Microwave Ceramics and Modules Filter
2 – Pole Filter for Mobile Broadcasting (Frontend) B69842N2647A627
Preliminary Datasheet
ISSUE DATE 5.08.02 ISSUE P1 PUBLISHER SAW MWC PD F PAGE 1/4
Features
Extreme Low Losses in Passband (typ. 0.5dB)
High Power Durability
High attenuations at GSM, PDC, PHS, UMTS, and WLAN Bands
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2 Dimension Limits
Recommended Footprint
Page 3 Characteristics
Maximum ratings
Typical passband characteristic
Page 4 Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules Filter
2 – Pole Filter for Mobile Broadcasting (Frontend) B69842N2647A627
Preliminary Datasheet
ISSUE DATE 5.08.02 ISSUE P1 PUBLISHER SAW MWC PD F PAGE 2/4
Dimension Limits
Recommended Footprint
I/O
GG
G
G
G G
I/O
Solder Pads:
I/O Pads must be
connected to lines with
50 impedance.
In the application a
termination of 50
must be realized.
Ground, covered with
solder resist,
connected to lower
ground plane by vias
with maximum
diameter of 0.3mm and
max. distance of 1mm
4.0 ±0.3
10.5
±
0.3
max 6.1
5.8 ± 0.3
I/O
G
a = 0.9±0.4
a
a
1.2 ±0.3
I/O
Microwave Ceramics and Modules Filter
2 – Pole Filter for Mobile Broadcasting (Frontend) B69842N2647A627
Preliminary Datasheet
ISSUE DATE 5.08.02 ISSUE P1 PUBLISHER SAW MWC PD F PAGE 3/4
Characteristics (over whole temperature range) min. typ. max.
Center frequency fc- 2.6425 - GHz
Insertion loss αIL 0.5 0.7 dB
Passband (2629- 2656) B27 MHz
Amplitude ripple (peak - peak) ∆α 0.1 0.2 dB
Standing Wave Ratio / Return Loss [dB] 1.12 / -25 1.5 / -14
Impedance Z 50
Attenuation α
at DC to 440 MHz
at 440 to 1525 MHz
at 1525 to 1680 MHz
at 1680 to 1980 MHz
at 1980 to 2170 MHz
at 2170 to 2500 MHz
at 3450 MHz
57
40
38
34
30
27
35
60
44
41
38
33
29
40
dB
dB
dB
dB
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1) - 40 /+ 90/56
Operating temperature Top - 40 / + 85 °C
Typical passband characteristics
Microwave Ceramics and Modules Filter
2 – Pole Filter for Mobile Broadcasting (Frontend) B69842N2647A627
Preliminary Datasheet
ISSUE DATE 5.08.02 ISSUE P1 PUBLISHER SAW MWC PD F PAGE 4/4
Processing information
Wettability to IEC 68-2-58: 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
Delivery mode
Blister tape acc. to IEC 286-3, grey
Pieces/tape: t.b.d
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.