oscillator Freq. (kHz) 99.5 95 100 1000 10 100 RT (k ) Figure 5. UCC1803/5 oscillator frequency vs. RT and CT. Figure 6. UCC1800/2/3 maximum duty cycle vs. oscillator frequency. 50 16 49.5 14 12 49 CT ICC (mA) pF 00 pF 30 =3 00 =2 pF 48 nF ,1 0V =1 C 10 =1 CT 48.5 CT Maximum Duty Cycle (%) 1000 Oscillator Frequency (kHz) VC 8 F n V, 1 =8 C VC 6 ad 47.5 4 47 VCC = VCC = 8V, 2 0 0 46.5 10 100 1000 o Lo 10V, N 100 200 300 400 500 600 700 No Load 800 Oscillator Frequency (kHz) Oscillator Frequency (kHz) Figure 7. UCC1801/4/5 maximum duty cycle vs. oscillator frequency. Figure 8. UCC1800 ICC vs. oscillator frequency. 7 900 1000 UCC1800/1/2/3/4/5 UCC2800/1/2/3/4/5 UCC3800/1/2/3/4/5 8 500 450 7 UCC1803/5 , 0V C VC ICC (mA) 5 400 =1 Dead Time (ns) 6 F 1n nF 1 V, 8 C= 4 VC 3 VCC = 2 d o Loa 10V, N 250 UCC1800/1/2/4 200 100 50 0 100 200 300 400 500 600 700 800 100 900 1000 Figure 8. UCC1805 ICC vs. oscillator frequency. 1.0 0.9 Slope = 1.8mV/C 0.7 0.6 0 -55-50 -25 0 25 50 75 300 400 500 600 700 Figure 9. Dead time vs. CT, RT = 100k. 1.1 0.8 200 CT (pF) Oscillator Frequency (kHz) COMP to CS Offset (Volts) 300 150 d , No Loa VCC = 8V 1 0 0 350 100 125 Temperature (C) Figure 10. COMP to CS offset vs. temperature, CS = 0V. 8 800 900 1000 PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9451301MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451302MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451303MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451304MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451305MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-9451305VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UCC1800J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1800J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1800L883B ACTIVE LCCC FK 20 1 TBD UCC1801J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1801J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type UCC1802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1802J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1803J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1804J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1804J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1805J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC1805J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC2800D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2800DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2800DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2800N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2800NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2800PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR UCC2800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR UCC2801D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2801DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2801DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC2801N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2801NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2801PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2801PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI UCC2802D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2802DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2802DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) Call TI UCC2802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC2802N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2802NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2802PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2802PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2802PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI UCC2803D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2803DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2803DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2803DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UCC2803N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2803NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2803PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2804D ACTIVE SOIC D 8 CU NIPDAU Level-1-260C-UNLIM 75 Addendum-Page 2 Green (RoHS & no Sb/Br) Call TI PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC2804D/70021 OBSOLETE SOIC D 8 TBD Call TI UCC2804D/81221 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804D/81221G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DR81221G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DTR/81221 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DTR/81260 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DTR/81260G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2804N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2804NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2804PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2805D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2805DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2805DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2805DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2805N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2805NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC2805PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2805PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2805PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI UCC3800D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3800DG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 Lead/Ball Finish MSL Peak Temp (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC3800DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3800N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3800NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3800PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3801D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3801DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3801DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3801N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3801NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3801PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3801PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3801PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3802D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3802DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3802DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3802N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3802NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3802PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC3802PWG4 ACTIVE TSSOP PW 8 UCC3802PWTRG4 ACTIVE TSSOP PW 8 UCC3803D ACTIVE SOIC D UCC3803DG4 ACTIVE SOIC UCC3803DTR ACTIVE UCC3803DTRG4 Lead/Ball Finish 150 Green (RoHS & no Sb/Br) TBD Call TI 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3803N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3803NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3803PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3804D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3804DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3804DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3804N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3804NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3804PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3805D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3805DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3805DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC3805DTR/81222G4 PREVIEW SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 5 CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Call TI PACKAGE OPTION ADDENDUM www.ti.com 10-Mar-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC3805DTRG4 ACTIVE SOIC D 8 UCC3805N ACTIVE PDIP P 8 50 UCC3805NG4 ACTIVE PDIP P 8 UCC3805PW ACTIVE TSSOP PW UCC3805PWG4 ACTIVE TSSOP UCC3805PWTRG4 ACTIVE TSSOP 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PW 8 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 6 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC2800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC2801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC2804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2804DTR/81221 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2804DTR/81260 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC2805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC3801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3801PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC3802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-Mar-2008 Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC3804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 UCC3805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC2800DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2800PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC2801DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2802DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2803DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2803PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC2804DTR SOIC D 8 2500 340.5 338.1 20.6 UCC2804DTR/81221 SOIC D 8 2500 340.5 338.1 20.6 UCC2804DTR/81260 SOIC D 8 2500 340.5 338.1 20.6 UCC2804PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC2805DTR SOIC D 8 2500 340.5 338.1 20.6 UCC3800DTR SOIC D 8 2500 340.5 338.1 20.6 UCC3800PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC3801DTR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC3801PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC3802DTR SOIC D 8 2500 340.5 338.1 20.6 UCC3803DTR SOIC D 8 2500 340.5 338.1 20.6 UCC3803PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC3804DTR SOIC D 8 2500 340.5 338.1 20.6 UCC3804PWTR TSSOP PW 8 2000 346.0 346.0 29.0 UCC3805DTR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 3 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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