D DRJ P
1
4 5
8
functiondiagram
(positivelogic)
1
7
6
4
53
8
VCC Vref
D
RS
RCANH
CANL
2
3 6
7
R
VCC
GND
D
CANL
CANH
RS
Vref
SN55HVD251
SN65HVD251
www.ti.com
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
INDUSTRIAL CAN TRANSCEIVER
Check for Samples: SN55HVD251,SN65HVD251
1FEATURES DESCRIPTION
• Drop-In Improved Replacement for the The HVD251 is intended for use in applications
PCA82C250 and PCA82C251 employing the Controller Area Network (CAN) serial
communication physical layer in accordance with the
• Bus-Fault Protection of ±36 V ISO 11898 Standard. The HVD251 provides
• Meets or Exceeds ISO 11898 differential transmit capability to the bus and
• Signaling Rates(1) Up to 1 Mbps differential receive capability to a CAN controller at
speeds up to 1 megabits per second (Mbps).
• High Input Impedance Allows up to 120 Nodes
on a Bus Designed for operation in harsh environments, the
• Bus Pin ESD Protection Exceeds 14 kV HBM device features cross-wire, overvoltage and loss of
ground protection to ±36 V. Also featured are
• Unpowered Node Does Not Disturb the Bus overtemperature protection as well as -7 V to 12 V
• Low-Current Standby Mode — 200 µA Typical common-mode range, and tolerance to transients of
• Thermal Shutdown Protection ±200 V. The transceiver interfaces the single-ended
CAN controller with the differential CAN bus found in
• Glitch-Free Power-Up and Power-Down Bus industrial, building automation, and automotive
Protection For Hot-Plugging applications.
• DeviceNet Vendor ID # 806 Rs, pin 8, selects one of three different modes of
(1) The signaling rate of a line is the number of voltage operation: high-speed, slope control, or low-power
transitions that are made per second expressed in bps (bits mode. The high-speed mode of operation is selected
per second). by connecting pin 8 to ground, allowing the
transmitter output transistors to switch as fast as
APPLICATIONS possible with no limitation on the rise and fall slope.
• CAN Data Buses The rise and fall slope can be adjusted by connecting
• Industrial Automation a resistor to ground at pin 8; the slope is proportional
• SAE J1939 Standard Data Bus Interface to the pin's output current. Slope control with an
external resistor value of 10 kΩgives ~ 15 V/µs slew
• NMEA 2000 Standard Data Bus Interface rate; 100 kΩgives ~ 2 V/µs slew rate.
If a high logic level is applied to the Rs pin 8, the
device enters a low-current standby mode where the
driver is switched off and the receiver remains active.
The local protocol controller returns the device to the
normal mode when it transmits to the bus.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER PACKAGE TEMPERATURE RANGE MARKED AS
SN65HVD251D 8-pin Small Outline Integrated Circuit (SOIC) -40°C to 125°C VP251
SN65HVD251P 8-pin Dual Inline Package (DIP) -40°C to 125°C 65HVD251
SN55HVD251DRJ 8-pin Small Outline No-Lead (SON) -55°C to 125°C SN55HVD251
ABSOLUTE MAXIMUM RATINGS(1) (2)
Values
Supply voltage range, VCC -0.3 V to 7 V
Voltage range at any bus terminal (CANH or CANL) -36 V to 36 V
Transient voltage per ISO 7637, pulse 1, 2, 3a, 3b CANH, CANL ±200 V
Input voltage range, VI(D, Rs, or R) -0.3 V to VCC + 0.5
Receiver output current, IO–10 mA to 10 mA
CANH, CANL and GND 14 kV
Human Body Model (3)
Electrostatic discharge All pins 6 kV
Charged-Device Model (4) All pins 1 kV
Electrical fast transient/burst IEC 61000-4-4, Classification B CANH, CANL ±3 kV
(see the Package
Continuous total power dissipation Dissipation Ratings Table)
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101.
