LMV7210DBV or DCK PACKAGE
(TOP VIEW)
LMV7220D, DGK, OR DRG PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
VCC+
2OUT
2IN−
2IN+
1OUT
1IN−
1IN+
VCC−
1
2
3
5
4
OUT
VCC−
IN+
VCC+
IN−
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
Check for Samples: LMV721,LMV722
1FEATURES
• Power-Supply Voltage Range: 2.2 V to 5.5 V
• Low Supply Current: 930 mA/Amplifier at 2.2 V
• High Unity-Gain Bandwidth: 10 MHz
• Rail-to-Rail Output Swing
– 600-ΩLoad: 120 mV From Either Rail at
2.2 V
– 2-kΩLoad: 50 mV From Either Rail at 2.2 V
• Input Common-Mode Voltage Range Includes
Ground
• Input Voltage Noise: 9 nV/√Hz at f = 1 kHz
APPLICATIONS
• Cellular and Cordless Phones
• Active Filter and Buffers
• Laptops and PDAs
• Battery Powered Electronics
DESCRIPTION/ORDERING INFORMATION
The LMV721 (single) and LMV722 (dual) are low-noise low-voltage low-power operational amplifiers that can be
designed into a wide range of applications. The LMV721 and LMV722 have a unity-gain bandwidth of 10 MHz, a
slew rate of 5 V/ms, and a quiescent current of 930 mA/amplifier at 2.2 V.
The LMV721 and LMV722 are designed to provide optimal performance in low-voltage and low-noise systems.
They provide rail-to-rail output swing into heavy loads. The input common-mode voltage range includes ground,
and the maximum input offset voltage are 3.5 mV (over recommended temperature range) for the devices. Their
capacitive load capability is also good at low supply voltages. The operating range is from 2.2 V to 5.5 V.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
Reel of 3000 LMV721IDCKR
SC-70 – DCK RK_
Single Reel of 250 LMV721IDCKT
SOT-23 – DBV Reel of 3000 LMV721IDBVR RBF_
–40°C to 105°C Reel of 2500 LMV722IDR
SOIC – D MV722I
Tube of 75 LMV722ID
Dual VSSOP – DGK Reel of 2500 LMV722IDGKR R6_
QFN – DRG Reel of 2500 LMV722IDRGR ZYY
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
R1
+
VCC
−
C2
Output
R2
VCC
Input
Electret
Microphone
C1
R3
R5
R4
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
Typical Application
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC+ – VCC– Supply voltage(2) 6 V
VID Differential input voltage(3) ±Supply voltage V
D package(5) 97
DBV package(5) 206
qJA Package thermal impedance(4) DCK package(5) 252 °C/W
DGK package(5) 172
DRG package(6) 50.7
TJOperating virtual-junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN−.
(4) Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/qJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
(6) The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions MIN MAX UNIT
VCC+ – VCC– Supply voltage 2.2 5.5 V
TJOperating virtual-junction temperature –40 105 °C
ESD Protection TYP UNIT
Human-Body Model 2000 V
Machine Model 100 V
2Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
Electrical Characteristics
VCC+ = 2.2 V, VCC−= GND, VICR = VCC+/2, VO= VCC+/2, and RL> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS TJMIN TYP MAX UNIT
25°C 0.02 3
VIO Input offset voltage mV
–40°C to 105°C 3.5
TCVIO Input offset voltage average drift 25°C 0.6 mV/°C
IIB Input bias current 25°C 260 nA
IIO Input offset current 25°C 25 nA
