MSL0104RGB Series
Data Sheet
■Features
■Outline
•
Side view RGB LEDs
•
High brightness, superior color mixing
■Size
■Dimensions
■Recommended Solder Pattern
■Moisture sensitivity level(MSL) : Level 3
■Specifications
Typ. I
F
Max. V
R
Min.*2
Typ.
Max.*2
I
F
Min. Typ. I
F
(V) (mA) (µA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
2.1 10 5 619 624 629 450 700
3.3 520 527 535 710 1200
3.2 465 470 475 220 400
2.1 10 5 619 624 629 450 700
3.3 520 527 535 710 1200
3.2 465 470 475 220 400
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC) Electrical and Optical Characteristics (Ta=25ºC)
Reverse
Operating Temp.
Storage Temp.
Forward Voltage V
F
Reverse Current I
R
Dominant Wavelength λ
D
Luminous Intensity I
V
Dissipation
Current
Voltage
P
D
(mW)
Emitting
Color
MSL0104RGBU
MSL0104RGBW
Peak Forward
I
F
(mA)
I
FP
(mA)
V
R
(V) T
opr
(ºC) T
stg
(ºC)
Power
Forward
Current
Green
100*1 -40〜+85 -40〜+100
*1 : Duty ≦1/20, Pulse width≦ 1ms *2 : Measurement tolerance:±2nm
AlGaInP
400
50
20 20
-
Blue
AlGaInP
Red 50
InGaN Green 40 - -
Blue
20
5
5
-
-
InGaN 40 -
Red
Tolerance : ±0.2 (unit : mm) (unit : mm)
6922 (2709)
6.9×2.2mm (t=2.15mm)
Color
Type GRB
2.18
0.6
0.6
0.3 0.32
0.3
0.3
1.58
1.06
Emitting
1.0
R
B
2.15
6.9
G
1.6
6. 4
5.4
① ② ③ ④ ⑤ ⑥ ⑦
A
(R)
A
(G)
K
(G)
K
(R)
K
(B)
A
(B)
A
(R)
R
① ② ③ ④ ⑤ ⑥ ⑦
G
B
ZDZD
2. 2
0.50.5
0.25
1.0 0.5
0.5
0.5
0.40.40.4
0.1
2.2
①Pin Mark
K:Cathode
A:Anode
Mark in g Area
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[Data Sheet]
■Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
[MSL0104RGB series]
Reference
0
0.5
1
1.5
2
2.5
0 5 10 15 20 25 30 35 40 45 50
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
0
10
20
30
40
50
60
-40 -20 0 20 40 60 80 100
1
10
100
1.0 2.0 3.0 4.0
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[Data Sheet]
■Viewing Angle
[MSL0104RGB series]
Reference
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
MSL0104RGB (R)
MSL0104RGB (G)
MSL0104RGB (B)
R
B
G
X
X X
X -
--
- Y
YY
Y
ｽｷｬﾝ方向
(Scanning Direction )
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100 50
X
XX
XY
YY
Y
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
90
50
80
X'
X'X'
X' Y'
Y'Y'
Y'
100
X'
X' X'
X' -
--
- Y'
Y'Y'
Y'
ｽｷｬﾝ方向
(Scanning Direction)
R
BG
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[Data Sheet]
■Rank Reference of Brightness*
*Measurement tolerance:±10%
■Chromaticity Diagram
[MSL0104RGB series]
0.15
0.20
0.25
0.30
0.35
0.10 0.15 0.20 0.25 0.30 0.35
CIE x
CIE y
1
11
1
2
22
2
3
33
3
4
44
4
5
55
5
6
66
6
7
77
7
8
88
8
Triple Color
(Ta=25ºC)
*3
*1 : When lighting three colores simultaneously <to express white light>
*2 : Reference value of each colors
*3 : Rank of Mixing white color
Y Rank
I
F
=8mA (Red)
I
F
=14mA (Green)
I
F
=18mA (Blue)
Y *1
140〜180 180〜220 220〜280 280〜360 360〜450 450〜560 560〜710 710〜900
900〜1100
1100〜1400 1400〜1800 1800〜2200 2200〜2800
Emitting
Color
Rank Iv
(mcd)
MSL0104RGB
Red
Green
Blue
White
I
F
(mA)
20 *2 *2
*2 *1
（Ｔａ＝25℃、If=8mA(Red）、If=14mA(Green）、If=18mA(Blue）)
x
y
x
y
x
y
x
y
0.220 0.280 0.215 0.260 0.210 0.240 0.205 0.220
0.215 0.260 0.210 0.240 0.205 0.220 0.200 0.200
0.255 0.260 0.250 0.240 0.245 0.220 0.240 0.200
0.260 0.280 0.255 0.260 0.250 0.240 0.245 0.220
x
y
x
y
x
y
x
y
0.260 0.280 0.255 0.260 0.250 0.240 0.245 0.220
0.255 0.260 0.250 0.240 0.245 0.220 0.240 0.200
0.295 0.260 0.290 0.240 0.285 0.220 0.280 0.200
0.300 0.280 0.295 0.260 0.290 0.240 0.285 0.220
Measurement tolerance：±0.02
1 2 3
5 6 7 8
4
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[Data Sheet]
■Taping(1)
Unit:ｍｍ
Note)Tolerance is within ±0.2mm unless
otherwise specified.
■Part No. Construction
■Packing Specification
Complying with IPC/JEDEC J-STD-033.
[MSL0104RGB series]
Chromaticity rank Rank sign
(for white LED） (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Taping Specification
CSL
04 V U
07 U W
09 D
Y
W
MSL 01 M
02
WB
*Concerning the Brightness rank.
04
RGB
*At three color lighting simultaneously<for white LED>
*Please refer to the rank chart above for
luminous intensity classification.
*Please refer to the Specification sheet for color classification.
*Part name is individual for each rank.
*When shipped as sample,the part name will
be a representative part name.
General products are free of ranks.
Please contact sales if rank appointment
is needed.
*Please refer to the Specification sheet about Taping specification.
White
RGB
Multi color series
6.9x2.2 t=2.15mm
Yellowish green
3.05x1.3 t=0.43mm
Yellow
Yellow
1.8x1.6 t=0.5mm
Chip LED 2.8x1.2 t=0.8mm
2.9x2.5 t=3.1mm
1.6x0.8 t=1.24mm
Red
Orange
Epoxy
Red Silicone
210 Y1M S L 0 4 R G B U
7.5
±0.1
2.0
±0.1
16
.0 ±0.3
1.75
±0.1
φ1.5
0
+ 0.1
0.30
±0.05
φ1 3
φ1 8 0
0
- 3
φ6 0
+ 1
0
19.4
± 1. 0
φ1.5
±0.1
4.0
±0.1
7.3
±0.1
2.6
±0.1
4.0
±0.1
B'
B
↑
A
↑
A'
±0.1
（Pin feed hole）
（Center hole）
Ａ-Ａ'cross sectioal view
Ｂ-Ｂ'cross sectional view
2.45
Pull
direction
Packing quantity
1,000pcs/reel
①Pin Mark
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[Data Sheet]
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
・Using Conditions
・Baking
Bake the product in case of below:
①The expiration date is passed.
②The color of 5% and 10% on humidity indicator card is not green.
・Baking Conditions
２．Application Methods
２－１．Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result
２－２．About Derating
It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
２－３．About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
①It requires long luminosity life
②It is always lit
２－４．Applied Stress on Product
The top of the LED is very soft, which the silicon resin is used as sealing resin.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
Temperature
Time
Humidity
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,
Please storing in the airtight container
■Precaution (Surface Mount Device)
Classification
Temperature
Humidity
Expiration Date
Remark
①Before using 5〜30℃ 30〜70%RH
Within 1 year
from Receiving Storage with waterproof package
[MSL0104RGB series]
②After opening
package
5〜30℃ Below 70%RH Within 168h
with our desiccant (silica gel)
(Even if the product is before expiration date.)
60±3℃
40〜48h
Below 20%RH
Remark
so please try not to apply stress on it.
・Recommend bake once.
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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[Data Sheet]
３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
Therefore, please pay attention to the storage environment for mounted product (concern the
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
[MSL0104RGB series]
the products.
generated gas of the surrounding parts of the products and the atmospheric environment).
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[Data Sheet]
Stress strength according to
he mounting position:
A＞B＞C＞D
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
[MSL0104RGB series]
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,
４－５．Soldering Pattern for Recommendation
one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle
according to the material and shape of the LED product.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
４－１. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
４．Mounting
finally has bad influence on the product’s reliability.
・The product is not guaranteed for flow soldering.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering
with other parts within the usage limitation after open the moistureproof package.
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
2. 18
0.6
0.6
0.3 0.32
0.3
0.3
1.58
1.06
Emitting
(Unit : mm)
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[Data Sheet]
Mark
Meanings
Conditions
please take care of following points.
140℃
[MSL0104RGB series]
４－６．Reflow Profile
Ts
max
Maximum of pre-heating temperature
180℃
Ts
min
Minimum of pre-heating temperature
ITEM
a) Heating method
Time for peak temperature
Within 10sec.
ΔT
R
/Δt
Temperature rising rate
Under 3℃/sec.
ΔT
D
/Δt
Temperature decreasing rate
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
t
s
Time from Tsmin to Tsmax
Over 60sec.
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
Over -3℃/sec.
T
L
Reference temperature
230〜260℃
t
L
Retention time for TL
Within 40sec.
T
P
Peak temperature
260℃(Max)
goes down to room temp.
furnaces vary by customer’s own conditions.
①SOLDER USED
t
P
Heating on PCB pattern, not direct to the
LED. (Fig-1)
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
325℃ within 3 sec.
４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
b)
Handling after
soldering
Please handle after the part temp.
SOLDERI
NG IRON
･Fig-
SOLDERI
NG LAND
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R1102
A
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Notice
ROHM Customer Support System
http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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