PACKAGE DISSIPATION RATINGS
CIRCUIT BOARD TA= 25°C DERATING FACTOR (1) TA= 85°C POWER TA= 125°C POWER
PACKAGE MODEL POWER RATING ABOVE TA= 25°C RATING RATING
Low-K(2) 576 mW 4.8 mW/°C 288 mW 96 mW
SOIC (D) High-K(3) 924 mW 7.7 mW/°C 462 mW 154 mW
Low-K(2) 888 mW 7.4 mW/°C 444 mW 148 mW
PDIP (P) High-K(3) 1212 mW 10.1 mW/°C 606 mW 202 mW
Low-K(2) 403 mW 4.03 mW/°C 262 mW 100 mW
High-K 1081 mW 10.8 mW/°C 703 mW 270 mW
SON (DRJ) (no Vias)(3)
High-K 2793 mW 27.9 mW/°C 1815 mW 698 mW
(with Vias)
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.
(3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.
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THERMAL CHARACTERISTICS
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
D 78.7
qJB Junction-to-board thermal resistance P 48.9 °C/W
DRJ 73
D 44.6
qJC Junction-to-case thermal resistance P 66.6 °C/W
DRJ 52
VCC = 5 V, Tj = 27°C, RL = 60Ω,
RSat 0 V, Input to D a 500-kHz 97.7 mW
50% duty cycle square wave
PDDevice power dissipation VCC = 5.5 V, Tj = 130°C, RL = 60Ω,
RSat 0 V, Input to D a 500-kHz 142 mW
50% duty cycle square wave
TSD Thermal shutdown junction temperature 165 °C
RECOMMENDED OPERATING CONDITIONS
PARAMETER MIN NOM MAX UNIT
Supply voltage, VCC 4.5 5.5 V
Voltage at any bus terminal (separately or common mode) VIor VIC -7(1) 12 V
High-level input voltage, VIH D input 0.7 VCC V
Low-level input voltage, VIL D input 0.3 VCC V
Differential input voltage, VID -6 6 V
Input voltage to Rs, VI(Rs) 0 VCC V
Input voltage at Rs for standby, VI(Rs) 0.75 VCC VCC V
Rs wave-shaping resistance 0 100 kΩ
Driver -50
High-level output current, IOH mA
Receiver -4
Driver 50
Low-level output current, IOL mA
Receiver 4
Operating free-air temperature, TASN65HVD251 -40 125 °C
SN55HVD251 –55 125
Junction temperature, TJ145 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
SUPPLY CURRENT
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Standby Rs at VCC, D at VCC 275 µA
ICC Supply current Dominant D at 0 V, 60 Ωload, Rs at 0 V 65 mA
Recessive D at VCC, no load, Rs at 0 V 14
(1) All typical values are at 25°C and with a 5-V supply.
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DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
CANH 2.75 3.5 4.5
Bus output voltage Figure 1 and Figure 2 ,
VO(D) (Dominant) D at 0 V Rs at 0 V, T ≥-40°C
CANL 0.5 2 V
CANH 2 2.5 3
Bus output voltage Figure 1 and Figure 2 , D at 0.7VCC,
VO(R) (Recessive) Rs at 0 V,
CANL 2 2.5 3
Figure 1 , D at 0 V, Rs at 0 V 1.5 2 3 V
Figure 3 , D at 0 V, Rs at 0 V, RNODE = 330 Ω1.2 2 3.1 V
VOD(D) Differential output voltage (Dominant) Figure 3 , D at 0 V, Rs at 0 V, RNODE = 165 Ω, 1.2 2 3.1 V
VCC ≥4.75 V
Figure 1 and Figure 2 , D at 0.7 VCC -120 12 mV
VOD(R) Differential output voltage (Recessive) D at 0.7 VCC, no load, T ≤85°C -0.5 0.05 V
VOC(pp) Peak-to-peak common-mode output voltage Figure 9, Rs at 0 V 600 mV
IIH High-level input current, D Input D at 0.7 VCC -40 0 µA
IIL Low-level input current, D Input D at 0.3 VCC -60 0 µA
Figure 11, VCANH at -7 V, CANL Open -200
Figure 11, VCANH at 12 V, CANL Open 2.5
IOS(SS) Short-circuit steady-state output current mA
Figure 11, VCANL at -7 V, CANH Open -2
Figure 11, VCANL at 12 V, CANH Open 200
COOutput capacitance See receiver input capacitance
IOZ High-impedance output current See receiver input current
IIRs(s) Rs input current for standby Rs at 0.75 VCC -10 µA
IIRs(f) Rs input current for full speed operation Rs at 0 V -550 0 µA
(1) All typical values are at 25°C and with a 5-V supply.
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Figure 4, Rs at 0 V 40 70
tpLH Propagation delay time, low-to-high-level output Figure 4, Rs with 10 kΩto ground 90 125
Figure 4, Rs with 100 kΩto ground 500 800
Figure 4, Rs at 0 V 85 125
tpHL Propagation delay time, high-to-low-level output Figure 4, Rs with 10 kΩto ground 200 260
Figure 4, Rs with 100 kΩto ground 1150 1450
Figure 4, Rs at 0 V 45 85
tsk(p) Pulse skew (|tpHL - tpLH|) Figure 4, Rs with 10 kΩto ground 110 180 ns
Figure 4, Rs with 100 kΩto ground 650 900
trDifferential output signal rise time 35 80 100
Figure 4, Rs at 0 V
tfDifferential output signal fall time 35 80 100
trDifferential output signal rise time 100 150 250
Figure 4, Rs with 10 kΩto ground
tfDifferential output signal fall time 100 150 250
trDifferential output signal rise time 600 950 1550
Figure 4, Rs with 100 kΩto ground
tfDifferential output signal fall time 600 950 1550
ten Enable time from standby to dominant Figure 8 0.5 µs
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RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going input threshold voltage 750 900
VIT- Negative-going input threshold voltage Rs at 0 V, (See Table 1) 500 650 mV
Vhys Hysteresis voltage (VIT+ - VIT-) 100
VOH High-level output voltage Figure 6, IO= -4mA 0.8 VCC V
VOL Low-level output voltage Figure 6, IO= 4mA 0.2 VCC V
CANH or CANL at 12 V 600
CANH or CANL at 12 V, Other bus 715
VCC at 0 V pin at 0 V,
IIBus input current µA
Rs at 0 V, D
CANH or CANL at -7 V -460
at 0.7 VCC
CANH or CANL at -7 V, -340
VCC at 0 V
Pin-to-ground, VI= 0.4 sin (4E6pt) + 0.5 pF
CIInput capacitance, (CANH or CANL) 20
V, D at 0.7 VCC
Pin-to-pin, VI= 0.4 sin (4E6pt) + 0.5 V, D pF
CID Differential input capacitance 10
at 0.7 VCC
RID Differential input resistance D at 0.7 VCC, Rs at 0 V 40 100 kΩ
RIN Input resistance, (CANH or CANL) D at 0.7 VCC, Rs at 0 V 20 50 kΩ
Receiver noise rejection See Figure 13
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tpLH Propagation delay time, low-to-high-level output 35 50
tpHL Propagation delay time, high-to-low-level output 35 50
tsk(p) Pulse skew (|tpHL - tpLH|) Figure 6 20 ns
trOutput signal rise time 2 4
tfOutput signal fall time 2 4
tp(sb) Propagation delay time in standby Figure 12, Rs at VCC 500
VREF-PIN CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
-5 µA < IO< 5 µA 0.45 VCC 0.55 VCC
VOReference output voltage V
-50 µA < IO< 50 µA 0.4 VCC 0.6 VCC
DEVICE SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Figure 10, Rs at 0 V 60 100
Total loop delay, driver input to receiver
tloop1 Figure 10, Rs with 10 kΩto ground 100 150 ns
output, recessive to dominant Figure 10, Rs with 100 kΩto ground 440 800
Figure 10, Rs at 0 V 115 150
Total loop delay, driver input to receiver
