TC1269-3.3VUATR - MICROCHIP TECHNOLOGY

 2002-2012 Microchip Technology Inc. DS21380C-page 1

TC1269

Features

• Very Low Ground Current for Longer Battery Life

• Very Low Dropout Voltage

• 300mA Output Circuit

• High Output Voltage Accuracy

• Stand ard or Custom Output Voltages

• Pow er Saving Shutdown Mode

• Bypass Input for Ultra Quie t Operation

• Over Current and Over Temperature Protection

• Space-Saving MSOP Package

Applications

• Bat tery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHS Phones

• Linear Post-Regulator for SMPS

• Pagers

•Digital Cameras

Device Selection Table

*Other output voltages are available. Please contact Microchip

Techno logy Inc. for details.

Package Type

General Description

The TC1269 is a fixed output, high accuracy (typically

±0.5%) CMOS upgrade for older (bipol ar) low dropout

regulators. Total supply current is typically 50A at full

load (20 to 60 times lower than in bipolar regulators).

TC1269 key features include ultra low noise operation

(plus optional Bypass input); very low dropout voltage

(typica lly 240mV at full load), and fast response to ste p

changes in load. Supply current is reduced to 0.05A

(typical) and VOUT falls to zero when the shutdown

input is low.

The TC1269 incorporates both over temperature and

over current protection. The TC1269 is stable with an

output capacitor of only 1F and has a maximum

output current of 300mA.

Typical Applicat ion

Part Number Output*

Voltage

(V) Package Junction

Temp. Range

TC1269-2.5VUA 2.5 8-Pin MSOP -40°C to +125°C

TC1269-2.8VUA 2.8 8-Pin MSOP -40°C to +125°C

TC1269-3.0VUA 3.0 8-Pin MSOP -40°C to +125°C

TC1269-3.3VUA 3.3 8-Pin MSOP -40°C to +125°C

TC1269-5.0VUA 5.0 8-Pin MSOP -40°C to +125°C

8-Pin MSOP

SHDN

Bypass

OUT

GND

TC1269

OUT

BYPASS

470pF

(Optional)

Shutdown Control

(from Power

Control Logic)

1µF

GND Bypass

SHDN

300mA CMOS LDO with Shutdown and VREF Bypass

TC1269

DS21380C-page 2  2002-2012 Microchip Technology Inc.

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maxim um Ratings*

Input Voltage .........................................................6.5V

Output Voltage......... ...... ..... (VSS – 0.3) to (VIN + 0.3V)

Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V

Power Dissipation................Internally Limited (Note 6)

Operati ng Temperature. ..... ...... ...-40°C < TJ < +125° C

Storage Temperature..........................-65°C to +150°C

*Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. These

are stress ratings only and funct ional operation of the device

at these or any other conditions above those indicated in the

operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

TC1269 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1A, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

VIN Input Operating Voltage — — 6.0 V

IOUTMAX Maximum Output Current 300 ——mA

VOUT Output Voltage —

VR – 2.5% VR ±0.5%

——

VR + 2.5% VNote 1

VOUT/TV

OUT Temperature Coefficient — 40 — ppm/°C Note 2

VOUT/VIN Line Regulation — 0.05 0.35 %(V

R + 1V) VIN6V

VOUT/VOUT Load Regulation — 0.5 2.0 %I

L = 0.1mA to IOUTMAX

VIN-VOUT Dr opout Voltage —

—

240

160

480

mV IL = 0.1mA

IL = 100mA

IL = 300mA (No te 4)

ISS1 Supply Current — 50 90 A SHDN = VIH

ISS2 Shut down Supply Current — 0.05 0.5 A SHDN = 0V

PSRR Power Supply Rejection Ratio — 50 — dB FRE 120Hz

IOUTSC Out put Short Circuit Current — 550 650 mA VOUT = 0V

VOUT/PDThermal Regulation — 0.04 — V/W Note 5

eN Output Noise — 260 — nV/Hz F = 1kHz , COUT = 1F, RLOAD = 50

SHDN Input

VIH SHDN Input High Threshold 45 ——%V

VIL SHDN Input Low Threshold — — 15 %VIN

Note 1: VR is the regulator out put voltage setting.

3: Regulation is measured at a const ant j unct ion temperatu re usi ng low duty cyc le puls e tes ting. Load regulation is tes ted ov er a load ra nge from

0.1mA to the maximum spec if ied output current . Ch anges in out put v olta ge due t o heat ing ef fec t s are cov ered by the t hermal regu lation spec ifica-

tion.

4: Dropou t vol tag e is defi ned as the i nput t o output di ff erent ial at w hich the output volt age drop s 2% bel ow it s nomina l value measured at a 1V differen-

tial.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 Ther mal C ons id er atio ns for more details.

TC VOUT = (VOUTMAX – VOUTMIN) x 106

VOUT x T

 2002-2012 Microchip Technology Inc. DS21380C-page 3

TC1269

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.

(8-Pin SOIC) Symbol Description

OUT Regulated voltage output.

2 NC No connect.

3 NC No connect.

4 GND Ground terminal.

5 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.

6 NC No connect.

7 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.

The regulator is fully enabled when a logic high is applied to this input. The regulator enters shut-

down when a logic low is applied to this input. During shutdown, output voltage fa lls to zero and

supply current is reduced to 0.05A (typ ical).

IN Unregulated supply input.

TC1269

DS21380C-page 4  2002-2012 Microchip Technology Inc.

3.0 DETAILED DESCRIPTION

The TC1269 is a precision regulator available in fixed

voltages. Unlike the bipolar regulators, the TC1269

supply current does not increase with load current. In

addition, VOUT remains stable and within regulation

over the entire 0mA to IOUTMAX operating load current

range, (an important consideration in RTC and CMOS

RAM battery backup applications).

Figure 3-1 shows a typical application circuit. The

regulator is enabled any time the shutdown input

(SHDN) is at or above VIH, and shutdown (disabled)

when SHDN is at or below VIL. SHDN may be

controlled by a CMOS logic gate, or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected direct ly to the input su ppl y. While

in shutdown, supply current decreases to 0.05A

(typical), VOUT falls to zero.

FIGURE 3-1: TYPICAL APPLICAT ION

CIRCUIT

3.1 Bypass Input

A 470pF capacitor connected from the By pass in put to

ground reduces noise present on the internal

reference, which in turn significantly reduces output

noise. If ou tput noise is not a concern, this input may be

left unconnected. Larger capacitor values may be

used, b ut res ul t s in a long er tim e pe riod to rated outpu t

voltage when power is initially applied.

3.2 Output Capacitor

A 1F (min) capacitor from VOUT to ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1 and less

than 5.0, and a resonant frequency above 1MHz. A

1F capacitor should be connected from VIN to GND if

there is more than 10 inches of wire between the

regulator and the AC filter capacitor, or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used. (Since many

aluminum electrolytic capacitors freeze at approxi-

mately -30°C, solid tantalums are recommended for

applications operating below -25°C.) When operating

from sources other than batteries, supply-noise

rejection and transient response can be improved by

increasing the value of the input and output capacitors

and employing passive filtering techniques.

TC1269

GND Bypass

SHDN

Battery

OUT

VOUT

CBYPASS

470pF

(Optional)

Shutdown Control

(from Power

Control Logic)

1µF

VIN

+C1

1µF+

–

 2002-2012 Microchip Technology Inc. DS21380C-page 5

TC1269

4.0 THERMAL CONSIDERATION S

4.1 Therma l Shutdown

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 150°C.

The regulator remains off until the die temperature

drops to approximately 140°C.

4.2 Power Dissipati o n

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst case actual power dissipation:

EQUATION 4-1:

The maximum allowable power dissipation

(Equation 4-2) is a function of the maximum ambient

temperature (TAMAX), the maximum allowable die

temperature (TJMAX) and the thermal resistance from

junction-to-air (JA).

EQUATION 4-2:

Equation 4-1 can be used in conjunction with

Equation 4-2 to ensure regulator thermal operation is

within li mits. For exampl e:

Given:

VINMAX = 3.0V ± 10%

VOUTMIN = 2.7V – 2.5%

ILOAD = 250mA

TAMAX = 55°C

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

PD  (VINMAX – VOUTMIN) ILOADMAX

= [(3.0 x 1.1) – (2.7 x .975)]250 x 10-3

= 167mW

Maximum allowable power dissipation:

In this example, the TC1269 dissipates a maximum of

167mW; below the allowable limit of 350mW. In a

similar manner, Equation 4-1 and Equation 4-2 can be

used to calculate maximum current and/or input

voltage limits.

