VCC
50:
LMH0002
SD/HD
VEE
SDO
SDI
SDI RREF
VCC
SDO
750:
50:
0.1 PF
1.0 PF
1.0 PF
VCC
75:75:0.1 PF
75:
5.6 nH
75:
5.6 nH
4.7 PF
4.7 PF
VCC
SD/HD
Differential
Input
LMH0002
www.ti.com
SNLS215E –JANUARY 2006–REVISED APRIL 2013
LMH0002 SMPTE 292M / 259M Serial Digital Cable Driver
Check for Samples: LMH0002
1FEATURES APPLICATIONS
2• SMPTE 292M, SMPTE 344M and SMPTE 259M • SMPTE 292M, SMPTE 344M, and SMPTE 259M
Compliant Serial Digital Interfaces
• Supports DVB-ASI at 270 Mbps • Sonet/SDH and ATM Interfaces
• Data Rates to 1.485 Gbps • Digital Routers and Switches
• Differential Input • Distribution Amplifiers
• 75ΩDifferential Output • Buffer Applications
• Selectable Slew Rate • Set Top Boxes
• Adjustable Output Amplitude • Security Cameras
• Single 3.3V Supply Operation DESCRIPTION
• Operating Temperature Range: Commercial The LMH0002 SMPTE 292M / 259M serial digital
0°C to +70°C (LMH0002MA) or Industrial −40°C cable driver is a monolithic, high-speed cable driver
to +85°C (LMH0002TMA and LMH0002SQ) designed for use in SMPTE 292M / 259M serial
• Typical Power Consumption: 125 mW in SD digital video and ITU-T G.703 serial digital data
Mode and 149 mW in HD Mode transmission applications. The LMH0002 drives 75Ω
transmission lines (Belden 8281, Belden 1694A or
• 8–pin SOIC or 16–pin WQFN Package equivalent) at data rates up to 1.485 Gbps.
• Replaces the GS1528, GS1528A, or GS1578A The LMH0002 provides two selectable slew rates for
SMPTE 259M and SMPTE 292M compliance. The
output voltage swing is adjustable via a single
external resistor.
The LMH0002 is powered from a single 3.3V supply.
Power consumption is typically 125 mW in SD mode
and 149 mW in HD mode. The LMH0002 is available
in an 8-pin SOIC or 16-pin WQFN package.
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMH0002
SNLS215E –JANUARY 2006–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage: −0.5V to 3.6V
Input Voltage (all inputs) −0.3V to VCC+0.3V
Output Current 28 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
Lead Temperature (Soldering 4 Sec) +260°C
Package Thermal Resistance
θJA 8-pin SOIC +160°C/W
θJA 16-pin WQFN +78.9°C/W
θJC 8-pin SOIC +105°C/W
θJC 16-pin WQFN +42.7°C/W
ESD Rating (HBM) 5kV
ESD Rating (MM) 250V
(1) "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE): 3.3V ±5%
Operating Free Air Temperature (TA)
LMH0002MA 0°C to +70°C
LMH0002TMA and LMH0002SQ −40°C to +85°C
2Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0002
LMH0002
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SNLS215E –JANUARY 2006–REVISED APRIL 2013
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1)(2).
Symbol Parameter Conditions Reference Min Typ Max Units
VCMIN Input Common Mode Voltage SDI, SDI 1.6 + VCC –V
VSDI/2 VSDI/2
VSDI Input Voltage Swing Differential 100 2000 mVP−P
VCMOUT Output Common Mode Voltage SDO, SDO VCC –V
VSDO
VSDO Output Voltage Swing Single-ended, 75Ωload, 750 800 850 mVP-P
RREF = 750Ω1%
Single-ended, 75Ωload, 900 1000 1100 mVP-P
RREF = 590Ω1%
SD/HD Input Voltage Min for SD SD/HD 2.4 V
Max for HD 0.8 V
SD/HD Input Current 3.7 µA
ICC Supply Current SD/HD = 0(3) 45 49 mA
SD/HD = 1(3) 38 43 mA
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +3.3V and TA= +25°C.
(3) Maximum ICC is measured at VCC = +3.465V and TA= +70°C.
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1).