tloop2 Figure 10, Rs with 10 kΩto ground 235 290 ns
output, dominant to recessive Figure 10, Rs with 100 kΩto ground 1070 1450
Total loop delay, driver input to receiver
tloop2 Figure 10, Rs at 0 V, VCC from 4.5 V to 5.1 V, 105 145 ns
output, dominant to recessive
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VO(CANH) + VO(CANL)
2
D
+
_
Rs
II
IO(CANH)
IO(CANL) VO(CANL)
VO(CANH)
60 W + 1%
VOD
VOC
VI
IIRs
VI(Rs)
93.5 V
Recessive
Dominant O(CANH)
V
O(CANL)
V
92.5 V
91.5 V
+
_
CANH
CANL
D
VIVOD
RS
60 W1%
±
RNODE
RNODE
–7V V 12V
TEST
≤ ≤
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Voltage, Current, and Test Definition
Figure 2. Bus Logic State Voltage Definitions
Figure 3. Driver VOD
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Rs
CANH
CANL
D
10%
90%
0.9V
0V
0.5V
(seeNote A)
+
_
RL=
60 W1%
±
CL=
50pF 20%
±
(seeNoteB)
VO
VI
VI(Rs)
tPLH tPHL
VCC
VO(D)
VO(R)
tf
tr
VI
VO
VCC/2 VCC/2
CANH
CANL
R
VID IO
VO
VI(CANH)
VI(CANL)
VI(CANH) + VI(CANL)
2
VIC =
1.5 V
CANH
CANL
R
(see Note A)
2 V 2.4 V 3.5 V
10%
90%
1.5 V
10%
VO
CL = 15 pF
+20% (see Note B)
IO
VI
0.7 VCC 0.3 VCC
VOH
VOL
tPLH tPHL
tf
tr
VI
VO
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SN65HVD251
www.ti.com
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
Figure 4. Driver Test Circuit and Voltage Waveforms
Figure 5. Receiver Voltage and Current Definitions
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle, tr≤
6ns, tf≤6ns, ZO= 50Ω.
B. CLincludes instrumentation and fixture capacitance within ±20%.
Figure 6. Receiver Test Circuit and Voltage Waveforms
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D
R
Rs
CANH
CANL
DUT
+
_
0 V
60 W 1%
0 V
VI
VO15 pF 20%
VCC
VOH
VOL
0.3 VCC
0.3 VCC
ten
0.7 VCC
VI
VO
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
www.ti.com
A. This test is conducted to test survivability only. Data stability at the R output is not specified.
Figure 7. Test Circuit, Transient Overvoltage Test
Table 1. Receiver Characteristics Over Common Mode Voltage
INPUT DIFFERENTIAL INPUT OUTPUT
VCANH VCANL |VID| R
12 V 11.1 V 900 mV L
-6.1 V -7 V 900 mV L VOL
-1 V -7 V 6 V L
12 V 6 V 6 V L
-6.5 V -7 V 500 mV H
12 V 11.5 V 500 mV H
-7 V -1 V 6 V H VOH
6 V 12 V 6 V H
open open X H
Figure 8. ten Test Circuit and Voltage Waveforms
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CANH
CANL
D
27 W 1%
27 W 1%
RS
VOC
VOC 50 pF 20%
VOC(PP)
VI
D
R
CANH
CANL
DUT
50%
0.3 Vcc
+
_
+
_
0.7 Vcc
60 W + 1%
RS
VI
10 kW or 100 kW + 5%
VRs
VO15 pF + 20%
VCC
0 V
VOH
VOL
D Input
R Output
tLoop2 tLoop1
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SN65HVD251
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SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle, tr≤
6ns, tf≤6ns, ZO= 50Ω.
