UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
SLUS270C - MARCH 1999 - REVISED JANUARY 2005
FEATURES
•100µA Typical Starting Supply Current
•500µA Typical Operating Supply
Current
•Operation to 1MHz
•Internal Soft Start
•Internal Fault Soft Start
•Internal Leading-Edge Blanking of the
Current Sense Signal
•1 Amp Totem-Pole Output
•70ns Typical Response from
Current-Sense to Gate Drive Output
•1.5% Tolerance Voltage Reference
•Same Pinout as UC3842 and
UC3842A
DESCRIPTION
The UCC1800/1/2/3/4/5 family of high-speed, low-power integrated cir-
cuits contain all of the control and drive components required for off-line
and DC-to-DC fixed frequency current-mode switching power supplies
with minimal parts count.
These devices have the same pin configuration as the UC1842/3/4/5
family, and also offer the added features of internal full-cycle soft start
and internal leading-edge blanking of the current-sense input.
The UCC1800/1/2/3/4/5 family offers a variety of package options, tem-
perature range options, choice of maximum duty cycle, and choice of
critical voltage levels. Lower reference parts such as the UCC1803 and
UCC1805 fit best into battery operated systems, while the higher refer-
ence and the higher UVLO hysteresis of the UCC1802 and UCC1804
make these ideal choices for use in off-line power supplies.
The UCC180x series is specified for operation from –55oC to +125oC,
the UCC280x series is specified for operation from –40oCto+85
oC, and
the UCC380x series is specified for operation from 0oCto+70
oC.
Low-Power BiCMOS Current-Mode PWM
Part Number Maximum Duty Cycle Reference Voltage Turn-On Threshold Turn-Off Threshold
UCCx800 100% 5V 7.2V 6.9V
UCCx801 50% 5V 9.4V 7.4V
UCCx802 100% 5V 12.5V 8.3V
UCCx803 100% 4V 4.1V 3.6V
UCCx804 50% 5V 12.5V 8.3V
UCCx805 50% 4V 4.1V 3.6V
application
INFO
available
BLOCK DIAGRAM
UDG92009-3
2
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
DIL-8, SOIC-8 (Top View)
J or N, D Package
OUT
VCC
REF
GND
1
2
3
4
8
7
6
5
FB
COMP
CS
RC
ABSOLUTE MAXIMUM RATINGS (Note 1)
VCC Voltage (Note 2)............................ 12.0V
VCC Current (Note 2) .......................... 30.0mA
OUT Current...................................±1.0A
OUT Energy (Capacitive Load) ................... 20.0µJ
Analog Inputs (FB, CS).................... –0.3V to 6.3V
Power Dissipation at TA< +25°C (N or J Package) ..... 1.0W
Power Dissipation at TA< +25°C (D Package)........ 0.65W
Power Dissipation at TA< +25°C (L Package) .......1.375W
Storage Temperature Range............. –65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ........ +300°C
Note 1: Values beyond which damage may occur. All voltages
are with respect to GND. All currents are positive into
the specified terminal. Consult Unitrode databook for
information regarding thermal specifications and limita-
tions of packages.
Note 2: In normal operation VCC is powered through a current
limiting resistor. Absolute maximum of 12V applies
when VCC is driven from a low impedance source such
that ICC does not exceed 30mA (which includes gate
drive current requirement). The resistor should be
sized so that the VCC voltage, under operating condi-
tions is below 12V but above the turn off threshold.
COMP
FB
CS
RC
REF
VCC
OUT
GND
8
7
6
5
1
2
3
4
CONNECTION DIAGRAMS
TSSOP-8 (Top View)
PW Package
UCC
PRODUCT OPTION
P AC KAG E
80
TE MP E R ATUR E R ANG E
ORDERING INFORMATION
Temperature Range Available Packages
UCC180X –55°C to +125°C J, L
UCC280X –40°C to +85°C N, D, PW
UCC380X 0°C to +70°C N, D, PW
TEMPERATURE AND PACKAGE SELECTION
LCC-20
(TOP VIEW)
L Package PACKAGE PIN FUNCTION
FUNCTION PIN
N/C 1
Comp 2
N/C 3-4
FB 5
N/C 6
CS 7
N/C 8-9
RC 10
N/C 11
PWR GND 12
GND 13
N/C 14
OUT 15
N/C 16
VCC 17
N/C 18-19
REF 20
3
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for –55°C≤TA≤+125°C for
UCC180x; –40°C ≤TA≤+85°C for UCC280x; 0°C ≤TA≤+70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;
CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ.
