AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
1
EEPROM
AS8E512K8
GENERAL DESCRIPTION
The AS8E512K8 is a 4 Megabit CMOS EEPROM Mod-
ule organized as 512K x 8-bits. It is built with four 128K x 8
components and a single decoder. The AS8E512K8 achieves
high speed access, low power consumption and high reliability
by employing advanced CMOS memory technology . Software
data protection is implemented using the JEDEC Optional
Standard algorithm.
This military temperature grade product is ideally suited
for military and space applications requiring high reliability.
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-93091
• MIL-STD-883
FEATURES
• Access times of 150, 200, 250, and 300 ns
• JEDEC Compatible Pinout
• 10,000 Write Endurance Cycles
• 10 year Data Retention
• Organized as 512Kx8
• Operation with single 5 volt supply
• Low power CMOS
• TTL Compatible Inputs and Outputs
OPTIONS MARKING
• Packaging
32 pin 600 MIL DIP CW No. 112
• Timing
150ns -150
200ns -200
250ns -250
300ns -300
• Operating Temperature Range
-Military (-55oC to +125oC) XT
-Industrial (-40oC to +85oC) IT
512K x 8 EEPROM
EEPROM Module PIN ASSIGNMENT
(Top View)
32-Pin DIP & 32-Pin SOJ (CW)
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O 0
I/O 1
I/O 2
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
WE\
A17
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
For more products and information
please visit our web site at
www.micross.com
A0 - A18 Address Inputs
I/O 0 - I/O 7 Data Inputs/Outputs
CE\ Chip Select
OE\ Output Enable
WE \ Write Enable
Vcc +5.0V Power
PIN DESCRIPTION
A17
A18
CE\
I/O 0 - I/O 7
OE\
1 of 4
Decoder
U1
U4U2
U3
I/O 0 - I/O 7 I/O 0 - I/O 7
I/O 0 - I/O 7 I/O 0 - I/O 7
A0
-
A16
A0 - A16 A0 - A16
WE\
A0 - A16
WE
\
WE\
WE
\
OE\ OE\ OE\
CE\
A
0 - A16
CE\
CE\
CE\
WE\
OE\
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
2
EEPROM
AS8E512K8
TOGGLE BIT:
In addition to DATA\ Polling the AS8E512K8 provides another
method for determining the end of a write cycle. During the write
operation, successive attempts to read data from the device will result
in I/O 6 toggling between one and zero. Once the write has completed,
I/O 6 will stop toggling and valid data will be read. Reading the toggle
bit may begin at any time during the write cycle.
DATA PROTECTION:
If precautions are not taken, inadvertent writes may occur during
transitions of the host power supply . The E2 module has incorporated
both hardware and software features that will protect the memory
against inadvertent writes.
HARDWARE PROTECTION:
Hardware features protect against inadvertent writes to the
AS8E512K8 in the following ways: (a) Vcc sense - if Vcc is below
3.8V (typical) the write function is inhibited; (b) Vcc power-on delay
- once Vcc has reached 3.8V the device will automatically time out
5ms (typical) before allowing a write; (c) write inhibit - holding any
one of OE\ low, CE\ high or WE\ high inhibits write cycles; (d) noise
fi lter - pulses of less than 15 ns (typical) on the WE\ or CE\ inputs
will not initiate a write cycle.
SOFTWARE DATA PROTECTION:
A software controlled data protection feature has been implemented
on theAS8E512K8. When enabled, the software data protection (SDP),
will prevent inadvertent writes. The SDP feature may be enabled or
disabled by the user and is shipped with SDP disabled, SDP is enabled
by the host system issuing a series of three write commands; three
specifi c bytes of data are written to three specifi c addresses (refer
to Software Data Protection Algorithm). After writing the three
byte command sequence and after tWC for each of the die the entire
AS8E512K8 will be protected from inadvertent write operations. It
should be noted, that once protected the host may still perform a byte
or page write to the AS8E512K8. This is done by preceding the data
to be written by the same three byte command sequence used to en-
able SDP. Once set, SDP will remain active unless the disable com-
mand sequence is issued. Power transitions do not disable SDP and
SDP will protect the AS8E512K8 during power-up and power-down
conditions. All command sequences must conform to the page write
timing specifi cations. The data in the enable and disable com-
mand sequences is not written to the device and the memory addresses
used in the sequence may be written with data in either a byte or page
write operation.
After setting SDP, any attempt to write to the device without the
three byte command sequence will start the internal write timers. No
data will be written to the device; however, for the duration of tWC,
read operations will effectively be polling operations.
DEVICE OPERATION:
The AS8E512K8 is an electrically erasable and programmable memory
module that is accessed like a Static RAM for the read or write cycle
without the need for external components. The device contains a
128-byte-page register to allow writing of up to 128 bytes of data
simultaneously. During a write cycle, the address and 1 to 128 bytes
of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will
automatically write the latched data using an internal control timer.
