HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200216
Issued Date : 1998.07.27
Revised Date : 2002. 10.24
Page No. : 1/3
HBAW56 HS MC Product Specification
HBAW56
HIGH-CONDUCTANCE ULTRA DIODE
Description
The HBAW56 consists of two high-speed switching diodes with
common anodes, fabricated in planar technology, and encapsulated
in the small plastic SMD SOT23 package.
Features
• Small SMD Package (SOT-23)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Absolute Maximum Ratings
• Maximum Temperatures
Storage Te mper ature............................................................................................ -65 ~ +150 °C
Junction Temper ature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 250 mW
• Maximum Voltages and Currents (Ta=25°C)
Reverse Voltage.................................................................................................................. 85 V
Repetitive Reverse Voltage................................................................................................. 75 V
Forward Current............................................................................................................. 215 mA
Repetitive Forward Current ........................................................................................... 125 mA
Forward Surge Current (1ms)......................................................................................... 450 mA
Characteristics (Ta=25 °C)
Characteristic Symbol Condition Min Max Unit
VF(1) IF=1mA - 715 mV
VF(2) IF=10mA - 855 mV
VF(3) IF=50mA - 1000 mV
Forward Voltage
VF(4) IF=150mA - 1250 mV
Reverse Current IR VR=75V - 1 uA
Total Capacitance CT VR=0, f=1MHz - 2 pF
Reverse Recovery Time Trr IF=IR=10mA, RL=100Ω
measured at IR=1mA -4nS
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200216
Issued Date : 1998.07.27
Revised Date : 2002. 10.24
Page No. : 2/3
HBAW56 HS MC Product Specification
Characteristics Curve
Forward Biased Voltage & Forward Current
0
150
300
450
0 500 1000 1500 2000
Forward Biased Voltage-VF(mV)
Current-I
F
(mA)
Capacitance & Reverse-Bias ed Voltage
0.1
1
0.1 1 10 100
R evers e Biased Vol tage-V
R
(V)
Capacitance- Cd (p F)
Power Derating
0
50
100
150
200
250
300
0 20 40 60 80 100 120 140 160
Ta(
o
C ), Am bient Temper atu r e
PD(mW), Power Dissipation
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200216
Issued Date : 1998.07.27
Revised Date : 2002. 10.24
Page No. : 3/3
HBAW56 HS MC Product Specification
SOT-23 Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 A l l oy; solder pl ating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V -0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of customer product design, infringement of patents, or applic at i o n assistance.
Head Office And Factory:
• Head Office (Hi-Sincerit y Mic roel ectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJK
D
AL
GV
C
B
3
21
S
Style: Pin 1.Cathode 2.Cathode
3.Common Anode
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
A 1
Control Code
Diagram:
