  
    
(250 Volts Peak)
The MOC3031, MOC3032 and MOC3033 devices consist of gallium arsenide
infrared emitting diodes optically coupled to a monolithic silicon detector
performing the function of a Zero Voltage crossing bilateral triac driver.
They are designed for use with a triac in the interface of logic systems to
equipment powered from 115 Vac lines, such as teletypewriters, CRTs, printers,
motors, solenoids and consumer appliances, etc.
Simplifies Logic Control of 115 Vac Power
Zero Voltage Crossing
dv/dt of 2000 V/µs Typical, 1000 V/µs Guaranteed
To order devices that are tested and marked per VDE 0884 requirements, the
suffix ”V” must be included at end of part number. VDE 0884 is a test option.
Recommended for 115 Vac(rms) Applications:
Solenoid/Valve Controls Temperature Controls
Lighting Controls E.M. Contactors
Static Power Switches AC Motor Starters
AC Motor Drives Solid State Relays
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
INFRARED LED
Reverse Voltage VR3 Volts
Forward Current — Continuous IF60 mA
Total Power Dissipation @ TA = 25°C
Negligible Power in Output Driver
Derate above 25°C
PD120
1.41
mW
mW/°C
OUTPUT DRIVER
Off–State Output Terminal Voltage VDRM 250 Volts
Peak Repetitive Surge Current
(PW = 100 µs, 120 pps) ITSM 1 A
Total Power Dissipation @ TA = 25°C
Derate above 25°CPD150
1.76 mW
mW/°C
TOTAL DEVICE
Isolation Surge Voltage(1)
(Peak ac Voltage, 60 Hz, 1 Second Duration) VISO 7500 Vac(pk)
Total Power Dissipation @ TA = 25°C
Derate above 25°CPD250
2.94 mW
mW/°C
Junction Temperature Range TJ40 to +100 °C
Ambient Operating Temperature RangeTA40 to +85 °C
Storage Temperature RangeTstg 40 to +150 °C
Soldering Temperature (10 s) TL260 °C
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.
1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
GlobalOptoisolator



COUPLER SCHEMATIC
STANDARD THRU HOLE
1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
5. DO NOT CONNECT
6. MAIN TERMINAL
1
2
3
6
5
4
ZERO
CROSSING
CIRCUIT
61
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
INPUT LED
Reverse Leakage Current
(VR = 3 V) IR 0.05 100 µA
Forward Voltage
(IF = 30 mA) VF 1.3 1.5 Volts
OUTPUT DETECTOR (IF = 0 unless otherwise noted)
Leakage with LED Off, Either Direction
(Rated VDRM(1))IDRM1 10 100 nA
Peak On–State Voltage, Either Direction
(ITM = 100 mA Peak) VTM 1.8 3 Volts
Critical Rate of Rise of Off–State Voltage dv/dt 1000 2000 V/µs
COUPLED
LED Trigger Current, Current Required to Latch Output
(Main Terminal Voltage = 3 V(2)) MOC3031
MOC3032
MOC3033
IFT
15
10
5
mA
Holding Current, Either Direction IH 250 µA
Isolation Voltage (f = 60 Hz, t = 1 sec) VISO 7500 Vac(pk)
ZERO CROSSING
Inhibit Voltage
(IF = Rated IFT, MT1–MT2 Voltage above which device will not
trigger.)
VIH 5 20 Volts
Leakage in Inhibited State
(IF = Rated IFT, Rated VDRM, Off State) IDRM2 500 µA
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max
2. IFT (15 mA for MOC3031, 10 mA for MOC3032, 5 mA for MOC3033) and absolute max IF (60 mA).
Figure 1. On–State Characteristics
–3 VTM, ON–STATE VOLTAGE (VOLTS)
I
–400
0
+400
+800
–2 –1 0 1 2 3
TM, ON-STATE CURRENT (mA)
–600
–800
–200
+200
+600
4–4
OUTPUT PULSE WIDTH – 80
µ
s
IF = 30 mA
f = 60 Hz
TA = 25
°
C
0.7
Figure 2. Trigger Current versus Temperature
–40 TA, AMBIENT TEMPERATURE (
°
C)
0.8
1.1
1.3
–20 0 20 40 60 80
FT
NORMALIZED I
100
0.9
1
1.2
NORMALIZED TO
TA = 25
°
C
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
MOC3031, MOC3032, MOC3033
5
1PWin, LED TRIGGER WIDTH (
µ
s)
10
15
20
25
2 5 2010 50
0
FT
I, NORMALIZED LED TRIGGER CURRENT
NORMALIZED TO:
PWin
q
100
µ
s
+250
Vdc
PULSE
INPUT MERCURY
WETTED
RELAY
RTEST
CTEST
R = 10 k
X100
SCOPE
PROBE
D.U.T.
APPLIED VOLTAGE
WAVEFORM 158 V
0 VOLTS
t
RC
Vmax = 250 V
dv
ń
dt
+
0.63 Vmax
t
RC
+
158
t
RC
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst–case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt to be
gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering.
t
RC is measured at this point and
recorded.
5–40 TA, AMBIENT TEMPERATURE (
°
C)
I
–20 0 20 40 60 80 100
10
20
50
100
200
500
DRM1, PEAK BLOCKING CURRENT (nA)
0.6
–40 TA, AMBIENT TEMPERATURE (
°
C)
I
IF = RATED IFT
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
–20 0 20 40 60 80 100
DRM2, NORMALIZED
TA = 25
°
C
IF = 0
Figure 3. IDRM1, Peak Blocking Current
versus Temperature Figure 4. IDRM2, Leakage in Inhibit State
versus Temperature
Figure 5. LED Current Required to Trigger
versus LED Pulse Width
Figure 6. Static dv/dt Test Circuit
100
MOC3031, MOC3032, MOC3033
Rin 1
2
6
4
180
MOC3031/
3032/3033
3
5
NOTE: This optoisolator should not be used to drive a load directly .
It is intended to be a trigger device only.
1 k
39
0.01
115 VAC
HOT
NEUTRAL
LOAD
Typical circuit for use when hot line switching is required.
In this circuit the “hot” side of the line is switched and the
load connected to the cold or neutral side. The load may be
connected to either the neutral or hot line.
Rin is calculated so that IF is equal to the rated IFT of the
part, 5 mA for the MOC3033, 10 mA for the MOC3032, or
15 mA for the MOC3031. The 39 ohm resistor and 0.01 µF
capacitor are for snubbing of the triac and may or may not
be necessary depending upon the particular triac and load
used.
Rin
R1
2
6
4
MOC3031/
3032/3033
3
5
VCC
R2
LOAD
180
D1
1
SCR SCR
D2
115 VAC
Suggested method of firing two, back–to–back SCR’s,
with a Motorola triac driver. Diodes can be 1N4001; resis-
tors, R1 and R2, are optional 1 k ohm.
*For highly inductive loads (power factor < 0.5), change this value to
360 ohms.
Figure 7. Hot–Line Switching Application Circuit
Figure 8. Inverse–Parallel SCR Driver Circuit
VCC
MOC3031, MOC3032, MOC3033
PACKAGE DIMENSIONS
THRU HOLE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
6 4
1 3
–A–
–B–
SEATING
PLANE
–T–
4 PLF
K
C
N
G
6 PLD
6 PLE
M
A
M
0.13 (0.005) B M
T
L
M
6 PLJ
M
B
M
0.13 (0.005) A M
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
J0.008 0.012 0.21 0.30
K0.100 0.150 2.54 3.81
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.015 0.100 0.38 2.54
_ _ _ _
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL
SURFACE MOUNT
–A–
–B–
S
SEATING
PLANE
–T–
J
K
L
6 PL
M
B
M
0.13 (0.005) A M
T
C
D6 PL
M
A
M
0.13 (0.005) B M
T
H
G
E6 PL
F4 PL
31
46
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
H0.020 0.025 0.51 0.63
J0.008 0.012 0.20 0.30
K0.006 0.035 0.16 0.88
L0.320 BSC 8.13 BSC
S0.332 0.390 8.43 9.90
MOC3031, MOC3032, MOC3033
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
0.4" LEAD SPACING
6 4
1 3
–A–
–B–
N
C
K
G
F4 PL
SEATING
D6 PL
E6 PL
PLANE
–T–
M
A
M
0.13 (0.005) B M
T
L
J
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
J0.008 0.012 0.21 0.30
K0.100 0.150 2.54 3.81
L0.400 0.425 10.16 10.80
N0.015 0.040 0.38 1.02
MOC3031, MOC3032, MOC3033
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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