© 2005 Fairchild Semiconductor Corporation DS500238 www.fairchildsemi.com
October 1999
Revised February 2005
74LCX07 Low Voltage Hex Buffer with Open Drain Outputs
74LCX07
Low Voltage Hex Buffer with Open Drain Outputs
General Descript ion
The LCX07 contains six buffers. The inputs tolerate volt-
ages up to 7V allowing the interface of 5V systems to 3V
systems.
The outputs of th e LCX07 are open drai n and can be co n-
nected to other open drain outputs to implement active
HIGH wire AND or active LOW wire OR functions.
The 74LC X07 is fabricated with advanced CMO S technol-
ogy to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
■5V tolerant inputs
■2.3V to 5.5V VCC specifications pro vided
■2.9 ns tPD max (VCC
3.3V), 10
P
A ICC max
■Power down high impedance inputs and outputs
■
24 mA output drive (VCC
3.0V)
■Implements patented noise/EMI reduction circuitry
■Latch-up performance exceeds JEDEC 78 conditions
■ESD performa nce :
Human body model
!
2000V
Machine model
!
200V
■Leadless Pb-Free DQFN package
Ordering Code:
Devices also available in Tape and Reel. Specify by append ing the suffix let t er “X” to the ordering co de.
Note 1: “_NL” indicat es Pb-Fre e pac k age (per JE D EC J -STD-0 20B). Devic e availa ble in Tape and Reel only.
Note 2: DQFN packag e av ailable in Tape and Reel only.
Order Number Package Package Description
Number
74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07MX_NL
(Note 1) M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX07BQX
(Note 2) MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX07MTCX_NL
(Note 1) MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide