DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
NC
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
NC − No internal connection
SN74CB3T3245
www.ti.com
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
8-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE WITH 5-V-TOLERANT LEVEL SHIFTER
Check for Samples: SN74CB3T3245
1FEATURES • Low Power Consumption (ICC = 40 μA Max)
• VCC Operating Range From 2.3 V to 3.6 V
• Standard '245-Type Pinout • Data I/Os Support 0- to 5-V Signaling Levels
• Output Voltage Translation Tracks VCC (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Supports Mixed-Mode Signal Operation on All • Control Inputs Can Be Driven by TTL or 5-
Data I/O Ports V/3.3-V CMOS Outputs
– 5-V Input Down to 3.3-V Output Level Shift • Ioff Supports Partial-Power-Down Mode
With 3.3-V VCC Operation
– 5-V/3.3-V Input Down to 2.5-V Output Level • Latch-Up Performance Exceeds 250 mA
Shift With 2.5-V VCC Per JESD 17
• 5-V-Tolerant I/Os With Device Powered Up or • ESD Performance Tested Per JESD 22
Powered Down – 2000-V Human-Body Model (A114-B,
• Bidirectional Data Flow With Near-Zero Class II)
Propagation Delay – 1000-V Charged-Device Model (C101)
• Low ON-State Resistance (ron) Characteristics
(ron = 5 ΩTyp) • Supports Digital Applications: Level
Translation, PCI Interface, USB Interface,
• Low Input/Output Capacitance Minimizes Memory Interleaving, Bus Isolation
Loading (Cio(OFF) = 5 pF Typ) • Ideal for Low-Power Portable Equipment
• Data and Control Inputs Provide Undershoot
Clamp Diodes
DESCRIPTION/ORDERING INFORMATION
The SN74CB3T3245 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing
for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by
providing voltage translation that tracks VCC. The SN74CB3T3245 supports systems using 5-V TTL, 3.3-V
LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2003–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74CB3T3245
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
Figure 1. Typical DC Voltage Translation Characteristics
The SN74CB3T3245 is an 8-bit bus switch with a single ouput-enable (OE) input and a standard '245 pinout.
When OE is low, the 8-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data
flow between ports. When OE is high, the 8-bit bus switch is OFF, and a high-impedance state exists between
the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging
current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TAPACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube SN74CB3T3245DW
SOIC – DW CB3T3245
Tape and reel SN74CB3T3245DWR
SSOP (QSOP) – DBQ Tape and reel SN74CB3T3245DBQR CB3T3245
–40°C to 85°C Tube SN74CB3T3245PW
TSSOP – PW KS245
Tape and reel SN74CB3T3245PWR
TVSOP – DGV Tape and reel SN74CB3T3245DGVR KS245
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Table 1. FUNCTION TABLE
INPUT INPUT/OUTPUT FUNCTION
OE A
L B A port = B port
H Z Disconnect
2Submit Documentation Feedback Copyright © 2003–2012, Texas Instruments Incorporated
Product Folder Links: SN74CB3T3245
A
EN(2)
B
Control
Circuit
VG(1)
1) Gate Voltage (VG) is approximately equal to VCC + VT when the switch is ON and VI > (VCC + VT).
2) EN is the internal enable signal applied to the switch.
OE
A1
A8
B1
B8
2
9
19
18
11
SW
SW
SN74CB3T3245
www.ti.com
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
LOGIC DIAGRAM (POSITIVE LOGIC)
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
Copyright © 2003–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: SN74CB3T3245
SN74CB3T3245
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
www.ti.com
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range(2) –0.5 7 V
VIN Control input voltage range(2) (3) –0.5 7 V
VI/O Switch I/O voltage range(2) (3) (4) –0.5 7 V
IIK Control input clamp current VIN < 0 –50 mA
II/OK I/O port clamp current VI/O < 0 –50 mA
II/O ON-state switch current(5) ±128 mA
Continuous current through VCC or GND ±100 mA
DBQ package 68
DGV package 92
θJA Package thermal impedance(6) °C/W
DW package 58
PW package 83
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for VI/O.