4.3 Layout Co nsiderations

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads, and wide power

supply bus lines combine to lower JA and, therefore,

increase the maximum allowable power dissipation

limit.

Where:

PD  (VINMAX – VOUTMIN)ILOADMAX

VINMAX

VOUTMIN

ILOADMAX

= Worst case actual pow er dissipation

= Minimum regulator output voltage

= Max imum output (load) current

= Maximum voltage on

VIN

MAX

= (T

MAX

–

MAX

)



Where all terms are previously defined.

PDMAX = (TJMAX – TAMAX)

JA

= (125 – 55)

200

= 350mW

TC1269

DS21380C-page 6  2002-2012 Microchip Technology Inc.

5.0 TYPICAL CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only . The p erformance chara cteristics listed herein are

not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Output Noise

FREQUENCY (kHz)

NOISE (μV/√HZ)

10.0

1.0

0.01 0.01 1 10 100 1000

0.1

0.0

RLOAD = 50Ω

COUT = 1μF

0.012

0.010

0.008

0.004

0.002

0.000

-0.002

-0.004

0.006

-40°-20°0°20°40°60°80°100°120°

TEMPERATURE (°C)

Line Regulation

LINE REGULATION (%)

2.00

1.80

1.60

1.20

1.00

0.80

0.60

0.40

0.20

0.00

1.40

-40°-20°0°20°40°60°80°100°120°

TEMPERATURE (°C)

Load Regulation

LOAD REGULATION (%)

1 to 300mA

1 to 50mA

1 to 100mA

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

050 100 150 200 250 300

LOAD CURRENT (mA)

DROPOUT VOLTAGE (V)

100.0

90.0

70.0

80.0

50.0

40.0

60.0

-40°-20°0°20°40°60°80°100°120°

TEMPERATURE (°C)

Supply Current

SUPPLY CURRENT (μA)

3.075

3.025

2.925

2.975

-40°-20°0°20°40°60°80°100°120°

TEMPERATURE (°C)

OUT

vs. Temperature

VOUT (V)

-4

= 4V

LOAD

= 100μA

LOAD

= 3.3μF

 2002-2012 Microchip Technology Inc. DS21380C-page 7

TC1269

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Pack age marking data not available at this time.

6.2 Taping Form

6.3 Package Dimensions

Component Taping Orientation for 8-Pin MSOP Devices

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

8-Pin MSOP 12 mm 8 mm 2500 13 in

Carrier Tape, Number of Components Per Reel and Reel Size

PIN 1

User Direction of Feed

Standard Reel Component Orientation

for TR Suffix Device

8-Pin MSOP

.122 (3.10)

.114 (2.90)

.122 (3.10)

.114 (2.90)

.043 (1.10)

MAX.

.006 (0.15)

.002 (0.05)

.016 (0.40)

.010 (0.25)

.197 (5.00)

.189 (4.80)

.008 (0.20)

.005 (0.13)

.028 (0.70)

.016 (0.40)

6° MAX.

.026 (0.65) TYP.

PIN 1

Dimensions: inches (mm)

Note: For th e mo s t c urr e nt pac kag e d r awi n gs , plea se se e th e M ic roc hi p Pa c ka gi n g Sp e ci f ic at ion lo c at e d

at http://www.microchip.com/packaging

TC1269

DS21380C-page 8  2002-2012 Microchip Technology Inc.

7.0 REVISION HISTORY

Revision C (November 2012)

Added a note to each package outline drawing.

 2002-2012 Microchip Technology Inc. DS21380C-page9

TC1269

SALES AND SUPPORT

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

TC1269

DS21380C-page10  2002-2012 Microchip Technology Inc.

NOTES:

 2002-2012 Microchip Technology Inc. DS21380C-page 11

Information contained in this publication regarding device

applications and the like is provided only for your con ve nience

and may be supersed ed by updates. It is y our respo ns ibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTA RT, PI C32 logo, rfPIC, SST, SST Logo, SuperF lash

and UNI/O are registered trademarks of Microchip T echnology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor ,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONIT OR, FanSense, HI- TIDE , In - Circuit Serial

Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MP LAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PI CC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & C o. & KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 9781620767825

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their par ticular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure famili es of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal m ethods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contai ned in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of int ellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperiph erals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

DS21380C-page 12  2002-2012 Microchip Technology Inc.

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