September 2013 Doc ID 10876 Rev 4 1/27
1
VND600SP-E
Double channel high-side driver
Features
■
ECOPACK
®
: lead free and RoHS compliant
■
Automotive Grade: compliance with AEC
Guidelines
■
Very low standby current
■
CMOS compatible input
■
Proportional load current sense
■
Current sense disable
■
Thermal shutdown protection and diagnosis
■
Undervoltage shutdown
■
Overvoltage clamp
■
Load current limitation
Description
The VND600SP-E is a monolithic device made
using STMicroelectronics™ VIPower™ M0-3
technology. It is intended for driving resistive or
inductive loads with one side connected to
ground. Active V
CC
pin voltage clamp protects the
device against low energy spikes (see ISO7637
transient compatibility table).
This device has two channels in high-side
configuration; each channel has an analog sense
output on which the sensing current is
proportional (according to a known ratio) to the
correspo ndi ng loa d cur rent.
Built-in thermal shutdown and outputs current
limitation protect the chip from overtemperature
and short circuit. Device turns-off in case of
ground pin disconnections.
Type R
DS(on)
I
lim
V
CC
VND600SP-E 30 mΩ 25 A 36 V
1
10
PowerSO-10™
Table 1. Device summary
Package Order codes
Tube Tape and reel
PowerSO-10™ VND600SP-E VND600SPTR-E
www.st.com
Contents VND600SP-E
2/27 Doc ID 10876 Rev 4
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Elect rical char acteristi c s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 PowerSO-10 maximum demagnetiz ation energy
(V
CC
= 13.5 V) 19
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 ECOPACK
®
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VND600SP-E List of tables
Doc ID 10876 Rev 4 3/27
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. V
CC
- output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Current sense 9 V ≤V
CC
≤16 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Switching (V
CC
= 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Logic input (channel 1, 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 11. Truth table (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 12. Electrical transient requirements on V
CC
pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Electrical transient requirements on V
CC
pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 14. Electrical transient requirements on V
CC
pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 15. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 16. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
List of figures VND600SP-E
4/27 Doc ID 10876 Rev 4
List of figures
Figure 1. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching characteristics (resistive load R
L
=2.6Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. I
OUT
/I
SENSE
versus I
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input low level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. I
LIM
vs T
case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 15. Turn-on voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. On-state resistance vs T
case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 18. On-state resistance vs V
CC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 19. Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. Maximum turn- off current versus load inductance
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 21. PowerSO-10 PC board
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 22. Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 21
Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 21
Figure 25. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 25
Figure 27. Tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VND600SP-E Block diagram and pin description
Doc ID 10876 Rev 4 5/27
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
Table 2. Suggested connections for unused and not connected pins
Connection / pin Current sense N.C. Output Input
Floating X X X
To ground Through 1 KΩ
resistor XThrough 10 KΩ
resistor
LOGIC
UNDERVOLTAGE
OVERVOLTAGE
OVERTEMP. 1
OVERTEMP. 2
ILIM2
PwCLAMP 2
K
IOUT2
ILIM1
PwCLAMP 1
K
IOUT1
INPUT 1
INPUT 2
GND
VCC
OUTPUT 1
CURRENT
SENSE 1
OUTPUT 2
CURRENT
SENSE 2
DRIVER 2
DRIVER 1
VCC CLAMP
Ot1
Ot2
Ot1
Ot2
Vdslim1
Vdslim2
1
2
3
4
5
6
7
8
9
10
11
OUTPUT 2
OUTPUT 2
N.C.
OUTPUT 1
OUTPUT 1
GROUND
INPUT 2
INPUT 1
C.SENSE1
C.SENSE2
V
CC
PowerSO-10
Electrical specifications VND600SP-E
6/27 Doc ID 10876 Rev 4
2 Electrical specifications
Figure 3. Current and voltage conventions
1)
V
Fn
= V
CCn
- V
OUTn
during reverse battery condition
2.1 Absolute maximum ratings
S tressing the device above the rating listed in Table 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics sure program and other relevant quality
document.
