1. General description
The 74LVC04A-Q100 pr ovides six inverting buf fers. Input s can be driven from either 3.3 V
or 5 V devices. This feat ur e allo ws the us e of th es e de vice s as translators in mixed 3.3 V
and 5 V applications.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
5 V tolerant inputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
Inputs accept voltages up to 5.5 V
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Ordering information
74LVC04A-Q100
Hex inverter
Rev. 1 — 30 August 2012 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74LVC04AD-Q100 40 Cto+125C SO14 plastic small outline package; 14 leads;
body width 3.9 mm SOT108-1
74LVC04APW-Q100 40 Cto+125C TSSOP14 plastic thin shrink outline package; 14 leads;
body width 4.4 mm SOT402-1
74LVC04ABQ-Q100 40 Cto+125C DHVQFN14 plastic dua l in-line compatible thermal enhanced
very thin quad flat package; no leads; 14 terminals;
body 2.5 30.85 mm
SOT762-1
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 2 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
4. Functional diagram
5. Pinning information
5.1 Pinning
Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram for one gate
mna342
1A 1Y
12
2A 2Y
34
3A 3Y
56
4A 4Y
98
5A 5Y
11 10
6A 6Y
13 12
112
mna343
314
516
918
11 110
13 112
mna341
AY
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4. Pin configuration SO14 and TSSOP14 Fig 5. Pin configuration DHVQFN14
$ 9
&&
< $
$<
<$
$<
<$
*1' <
DDD





/9&$4
DDD
/9&$4
*1'
7UDQVSDUHQWWRSYLHZ
< $
$ <
< $
$ <
< $
*1'
<
$
9&&





WHUPLQDO
LQGH[DUHD
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 3 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level
7. Limiting values
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2] The output voltage ratings may be exceeded if the output current ratings are observed.
[3] For SO14 packages: above 70 C derate linearly with 8 mW/K.
For TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 C derate linearly with 4.5 mW/K.
Table 2. Pin description
Symbol Pin Description
1A, 2A, 3A, 4A, 5A, 6A 1, 3, 5, 9, 11, 13 data input
1Y, 2Y, 3Y, 4Y, 5Y, 6Y 2, 4, 6, 8, 10, 12 data output
GND 7 ground (0 V)
VCC 14 supply voltage
Table 3. Function table[1]
Input nA Output nY
LH
HL
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +6.5 V
IIK input clamping current VI<0 50 - mA
VIinput voltage [1] 0.5 +6.5 V
IOK output clamping current VO>V
CC or VO<0 - 50 mA
VOoutput voltage [2] 0.5 VCC +0.5 V
IOoutput current VO=0V toV
CC -50 mA
ICC supply current - 100 mA
IGND ground current 100 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb =40 C to +125 C[3] - 500 mW
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 4 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
8. Recommended operating conditions
9. Static characteristics
Table 5. Recommended operating con ditions
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 1.65 - 3.6 V
functional 1.2 - - V
VIinput voltage 0 - 5.5 V
VOoutput voltage 0 - VCC V
Tamb ambient temperature 40 - +125 C
t/V input transition rise and
fall rate VCC =1.65V to2.7V 0 - 20 ns/V
VCC = 2.7 V to 3.6 V 0 - 10 ns/V
Table 6. Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C40 C to +125 CUnit
Min Typ[1] Max Min Max
VIH HIGH-level
input voltage VCC = 1.2 V 1.08 - - 1.08 - V
VCC = 1.65 V to 1.95 V 0.65 VCC - - 0.65 VCC -V
VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V
VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V
VIL LOW-level
input voltage VCC = 1.2 V - - 0.12 - 0.12 V
VCC = 1.65 V to 1.95 V - - 0.35 VCC -0.35 VCC V
VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V
VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V
VOH HIGH-level
output
voltage
VI=V
IH or VIL
IO=100 A;
VCC =1.65Vto3.6V VCC 0.2 - - VCC 0.3 - V
IO=4mA; V
CC = 1.65 V 1.2 - - 1.05 - V
IO=8mA; V
CC = 2.3 V 1.8 - - 1.65 - V
IO=12 mA; VCC = 2.7 V 2.2 - - 2.05 - V
IO=18 mA; VCC = 3.0 V 2.4 - - 2.25 - V
IO=24 mA; VCC = 3.0 V 2.2 - - 2.0 - V
VOL LOW-level
output
voltage
VI=V
IH or VIL
IO= 100 A;
VCC = 1.65 V to 3.6 V - - 0.2 - 0.3 V
IO=4mA; V
CC = 1.65 V - - 0.45 - 0.65 V
IO=8mA; V
CC = 2.3 V - - 0.6 - 0.8 V
IO=12mA; V
CC = 2.7 V - - 0.4 - 0.6 V
IO=24mA; V
CC = 3.0 V - - 0.55 - 0.8 V
IIinput leakage
current VCC = 3.6 V; VI=5.5VorGND - 0.1 5- 20 A
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 5 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb =25C.