PARAMETER TEST CONDITIONS UCC180X
UCC280X UCC380X UNITS
MIN TYP MAX MIN TYP MAX
Reference Section
Output Voltage TJ=+25°C, I=0.2mA, UCCx800/1/2/4 4.925 5.00 5.075 4.925 5.00 5.075 V
TJ=+25°C, I=0.2mA, UCCx803/5 3.94 4.00 4.06 3.94 4.00 4.06
Load Regulation 0.2mA<I<5mA 10 30 10 25 mV
Line Regulation TJ=+25°C,
VCC=10V to Clamp (IVCC=25mA) 1.9 1.9 mV/V
TJ=–55°C to +125°C,
VCC=10V to Clamp (IVCC=25mA) 2.5 2.1 mV/V
Total Variation UCCx800/1/2/4 (Note 7) 4.88 5.00 5.10 4.88 5.00 5.10 V
UCCx803/5 (Note 7) 3.90 4.00 4.08 3.90 4.00 4.08 V
Output Noise Voltage 10Hz ≤f≤10kHz, TJ=+25°C (Note 9) 130 130 µV
Long Term Stability TA=+125°C, 1000 Hours (Note 9) 5 5 mV
Output Short Circuit –5 –35 –5 –35 mA
Oscillator Section
Oscillator Frequency UCCx800/1/2/4 (Note 4) 40 46 52 40 46 52 kHz
UCCx803/5 (Note 4) 26 31 36 26 31 36 kHz
Temperature Stability (Note 9) 2.5 2.5 %
Amplitude peak-to-peak 2.25 2.40 2.55 2.25 2.40 2.55 V
Oscillator Peak Voltage 2.45 2.45 V
Error Amplifier Section
Input Voltage COMP=2.5V; UCCx800/1/2/4 2.44 2.50 2.56 2.44 2.50 2.56 V
COMP=2.0V; UCCx803/5 1.95 2.0 2.05 1.95 2.0 2.05
Input Bias Current –11–11µA
Open Loop Voltage Gain 60 80 60 80 dB
COMP Sink Current FB=2.7V, COMP=1.1V 0.3 3.5 0.4 2.5 mA
COMP Source Current FB=1.8V, COMP=REF–1.2V –0.2 –0.5 –0.8 –0.2 –0.5 –0.8 mA
Gain Bandwidth Product (Note 9) 2 2 MHz
PWM Section
Maximum Duty Cycle UCCx800/2/3 97 99 100 97 99 100 %
UCCx801/4/5 48 49 50 48 49 50
Minimum Duty Cycle COMP=0V 0 0 %
Current Sense Section
Gain (Note 5) 1.10 1.65 1.80 1.10 1.65 1.80 V/V
Maximum Input Signal COMP=5V (Note 6) 0.9 1.0 1.1 0.9 1.0 1.1 V
Input Bias Current –200 200 –200 200 nA
CS Blank Time 50 100 150 50 100 150 ns
Over-Current Threshold 1.42 1.55 1.68 1.42 1.55 1.68 V
COMP to CS Offset CS=0V 0.45 0.90 1.35 0.45 0.90 1.35 V
4
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
ELECTRICAL CHARACTERISTICSUnless otherwise stated, these specifications apply for –55°C≤TA≤+125°C for
UCC180x; –40°C ≤TA≤+85°C for UCC280x; 0°C ≤TA≤+70°C for UCC380x; VCC=10V (Note 3); RT=100k from REF to RC;
CT=330pF from RC to GND; 0.1 F capacitor from VCC to GND; 0.1 F capacitor from VREF to GND. TA=TJ.
