IXD_602 2-Ampere Dual Low-Side Ultrafast MOSFET Drivers Features Description * 2A Peak Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Matched Rise and Fall Times * Low Propagation Delay Time: 25ns * Low 10A Supply Current * Low Output Impedance The IXDF602/IXDI602/IXDN602 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 2A of peak current while producing voltage rise and fall times of less than 10ns. The input of each driver is TTL and CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross conduction and current "shoot-through." Low propagation delay and fast, matched rise and fall times make the IXDF602/IXDI602/ IXDN602 ideal for high-frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver Pb e3 RoHS 2002/95/EC The IXDN is configured as a dual non-inverting driver, the IXDI is configured as a dual inverting driver, and the IXDF is configured as a dual driver, one inverting and one non-inverting. The IXDF602/IXDI602/IXDN602 family is available in a standard 8-pin DIP (PI), 8-lead SOIC (SIA), 8-lead SOIC with an exposed grounded metal back (SI), and an 8-lead DFN (D2) package. Ordering Information Logic Configuration Part Number IXDF602D2TR IXDF602PI IXDF602SI IXDF602SITR IXDF602SIA IXDF602SIATR IXDI602D2TR IXDI602PI IXDI602SI IXDI602SITR IXDI602SIA IXDI602SIATR IXDN602D2TR IXDN602PI IXDN602SI IXDN602SITR IXDN602SIA IXDN602SIATR INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB DS-IXD_602 - R00B Package Type Packing Method Quantity 8-Lead DFN 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Lead DFN 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Lead DFN 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel 2000 50 100 2000 100 2000 2000 50 100 2000 100 2000 2000 50 100 2000 100 2000 PRELIMINARY 1 IXD_602 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 5 5 2. Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 R00B PRELIMINARY 2 IXD_602 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDF602 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB Pin Name IXDI602 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB 8 NC 7 OUTA 6 VCC 5 OUTB Description INA Channel A Logic Input INB Channel B Logic Input OUTA OUTA Channel A Output -Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output -Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDN602 NC 1 INA 2 GND 3 INB 4 A B 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC - 40 V All Other Pins - -0.3 VCC+0.3 V - 2 A Output Current Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Unless otherwise specified, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range R00B Symbol Minimum Maximum Units VCC 4.5 35 V TA -40 +125 C PRELIMINARY 3 IXD_602 1.5 Electrical Characteristics Test Conditions: TA=25C, 4.5V < VCC < 35V, one channel (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 0V < VIN < VCC IIN -10 - 10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 2.5 4 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 2 3 IDC - - 1 tR - 7.5 10 Input Voltage Range Input Current Rise Time Limited by package power dissipation CLOAD=1000pF, VCC=18V Fall Time CLOAD=1000pF, VCC=18V tF - 6.5 9 On-Time Propagation Delay CLOAD=1000pF, VCC=18V tONDLY - 25 32 Off-Time Propagation Delay CLOAD=1000pF, VCC=18V tOFFDLY - 20 30 - 1 3 - - 10 - - 10 Output Current, Continuous VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC 4 PRELIMINARY ICC Units V A V A ns mA A R00B IXD_602 1.6 Electrical Characteristics Test Conditions: TA=-40C to +125C, 4.5V < VCC < 35V, TJ<150C, one channel (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 0V < VIN < VCC IIN -10 - 10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 2.5 6 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 2 6 IDC - - 1 tR - - 11 Input Voltage Range Input Current Rise Time Limited by package power dissipation CLOAD=1000pF, VCC=18V Fall Time CLOAD=1000pF, VCC=18V tF - - 10 On-Time Propagation Delay CLOAD=1000pF, VCC=18V tONDLY - - 40 Off-Time Propagation Delay CLOAD=1000pF, VCC=18V tOFFDLY - - 38 - 1 3 - - 10 - - 10 Output Current, Continuous VCC=18V, VIN=3.5V VCC=18V, VIN=0V Power Supply Current ICC VCC=18V, VIN=VCC Units V A V A ns mA A 1.7 Thermal Characteristics Package Parameter Rating D2 (8-Lead DFN) Units 100 PI (8-Lead DIP) 125 JA SI (8-Lead SOIC with Exposed Metal Back) C/W 71 SIA (8-Lead SOIC) 128 2 Performance Characteristics VIH INx VIH INx VIL tondelay VIL toffdelay toffdelay tondelay tf tr 90% OUTx OUTx 10% 90% 10% tr tf Non-Inverting Driver Waveforms R00B Inverting Driver Waveforms PRELIMINARY 5 IXD_602 3 Mechanical Dimensions 3.0.1 8-Pin SOIC - SIA Package 0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 (0.213) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 0.60 (0.024) 0 / 8 4.80 / 5.00 (0.190 / 0.197) 0.10 / 0.25 (0.004 / 0.010) Recommended PCB Land Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.30 / 1.75 (0.051 / 0.069) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation AA. 3.0.2 8-Pin SOIC - SI Package 3.80 (0.150) 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 2.75 5.40 (0.209) (0.108) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 1.27 (0.050) 0.60 (0.024) 0 / 8 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3.81 (0.130 / 0.150) 6 NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation BA. PRELIMINARY R00B IXD_602 3.0.3 8-Pin DFN - D2 Package 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.158 BSC) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177) 3.05 (0.120) 0.45 (0.018) 0.00 / 0.05 (0.000 / 0.002) 2.55 (0.100) 1.20 (0.047) 0.76 / 0.81 (0.030 / 0.032) Recommended PCB Land Pattern 3.04 / 3.09 (0.120 / 0.122) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) Pin 8 Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.54 / 2.59 (0.100 / 0.102) 3.0.4 8-Pin DIP - PI Package 9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 6.10 / 6.86 (0.240 / 0.270) 7.62 BSC (0.300 BSC) 2.540 BSC (0.100 BSC) 0.38 / 1.02 (0.015 / 0.040) 7.37 / 8.26 (0.290 / 0.325) 3.05 / 3.81 (0.120 / 0.150) 7.62 / 10.92 (0.300 / 0.430) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100) 7.50 (0.295) 1.40 (0.055) PC Board Pattern 3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023) 3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_602-R00B (c)Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 7/7/2010 R00B PRELIMINARY 7