10. Dynamic characteristics
[1] Typical values are measured at Tamb =25C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V, and 3.3 V respectively.
[2] tpd is the same as tPLH and tPHL.
[3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
[4] CPD is used to determine the dynamic power dissipation (PDin W).
PD=C
PD VCC2fiN+(CLVCC2fo) where:
fi= input frequency in MHz; fo= output frequency in MHz
CL= output load capacitance in pF
VCC = supply voltage in Volts
N = number of inputs switching
(CLVCC2fo) = sum of the outputs
ICC supply
current VCC = 3.6 V; VI=V
CC or GND;
IO=0A -0.110-40A
ICC additional
supply
current
per input pin;
VCC = 2.7 V to 3.6 V;
VI=V
CC 0.6 V; IO=0A
- 5 500 - 5000 A
CIinput
capacitance VCC = 0 V to 3.6 V;
VI=GNDtoV
CC
-4.0---pF
Table 6. Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C40 C to +125 CUnit
Min Typ[1] Max Min Max
Table 7. Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.
Symbol Parameter Conditions 40 C to +85 C40 C to +125 CUnit
Min Typ[1] Max Min Max
tpd propagation delay nA to nY; see Figure 6 [2]
VCC = 1.2 V - 14 - - - ns
VCC = 1.65 V to 1.95 V 0.3 3.7 8.8 0.3 10.2 ns
VCC = 2.3 V to 2.7 V 0.5 2.2 5.0 0.5 5.8 ns
VCC = 2.7 V 1.0 2.1 5.5 1.0 7 .0 ns
VCC = 3.0 V to 3.6 V 1.0 2.0 4.5 1.0 6.0 ns
tsk(o) output skew time VCC = 3.0 V to 3.6 V [3] - - 1.0 - 1.5 ns
CPD power dissipation
capacitance per buffer; VI=GNDtoV
CC [4]
VCC = 1.65 V to 1.95 V - 3.9 - - - pF
VCC = 2.3 V to 2.7 V - 7.1 - - - pF
VCC = 3.0 V to 3.6 V - 9.9 - - - pF
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 6 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
11. Waveforms
VM= 1.5 V at VCC 2.7 V
VM=0.5 VCC at VCC <2.7V
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. The input (nA) to output (nY) propagation delays
mna344
t
PHL
t
PLH
V
M
V
M
V
M
V
M
nA input
nY output
GND
V
I
V
OH
V
OL
Test data is given in Table 8.
Definitions for test circuit:
RL = Load resistance
CL = Load capacitance including jig and probe capacitance
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 7. Load circuitry for measuring switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aaf615
V
CC
V
I
V
O
DUT
CL
RTRL
PULSE
GENERATOR
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 7 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
Table 8. Test data
Supply voltage Input Load
VItr, tfCLRL
1.2 V VCC 2 ns 30 pF 1 k
1.65 V to 1.95 V VCC 2 ns 30 pF 1 k
2.3 V to 2.7 V VCC 2 ns 30 pF 500
2.7V 2.7V 2.5 ns 50 pF 500
3.0Vto3.6V 2.7V 2.5 ns 50 pF 500
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 8 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
12. Package outline
Fig 8. Package outline SOT108-1 (SO14)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 9 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
Fig 9. Package outline SOT402-1 (TSSOP14)
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 10 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
Fig 10. Package outline SOT762-1 (DHVQFN14)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
Dh
1.65
1.35
y1
2.6
2.4 1.15
0.85
e1
2
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
26
13 9
8
7
1
14
X
D
E
C
BA
02-10-17
03-01-27
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 11 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
13. Abbreviations
14. Revision history
Table 9. Abbreviations
Acronym Description
CDM Charged Device Mo del
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
MIL Military
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74LVC04A_Q100 v.1 20120830 Product data sheet - -
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 12 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full dat a sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre vail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the applica tion or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminar y specification.
Product [short] dat a sheet Production This document contains the product specification.
74LVC04A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 30 August 2012 13 of 14
NXP Semiconductors 74LVC04A-Q100
Hex inverter
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74LVC04A-Q100
Hex inverter
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 August 2012
Document identifier: 74LVC04A_Q100
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 3
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Recommended operating conditions. . . . . . . . 4
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16 Contact information. . . . . . . . . . . . . . . . . . . . . 13
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14