Description
These Super Bright Precision
Optical Performance LED lamps
are based on flip chip InGaN
material, which is the brightest
and most efficient technology
for LEDs. A blue LED die is
coated by a phosphor to pro-
duce white.
Package Dimension A
Package Dimension B
Dimension H:
23 & 30 Degree = 12.67 +/- 0.25 mm (0.499 +/- 0.01 inch)
15 Degree = 12.93 +/- 0.25 mm (0.509 +/- 0.01 inch)
Notes :
1. All dimensions are in milimetres /inches.
2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.
.028
0.70 max
.100
±
.015
2.54
±
0.38
1.244
31.60 min
.093
2.35 max
.228
±
.008
ø5.80
±
0.20
.343
±
.008
8.71
±
0.20
.197
±
.008
5.00
±
0.20 note#1
.039
1.00 min
.020
±
.004
0.50
±
0.10 sq. typ.
.045
±
.008
1.14
±
0.20
cathode
flat
cathode
lead
cathode
lead cathode
flat
NOTES:
1. MEASURED JUST ABOVE FLANGE.
.059±.006
1.50±0.15
Refer to Table1
Dimension H
.343
±
.008
8.71
±
0.20
.100
±
.015
2.54
±
0.38
1.244
31.60 min
.020
±
.004
0.50
±
0.10 sq. typ.
.039
1.00 min
.197
±
.008
5.00
±
0.20
.228
±
.008
ø5.80
±
0.20
.028
0.70 max
.045
±
.008
1.14
±
0.20
note#1
Agilent HLMP-CW18, HLMP-CW19,
HLMP-CW28, HLMP-CW29,
HLMP-CW38, HLMP-CW39
T-1 3/4 Precision Optical
Performance White LED
Data Sheet
These T- 1 3/4 lamps
incorporate precise optics
producing well- defined spatial
radiation patterns at specific
viewing cone angle.
Benefit
• Reduced Power Consumption,
Higher Reliability, and Increased
Optical/Mechanical Design
Flexibility Compared to
Incandescent Bulbs and Other
Alternative White Light Sources
Features
• Highly Luminous White Emission
•15
o, 23 o, and 30o viewing angle
• New InGaN flip chip die technology
with protective diode.
• ESD class 3
Applications
• Electronic Signs and Signals
• Small Area Illumination
• Legend Backlighting
• General Purpose Indicators
2
Device Selection Guide
Part Numbering System
Part Number Typ. Viewing Angle Iv (cd) @ 20mA Standoff Leads Package
Dimension
Min. Typ.
HLMP-CW18-VY0xx 15°4.20 6.40 No A
HLMP-CW19-VY0xx 15°4.20 6.40 Yes B
HLMP-CW28-TW0xx 23°2.50 3.80 No A
HLMP-CW29-TW0xx 23°2.50 3.80 Yes B
HLMP-CW38-SV0xx 30°1.90 3.00 No A
HLMP-CW39-SV0xx 30°1.90 3.00 Yes B
Notes:
1. Tolera nce for luminous intensity meas urement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED with unprotected eyes.
Mechanical Option
00: Bulk
DD: Ammo Pack
L
M P
Color Bin Options
0: Full color bin distribution
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Viewing Angle
18: 15 without standoffs
19: 15˚ with standoffs
28: 23˚ without standoffs
29: 23˚ with standoffs
38: 30 ˚ without standoffs
39: 30 ˚ with standoffs
Color Options
W: White
Package Options
C: T-1 3/4
--XXXXXXX
CW
Minimum Intensity Bin Limit
Refer to Device Selection Guide
3
Absolute Maximum Ratings (TA = 25°C)
Electrical/Optical Characteristics (TA = 25oC)
Parameter Value Units
DC Forward Current [1] 30 mA
Peak Forward Current [2] 100 mA
Average Forward Current 30 mA
Power Dissipation 120 mW
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +85 °C
Storage Temperat ure Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, 1 KHz
Parameters Symbol Minimum Typical Maximum Units Test Condition
Forward voltage VF3.4 4.0 V IF = 20 mA
Capacitance C 53 pF VF=0, f=1 MHz
Reverse Voltage [1] VR0.6 V IR = 10 mA
Thermal resistance RqJ-PIN 240 oC/W LED Junction to cathode lead
Viewing Angle [2]
CW18/CW19
CW28/CW29
CW38/CW39
2q1/2 15
23
30
Degree IF = 20 mA
Chromaticity Coordinate [3] X
Y0.31
0.32 IF = 20 mA
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 m
2. 2q1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity
3. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
4. The radiant intensity, Ie in watts/ steradian, may be found from the equation Ie = Iv/h v, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
4
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Iv vs. Forward Current Figure 4. Maximum Fwd Current vs Temperature
Figure 5. Chromaticity Coordinates Changes over Forward Current
0.0
0.2
0.4
0.6
0.8
1.0
380 480 580 680 780
Wa velength (nm)
Relative Intensity
0
10
20
30
01234
Forward Voltage (V)
Forward Current (mA)
0.0
0.3
0.6
0.9
1.2
1.5
0102030
DC Forward Current (mA)
Relative Luminous Intensity
0
5
10
15
20
25
30
35
0 20406080100
Ambient Temperature (C)
Maximum Forward
Current (mA)
RΘJ-A = 780
˚
C/W
RΘJ-A = 585
˚
C/W
0.30
0.32
0.34
0.305 0.310 0.315 0.320
X Coordinate
Y Coordinate
30 mA
20 mA
10 mA
5 mA
1 mA
5
Figure 6a. CW1x Spatial Radiation Pattern Figure 6b. CW2x Spatial Radiation Pattern
Figure 6c. CW3x Spatial Radiation Pattern
0.0
0.5
1.0
-90 -70 -50 -30 -10 10 30 50 70 90
Angular Displacement (Degree)
Relative Intensity
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
Angular Displacement
Relative Luminous Intensity
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
Angular Displacement
Relative Luminous Intensity
6
Color Bin Limit Tables
Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram
Rank Limits
(Chromaticity Coordinates)
1x
y0.330
0.360 0.330
0.318 0.356
0.351 0.361
0.385
2x
y0.287
0. 295 0.296
0.276 0.330
0.318 0.330
0.339
3x
y0.264
0.267 0.280
0.248 0.296
0.276 0.283
0.305
4 x
y0.283
0.305 0.287
0.295 0.330
0.339 0.330
0.360
Tolerance for each bin limit is ±0.01
Note:
1. Bin categories are established for classification of products. Products may not be available in all
bin categories. Please contact your Agilent representative for information on currently available
0.20
0.25
0.30
0.35
0.40
0.26 0.3 0.34 0.38
X-coordinate
Y-coordinate
1
3
4
Black Body Curv e
Intensity Bin Limit Table
Bin Intensity (mcd) at 20 mA
Min Max
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Tolerance for each bin limit is ± 15%
7
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or
cut to length prior to insertion and soldering into
PC board.
• If lead forming is required before soldering, care
must be taken to avoid any excessive mechanical
stress induced to LED package. Otherwise, cut the
leads of LED to length after soldering process at
room temperature. The solder joint formed will
absorb the mechanical stress of the lead cutting
from traveling to the LED chip die attach and
wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely
upon hand operation.
Soldering Condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for
those parts without standoff.
• Recommended soldering condition:
Wave
Soldering Manual Solder
Dipping
Pre-heat temperature 105 °C Max. −
Preheat time 30 sec Max −
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
• Wave soldering parameter must be set and
maintain according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering
profile to ensure the soldering profile used is
always conforming to recommended soldering
condition.
• If necessary, use fixture to hold the LED
component in proper orientation with respect to
the PCB during soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to
cool to room temperature, 25°C before handling.
• Special attention must be given to board
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
• Recommended PC board plated through holes
Note: Refer to application note AN1027 for more
information on sold eri n g LED components.
LED component
ead size Diagonal Plated through hole
diameter
0.457 x 0.457mm
(0.018 x 0.018inch) 0.646 mm
(0.025 inch) 0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508mm
(0.020 x 0.020inch) 0.718 mm
(0.028 inch) 1.049 to 1.150mm
(0.041 to 0.045 inch)
Recommended Wave Soldering Profile
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
TEMPERATURE - ˚C
100
50
30
0 10 20 30 40 50 60 70 80 90 100
LAMINAR WAVE
HOT AIR KNIFE
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Data subject to change.
Copyright 2005 Agilent Technologies, Inc.
October 27, 2005
Obsoletes 5989-0461EN
5989-4155EN