I
S
I
GND
OUTPUT2
V
CC
I
OUT2
V
CC
V
SENSE2
CURRENT SENSE 1 I
SENSE1
V
OUT2
OUTPUT1 I
OUT1
CURRENT SENSE 2 I
SENSE2
V
SENSE1
V
OUT1
INPUT2
I
IN2
INPUT1
I
IN1
V
IN2
V
IN1
GROUND
V
F1 (1)
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
V
CC
DC supply vol t age 41 V
-V
CC
Reverse supply voltage -0.3 V
- I
GND
DC reverse ground pin current -200 mA
I
OUT
Output current Internally limited A
I
R
Reverse output current -21 A
I
IN
Input current +/- 10 mA
V
CSENSE
Current se nse maximum vo ltage -3
+15 V
V
VND600SP-E Electrical specification s
Doc ID 10876 Rev 4 7/27
2.2 Thermal data
V
ESD
Electrostatic discharge (Human Body Model:
R=1.5KΩ; C = 100 pF)
– INPUT
– CURRENT SENSE
– OUTPUT
–V
CC
4000
2000
5000
5000
V
V
V
V
E
MAX
Maximum switching energy
(L = 0.13 mH; R
L
=0Ω; V
bat
=13.5V;
T
jstart
= 150 °C; I
L
=40A) 145 mJ
P
tot
Pow er di ssipation at T
c
= 25 °C 96.1 W
T
j
Junction operating temperature Internally limited °C
T
c
Case operating temperature -40 to 150 °C
T
STG
Storage temperature -55 to 150 °C
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Table 4. Thermal data
Symbol Parameter Value Unit
R
thj-case
Thermal resistance junction-case (max) 1.3 °C/W
R
thj-amb
Thermal resistance junct ion-ambient (max) 51.3
(1)
1. When mounted on a standard single sided FR-4 board with 0.5 cm
2
of Cu (at least 35 μm thick).
37
(2)
2. When mounted on a standard single-sided FR-4 board with 6 cm
2
of Cu (at least 35 μm th ick) .
°C/W
Electrical specifications VND600SP-E
8/27 Doc ID 10876 Rev 4
2.3 Electrical characteristics
Values specified in this section are for 8 V < V
CC
< 36 V;
-40 °C < T
j
< 150 °C, unl es s
otherwise stated. (Per each channel).
Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
CC (1)
1. Per device.
Operating supply
voltage 5.5 13 36 V
V
USD (1)
Undervoltage shutdown 3 4 5.5 V
V
OV (1)(2)
Overvoltage shutdown 36 V
R
ON
On-state resistance
I
OUT
= 5 A; T
j
=25°C 30 mΩ
I
OUT
= 5 A; T
j
= 150 °C 60 mΩ
I
OUT
= 3 A; V
CC
=6V 100 mΩ
V
clamp
Clamp voltage I
CC
=20mA
(2)
2. V
clamp
and V
OV
are correlated. Typical difference is 5 V.