PARAMETER TEST CONDITIONS UCC180X
UCC280X UCC380X UNITS
Output Section
OUT Low Level I=20mA, all parts 0.1 0.4 0.1 0.4 V
I=200mA, all parts 0.35 0.90 0.35 0.90 V
I=50mA, VCC=5V, UCCx803/5 0.15 0.40 0.15 0.40 V
I=20mA, VCC=0V, all parts 0.7 1.2 0.7 1.2 V
OUT High VSAT
(VCC-OUT) I=–20mA, all parts 0.15 0.40 0.15 0.40 V
I=–200mA, all parts 1.0 1.9 1.0 1.9 V
I=–50mA,VCC=5V, UCCx803/5 0.4 0.9 0.4 0.9 V
Rise Time CL=1nF 41 70 41 70 ns
Fall Time CL=1nF 44 75 44 75 ns
Undervoltage Lockout Section
Start Threshold (Note 8) UCCx800 6.6 7.2 7.8 6.6 7.2 7.8 V
UCCx801 8.6 9.4 10.2 8.6 9.4 10.2 V
UCCx802/4 11.5 12.5 13.5 11.5 12.5 13.5 V
UCCx803/5 3.7 4.1 4.5 3.7 4.1 4.5 V
Stop Threshold (Note 8) UCCx1800 6.3 6.9 7.5 6.3 6.9 7.5 V
UCCx1801 6.8 7.4 8.0 6.8 7.4 8.0 V
UCCx802/4 7.6 8.3 9.0 7.6 8.3 9.0 V
UCCx803/5 3.2 3.6 4.0 3.2 3.6 4.0 V
Undervoltage Lockout Section (cont.)
Start to Stop Hysteresis UCCx800 0.12 0.3 0.48 0.12 0.3 0.48 V
UCCx801 1.6 2 2.4 1.6 2 2.4 V
UCCx802/4 3.5 4.2 5.1 3.5 4.2 5.1 V
UCCx803/5 0.2 0.5 0.8 0.2 0.5 0.8 V
Soft Start Section
COMP Rise Time FB=1.8V, Rise from 0.5V to REF–1V 4 10 4 10 ms
Overall Section
Start-up Current VCC < Start Threshold 0.1 0.2 0.1 0.2 mA
Operating Supply Current FB=0V, CS=0V 0.5 1.0 0.5 1.0 mA
VCC Internal Zener Voltage ICC=10mA (Note 8), (Note 10) 12 13.5 15 12 13.5 15 V
VCC Internal Zener Voltage Minus
Start Threshold Voltage UCCx802/4 (Note 8) 0.5 1.0 0.5 1.0 V
Note 3: Adjust VCC above the start threshold before setting at 10V.
Note 4: Oscillator frequency for the UCCx800, UCCx802 and UCCx803 is the output frequency.
Oscillator frequency for the UCCx801, UCCx804 and UCCx805 is twice the output frequency.
Note 5: Gain is defined by: AV
V
VV
COMP
CS
CS
=≤≤
∆
∆
008..
Note 6: Parameter measured at trip point of latch with Pin 2 at 0V.
Note 7: Total Variation includes temperature stability and load regulation.
Note 8: Start Threshold, Stop Threshold and Zener Shunt Thresholds track one another.
Note 9: Guaranteed by design. Not 100% tested in production.
Note 10: The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.
5
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
PIN DESCRIPTIONS
COMP: COMP is the output of the error amplifier and the
input of the PWM comparator.
Unlike other devices, the error amplifier in the UCC3800
family is a true, low output-impedance, 2MHz operational
amplifier. As such, the COMP terminal can both source
and sink current. However, the error amplifier is internally
current limited, so that you can command zero duty cycle
by externally forcing COMP to GND.
The UCC3800 family features built-in full cycle Soft Start.
Soft Start is implemented as a clamp on the maximum
COMP voltage.
CS: CS is the input to the current sense comparators.
The UCC3800 family has two different current sense
comparators: the PWM comparator and an over-current
comparator.
The UCC3800 family contains digital current sense filter-
ing, which disconnects the CS terminal from the current
sense comparator during the 100ns interval immediately
following the rising edge of the OUT pin. This digital filter-
ing, also called leading-edge blanking, means that in
most applications, no analog filtering (RC filter) is re-
quired on CS. Compared to an external RC filter tech-
nique, the leading-edge blanking provides a smaller
effective CS to OUT propagation delay. Note, however,
that the minimum non-zero On-Time of the OUT signal is
directly affected by the leading-edge-blanking and the CS
to OUT propagation delay.
The over-current comparator is only intended for fault
sensing, and exceeding the over-current threshold will
cause a soft start cycle.
FB: FB is the inverting input of the error amplifier. For
best stability, keep FB lead length as short as possible
and FB stray capacitance as small as possible.
GND: GND is reference ground and power ground for all
functions on this part.
OUT: OUT is the output of a high-current power driver ca-
pable of driving the gate of a power MOSFET with peak
currents exceeding ±750mA. OUT is actively held low
when VCC is below the UVLO threshold.