The end of a write cycle can be detected by DATA\ polling of I/O7.
Once the end of a write cycle has been detected a new access for a
read or write can begin.
READ:
The AS8E512K8 is accessed like a Static RAM. When CE\ and
OE\ are low and WE\ is high, the data stored at the memory loca-
tion determined by the address pins is asserted on the outputs. The
outputs are put in the high impedance state when either CE\ or OE\ is
high. This dual-line control gives designers fl exibility in preventing
bus contention in their system.
BYTE WRITE:
A low pulse on the WE\ or CE\ input with CE\ or WE\ low (re-
spectively) and OE\ high initiates a write cycle. The address is latched
on the falling edge of CE\ or WE\, whichever occurs last. The data
is latched by the fi rst rising edge of CE\ or WE\. Once a byte, word
or double word write has been started it will automatically time itself
to completion.
PAGE WRITE:
The page write operation of the AS8E512K8 allows 1 to 128
BWDWs of data to be written into the device during a single internal
programming period. Each new BWDW must be written within
150us (tBLC) of the previous BWDW. If the tBLC limit is exceeded the
AS8E512K8 will cease accepting data and commence the internal
programming operation. For each WE\ high to low transition during
the page write operation, A7-A18 must be the same.
The A0-A6 inputs are used to specify which bytes within the page
are to be written. The bytes may be loaded in any order and may be
altered within the same load period. Only bytes which are specifi ed
for writing will be written; unnecessary cycling of other bytes within
the page does not occur.
DATA\ POLLING:
The AS8E512K8 features DATA\ Polling to indicate the end of a
write cycle. During a byte or page write cycle an attempted read of
the last byte written will result in the complement of the written data
to be presented on I/O 7. Once the write cycle has been completed,
true data is valid on all outputs, and the next write cycle may begin.
DATA\ Polling may begin at anytime during the write cycle.
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
3
EEPROM
AS8E512K8
PIN CAPACITANCE (f= 1MHz, T = 25° C)(1)
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55oC<T
A<+125oC; Vcc = 5V +10%)
OPERATING MODES
ABSOLUTE MAXIMUM RATINGS*
Voltage on Vcc Supply Relative to Vss
Supply/Input Voltage Range1.........................-0.6V to +6.25V DC
Voltage on OE\ and A9....................................-0.6V to +13.5V DC
Voltage on all other pins..................................-0.6V to +6.25V DC
Storage Temperature.............................................-65°C to +150°C
Operating Temperature, TA (Ambient)................-55oC to +125oC
Lead Temperature (soldering 10 seconds)........................+300oC
Maximum Junction Temperature**....................................+165°C
NOTE: 1. Including NC pins, with respect to ground.
*Stresses greater than those listed under "Absolute Maxi-
mum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated
in the operation section of this specifi cation is not implied.
Exposure to absolute maximum rating conditions for ex-
tended periods may affect reliability.
** Junction temperature depends upon package type, cycle
time, loading, ambient temperature and airfl ow.
NOTE: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
SYMBOL CONDITIONS MAX UNIT
C
ADD, OE\, WE\
V
IN
= 0V, f = 1MHz 45 pF
C
I/O
V
OUT
= 0V, f = 1MHz 50 pF
C
CE\
V
IN
= 0V, f = 1MHz 10 pF
MODE CE\ OE\ WE\ I/O
Read V
IL
V
IL
V
IH
D
OUT
Write
2
V
IL
V
IH
V
IL
D
IN
Standby/Write Inhibit V
IH
X
1
X High Z
Write Inhibit X X V
IH
Write Inhibit X V
IL
X
Output Disable X V
IH
X High Z
PARAMETER CONDITION SYMBOL MIN MAX UNITS
Input Load Current V
IN
= OV to Vcc + 1V I
LI
-20 20 μΑ
Output Leakage Current V
I/O
= OV to Vcc I
LO
-20 20 μΑ
Vcc Standby Current CMOS CE\ = Vcc -0.2V to Vcc + 1 I
SB1
mA
Vcc Standby Current TTL CE\ = 2.2V to Vcc + 1 I
SB2
20 mA
Vcc Active Current F = 5 MHz; I
OUT
= 0 mA I
CC
120 mA
Input Low Voltage V
IL
0.8 V
Input High Voltage V
IH
2.0 V
Output Low Voltage IOL = 2.1 mA V
OL
0.45 V
Output High Voltage IOH = -400 μAV
OH1
2.4 V
Output High Voltage CMOS IOH = -100 μA; Vcc = 4.5V V
OH2
4.2 V
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
4
EEPROM
AS8E512K8
NOTES:
1. CE\ may be delayed up to tACC-tCE after the address transi-
tion without inpact on tACC.