41 48 55 V
I
S (1)
Supply current
Off-state; V
CC
=13V;
V
IN
=V
OUT
=0V 12 40 µA
Off-state; V
CC
=13V;
V
IN
=V
OUT
=0V; T
j
=25°C 12 25 mA
On-state; V
IN
=5V; V
CC
=13V;
I
OUT
= 0 A; R
SENSE
=3.9kΩ6mA
I
L(off1)
Off-state output current V
IN
=V
OUT
=0V 0 50 µA
I
L(off2)
Off-state output current V
IN
=0V; V
OUT
=3.5V -75 0 µA
I
L(off3)
Off-state output current V
IN
=V
OUT
=0V;
V
CC
=13V; T
j
=125°C 5µA
I
L(off4)
Off-state output current V
IN
=V
OUT
=0V; V
CC
=13V;
T
j
=25°C 3µA
Table 6. Protection
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
lim
DC short circuit current V
CC
= 13 V 25 40 70 A
5.5 V < V
CC
<36V 70 A
T
TSD
Thermal sh utdown
temperature 150 175 200 °C
T
R
Thermal res et temp era ture 135 °C
T
HYST
Thermal hy ste res is 7 15 °C
VND600SP-E Electrical specification s
Doc ID 10876 Rev 4 9/27
V
demag
Turn-off output voltage
clamp I
OUT
= 2 A; V
IN
=0V;
L=6mH V
CC
-41 V
CC
-
48 V
CC
-
55 V
V
ON
Output voltage drop
limitation I
OUT
=0.5A
T
j
= -40°C...+150°C 50 mV
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles
Table 7. V
CC
- output diode
Symbol Parameter Test conditions Min Typ Max Unit
V
F
Forward on voltage -I
OUT
= 2.6 A; T
j
= 150 °C - - 0.6 V
Table 6. Protection
(1)
(continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Table 8. Current sense 9 V ≤V
CC
≤16 V
Symbol Parameter Test conditions Min Typ Max Unit
K
1
I
OUT
/I
SENSE
I
OUT1
or I
OUT2
= 0.5 A;
V
SENSE
= 0.5 V; other channels
open; T
j
= -40 °C...150 °C 3300 4400 6000
dK
1
/K
1
Current sense ratio drift I
OUT1
or I
OUT2
= 0.5 A;
V
SENSE
= 0.5 V; other channels
open; T
j
= -40 °C...150 °C -10 +10 %
K
2
I
OUT
/I
SENSE
I
OUT1
or I
OUT2
= 5 A; V
SENSE
=4V;
other channels open; T
j
=-40°C
T
j
= 25 °C...150 °C 4200
4400 4900
4900 6000
5750
dK
2
/K
2
Current sense ratio drift I
OUT1
or I
OUT2
= 5 A; V
SENSE
=4V;
other channels open;
T
j
= - 40 °C...150 °C -6 +6 %
K
3
I
OUT
/I
SENSE
I
OUT1
or I
OUT2
=15A; V
SENSE
=4V;
other channels open; T
j
=- 40 °C
T
j
= 25 °C...150 °C 4200
4400 4900
4900 5500
5250
dK
3
/K
3
Current sense ratio drift I
OUT1
or I
OUT2
=15A; V
SENSE
=4V;
other channels open;
T
j
= -40 °C...150 °C -6 +6 %
V
SENSE1,2
Max analog sense output
voltage
V
CC
= 5.5 V; I
OUT1,2
= 2.5 A;
R
SENSE
=10kΩ2V
V
CC
>8V, I
OUT1,2
= 5 A;
R
SENSE
=10kΩ4V
V
SENSEH
Analog sense output
voltage in overtemperature
condition V
CC
=13V; R
SENSE
=3.9kΩ5.5 V
Electrical specifications VND600SP-E
10/27 Doc ID 10876 Rev 4
R
VSENSEH
Analog sense output
impedanc e in
overtemperature condition
V
CC
=13V; T
j
>T
TSD
;
All channels open 400 Ω
t
DSENSE
Current sense delay
response to 90% I
SENSE (1)