The high-current power driver consists of FET output de-
vices, which can switch all of the way to GND and all of
the way to VCC. The output stage also provides a very
low impedance to overshoot and undershoot. This means
that in many cases, external schottky clamp diodes are
not required.
RC: RC is the oscillator timing pin. For fixed frequency
operation, set timing capacitor charging current by con-
necting a resistor from REF to RC. Set frequency by con-
necting a timing capacitor from RC to GND. For best
performance, keep the timing capacitor lead to GND as
short and direct as possible. If possible, use separate
ground traces for the timing capacitor and all other func-
tions.
The frequency of oscillation can be estimated with the
following equations:
UCCx800/1/2/4: FRC
=•
15.
UCCx803, UCCx805: FRC
=•
10.
where frequency is in Hz, resistance is in ohms, and ca-
pacitance is in farads. The recommended range of timing
resistors is between 10k and 200k and timing capacitor is
100pF to 1000pF. Never use a timing resistor less than
10k.
To prevent noise problems, bypass VCC to GND with a
ceramic capacitor as close to the VCC pin as possible.
An electrolytic capacitor may also be used in addition to
the ceramic capacitor.
REF: REF is the voltage reference for the error amplifier
and also for many other functions on the IC. REF is also
used as the logic power supply for high speed switching
logic on the IC.
When VCC is greater than 1V and less than the UVLO
threshold, REF is pulled to ground through a 5k ohm re-
sistor. This means that REF can be used as a logic out-
put indicating power system status. It is important for
reference stability that REF is bypassed to GND with a
ceramic capacitor as close to the pin as possible. An
electrolytic capacitor may also be used in addition to the
ceramic capacitor. A minimum of 0.1µF ceramic is re-
quired. Additional REF bypassing is required for external
loads greater than 2.5mA on the reference.
To prevent noise problems with high speed switching
transients, bypass REF to ground with a ceramic capaci-
tor very close to the IC package.
VCC: VCC is the power input connection for this device.
In normal operation VCC is powered through a current
limiting resistor. Although quiescent VCC current is very
low, total supply current will be higher, depending on
OUT current. Total VCC current is the sum of quiescent
VCC current and the average OUT current. Knowing the
operating frequency and the MOSFET gate charge (Qg),
average OUT current can be calculated from:
IQF
OUT g
=×
.
There should be a minimum of 1.0mF in parallel with a
0.1mF ceramic capacitor from VCC to ground located
close to the device
6
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
Figure 1. Oscillator. Figure 2. Error amplifier gain/phase response.
The UCC3800/1/2/3/4/5 oscillator generates a sawtooth
waveform on RC. The rise time is set by the time constant
of RTand CT. The fall time is set by CT and an internal tran-
sistor on-resistance of approximately 125 . During the fall
time, the output is off and the maximum duty cycle is re-
duced below 50% or 100% depending on the part number.
Larger timing capacitors increase the discharge time and re-
duce the maximum duty cycle and frequency.
4.00
3.98
3.96
3.94
3.92
3.90
3.88
3.86
3.84
3.824 4.2 4.4 4.6 4.8 55.2 5.4 5.6 5.8 6
V (V)
CC
V (V)
REF
Figure 3. UCC1803/5 VREF vs. VCC;I
LOAD = 0.5mA.
1000
100
1010 100 1000
Oscillator Freq. (kHz)
R(k)
T
100pF
200pF
330pF
1nF
Figure 4. UCC1800/1/2/4 oscillator frequency vs. RTand
CT.
7
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
46.5
47
47.5
48
48.5
49
49.5
50
10 100 1000
Oscillator Frequency (kHz)
Maximum Duty Cycle (%)
C = 100pF
T
C = 200pF
T
C = 330pF
T
Figure 7. UCC1801/4/5 maximum duty cycle vs.
oscillator frequency.
0
2
4
6
8
10
12
14
16
0 100 200 300 400 500 600 700 800 900 1000
Oscillator Frequency (kHz)
I (mA)
CC
V = 10V, 1nF
CC
V = 8V, 1nF
CC
V = 10V, No Load
CC
V = 8V, No Load
CC
Figure 8. UCC1800 ICC vs. oscillator frequency.
95
95.5
96
96.5
97
97.5
98
98.5
99
99.5
100
10 100 1000
Oscillator Frequency (kHz)
Maximum Duty Cycle (%)
C = 100pF
T
C = 200pF
T
C = 330pF
T
Figure 6. UCC1800/2/3 maximum duty cycle vs.
oscillator frequency.
