GlobalOptoisolator (250 Volts Peak) The MOC3031, MOC3032 and MOC3033 devices consist of gallium arsenide infrared emitting diodes optically coupled to a monolithic silicon detector performing the function of a Zero Voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 115 Vac lines, such as teletypewriters, CRTs, printers, motors, solenoids and consumer appliances, etc. * * * * Simplifies Logic Control of 115 Vac Power Zero Voltage Crossing dv/dt of 2000 V/s Typical, 1000 V/s Guaranteed To order devices that are tested and marked per VDE 0884 requirements, the suffix "V" must be included at end of part number. VDE 0884 is a test option. Recommended for 115 Vac(rms) Applications: * Solenoid/Valve Controls * Lighting Controls * Static Power Switches * AC Motor Drives * * * * Temperature Controls AC Motor Starters Symbol Value 1 6 2 5 Unit ZERO CROSSING CIRCUIT 3 Reverse Voltage VR 3 Volts Forward Current -- Continuous IF 60 mA Total Power Dissipation @ TA = 25C Negligible Power in Output Driver Derate above 25C PD 120 mW 1.41 mW/C OUTPUT DRIVER Off-State Output Terminal Voltage VDRM 250 Volts Peak Repetitive Surge Current (PW = 100 s, 120 pps) ITSM 1 A PD 150 1.76 mW mW/C VISO 7500 Vac(pk) Total Power Dissipation @ TA = 25C Derate above 25C PD 250 2.94 mW mW/C Junction Temperature Range TJ - 40 to +100 C Ambient Operating Temperature Range TA - 40 to +85 C Storage Temperature Range Tstg - 40 to +150 C Soldering Temperature (10 s) TL 260 C TOTAL DEVICE Isolation Surge Voltage(1) (Peak ac Voltage, 60 Hz, 1 Second Duration) STANDARD THRU HOLE Solid State Relays INFRARED LED Total Power Dissipation @ TA = 25C Derate above 25C 1 COUPLER SCHEMATIC E.M. Contactors MAXIMUM RATINGS (TA = 25C unless otherwise noted) Rating 6 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. 1. 2. 3. 4. 5. 5. 6. 4 ANODE CATHODE NC MAIN TERMINAL SUBSTRATE DO NOT CONNECT MAIN TERMINAL MOC3031, MOC3032, MOC3033 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage Current (VR = 3 V) IR -- 0.05 100 A Forward Voltage (IF = 30 mA) VF -- 1.3 1.5 Volts IDRM1 -- 10 100 nA Peak On-State Voltage, Either Direction (ITM = 100 mA Peak) VTM -- 1.8 3 Volts Critical Rate of Rise of Off-State Voltage dv/dt 1000 2000 -- V/s -- -- -- -- -- -- 15 10 5 INPUT LED OUTPUT DETECTOR (IF = 0 unless otherwise noted) Leakage with LED Off, Either Direction (Rated VDRM(1)) COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = 3 V(2)) MOC3031 MOC3032 MOC3033 IFT IH -- 250 -- A VISO 7500 -- -- Vac(pk) VIH -- 5 20 Volts IDRM2 -- -- 500 A Holding Current, Either Direction Isolation Voltage (f = 60 Hz, t = 1 sec) mA ZERO CROSSING Inhibit Voltage (IF = Rated IFT, MT1-MT2 Voltage above which device will not trigger.) Leakage in Inhibited State (IF = Rated IFT, Rated VDRM, Off State) 1. 2. 2. Test voltage must be applied within dv/dt rating. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3031, 10 mA for MOC3032, 5 mA for MOC3033) and absolute max IF (60 mA). TYPICAL ELECTRICAL CHARACTERISTICS +800 OUTPUT PULSE WIDTH - 80 s IF = 30 mA +600 f = 60 Hz +400 TA = 25C NORMALIZED TO TA = 25C 1.3 1.2 NORMALIZED IFT ITM , ON-STATE CURRENT (mA) TA = 25C 1.1 +200 0 -200 1 0.9 -400 0.8 -600 0.7 -800 -4 -3 -2 -1 0 1 2 3 VTM, ON-STATE VOLTAGE (VOLTS) Figure 1. On-State Characteristics 4 -40 -20 0 20 40 60 TA, AMBIENT TEMPERATURE (C) 80 100 Figure 2. Trigger Current versus Temperature MOC3031, MOC3032, MOC3033 1.5 1.4 IF = 0 200 1.3 IDRM2, NORMALIZED I DRM1, PEAK BLOCKING CURRENT (nA) 500 100 50 20 IF = RATED IFT 1.2 1.1 1 0.9 0.8 0.7 10 0.6 5 -40 -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (C) -40 IFT, NORMALIZED LED TRIGGER CURRENT Figure 3. IDRM1, Peak Blocking Current versus Temperature -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (C) Figure 4. IDRM2, Leakage in Inhibit State versus Temperature 25 NORMALIZED TO: PWin 100 s TA = 25C q 20 15 10 5 0 1 2 5 10 20 PWin, LED TRIGGER WIDTH (s) 50 100 Figure 5. LED Current Required to Trigger versus LED Pulse Width +250 Vdc PULSE INPUT APPLIED VOLTAGE WAVEFORM RTEST 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. tRC is measured at this point and recorded. R = 10 k CTEST MERCURY WETTED RELAY D.U.T. X100 SCOPE PROBE Vmax = 250 V 158 V + 0.63 RCVmax + 158 RC dv dt 0 VOLTS t tRC Figure 6. Static dv/dt Test Circuit t MOC3031, MOC3032, MOC3033 VCC Rin 1 180 6 Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 5 mA for the MOC3033, 10 mA for the MOC3032, or 15 mA for the MOC3031. The 39 ohm resistor and 0.01 F capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load used. HOT 2 MOC3031/ 5 3032/3033 3 4 39 115 VAC 0.01 1k LOAD NEUTRAL * For highly inductive loads (power factor < 0.5), change this value to 360 ohms. Figure 7. Hot-Line Switching Application Circuit 115 VAC R1 VCC 1 Rin 2 3 D1 Suggested method of firing two, back-to-back SCR's, with a Motorola triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 1 k ohm. 6 MOC3031/ 3032/3033 SCR 5 4 SCR 180 NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. D2 R2 LOAD Figure 8. Inverse-Parallel SCR Driver Circuit MOC3031, MOC3032, MOC3033 PACKAGE DIMENSIONS -A- 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 -B- 1 3 F 4 PL C N -T- L K SEATING PLANE J 6 PL 0.13 (0.005) G M E 6 PL D 6 PL 0.13 (0.005) M T A B M M T B M A M DIM A B C D E F G J K L M N M INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 STYLE 6: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15 _ 0.38 2.54 ANODE CATHODE NC MAIN TERMINAL SUBSTRATE MAIN TERMINAL THRU HOLE -A- 6 4 -B- 1 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3 F 4 PL L H C -T- G J K 6 PL E 6 PL 0.13 (0.005) D 6 PL 0.13 (0.005) M T A M B M SEATING PLANE T B M A M M SURFACE MOUNT DIM A B C D E F G H J K L S INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90 MOC3031, MOC3032, MOC3033 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. -A- 6 4 -B- 1 3 L N F 4 PL C -T- SEATING PLANE G J K D 6 PL E 6 PL 0.13 (0.005) M T A M B M 0.4" LEAD SPACING DIM A B C D E F G J K L N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2000 Fairchild Semiconductor Corporation