Symbol Parameter Conditions Reference Min Typ Max Units
DRSDI Input Data Rate .(2) SDI, SDI 1485 Mbps
tjit Additive Jitter 1.485 Gbps SDO, SDO 26 psP-P
270 Mbps 18 psP-P
tr,tfOutput Rise Time, Fall Time SD/HD = 0, 20% – 80%,(3) 120 220 ps
SD/HD = 1, 20% – 80% 400 560 800 ps
Mismatch in Rise/Fall Time .(2) 30 ps
Duty Cycle Distortion SD/HD = 0, (2) 30 ps
SD/HD = 1, (2) 100 ps
tOS Output Overshoot .(2) 8 %
RLSDO Output Return Loss .(4) 15 20 dB
(1) Typical values are stated for VCC = +3.3V and TA= +25°C.
(2) Specification is ensured by characterization.
(3) Specification is ensured by characterization and verified by test.
(4) Output return loss is dependent on board design. The LMH0002 meets this specification on the SD002 evaluation board from 5MHz to
1.5GHz.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMH0002
1
4
3
2LMH0002SQ
(top view)
12
9
10
11
85 6 7
1316 15 14
VEE
SDI
SDI SDO
SD/HD
VCC
NC NC
NC
NC
NC
NC
NC
NC
RREF
SDO
SDO
SDO
1
2
3
4 5
6
7
8
LMH002MA
SDI
RREF
SDI
SD/HD
VCC
VEE
LMH0002
SNLS215E –JANUARY 2006–REVISED APRIL 2013
www.ti.com
CONNECTION DIAGRAM
Figure 1. 8-Pin SOIC
See D Package
Figure 2. 16-Pin WQFN
See RUM0016A Package
Table 1. PIN DESCRIPTIONS
SOIC WQFN Name Description
Pin # Pin #
1 1 SDI Serial data true input.
2 2 SDI Serial data complement input.
3 3 VEE Negative power supply (ground).
4 4 RREF Output driver level control. Connect a resistor to VCC to set output voltage swing.
5 9 VCC Positive power supply (+3.3V).
6 10 SD/HD Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and
SMPTE 259M when high.
7 11 SDO Serial data complement output.
8 12 SDO Serial data true output.
— 5, 6, 7, 8, NC No connect.
13, 14, 15,
16
— DAP VEE Connect exposed DAP to negative power supply (ground).
4Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0002
10 k:
SDI
SDI
VCC
10 k:
5 k:
80:
VCC
10 k:
LMH0002
www.ti.com
SNLS215E –JANUARY 2006–REVISED APRIL 2013
APPLICATION INFORMATION
Device Operation
INPUT INTERFACING
The LMH0002 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC
or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are self-
biased at approximately 2.1V with VCC = 3.3V. Figure 3 shows the differential input stage for SDI and SDI.
Figure 3. Differential Input Stage for SDI and SDI.
OUTPUT INTERFACING
The LMH0002 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75ΩAC-coupled
coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the RREF resistor connected between
the RREF pin and VCC.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
OUTPUT SLEW RATE CONTROL
The LMH0002 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via
the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise
and fall times, or SMPTE 292M compliance, SD/HD is set low.
REPLACING THE GENNUM GS1528, GS1528A, and GS1578A
The LMH0002MA is form-fit-function compatible with the Gennum GS1528 and GS1528A. The LMH0002SQ is
form-fit-function compatible with the Gennum GS1578A.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMH0002
LMH0002
SNLS215E –JANUARY 2006–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0002
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH0002MA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L002
LMH0002MAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L002
LMH0002SQ/NOPB ACTIVE WQFN RUM 16 1000 RoHS & Green SN Level-1-260C-UNLIM L002
LMH0002SQE/NOPB ACTIVE WQFN RUM 16 250 RoHS & Green SN Level-1-260C-UNLIM L002
LMH0002TMA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L002T
LMH0002TMAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 L002T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMH0002MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH0002SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LMH0002SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LMH0002TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH0002MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH0002SQ/NOPB WQFN RUM 16 1000 210.0 185.0 35.0
LMH0002SQE/NOPB WQFN RUM 16 250 210.0 185.0 35.0
LMH0002TMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
www.ti.com
SQB16A (Rev A)
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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