25°C 70 88
CMMR Common-mode rejection ratio VICR = 0 V to 1.3 V dB
–40°C to 105°C 64
25°C 80 90
VCC+ = 2.2 V to 5 V,
PSRR Power-supply rejection ratio dB
VO= 0, VICR = 0 –40°C to 105°C 70
CMRR ≥50 dB –0.3
VICR Input common-mode voltage 25°C V
1.3
25°C 75 81
RL= 600 Ω,
VO= 0.75 V to 2 V –40°C to 105°C 70
AVD Large-signal voltage gain dB
25°C 75 84
RL= 2 kΩ,
VO= 0.5 V to 2.1 V –40°C to 105°C 70
25°C 2.090 2.125
RL= 600 Ωto VCC+/2 –40°C to 105°C 2.065
25°C 0.071 0.120
–40°C to 105°C 0.145
VOOutput swing V
25°C 2.150 2.177
RL= 2 kΩto VCC+/2 –40°C to 105°C 2.125
25°C 0.056 0.080
–40°C to 105°C 0.105
25°C 10 14.9
Sourcing, VO= 0 V,
VIN(diff) = ±0.5 V –40°C to 105°C 5
IOOutput current mA
25°C 10 17.6
Sinking, VO= 2.2 V,
VIN(diff) = ±0.5 V –40°C to 105°C 5
25°C 0.93 1.3
LMV721 –40°C to 105°C 1.5
ICC Supply current mA
25°C 1.81 2.4
LMV722 –40°C to 105°C 2.6
SR Slew rate(1) 25°C 4.9 V/ms
GBW Gain bandwidth product 25°C 10 MHz
ΦmPhase margin 25°C 67.4 °
GmGain margin 25°C –9.8 dB
VnInput-referred voltage noise f = 1 kHz 25°C 9 nV/√Hz
InInput-referred current noise f = 1 kHz 25°C 0.3 pA/√Hz
f = 1 kHz, AV = 1,
THD Total harmonic distortion 25°C 0.004 %
RL= 600 Ω, VO= 500 mVpp
(1) Connected as voltage follower with 1-V step input. Number specified is the slower of the positive and negative slew rate.
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): LMV721 LMV722
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
Electrical Characteristics
VCC+ = 5 V, VCC−= GND, VICR = VCC+/2, VO= VCC+/2, and RL> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS TJMIN TYP MAX UNIT
25°C –0.08 3
VIO Input offset voltage mV
–40°C to 105°C 3.5
TCVIO Input offset voltage average drift 25°C 0.6 mV/°C
IIB Input bias current 25°C 260 nA
IIO Input offset current 25°C 25 nA
25°C 80 89
CMMR Common-mode rejection ratio VICR = 0 V to 4.1 V dB
–40°C to 105°C 75
25°C 70 90
VCC+ = 2.2 V to 5 V,
PSRR Power-supply rejection ratio dB
VO= 0, VICR = 0 –40°C to 105°C 64
CMRR ≥50 dB –0.3
VICR Input common-mode voltage 25°C V
4.1
25°C 80 87
RL= 600 Ω,
VO= 0.75 V to 4.8 V –40°C to 105°C 70
AVD Large-signal voltage gain dB
25°C 80 94
RL= 2 kΩ,
VO= 0.7 V to 4.9 V –40°C to 105°C 70
25°C 4.84 4.882
RL= 600 Ωto VCC+/2 –40°C to 105°C 4.815
25°C 0.134 0.19
–40°C to 105°C 0.215
VOOutput swing V
25°C 4.93 4.952
RL= 2 kΩto VCC+/2 –40°C to 105°C 4.905
25°C 0.076 0.11
–40°C to 105°C 0.135
25°C 20 52.6
Sourcing, VO= 0 V,
VIN(diff) = ±0.5 V –40°C to 105°C 12
IOOutput current mA
25°C 15 23.7
Sinking, VO= 2.2 V,
VIN(diff) = ±0.5 V –40°C to 105°C 8.5
25°C 1.03 1.4
LMV721 –40°C to 105°C 1.7
ICC Supply current mA
25°C 2.01 2.4
LMV722 –40°C to 105°C 2.8
SR Slew rate(1) 25°C 5.25 V/ms
GBW Gain bandwidth product 25°C 10 MHz
ΦmPhase margin 25°C 72 °
GmGain margin 25°C –11 dB
VnInput-referred voltage noise f = 1 kHz 25°C 8.5 nV/√Hz
InInput-referred current noise f = 1 kHz 25°C 0.2 pA/√Hz
f = 1 kHz, AV = 1,
THD Total harmonic distortion 25°C 0.001 %
RL= 600 Ω, VO= 500 mVpp
(1) Connected as voltage follower with 1-V step input. Number specified is the slower of the positive and negative slew rate.
4Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to VCC – V
Isource – Sourcing Current – mA
VCC = 2.2 V
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
2 2.5 3 3.5 4 4.5 5 5.5 6
VCC – Supply Voltage – V
ICC – Supply Current – mA
TA= 125°C TA= 85°C
TA= –40°C
TA= 25°C
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to VCC – V
Isink – Sinking Current – mA
VCC = 2.2 V
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to VCC – V
Isource – Sourcing Current – mA
VCC = 5 V
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS
SUPPLY CURRENT SOURCING CURRENT
vs vs
SUPPLY VOLTAGE OUTPUT VOLTAGE
SOURCING CURRENT SINKING CURRENT
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): LMV721 LMV722
0.1
1
10
100
0.001 0.01 0.1 1 10
Output Voltage Referenced to VCC – V
Isink – Sinking Current – mA
VCC = 5 V
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
2 2.5 3 3.5 4 4.5 5
VCC – Supply Voltage – V
VIO – Input Offset Voltage – mV
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0 0.3 0.6 0.9 1.2 1.5
VICR – Input Common-Mode Voltage – V
VIO – Input Offset Voltage – mV
VCC = 2.2 V
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0 0.5 1 1.5 2 2.5 3 3.5 4
VICR – Input Common-Mode Voltage – V
VIO – Input Offset Voltage – mV
VCC = 5 V
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SINKING CURRENT OUTPUT VOLTAGE SWING
vs vs
OUTPUT VOLTAGE SUPPLY VOLTAGE
INPUT OFFSET VOLTAGE INPUT OFFSET VOLTAGE
vs vs
INPUT COMMON-MODE VOLTAGE INPUT COMMON-MODE VOLTAGE
6Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Output Voltage – V
Input Differential Voltage – mV
VCC = 5 V
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0 0.5 1 1.5 2 2.5
Output Voltage – V
Input Differential Voltage – mV
VCC = 2.2 V
1
10
100
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
f – Frequency – Hz
Input Voltage Noise – µV/ Hz
10 100 1k 10k 100k
√Hz
0.1
1
10
100
1.E+01 1.E+02 1.E+03 1.E+04
f – Frequency – Hz
Input Current Noise – pA/ Hz
10 100 1k 10k
√Hz
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS (continued)
INPUT VOLTAGE INPUT VOLTAGE
vs vs
OUTPUT VOLTAGE OUTPUT VOLTAGE
INPUT VOLTAGE NOISE INPUT CURRENT NOISE
vs vs
FREQUENCY FREQUENCY
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): LMV721 LMV722
0
20
40
60
80
100
120
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
f – Frequency – Hz
PSRR – dB
VCC = 2.2 V
100 1k 10k 100k 1M 10M
0
20
40
60
80
100
120
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
f – Frequency – Hz
PSRR – dB
VCC = 5 V
100 1k 10k 100k 1M 10M
-20
-10
0
10
20
30
40
50
60
70
80
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
f – Frequency – Hz
Gain – dB
-20
-5
10
25
40
55
70
85
100
115
130
Phase – deg
Phase
Gain
VCC = 5 V
1k 10k 100k 1M 10M 100M
-20
-10
0
10
20
30
40
50
60
70
80
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
f – Frequency – Hz
Gain – dB
-20
-5
10
25
40
55
70
85
100
115
130
Phase – deg
Phase
Gain
VCC = 2.2 V
1k 10k 100k 1M 10M 100M
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
PSRR PSRR
vs vs
FREQUENCY FREQUENCY
GAIN AND PHASE GAIN AND PHASE
vs vs
FREQUENCY FREQUENCY
8Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
0.0001
0.001
0.01
0.1
1
100 1000 10000 100000
f – Frequency – Hz
THD – %
VCC = 2.2 V
100 1k 10k 100k
4
4.2
4.4
4.6
4.8
5
5.2
5.4
5.6
5.8
6
2 2.5 3 3.5 4 4.5 5
VCC – Supply Voltage – V
SR – Slew Rate – V/µs
Rising
Falling
RL= 2 k©, CL= 21.2 nF, RO= 0 ©
2 µs per Division
0.25 V per Division
V = 5V, R = 2 k , C = 21.2 nF, R = 0
CC L L O
Ω Ω
RL= 2 k©, CL= 21.2 nF, RO= 2.1 ©
2 µs per Division
0.25 V per Division
V = 5V, R = 2 k , C = 21.2 nF, R = 2.1
CC L L O
Ω Ω
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS (continued)
SLEW RATE THD
vs vs
SUPPLY VOLTAGE FREQUENCY
PULSE RESPONSE PULSE RESPONSE
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): LMV721 LMV722
RL= 2 k©, CL= 21.2 nF, RO= 9.5 ©
2 µs per Division
0.25 V per Division