2. OE\ may be delayed up to tCE-tOE after the falling edge of
CE\ without inpact on tCE or by tACC-tOE after an address change
without inpact on tACC.
3. tDF is specifi ed from OE\ or CE\ whichever occurs fi r s t
(CL = 5pF).
4. This parameter is characterized and is not 100% tested.
5. A17 and A18 must remain valid through the WE\ and CE\
low pulse.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC READ OPERATING
CONDITIONS (-55oC<T
A<+125oC; Vcc = 5V +10%)
INPUT TEST WAVEFORMS AND MEASUREMENT
LEVEL FOR AC TEST CONDITIONS
OUTPUT TEST LO AD
100pF
1.8K
1.3K
5.0V
A.C. READ WAVEFORMS(1,2,3,4)
ADDRESS
CE\
OE\
OUTPUT OUTPUT
HIGH Z
tOE
tACC
tDF
tCE
ADDRESS VALID
tOH
VALID
Input P ulse Levels 0V to 3.0V
Input R ise and Fall T im es 5nS
Input and O utput 1.5V
Timin
g
R eference Levels
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
5
EEPROM
AS8E512K8
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC WRITE OPERATING
CONDITIONS (-55oC<T
A<+125oC; Vcc = 5V +10%)
SYMBOL PARAMETER MIN MAX UNITS
t
WC
Write Cycle Time 10 ms
t
AS
Address Set-up time 10 ns
t
AH
Address Hold Time
5
50 ns
t
DS
Data Set-up Time 50 ns
t
DH
Data Hold Time 0 ns
t
WP
Write Pulse Width 100 ns
t
BLC
Byte Load Cycle Time 150 μs
t
WPH
Write Pulse Width High 50 ns
AC WRITE WAVEFORMS - CE\ CONTROLLED5
A C WRITE W AVEFORMS - WE\ CONTROLLED5
OE\
ADDRESS
CE\
WE\
DAT A IN
tOES
tAS5tAH5
tCS
tWP tDS
tOEH
tCH
tWPH
tDH
SYMBOL PARAMETER MIN MAX UNITS
OE\
ADDRESS
DAT A IN
tOES
tAS5tAH5
tCS
tWP tDS
tOEH
tCH
tWPH
tDH
?WE\
CE\
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
6
EEPROM
AS8E512K8
PAGE MODE CHARACTERISTICS
PARAMETER SYMBOL MIN MAX UNITS
Address, OE\ Setup Time tAS, tOES 10 ns
Address Hold Time tAH 50 ns
Chip Select Setup Time tCS 0ns
Chip Select Hold Time tCH 0ns
Write Pulse Width (WE\ or CE\) tWP 100 ns
Data Setup Time tDS 50 ns
Data, OE\ Hold Time tDH, tOEH 10 ns
VIH
VIL
VH
VIH
VIH
VIL
CE\
?OE\
?WE\
tS
tw
tH
PA GE MODE WRITE WA VEFORMS(1,2,3)
CHIP ERASE WAVEFORMS
NOTES: 1. A7 through A16 must specify the page address during each high to low transition of ?W/E (or ?C/E).
2. ?O/E must be high only when ?W/E and ?C/E are both low .
3. A17 and A18 must remain valid throughout the WE\ and CE\ low.
NOTES:
tS = 5μsec (min)
tW= tH= 10 msec (min)
VH=12.0 V +/- 0.5 V
PARAMETER SYMBOL MIN MAX UNITS
A0-A18
DATA
tAS
tWP
tAH
tWPH
tDH
tDS
tBLC
tWC
BYTE 0 BYTE 126 BYTE 127
BYTE 1 BYTE 2 BYTE 3
?CE\
OE\
WE\
VALID ADDR
VALID DATA
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
7
EEPROM
AS8E512K8
SOFTWARE DATA PROTECTION ENABLE
ALGORITHM(1)(5)
SOFTWARE DATA PROTECTION DISABLE
ALGORITHM(1)(5)
NOTES:
1. Data Format: I/O 7 - I/O0 (Hex)
2. Write Protect state will be active at end of write even if no other data is
loaded.
3. Write Protect state will be deactivated at end of period even if no other
data is loaded.
4. 1 to 128 bytes of data are loaded.
