LDA200 Solid State Current Sensors Break Down Voltage Current Transfer Ratio Saturation Voltage Input Control Current LDA200 20 100 .5 6 Units V % V mA Features * AC and DC Input Versions Available * Small 8 Pin DIP Package * 100mA Continuous Load Rating * 3750VRMS Input/Output Isolation * Machine Insertable, Wave Solderable * Surface Mount and Tape & Reel Versions Available Applications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Loop Detect * Ring Detect * Current Sensing Description LDA200 is a dual optocoupler with a single or darlington transistor output. The product features a bidirectional input. Current transfer ratios range from 33% to 1000% Approvals * UL Recognized: File Number E76270 * CSA Certified: File Number LR 43639-10 * BSI Certified: * BS EN 60950:1992 (BS7002:1992) Certificate #:7344 * BS EN 41003:1993 Certificate #:7344 Ordering Information Part # LDA200 LDA200S LDA200STR Description 8 Pin DIP (50/Tube) 8 Pin Surface Mount (50/Tube) 8 Pin Surface Mount (1000/Reel) Pin Configuration LDA200 Pinout DS-LDA200-R1.0 www.clare.com 1 8 2 7 3 6 4 5 1 LDA200 Absolute Maximum Ratings (@ 25 C) Parameter Input Power Dissipation Input Control Current Peak (10ms) Reverse Input Voltage Phototransistor Power Dissipation Total Package Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Soldering Temperature DIP Package Surface Mount Package (10 Seconds Max.) 1 2 3 Min Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability. Typ Max Units - - 1501 100 1 5 1502 mW mA A V mW - - 8003 mW 3750 -40 -40 - VRMS C +85 +125 C - - +260 +220 C C Derate Linearly 1.33 mw/oC Derate Linearly 2.0 mw/oC Derate Linearly 6.67 mw/oC Electrical Characteristics Parameter Output Characteristics @ 25C Phototransistor Blocking Voltage Phototransistor Output Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics @ 25C Input Control Current Input Voltage Drop Input Reverse Voltage (LDA201, LDA211) Input Reverse Current (LDA201, LDA211) Common Characteristics @ 25C Input to Output Isolation 2 Conditions Symbol Min Typ Max Units IC=10A VCE=5V, IF=0mA IC=2mA, IF=16mA IC=.15mA, IF=.05mA IF=6mA, VCE=0.5V 50V, f=1 MHz BVCEO ICEO VSAT VSAT CTR COUT 20 33 - 50 50 0.3 100 3 500 0.5 - V nA V V % pF IC=2mA, VCE=0.5V IF=5mA - IF VF VR 6 0.9 - 2 1.2 - 100 1.4 5 mA V V VR=5V IR - - 10 nA - VI/O 3750 - - VRMS www.clare.com Rev. 1.0 LDA200 LDA200 Typical Normalized CTR vs. Forward Current (VCE = 0.5V) LDA200 Typical Normalized CTR vs. Temperature (VCE = 0.5V) 4.5 8 4.0 7 3.5 3.0 2.5 2.0 1.5 1.0 3 2 0 6 8 10 12 IF (mA) 14 16 18 20 8 4 1 4 10 5 0 2 12 6 0.5 0 LDA200 Typical Collector Current vs. Forward Current (VCE = 0.5V) -40 -20 0 20 40 60 1mA 2mA 5mA 10mA 15mA 20mA 80 100 120 Temperature (C) IC (mA) Normalized CTR (%) Normalized CTR (%) PERFORMANCE DATA* 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 IF (mA) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Rev. 1.0 www.clare.com 3 LDA200 MECHANICAL DIMENSIONS 9.652 .381 (.380 .015) 8 Pin DIP Surface Mount ("S" Suffix) 2.540 .127 (.100 .005) 7.620 .254 (.300 .010) 4.445 .127 (.175 .005) 3.302 (.130) (.100 .005) 9.525 .254 (.375 .010) 6.350 .127 (.250 .005) .635 TYP. (.025) PC Board Pattern (Top View) 2.540 .127 8.305 .127 (.327 .005) 1.905 .127 (.075 .005) .254 TYP. (.010) .457 .076 (.018 .003) 1.498 .127 (.059 .005) 8.077 .127 (.318 .005) 9.652 .381 (.380 .015) 8 Pin DIP Through Hole (Standard) 7.620 .254 (.300 .010) 7.239 TYP. (.285) PC Board Pattern (Top View) 2.540 .127 (.100 .005) 3.302 (.130) 9.144 .508 (.360 .020) 6.350 .127 (.250 .005) 9.144 TYP. (.360) 2.540 .127 8-.800 DIA. (.100 .005) (8-.031 DIA.) 7.620 .127 (.300 .005) 6.350 .127 (.250 .005) .457 .076 (.018 .003) 7.620 .127 (.300 .005) 8.077 .127 (.318 .005 ) Tape and Reel Packaging for 8 Pin Surface Mount Package 330.2 DIA. (13.00) Top Cover Tape Thickness .102 MAX. (.004) 6.731 MAX. 1.753 .102 (.265) (.069 .004) .406 MAX. (.016) 2.007 .102 1.498 .102 3.987 .102 (.079 .004) (.059 .004) (.157 .004) 7.493 .102 (.295 .004) 1 8 12.090 (.476) 10.300 (.405) 4.877 (.192) Top Cover Tape Embossed Carrier Embossment 16.002 .305 (.630 .012) .050R TYP. 11.989 .102 (.472 .004) 10.300 .102 (.405 .004) 1.549 .102 (.061 .004) User Direction of Feed Dimensions mm (inches) 4 www.clare.com Rev. 1.0 For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-LDA200-R1.0 (c)Copyright 2002, Clare, Inc. All rights reserved. Printed in USA. 6/3/02