PCAN
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Revision: 08-May-2018 1Document Number: 60125
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Chip Resistor (up to 6 W)
PCAN series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
FEATURES
High thermal conductivity aluminum nitride
substrate
Power rating up to 6.0 W
Resistance range 2 to 30.1 k
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
APPLICATIONS
Power supplies
Power switching
Braking system
TYPICAL PERFORMANCE
Note
(1) Dependant on component mounting by user
Note
(1) Dependant on component mounting by user
ABSOLUTE
TCR 25
TOL. 0.1
Available
Available
Available
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Passivated nichrome -
Resistance Range 2 to 30.1 k-
TCR: Absolute 25 ppm/°C (standard) and 100 ppm/°C -
Tolerance: Absolute 0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 % -55 °C to +150 °C
Power Rating: Resistor 0.5 W to 6.0 W (1) Maximum at +70 °C
Stability: Absolute R 1.0 % 1000 h at +70 °C
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 75 V to 100 V -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise < -30 dB -
Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C
COMPONENT RATINGS
CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE ()
0603 500 (1) 75 2 to 30.1K
0805 1000 (1) 100 2 to 30.1K
1206 2000 (1) 100 2 to 30.1K
2512 6000 (1) 100 2 to 30.1K
PCAN
www.vishay.com Vishay Dale Thin Film
Revision: 08-May-2018 2Document Number: 60125
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Environmental testing was performed based on MIL-STD-202 Standard Test Methods
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST (1) TEST LIMITS TYPICAL VISHAY
PERFORMANCE
Resistance temperature characteristic ± 25 ppm/°C ± 15 ppm/°C
Maximum ambient temperature at rated wattage +70 °C +70 °C
Maximum ambient temperature at power derating +150 °C +150 °C
Thermal shock ± 0.25 % ± 0.10 %
Low temperature operation ± 0.25 % ± 0.01 %
Short time overload ± 0.5 % ± 0.2 %
High temperature exposure ± 0.2 % ± 0.05 %
Resistance to soldering heat ± 0.25 % ± 0.025 %
Moisture resistance ± 0.4 % ± 0.01 %
Life at +70 °C for 1000 h ± 1.00 % ± 0.4 %
DIMENSIONS in inches
CASE SIZE LENGTH
L
WIDTH
W
THICKNESS
T
MIN./MAX.
TOP PAD
D
BOTTOM PAD
E
0603 0.064 ± 0.006 0.032 ± 0.005 0.015 ± 0.003 0.012 ± 0.005 0.021 ± 0.005
0805 0.080 ± 0.006 0.050 ± 0.005 0.015 ± 0.003 0.016 ± 0.005 0.025 ± 0.005
1206 0.126 ± 0.008 0.063 ± 0.005 0.015 ± 0.003 0.020 + 0.005 / - 0.010 0.040 ± 0.005
2512 0.259 + 0.009 / - 0.015 0.124 ± 0.005 0.015 ± 0.003 0.020 ± 0.005 0.050 ± 0.005
LAND PATTERN DIMENSIONS in inches
D
L
E
T
W
L
DT
0.0920
0.0340
0.0390
0.0140
0603 Land Pattern
0.1050
0.0520
0.0425
0.0200
0805 Land Pattern
0.1730
0.0710
0.0755
0.0220
1206 Land Pattern
0.2910
0.1260
0.0910
0.1090
2512 Land Pattern
PCAN
www.vishay.com Vishay Dale Thin Film
Revision: 08-May-2018 3Document Number: 60125
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate testcard surface
temperature of 75 °C.
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate testcard surface
temperature of 75 °C.
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
•Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels
Thermal imaging and load life testing was conducted mounting
one device to a 1.6" x 3.7" test card with 3.5 mil copper plating
on both surfaces. Thermal vias on 50 mil centers were utilized for
heat transfer between surfaces of the test card
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
STANDARD MATERIAL SPECIFICATIONS
Resistive element Passivated nichrome
Substrate material Aluminum nitride
Terminations (Tin/lead) Tin / lead solder over nickel barrier
Terminations (Lead (Pb)-free) Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over nickel barrier
PCAN0603 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
200 Ω
20 Ω
7.0
6.0
4.0
3.0
2.0
1.0
0.0
5.0
PCAN0805 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
200 Ω
50 Ω
8.0
6.0
4.0
3.0
2.0
1.0
0.0
5.0
7.0
PCAN1206 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
12.0
10.0
8.0
6.0
4.0
2.0
0.0
175 Ω
30 Ω
PCAN2512 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
12.0
10.0
8.0
6.0
4.0
2.0
0.0
150 Ω
30 Ω
PCAN
www.vishay.com Vishay Dale Thin Film
Revision: 08-May-2018 4Document Number: 60125
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1) Less than 10 . 100 ppm/°C and 1 % tolerance best
(2) Available on 10 and higher
DERATING CURVE
SINGLE PULSE LOAD TESTING
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PCAN1206H1000BBT1
GLOBAL
MODEL
CASE
SIZE
TCR
CHARACTERISTIC RESISTANCE TOLERANCE TERMINATION PACKAGING
PCAN 0603
0805
1206
2512
E = ± 25 ppm/°C
H = ± 50 ppm/°C
K = ± 100 ppm/°C (1)
The first 3 digits are
significant figures and
the last digit specifies
the number of zeros
to follow.
“R” designates the
decimal point.
Example:
10R0 = 10
1000 = 100
B = ± 0.1 % (2)
C = ± 0.25 %
D = ± 0.5 %
F = ± 1.0 % (1)
G = ± 2.0 %
B = wraparound
Sn/Pb solder
w/ nickel barrier
S = wraparound
lead (Pb)-free
solder (e1)
RoHS compliant
G =wraparound Au,
over Ni (gold)
termination
epoxy bondable
RoHS compliant
(e4)
BS = BULK
100 min., 1 mult
WS = WAFFLE
100 min., 1 mult
W0 = 100 pc min. waffle,
1 mult
WI = 100 min., 1 mult
(package unit single lot
date code)
TAPE AND REEL
T0 = 100 min., 100 mult
T1 = 1000 min., 1000 mult
T3 = 300 min., 300 mult
T5 = 500 min., 500 mult
TF = Full reel
TS = 100 min., 1 mult
TI = 100 min., 1 mult
(item single lot date code)
TP = 100 min., 1 mult
(package unit single lot
date code)
Ambient Temperature °C
0155
0
20
40
60
80
100
Percent of Rated Power
70 125
Pulse Duration (s)
Peak Power (W)
0.1
1
10
100
0.00001 10.10.010.0010.0001 10
100 Ω - 2512
100 Ω - 1206
06H1 00B01 BT1NPC 2A
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Revision: 08-Feb-17 1Document Number: 91000
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