(5) IIand IOare used to denote specific conditions for II/O.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VCC = 2.3 V to 2.7 V 1.7 5.5
VIH High-level control input voltage V
VCC = 2.7 V to 3.6 V 2 5.5
VCC = 2.3 V to 2.7 V 0 0.7
VIL Low-level control input voltage V
VCC = 2.7 V to 3.6 V 0 0.8
VI/O Data input/output voltage 0 5.5 V
TAOperating free-air temperature –40 85 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4Submit Documentation Feedback Copyright © 2003–2012, Texas Instruments Incorporated
Product Folder Links: SN74CB3T3245
SN74CB3T3245
www.ti.com
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
Electrical Characteristics(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK VCC = 3 V, II= –18 mA –1.2 V
VOH See Figure 3 and Figure 4
IIN Control inputs VCC = 3.6 V, VIN = 3.6 V to 5.5 V or GND ±10 μA
VI= VCC – 0.7 V to 5.5 V ±20
IIVCC = 3.6 V, Switch ON, VIN = VCC or GND VI= 0.7 V to VCC – 0.7 V –40 μA
VI= 0 to 0.7 V ±5
IOZ (3) VCC = 3.6 V, VO= 0 to 5.5 V, VI= 0, Switch OFF, VIN = VCC or GND ±10 μA
Ioff VCC = 0, VO= 0 to 5.5 V, VI= 0, 10 μA
VI= VCC or GND 40
VCC = 3.6 V, II/O = 0,
ICC μA
Switch ON or OFF, VIN = VCC or GND VI= 5.5 V 40
ΔICC (4) Control inputs VCC = 3 V to 3.6 V, One input at VCC – 0.6 V, Other inputs at VCC or GND 300 μA
Cin Control inputs VCC = 3.3 V, VIN = VCC or GND 4 pF
Cio(OFF) VCC = 3.3 V, VI/O = 5.5 V, 3.3 V, or GND, Switch OFF, VIN = VCC or GND 5 pF
VI/O = 5.5 V or 3.3 V 5
Cio(ON) VCC = 3.3 V, Switch ON, VIN = VCC or GND pF
VI/O = GND 13
IO= 24 mA 5 8.5
VCC = 2.3 V, TYP at VCC = 2.5 V, VI= 0 IO= 16 mA 5 8.5
ron (5) Ω
IO= 64 mA 5 7
VCC = 3 V, VI= 0 IO= 32 mA 5 7
(1) VIN and IIN refer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA= 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
VCC = 2.5 V VCC = 3.3 V
FROM TO ± 0.2 V ± 0.3 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX
tpd (1) A or B B or A 0.15 0.25 ns
ten OE A or B 1 10.5 1 8 ns
tdis OE A or B 1 5.5 1 7.5 ns
(1) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Copyright © 2003–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: SN74CB3T3245
VOH
VOL
CL
(see Note A)
TEST CIRCUIT
S1 2 × VCC
Open
GND
RL
RL
tPLH tPHL
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
VOH
VOL
0 V
VOL + V∆
VOH − V∆
0 V
Output
Control
(VIN)
VCC
VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
50 Ω
VG1
VCC
DUT
50 Ω
VIN
50 Ω
VG2 50 Ω
VI
TEST RL
S1 V∆
CL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
VCC VI
tPHZ/tPZH
tPLZ/tPZL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
2 × VCC
2 × VCC
Open
Open
500 Ω
500 Ω
500 Ω
500 Ω
500 Ω
500 Ω
3.6 V or GND
5.5 V or GND
GND
GND
3.6 V
5.5 V
30 pF
50 pF
30 pF
50 pF
30 pF
50 pF
0.15 V
0.3 V
0.15 V
0.3 V
Output
Control
(VIN)
Input Generator
Input Generator
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2 VCC/2 VCC/2
VCC/2
VO
SN74CB3T3245
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 2. Test Circuit and Voltage Waveforms
6Submit Documentation Feedback Copyright © 2003–2012, Texas Instruments Incorporated
Product Folder Links: SN74CB3T3245
V − Output Voltage − V
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
O
VI − Input Voltage − V
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
VI − Input Voltage − V
0.0
1.0
2.0
3.0
4.0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
0.0
1.0
2.0
3.0
4.0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VCC = 3 V
IO = 1 µA
TA = 25°C
VCC = 2.3 V
IO = 1 µA
TA = 25°C
V − Output Voltage − V
O
SN74CB3T3245
www.ti.com
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
TYPICAL CHARACTERISTICS
Figure 3. Data Output Voltage vs Data Input Voltage
Copyright © 2003–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: SN74CB3T3245
1.5
2.0
2.5
3.0
3.5
4.0
2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7
1.5
2.0
2.5
3.0
3.5
4.0
2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7
1.5
2.0
2.5
3.0
3.5
4.0
2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
VCC − Supply Voltage − V
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = 85°C
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
VCC − Supply Voltage − V
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = 25°C
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
VCC − Supply Voltage − V
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = –40°C
VOH − Output Voltage High − V
VOH − Output Voltage High − V
VOH − Output Voltage High − V
100 µA
8 mA
16 mA
24 mA
100 µA
8 mA
16 mA
24 mA
100 µA
8 mA
16 mA
24 mA
100 µA
8 mA
16 mA
24 mA
SN74CB3T3245
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
www.ti.com
TYPICAL CHARACTERISTICS
Figure 4. VOH Values
8Submit Documentation Feedback Copyright © 2003–2012, Texas Instruments Incorporated
Product Folder Links: SN74CB3T3245
SN74CB3T3245
www.ti.com
SCDS136A –OCTOBER 2003–REVISED AUGUST 2012
REVISION HISTORY
Changes from Original (March 2005) to Revision A Page
• Updated graphic note and picture in figure 1. ...................................................................................................................... 2
Copyright © 2003–2012, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: SN74CB3T3245
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74CB3T3245DBQRE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CB3T3245DBQRG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CB3T3245DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CB3T3245DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DBQR ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CB3T3245DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CB3T3245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74CB3T3245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CB3T3245DBQR SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74CB3T3245DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74CB3T3245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74CB3T3245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CB3T3245DBQR SSOP DBQ 20 2500 367.0 367.0 38.0
SN74CB3T3245DGVR TVSOP DGV 20 2000 367.0 367.0 35.0
SN74CB3T3245DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74CB3T3245PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated