SN74CBT16292
12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
WITH INTERNAL PULLDOWN RESISTORS
SCDS053E – MARCH 1998 – REVISED OCT OBER 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Member of Texas Instruments’ Widebus
Family
D
4-Ω Switch Connection Between Two Ports
D
TTL-Compatible Control Input Levels
D
Make-Before-Break Feature
D
Internal 500-Ω Pulldown Resistors to
Ground
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
description
The SN74CBT16292 is a 12-bit 1-of-2 high-speed
TTL-compatible FET multiplexer/demultiplexer.
The low on-state resistance of the switch allows
connections to be made with minimal propagation
delay.
When the select (S) input is low, port A is
connected to port B1, and RINT is connected to
port B2. When S is high, port A is connected to port
B2, and RINT is connected to port B1.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SSOP DL
Tube SN74CBT16292DL
CBT16292
40
°
Cto85
°
C
SSOP
–
DL
Tape and reel SN74CBT16292DLR
CBT16292
–
40°C
to
85°C
TSSOP – DGG Tape and reel SN74CBT16292DGGR CBT16292
TVSOP – DGV Tape and reel SN74CBT16292DGVR CY292
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2000, Texas Instruments Incorporated
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
S
1A
NC
2A
NC
3A
NC
GND
4A
NC
5A
NC
6A
NC
7A
NC
VCC
8A
GND
NC
9A
NC
10A
NC
11A
NC
12A
NC
NC
NC
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
SN74CBT16292
12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
WITH INTERNAL PULLDOWN RESISTORS
SCDS053E – MARCH 1998 – REVISED OCT OBER 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUT
SFUNCTION
L
A port = B1 port
L
RINT = B2 port
H
A port = B2 port
H
RINT = B1 port
logic diagram (positive logic)
1A 1B1
RINT
1B2
RINT
S
12A 12B1
RINT
12B2
RINT
2
27
1
54
53
30
29
SN74CBT16292
12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
WITH INTERNAL PULLDOWN RESISTORS
SCDS053E – MARCH 1998 – REVISED OCT OBER 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DGG package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 48°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 56°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN MAX UNIT
VCC Supply voltage 4 5.5 V
VIH High-level control input voltage 2 V
VIL Low-level control input voltage 0.8 V
TAOperating free-air temperature –40 85 °C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 V
IIVCC = 5.5 V, VI = VCC or GND ±5µA
ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3µA
∆ICC§Control input VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA
CiControl input VI = 3 V or 0 3 pF
Cio VCC = 0, VO = 3 V or 0 8 pF
VCC = 4 V,
TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 10 20
r
o
n
VI=0
II = 64 mA 3 7 Ω
on
VCC = 4.5 V
V
I =
0
II = 30 mA 3 7
VI = 2.4 V, II = 15 mA 5 15
‡All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
SN74CBT16292
12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
WITH INTERNAL PULLDOWN RESISTORS
SCDS053E – MARCH 1998 – REVISED OCT OBER 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC = 4 V VCC = 5 V
± 0.5 V UNIT
(INPUT)
(OUTPUT)
MIN MAX MIN MAX
tpd†A or B B or A 0.5 0.25 ns
ten SA or B 6.8 1 6 ns
tdis SA or B 7 1 6.3 ns
†The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER DESCRIPTION VCC = 4 V VCC = 5 V
± 0.5 V UNIT
MIN MAX MIN MAX
tmbb‡Make-before-break time 0 2 0 2 ns
‡The make-before-break time is the time interval between make and break, during the transition from one selected port to the other.
SN74CBT16292
12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
WITH INTERNAL PULLDOWN RESISTORS
SCDS053E – MARCH 1998 – REVISED OCT OBER 2000
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
2.3 V
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 7 V
Open
GND
500 Ω
500 Ω
tPLH tPHL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
1.5 V 1.5 V 3 V
0 V
1.5 V 1.5 V VOH
VOL
0 V
1.2 V VOL + 0.3 V
1.2 V VOH – 0.3 V
Input
3 V
2.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPZL/tPLZ
tPZH/tPHZ
Open
7 V
Open
TEST S1
0 V
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when connected to the internal 500-Ω
pulldown resistor. W aveform 2 is for an output with internal conditions such that the output is high except when connected to the
internal 500-Ω pulldown resistor.
C. All pulse inputs and DC inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis. Z = RINT = 500 Ω
F. tPZL and tPZH are the same as ten. Z = RINT = 500 Ω
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74CBT16292DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16292DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16292DGVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBT16292DGVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DGVR ACTIVE TVSOP DGV 56 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DL ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DLG4 ACTIVE SSOP DL 56 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DLR ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBT16292DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Sep-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBT16292DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1
SN74CBT16292DGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1
SN74CBT16292DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBT16292DGGR TSSOP DGG 56 2000 346.0 346.0 41.0
SN74CBT16292DGVR TVSOP DGV 56 2000 346.0 346.0 41.0
SN74CBT16292DLR SSOP DL 56 1000 346.0 346.0 49.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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