500 µs
1. Current sense signal delay after positive input slope.
Table 8. Current sense 9 V ≤V
CC
≤16 V (continued)
Symbol Parameter Test conditions Min Typ Max Unit
Table 9. Switching (V
CC
=13V)
Symbol Parameter Test conditions Min Typ Max Unit
t
d(on)
Turn-on delay time R
L
=2.6Ω (seeFigure 4)-30-µs
t
d(off)
Turn-on delay time R
L
=2.6Ω (seeFigure 4)-30-µs
(dV
OUT
/dt)
on
T urn-on voltage sl ope R
L
=2.6Ω (see Figure 4)-Figure 15 -V/µs
(dV
OUT
/dt)
off
T urn-of f volta ge slope R
L
=2.6Ω (see
Figure 4)-Figure 16 -V/µs
Table 10. Logic input (channel 1, 2)
Symbol Parameter Test conditions Min Typ Max Unit
V
IL
Input low level voltage 1.25 V
I
IL
Low level input current V
IN
=1.25V 1 µA
V
IH
Input high level voltage 3.25 V
I
IH
High level input current V
IN
=3.25V 10 µA
V
I(hyst)
Input hysteresis voltage 0.5 V
V
ICL
Input clamp voltage I
IN
=1mA 6 6.88V
I
IN
=-1mA -0.7 V
VND600SP-E Electrical specification s
Doc ID 10876 Rev 4 11/27
Figure 4. Switching characteristics (resistive load R
L
=2.6Ω)
Figure 5. I
OUT
/I
SENSE
versus I
OUT
V
OUT
dV
OUT
/dt
(on)
t
r
80%
10% t
f
dV
OUT
/dt
(off)
I
SENSE
t
t
90%
t
d(off)
INPUT
t
90%
t
d(on)
t
DSENSE
0246810121416
3000
3500
4000
4500
5000
5500
6000
6500
min.Tj=-40°C
max.Tj=-40°C
min.Tj=25...150°C
max.Tj=25...150°C
typical value
I
OUT
/I
SENSE
I
OUT
(A)
Electrical specifications VND600SP-E
12/27 Doc ID 10876 Rev 4
Table 11. Truth table (per each channel)
Conditions Input Output Sense
Normal operati on L
HL
H0
Nominal
Overtemperature L
HL
L0
V
SENSEH
Undervoltage L
HL
L0
0
Overvoltage L
HL
L0
0
Short circuit to GND L
H
H
L
L
L
0
(T
j
<T
TSD
) 0
(T
j
>T
TSD
) V
SENSEH
Short circuit to V
CC
L
HH
H0
< Nominal
Negative output voltage
clamp LL0
VND600SP-E Electrical specification s
Doc ID 10876 Rev 4 13/27
Table 12. Electrical transient requirements on V
CC
pin (part 1)
ISO T/R 7637/1
test pulse
Test levels
I II III IV Delays and
impedance
1 -25 V -50 V -75 V -100 V 2 ms, 10 Ω
2 +25 V +50 V +75 V +100 V 0.2 ms, 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs, 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs, 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01
Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2
Ω
Table 13. Electrical transient requirements on V
CC
pin (part 2)
ISO T/R 7637/1
Test pulse
Test levels results
I II III IV
1CCCC
2CCCC
3aCCCC
3bCCCC
4CCCC
5CEEE
Table 14. Electrical transient requirements on V
CC
pin (part 3)
Class Contents
CAll functions of the device are performed as designed after exposure to
disturbance.
EOne or more functions of the device is not performed as designed after exposure
to disturbance and cannot be returned to proper operation without replacing the
device.