5. Applies to each of the 4 die in the module.
Load Data 55
to
Address 2AAA
Writes Enabled(2)
Enter Data
Protect State
Load Data AA
to
Address 5555
Load Data XX
to
Any Address(4)
Load Data A0
to
Address 5555
Load Last Byte
to
Last Address
Exit Data Protect
State(3)
Load Data AA
to
Address 5555
Load Data 55
to
Address 2AAA
Load Data 80
to
Address 5555
Load Data AA
to
Address 5555
Load Data 20
to
Address 5555
Load Data XX
to
Any Address(4)
Load Last Byte
to
Last Address
Load Data 55
to
Address 2AAA
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
8
EEPROM
AS8E512K8
SOFTWARE PROTECTED PROGRAM CYCLE WAVEFORM(1,2,3,4)
NOTES: 1. A0-A14 must conform to the addressing sequence for the fi rst three bytes as shown above.
2. After the command sequence has been issued and a page write operation follows, the page address inputs
(A7-A18) must be the same for each high to low transition of WE\ (or CE\).
3. OE\ Must be high only when WE\ and CE\ are both low.
4. A17 and A18 must remain valid throughout the WE\ and CE\ low cycle.
OE\
CE\
WE\
A0-A6
A7-A18
DATA
tWP
tWPH tBLC
tAS tAH
tDS tDH
BYTE 0 BYTE 126 BYTE 127
BYTE ADDRESS
PAGE ADDRESS
5555 2AAA 5555
55 A0
AA
tWC
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
9
EEPROM
AS8E512K8
DATA POLLING CHARACTERISTICS(1)
NOTES: 1. These parameters are characterized and not 100% tested.
2. See A.C. Read Characteristics.
DATA POLLING WAVEFORMS
PARAMETER SYMBOL MIN MAX UNITS
Data Hold Time t
DH
10 ns
OE\ Hold Time t
OEH
10 ns
OE\ to Output Delay
2
t
OE
ns
Write Recovery Time t
WR
0ns
WE\
CE\
OE\ tOE HIGH Z
tOEH
tWR
An An An An
An
I/O7
A0-A18
PARAMETER SYMBOL MIN MAX UNITS
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
10
EEPROM
AS8E512K8
NOTES: 1. Toggling either OE\ or CE\ or Both OE\ and CE\ will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
TOGGLE BIT WAVEFORMS(1,2,3)
NOTES: 1. These parameters are characterized and not 100% tested.
2. See A.C. Read Characteristics.
TOGGLE BIT CHARACTERISTICS(1)
PARAMETER SYMBOL MIN MAX UNITS
Data Hold Time t
DH
10 ns
OE\ Hold Time t
OEH
10 ns
OE\ to Output Delay
2
t
OE
ns
OE\ High Pulse t
OEHP
150
Write Recovery Time t
WR
0ns
PARAMETER SYMBOL MIN MAX UNITS
tDH tWR
tOEH
tOE HIGH Z
WE\
CE\
?OE\
I/O6
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
11
EEPROM
AS8E512K8
MECHANICAL DEFINITIONS*
Micross Case #112 (Package Designator CW)
SMD 5962-93091, Case Outline Y
D1
D
116
1732
B1 B
*All measurements are in inches.
NOTE: These dimensions are per the SMD. Micross' package dimensional limits
may differ, but they will be within the SMD limits.
A1
ee1
A2
A
D2
MIN MAX
A 0.161 0.181
A1 0.027 0.047
A2
B 0.009 0.012
B1 0.590 0.610
D 1.654 1.686
D1 0.580 0.600
D2 1.492 1.508
e
e1 0.016 0.02
0.100 TYP
SYMBOL SMD Specifications
0.125 MIN
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
12
EEPROM
AS8E512K8
ORDERING INFORMATION
*AVAILABLE PROCESSES
IT = Industrial Temperature Range -40oC to +85oC
XT = Extended Temperature Range -55oC to +125oC
HQ = MIL-PRF-38534 -55oC to +125oC
Device Number Package
Type Speed
ns Process
AS8E512K8 CW -150 /*
AS8E512K8 CW -200 /*
AS8E512K8 CW -250 /*
AS8E512K8 CW -300 /*
EXAMPLE: AS8E512K8CW-250/XT
AS8E512K8
Rev. 3.2 01/10
Micross Components reserves the right to change products or specifi cations without notice.
13
EEPROM
AS8E512K8
*Micross part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD.
MICROSS TO DSCC PART NUMBER
CROSS REFERENCE*
Micross Package Designator CW
Micross Part # SMD Part #
AS8E512K8CW-150/HQ 5962-9309101HYC
AS8E512K8CW-150/HQ 5962-9309101HYA
AS8E512K8CW-200/HQ 5962-9309104HYC
AS8E512K8CW-200/HQ 5962-9309104HYA
AS8E512K8CW-250/HQ 5962-9309103HYC
AS8E512K8CW-250/HQ 5962-9309103HYA
AS8E512K8CW-300/HQ 5962-9309102HYC
AS8E512K8CW-300/HQ 5962-9309102HYA
