SEMICONDUCTOR TECHNICAL DATA KEC KIA7019AP/AF ~ KIA7045AP/AF BIPOLAR LINEAR INTEGRATED CIRCUIT VOLTAGE DETECTOR Function of this IC is accurately resetting the system after detecting voltage at the time of switching power on and instantaneous power off in various CPU systems and other logic systems. < I | 1 t | N DIM MILLIMETERS FEATURES K i a | 470 Max . . et B 4.80 MAX * Current Consumption is Low. IccL=300HA Typ. Icci=30uA Typ. D c 3.70 MAX * Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ. : se * Hysteresis Voltage is Provided. 50mV Typ. r = * Reset Signal Generation Starting Voltages: Pu a 0.45 KIA701I9AP/AF 1.9V Typ. KIA7033AP/AF 3.3V Typ. : ne 1 ee KIA7021AP/AF 2.1V Typ. KIA7034AP/AF 3.4V Typ. x see KIA7023AP/AF 2.3V Typ. KIA7035AP/AF 3.5V Typ. N 1.00 KIA7025AP/AF 2.5V Typ. KIA7036AP/AF 3.6V Typ. KIA7027AP/AF 2.7V Typ. KIA7039AP/AF 3.9V Typ. 2. OND KIA7029AP/AF 29V Typ. KIA7042AP/AF 4.2V Typ. 3 our KIA7031AP/AF 3.1V Typ. KIA7045AP/AF 4.5V Typ. TO-92 KIA7032AP/AF 3.2V Typ. * Taping Type is also Available. APPLICATIONS (1) As Control Circuit of Battery-Backed Memory. A c (2) As Measure Against Erroneous Operations at Power ON-OFF. H (3) As Measure Against System Runaway at Instantaneous a_i I . Break of Power Supply etc. A pa (4) As Resetting Function for the CPU-Mounted Equipment, ToT 1 DIM | MILLIMETERS such as Personal Computers, Printers, VTRs and so forth. >! LY i Lo! : K Cc 1.70 MAX EQUIVALENT CIRCUIT ale P| OB To.t0 E 4.25 MAX F 1.504 0.10 oe Voc | 040 J 0.75 MIN OUT 1 2 3 K 0640 1. Vec 2. GND 3. OUT GND SOT89 MAXIMUM RATINGS (Ta=25T) MARKING CHARACTERISTIC SYMBOL] RATING |UNIT Type No. | Marking | Type No. | Marking KIA7019AF 6A KIA7023AF 6J Supply Volt: Vec -0.3~+15.0| V upp wouaes ve KIA7021AF| 6B |KIA7034AF| 6K Power Dissipation | KIA70I9AP~45AP p 400 nw KIA7023AF| 6C |KIA7035AF] 6L an . D (Package Limitation) | x] q79194F~45AF 500 KIA7025AF| 6D |KIA7036AF| 6M Operating Temperature Topr -30~ +75 Cc KIA7027AF OE KIA7039AF ON KIA7029AF 6F KIA7042AF 6P Storage Temperature Tag 5d ~ +150 C KIA7031AF 6G KIA7045AF 6R KIA7032AF 6H 1998. 6. 29 Revision No : 1 KEC V4KIA7019AP/AF ~ KTA7045AP/AF ELECTRICAL CHARACTERISTICS CHARACTERISTIC SYMBOL|TEST CIR. TEST CONDITION MIN. | TYP. | MAX. | UNIT KIA701I9AP/AF| 1.75 1.9 2.05 KIA7021AP/AF| 1.95 2.1 2.25 KIA7023AP/AF| 2.15 2.3 2.45 KIA7025AP/AF | 2.35 25 2.65 KIA7027AP/AF | 2.55 2.7 2.85 KIA7029AP/AF | 2.75 29 3.05 Rr =2002 KIA7031AP/AF | 2.95 3.1 3.25 Detecting Voltage Vs 1 v. <0.4V KIA7032AP/AF | 3.05 3.2 3.35 Vv OLS KIA7033AP/AF | 3.15 3.3 3.45 KIA7034AP/AF | 3.25 3.4 3.55 KIA7035AP/AF | 3.35 3.5 3.65 KIA7036AP/AF | 3.45 3.6 3.75 KIA7039AP/AF | 3.75 3.9 4.05 KIA7042AP/AF | 4.05 A2 4.35 KIA7045AP/AF | 4.35 A5 4.65 Low-Level Output Voltage Vor 1 Ri_=200 02 - - 0.4 Vv Output Leakage Current Tou 1 Vec=l15V - - 0.1 LA Hysteresis Voltage AVs 1 Rr=200 2 30 50 100 mV Detecting Voltage Vs/AT 1 Rr=200.2 - |+oo1] - | vt Temperature Coefficient Circuit Current at on Time IccL 1 Vcec=Vsmin.-0.05V - 300 500 LA Circuit Current at off Time IccH 1 Vec=5.25V - 30 50 LA Threshold Operating Voltage Vopr 1 Rr=200 62 - 0.8 - Vv Vor s0.4V "L Transmission Delay Time tpHL 2 Coton - 10 - US "H" Transmission Delay Time tpLH 2 Cobo, . - 15 - US Output Current at on Time I ToL I 1 VeorVs min.~0.05V" 20 - - mA Tce=25C _ Vcc=Vsmin.-0.05V . _ _ Output Current at on Time II ToL II 1 Te=-20~ 475C 16 mA 1998. 6. 29 Revision No : 1 KEC 2/4KIA7019AP/AF ~ KIA7045AP/AF TEST CIRCUIT 1. @- Ry, V1) [KIA70XXAP/AFL(3 ) ] ifn 10uF/ 10V(M) / mm TEST CIRCUIT 2. Ry, Q im aot te = sv Input 7 0.2uF > Pulse | /10V Cr, (at) + T | APPLICATION CIRCUIT (1) BATTERY LOW INDICATOR (2) CPU RESETTING Vec , OVec 5V Re R1 Veo KIA70xxAP/AF KIA70xxAP/AF Reset CPU LED \ GND bom Veco =5V i L NL V Delay Time for Power ON Reset | (1) Connecting of LED and R2 obtains a voltage drop indicator. (NOTE) (2) Connecting of C1 and selection of time constant with C1 and R1 set the power on delay time. 1998. 6. 29 Revision No : 1 KEC 3/4KIA7019AP/AF ~ KTA7045AP/AF PRECAUTION FOR USE SOLDERING Flat Package (SOT-89 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. oS 240 Do 5S ae Gx os 210 a, o& | | pr | | 28 | FS 150 as | | a | | oe | | n 6 | | al | | l | 60 sec. _ | |. | Time (sec.) Wi Within 30 sec. Fig 6 (a) When employing solder reflow method @ Atmospheric temperature around resin surfaces must be less than 240C, not exceeding the time length of 10 sec. @ Recommend temperature profile @ Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. * Please keep a reflow solder operating when SOT-89 package's soldering. 1998. 6. 29 Revision No : 1 KEC 4/4