V = 5V, R = 2 k , C = 21.2 nF, R = 9.5
CC L L O
Ω Ω
RL= 10 k©, CL= 21.2 nF, RO= 0 ©
2 µs per Division
0.25 V per Division
V = 5V, R = 10 k , C = 21.2 nF, R = 0
CC L L O
Ω Ω
RL= 600 ©, CL= 21.2 nF, RO= 0 ©
2 µs per Division
0.25 V per Division
V = 5V, R = 600 , C = 21.2 nF, R = 0
CC L L O
Ω Ω
RL= 2 ©, CL= 2.12 nF, RO= 0 ©
1 µs per Division
250 mV per Division
V = 2.2V, R = 2 , C = 2.12 nF, R = 0
CC L L O
Ω Ω
RL= 2 k©, CL= 2.12 nF, RO= 0 ©
1 µs per Division
250 mV per Division
V = 2.2V, R = 2 k , C = 2.12 nF, R = 0
CC L L O
Ω Ω
RL= 10 k©, CL= 2.12 nF, RO= 0 ©
1 µs per Division
250 mV per Division
V = 2.2V, R = 10 k , C = 2.12 nF, R = 0
CC L L O
Ω Ω
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
PULSE RESPONSE PULSE RESPONSE
PULSE RESPONSE PULSE RESPONSE
PULSE RESPONSE PULSE RESPONSE
10 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
RL= 10 k©, CL= 2.12 nF, RO= 2.2 ©
1 µs per Division
250 mV per Division
V = 2.2V, R = 10 k , C = 2.12 nF, R = 2.2
CC L L O
Ω Ω
RL= 10 k©, CL= 2.12 nF, RO= 11.5 ©
1 µs per Division
250 mV per Division
V = 2.2V,
CC R = 10 k , C = 2.12 nF, R = 11.5
L L O
Ω Ω
RL= 600 ©, CL= 1.89 nF, RO= 0 ©
1 µs per Division
250 mV per Division
V = 2.2V, R = 600 , C = 1.89 nF, R = 0
CC L L O
Ω Ω
LMV721
LMV722
www.ti.com
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS (continued)
PULSE RESPONSE PULSE RESPONSE
PULSE RESPONSE
Copyright © 2005–2010, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): LMV721 LMV722
LMV721
LMV722
SLOS470C –JUNE 2005–REVISED SEPTEMBER 2010
www.ti.com
REVISION HISTORY
Changes from Revision B (August 2010) to Revision C Page
• Changed all temperature parameters from max of 85°C to 105°C ...................................................................................... 1
• Changed supply voltage max value to 6 in Absolute Maximum Ratings table ..................................................................... 2
• Changed supply voltage MAX value to 5.5 in Recommended Operating Conditions table ................................................. 2
• Changed AVD, VOtest conditons for RL= 600 Ω: 0.75 V to 4.8 V ........................................................................................ 4
• Changed AVD, VOtest conditons for RL= 2 kΩ Ω: 0.75 V to 4.8 V ....................................................................................... 4
12 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): LMV721 LMV722
PACKAGE OPTION ADDENDUM
www.ti.com 31-Aug-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV721IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV721IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV721IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV721IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV721IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
LMV721IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
LMV722ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
LMV722IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
LMV722IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV722IDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV722IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
LMV722IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 31-Aug-2010
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV721IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV721IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV721IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV722IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
LMV722IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV721IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
LMV721IDCKR SC70 DCK 5 3000 180.0 180.0 18.0
LMV721IDCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV722IDGKR MSOP DGK 8 2500 370.0 355.0 55.0
LMV722IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 2
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