Electrical specifications VND600SP-E
14/27 Doc ID 10876 Rev 4
Figure 6. Waveforms
SENSE
n
INPUT
n
NORMAL OPERATION
UNDERVOLTAGE
V
CC
V
USD
V
USDhyst
INPUT
n
OVERVOLTAGE
V
CC
SENSE
n
INPUT
n
SENSE
n
LOAD CURRENT
n
LOAD CURRENT
n
LOAD CURRENT
n
OVERTEMPERATURE
INPUT
n
SENSE
n
T
TSD
T
R
T
j
LOAD CURRENT
n
V
OV
V
CC
> V
OV
V
CC
< V
OV
SHORT TO GROUND
INPUT
n
LOAD CURRENT
n
SENSE
n
LOAD VOLTAGE
n
INPUT
n
LOAD VO LTAG E
n
SENSE
n
LOAD CURRENT
n
<Nominal <Nominal
SHORT TO V
CC
I
SENSE
=
R
SENSE
V
SENSEH
VND600SP-E Electrical specification s
Doc ID 10876 Rev 4 15/27
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
Figure 9. Input low level Figure 10. Input high level
Figure 11. Input clamp voltage Figure 12. Input hysteresis voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
IL(off1) (uA)
Off state
Vcc=36V
Vin=Vout=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Iih (uA)
Vin=3.25V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Vil (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Vih (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (°C )
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Vhyst (V)
Electrical specifications VND600SP-E
16/27 Doc ID 10876 Rev 4
Figure 13. Overvoltage shutdown Figure 14. I
LIM
vs T
case
Figure 15. Turn-on voltage slope Figure 16. Turn-off voltage slope
Figure 17. On-state resistance vs T
case
Figure 18. On-state resistance vs V
CC
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
30
32
34
36
38
40
42
44
46
48
50
Vov (V )
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
10
20
30
40
50
60
70
80
Ilim (A)
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
250
300
350
400
450
500
550
600
650
700
750
dVout/dt(on) (V/m s)
Vcc=13V
Rl=2.6Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
50
100
150
200
250
300
350
400
450
500
dVout/dt(off) (V/ms )
Vcc=13V
Rl=2.6Ohm
-75 -50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
10
20
30
40
50
60
70
80
90
100
Ron (mOhm)
Iout=5A
Vcc=8V & 36V
5 10152025303540
Vcc (V)
0
10
20
30
40
50
60
70
80
Ron (mOhm)
Iout=5A Tc= 150°C
Tc= 25° C
Tc= - 40°C
VND600SP-E Application information
Doc ID 10876 Rev 4 17/27
3 Application information
Figure 19. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R
GND
only)
This can be used with any type of load.
The following is an indication on how to dimension the R
GND
resistor.
1. R
GND
≤ 600 mV / I
S(on)max
2. R
GND
≥ (-V
CC
) / (-I
GND
)
where -I
GND
is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device’s datasheet.
Power dissipation in R
GND
(when V
CC
< 0: during reverse battery situations) is:
P
D
= (-V
CC
)
2
/ R
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
S(on)max
becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
GND
produces a shift (I
S(on)max
* R
GND
) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in the case of several
high-side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2).
V
CC
GND OUTPUT2
CURRENT SENSE1
D
ld
+5V
R
prot
R
SENSE2
OUTPUT1
R
SENSE1
INPUT1
D
GND
R
GND
V
GND
CURRENT SENSE2
INPUT2
μ
CR
prot
R
prot
R
prot
Application information VND600SP-E
18/27 Doc ID 10876 Rev 4
3.1.2 Solution 2: diode (D
GND
) in the ground line
A resistor (R
GND
= 1 kΩ) should be inserted in parallel to D
GND
if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (∼600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift does not vary if more than one HSD shares the same diode/resistor
network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused INPUT and ST ATUS pin is to leave them unconnected, while
unused SENSE pin has to be connected to ground pin.
3.2 Load dump protection
D
ld
is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
CC
max DC rating. The same applies if the device is subject to transients on the V
CC
line
that are greater than the ones shown in Table 12.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the V
CC
line,
the control pins are pulled negative. ST suggests to insert a resistor (R
prot
) in li ne to prev ent
the microcontroller I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os.
-V
CCpeak
/I
latchup
≤ R
prot
≤ (V
OH
µ
C
-V
IH
-V
GND
) / I
IHmax
Calculation example:
For V
CCpeak
= -100 V and I
latchup
≥ 20 mA; V
OH
µ
C
≥ 4.5 V
5kΩ ≤ R
prot
≤ 65 kΩ.
Recommended values:
R
prot
=10 kΩ.
