BZX84C7V5Q-13-F - DIODES Incorporated

BZX84C2V4 - BZX84C51

Document number: DS18001 Rev. 30 - 2 1 of 5

www.diodes.com May 2012

BZX84C2V4 - BZX84C51

350mW SURFACE MOUNT ZENER DIODE

Features

• Planar Die Construction

• 350mW Power Dissipation

• Zener Voltages from 2.4V - 51V

• Ideally Suited for Automated Assembly Processes

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SOT23

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

• Polarity: See Diagram

• Weight: 0.008 grams (approximate)

Ordering Information (Note 5)

Part Number Qualification Case Packaging

(Type Number)-7-F Commercial SOT23 3,000/Tape & Reel

(Type Number)Q-7-F Automotive SOT23 3,000/Tape & Reel

(Type Number)-13-F Commercial SOT23 10,000/Tape & Reel

(Type Number)Q-13-F Automotive SOT23 10,000/Tape & Reel

*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4-

BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire

Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.

BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3

Fire Retardants.

5. For packaging details, go to our website at http://www.diodes.com.

Marking Information

Date Code Key

Year 1998 … 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017

Code J … N P R S T U V W X Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

Top View Device Schematic

SOT23

K = SAT (Shanghai Assembly / Test site)

xx = Product Type Marking Code

(See Electrical Characteristics Table)

YM = Date Code Marking

Y = Year (ex: Z = 2012)

M = Month (ex: 9 = September)

C = CAT (Chengdu Assembly / Test site)

xx = Product Type Marking Code

(See Electrical Characteristics Table)

YM = Date Code Marking

Y = Year (ex: Z = 2012)

M = Month (ex: 9 = September)

Cxx

Kxx

BZX84C2V4 - BZX84C51

Document number: DS18001 Rev. 30 - 2 2 of 5

www.diodes.com May 2012

BZX84C2V4 - BZX84C51

Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic Symbol Value Unit

Forward Voltage @ IF = 10mA VF 0.9 V

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 6) PD 300 mW

Power Dissipation (Note 7) PD 350 mW

Thermal Resistance, Junction to Ambient Air (Note 6) R

JA 417 °C/W

Thermal Resistance, Junction to Ambient Air (Note 7) R

JA 357 °C/W

Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C

Electrical Characteristics @TA = 25°C unless otherwise specified

Type

Number Marking

Code

Zener Voltage

Range

(Note 8)

Maximum Zener

Impedance

f = 1KHz

Maximum Reverse

Current

(Note 8)

Temperature

Coefficient

@ IZT

mV/°C

VZ @ IZT IZT ZZT @

IZT ZZK @ IZK I

R V

R Min Max

Nom (V) Min (V) Max (V) (mA) (

) (

) (mA) (μA) (V)