1000
100
1010 100 1000
Oscillator Freq. (kHz)
R(k)T
100pF
200pF
330pF
1nF
Figure 5. UCC1803/5 oscillator frequency vs. RTand CT.
8
UCC1800/1/2/3/4/5
UCC2800/1/2/3/4/5
UCC3800/1/2/3/4/5
0
50
100
150
200
250
300
350
400
450
500
100 200 300 400 500 600 700 800 900 1000
C (pF)
T
Dead Time (ns)
UCC1803/5
UCC1800/1/2/4
Figure 9. Dead time vs. CT,R
T= 100k.
0
0.6
0.7
0.8
0.9
1.0
1.1
-55-50 -25 0 25 50 75 100 125
Temperature (°C)
COMP to CS Offset (Volts)
Slope = 1.8mV/ C°
Figure 10. COMP to CS offset vs. temperature,
CS=0V.
0
1
2
3
4
5
6
7
8
0 100 200 300 400 500 600 700 800 900 1000
Oscillator Frequency (kHz)
I (mA)
CC
V = 10V, 1nF
CC
V = 8V, 1nF
CC
V = 10V, No Load
CC
V = 8V, No Load
CC
Figure 8. UCC1805 ICC vs. oscillator frequency.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9451301MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-9451302MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-9451303MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-9451304MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-9451305MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-9451305VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UCC1800J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1800J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1800L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UCC1801J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1801J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1802J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1803J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1804J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1804J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1805J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC1805J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC2800D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2800DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2800DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2800N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2800NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2800PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) Call TI Level-2-260C-1 YEAR
UCC2800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) Call TI Level-2-260C-1 YEAR
UCC2801D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2801DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2801DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UCC2801N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2801NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2801PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2801PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
UCC2802D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2802DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2802DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2802J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC2802N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2802NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2802PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2802PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2802PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
UCC2803D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2803DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2803DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2803DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2803J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UCC2803N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2803NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2803PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2804D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC2804D/70021 OBSOLETE SOIC D 8 TBD Call TI Call TI
UCC2804D/81221 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804D/81221G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DR81221G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DTR/81221 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DTR/81260 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DTR/81260G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2804N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2804NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2804PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2805D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2805DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2805DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2805DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC2805N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2805NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC2805PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2805PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2805PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
UCC3800D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3800DG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 3
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UCC3800DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3800DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3800N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3800NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3800PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3800PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3800PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3800PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3801D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3801DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3801DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3801DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3801N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3801NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3801PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3801PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3801PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3801PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3802D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3802DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3802DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3802DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3802N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3802NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3802PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 4
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC3802PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3802PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
UCC3803D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3803DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3803DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3803DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3803N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3803NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3803PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3803PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3803PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3803PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3804D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3804DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3804DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3804DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3804N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3804NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3804PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3804PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3804PWTR ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3804PWTRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3805D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3805DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3805DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3805DTR/81222G4 PREVIEW SOIC D 8 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 5
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC3805DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC3805N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3805NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3805PW ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3805PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3805PWTRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Mar-2008
Addendum-Page 6
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC2800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC2801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC2804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2804DTR/81221 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2804DTR/81260 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC2804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC2805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3800DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3800PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC3801DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3801PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC3802DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3803DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3803PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC3804DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC3804PWTR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
UCC3805DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC2800DTR SOIC D 8 2500 340.5 338.1 20.6
UCC2800PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC2801DTR SOIC D 8 2500 340.5 338.1 20.6
UCC2802DTR SOIC D 8 2500 340.5 338.1 20.6
UCC2803DTR SOIC D 8 2500 340.5 338.1 20.6
UCC2803PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC2804DTR SOIC D 8 2500 340.5 338.1 20.6
UCC2804DTR/81221 SOIC D 8 2500 340.5 338.1 20.6
UCC2804DTR/81260 SOIC D 8 2500 340.5 338.1 20.6
UCC2804PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC2805DTR SOIC D 8 2500 340.5 338.1 20.6
UCC3800DTR SOIC D 8 2500 340.5 338.1 20.6
UCC3800PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC3801DTR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC3801PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC3802DTR SOIC D 8 2500 340.5 338.1 20.6
UCC3803DTR SOIC D 8 2500 340.5 338.1 20.6
UCC3803PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC3804DTR SOIC D 8 2500 340.5 338.1 20.6
UCC3804PWTR TSSOP PW 8 2000 346.0 346.0 29.0
UCC3805DTR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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