VND600SP-E Application information
Doc ID 10876 Rev 4 19/27
3.4 PowerSO-10 maximum demagnetization energy
(V
CC
= 13.5 V )
Figure 20. Maximum turn- off current versus load inductance
(1)
1. Values are generated with R
L
=0
Ω
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
C: Repetitive pulse at T
jstart
=125°C
A: A single pulse at T
jstart
= 150 °C
B: Repetitive pulse at T
jstart
=100°C
Condition:
V
CC
=13.5V
V
IN
, I
L
t
Demagnetization Demagnetization Demagnetization
Package and PCB thermal data VND600SP-E
20/27 Doc ID 10876 Rev 4
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 21. PowerSO-10 PC boa rd
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm,
Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 22. R
thj-amb
vs PCB copper area in open box free air condition
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
VND600SP-E Package and PCB thermal data
Doc ID 10876 Rev 4 21/27
Figure 23. PowerSO-10 thermal impedance junction ambient single pulse
Equation 1
:
pulse calculation formula
Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10
Z
THδ
R
TH
δZ
THtp
1δ–()+⋅=
where
δt
p
T⁄=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
Package and PCB thermal data VND600SP-E
22/27 Doc ID 10876 Rev 4
Table 15. Thermal parameter
Area/island (cm
2
)Footprint6
R1 (°C/ W) 0.05
R2 (°C/ W) 0.3
R3 (°C/ W) 0.3
R4 (°C/ W) 0.8
R5 (°C/ W) 12
R6 (°C/ W) 37 22
C1 (W.s/ °C) 0.001
C2 (W.s /°C) 5.00E-03
C3 (W.s/ °C) 0.02
C4 (W.s/ °C) 0.3
C5 (W.s/ °C) 0.75
C6 (W.s/ °C) 3 5
VND600SP-E Package and packing information
Doc ID 10876 Rev 4 23/27
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.2 PowerSO-10 mechanical data
Figure 25. PowerSO-10 package dimensions
DETAIL "A "
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
E
C
A
B
B
DETAIL "A"
SEATING
PLA NE
E2
10
1
eB
HE
0.25
Package and packing information VND600SP-E
24/27 Doc ID 10876 Rev 4
Table 16. PowerSO-10 mechanical data
Dim. Millimeters
Min. Typ. Max.
A3.35 3.65
A
(1)
1. Muar only POA P013P.
3.4 3.6
A1 0 0.10
B0.40 0.60
B
(1)
0.37 0.53
C0.35 0.55
C
(1)
0.23 0.32
D9.40 9.60
D1 7.40 7.60
E9.30 9.50
E2 7.20 7.60
E2
(1)
7.30 7.50
E4 5.90 6.10
E4
(1)
5.90 6.30
e1.27
F1.25 1.35
F
(1)
1.20 1.40
H 13.80 14.40
H
(1)
13.85 14.35
h0.50
L1.20 1.80
L
(1)
0.80 1.10
a0° 8°
α
(1)
2° 8°
VND600SP-E Package and packing information
Doc ID 10876 Rev 4 25/27
5.3 PowerSO-10 packing information
Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix)
Figure 27. Tape and reel shipment (suffix “TR”)
6.30
10.8 - 11
14.6 - 14.9
9.5
1
2
3
4
51.27
0.67 - 0.73
0.54 - 0.6
10
9
8
7
6
B
A
C
All dimensions are in mm.
Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)
Casablanca 50 1000 532 10.4 16.4 0.8
Muar 50 1000 532 4.9 17.2 0.8
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
TAPE DIMENSIONS
Acc ording to Electronic Indus tries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensio ns are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min ) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm m in
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Revision history VND600SP-E
26/27 Doc ID 10876 Rev 4
6 Revision history
Table 17. Document revision history
Date Revision Changes
01-Oct-2004 1 Initial release.
28-Jun-2010 2 Changed Features list .
Reformatted entire document. No content change.
11-Feb-2011 3
Updated Features list .
Updated fol lowi ng tables :
–Table 5: Power
–Table 8: Current sense 9 V £ VCC £ 16 V
19-Sep-20 13 4 Updated Disclaim er.
VND600SP-E
Doc ID 10876 Rev 4 27/27
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