BZX84C2V4 ZB 2.4 2.2 2.6 5.0 100 600 1.0 50 1.0 -3.5 0

BZX84C2V7 ZC 2.7 2.5 2.9 5.0 100 600 1.0 20 1.0 -3.5 0

BZX84C3V0 ZD 3.0 2.8 3.2 5.0 95 600 1.0 10 1.0 -3.5 0

BZX84C3V3 ZE 3.3 3.1 3.5 5.0 95 600 1.0 5.0 1.0 -3.5 0

BZX84C3V6 ZF 3.6 3.4 3.8 5.0 90 600 1.0 5.0 1.0 -3.5 0

BZX84C3V9 ZG 3.9 3.7 4.1 5.0 90 600 1.0 3.0 1.0 -3.5 0

BZX84C4V3 ZH 4.3 4.0 4.6 5.0 90 600 1.0 3.0 1.0 -3.5 0

BZX84C4V7 Z1 4.7 4.4 5.0 5.0 80 500 1.0 3.0 2.0 -3.5 0.2

BZX84C5V1 Z2 5.1 4.8 5.4 5.0 60 480 1.0 2.0 2.0 -2.7 1.2

BZX84C5V6 Z3 5.6 5.2 6.0 5.0 40 400 1.0 1.0 2.0 -2.0 2.5

BZX84C6V2 Z4 6.2 5.8 6.6 5.0 10 150 1.0 3.0 4.0 0.4 3.7

BZX84C6V8 Z5 6.8 6.4 7.2 5.0 15 80 1.0 2.0 4.0 1.2 4.5

BZX84C7V5 Z6 7.5 7.0 7.9 5.0 15 80 1.0 1.0 5.0 2.5 5.3

BZX84C8V2 Z7 8.2 7.7 8.7 5.0 15 80 1.0 0.7 5.0 3.2 6.2

BZX84C9V1 Z8 9.1 8.5 9.6 5.0 15 100 1.0 0.5 6.0 3.8 7.0

BZX84C10 Z9 10 9.4 10.6 5.0 20 150 1.0 0.2 7.0 4.5 8.0

BZX84C11 Y1 11 10.4 11.6 5.0 20 150 1.0 0.1 8.0 5.4 9.0

BZX84C12 Y2 12 11.4 12.7 5.0 25 150 1.0 0.1 8.0 6.0 10.0

BZX84C13 Y3 13 12.4 14.1 5.0 30 170 1.0 0.1 8.0 7.0 11.0

BZX84C15 Y4 15 13.8 15.6 5.0 30 200 1.0 0.1 10.5 9.2 13.0

BZX84C16 Y5 16 15.3 17.1 5.0 40 200 1.0 0.1 11.2 10.4 14.0

BZX84C18 Y6 18 16.8 19.1 5.0 45 225 1.0 0.1 12.6 12.4 16.0

BZX84C20 Y7 20 18.8 21.2 5.0 55 225 1.0 0.1 14.0 14.4 18.0

BZX84C22 Y8 22 20.8 23.3 5.0 55 250 1.0 0.1 15.4 16.4 -

BZX84C24 Y9 24 22.8 25.6 5.0 70 250 1.0 0.1 16.8 18.4 -

BZX84C27 YA 27 25.1 28.9 2.0 80 300 0.5 0.1 18.9 21.4 -

BZX84C30 YB 30 28.0 32.0 2.0 80 300 0.5 0.1 21.0 24.4 -

BZX84C33 YC 33 31.0 35.0 2.0 80 325 0.5 0.1 23.1 27.4 -

BZX84C36 YD 36 34.0 38.0 2.0 90 350 0.5 0.1 25.2 30.4 -

BZX84C39 YE 39 37.0 41.0 2.0 130 350 0.5 0.1 27.3 33.4 -

BZX84C43 YF 43 40.0 46.0 2.0 150 375 0.5 0.1 30.1 37.6 -

BZX84C47 YG 47 44.0 50.0 2.0 170 375 0.5 0.1 32.9 42.0 -

BZX84C51 YH 51 48.0 54.0 2.0 180 400 0.5 0.1 35.7 46.6 -

Notes: 6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.

7. Valid provided the terminals are kept at ambient temperature.

8. Short duration pulse test used to minimize self-heating effect.

BZX84C2V4 - BZX84C51

Document number: DS18001 Rev. 30 - 2 3 of 5

www.diodes.com May 2012

BZX84C2V4 - BZX84C51

400

T , Ambient Temperature, (°C)

Fig. 1 Power Derating Curve

DISSI

(mW)

200

100

300

500

0100 200

Note 6 Note 7

012345678910

I, ZENE

(mA)

V , ZENER VOLTAGE (V)

Fi g. 2 Typi c al Z en er B r eak down C ha r acter ist ic s

I, ZENE

(mA)

V , ZENER VOLTAGE (V)

Fig. 3 Typical Zener Breakdown Characteristics

10 20 30 40

T = 25°C

Test current I

5mA

Test current I

2mA

C10

C12

C18

C22

C27

C33 C36

C39

C15

020 30 40 50 60 70

I, ZE

(mA)

V , ZENER VOLTAGE (V)

Fig. 4 Typical Zener Breakdown Characteristics

T = 25°C

Test Current I

2mA

C43

C47

C51

C , TOT A L CAP ACIT ANCE (pF)

100

1,000

10 100

1V , NOMINAL ZENER VOLTAGE (V)

Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage

T = 25°C

V = 1V

V = 2V

V = 1V

V = 2V

C , TOTAL CAPACITANCE (pF)

100

10 V , NOMINAL ZENER VOLTAGE (V)

Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage

BZX84C2V4 - BZX84C51

Document number: DS18001 Rev. 30 - 2 4 of 5

www.diodes.com May 2012

BZX84C2V4 - BZX84C51

Package Outline Dimensions

Suggested Pad Layout

SOT23

Dim Min Max Typ

A 0.37 0.51 0.40

B 1.20 1.40 1.30

C 2.30 2.50 2.40

D 0.89 1.03 0.915

F 0.45 0.60 0.535

G 1.78 2.05 1.83

H 2.80 3.00 2.90

J 0.013 0.10 0.05

K 0.903 1.10 1.00

K1 - - 0.400

L 0.45 0.61 0.55

M 0.085 0.18 0.11

α 0° 8° -

All Dimensions in mm

Dimensions Value (in mm)

Z 2.9

X 0.8

Y 0.9

C 2.0

E 1.35

X E

BZX84C2V4 - BZX84C51

Document number: DS18001 Rev. 30 - 2 5 of 5

www.diodes.com May 2012

BZX84C2V4 - BZX84C51

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.