Figure 9. Peak-to-Peak Common Mode Output Voltage
Figure 10. tLOOP Test Circuit and Voltage Waveforms
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D
15 s
CANH
CANL Vin
0 V
0 V
12 V
–7 V
or
0 V
Rs
IOS
–7 V or 12 V
JIOS(SS)J
JIOS(P)J
10 ms
Vin
Vin
0 V or VCC
(see Note B)
1.5 V
CANH
CANL
R
2.4 V 3.5 V
1.5 V
(see Note A)
VOH
VI
VO
CL = 15 pF
VI
VOVOL
0.3 VCC
tp(sb)
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
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Figure 11. Driver Short-Circuit Test
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle, tr≤
6ns, tf≤6ns, ZO= 50 Ω.
B. CL includes instrumentation and fixture capacitance within ±20%.
Figure 12. Receiver Propagation Delay in Standby Test Circuit and Waveform
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CANH
CANL
5 V
Vac
R
500 mV
900 mV
R1 R2
+
–
12 V
–7 V
R1+1%
R1+1%
R2+1%
R2+1%
VI
VI
VID
50 W
50 W
450 W
227 W
VID
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SN65HVD251
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SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
DEVICE INFORMATION
A. All input pulses are supplied by a generator having the following characteristics: fIN < 1.5 MHz, TA= 25°C, VCC = 5 V.
B. The receiver output should not change state during application of the common-mode input waveform.
Figure 13. Common-Mode Input Voltage Rejection Test
FUNCTION TABLES
Table 2. DRIVER
INPUTS OUTPUTS
Voltage at Rs, VRs BUS STATE
D CANH CANL
L VRs < 1.2 V H L Dominant
H VRs < 1.2 V Z Z Recessive
Open X Z Z Recessive
X VRs > 0.75 VCC Z Z Recessive
X Open Z Z Recessive
Table 3. RECEIVER
DIFFERENTIAL INPUTS [VID = V(CANH) - V(CANL)] OUTPUT R(1)
VID ≥0.9 V L
0.5V < VID < 0.9 V ?
VID ≤0.5 V H
Open H
(1) H = high level; L = low level; X = irrelevant; ? = indeterminate; Z = high impedance
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Vcc
CANH and CANL Outputs
Vcc
Input
CANH Input
Vcc
Input
D Input
Vcc
Input
CANL Input
Vcc
R Output
Output
Rs Input
Output
Input
Vcc
+
100 kW
1 kW
9 V 9 V
15 W
9 kW
9 kW
110 kW
45 kW
40 V
110 kW9 kW
45 kW
9 kW
40 V
40 V
SN55HVD251
SN65HVD251
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Figure 14. Equivalent Input and Output Schematic Diagrams
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62
64
66
68
70
72
74
–40 –25 –10 5 20 35 50 65 80 95 110 125
RS = 0 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 5 V
tLOOP1 – Loop Time – ns
TA – Free-Air Temperature – C
120
125
130
135
140
145
150
–40–25 –10 5 20 35 50 65 80 95 110 125
VCC = 5.5 V
VCC = 5 V
VCC = 4.5 V
RS = 0 V
tLOOP2 – Loop Time – ns
TA – Free-Air Temperature – C
25
26
27
28
29
30
31
32
33
0 250 500 750 1000 1250 1500 1750 2000
VCC = 5 V,
TA = 25°C,
RS = 0 V,
RL = 60 Ω,
CL = 50 pF
ICC – RMS Supply Current – mA
Signaling Rate – kbps
0
1
0.5
5
0 10 20 60 70 80
I -DriverOutputCurrent-mA
O
V -DriverOutputVoltage-V
OD
CANH
CANL
2
2.5
3
3.5
4
4.5
1.5
30 40 50
VCC =5V,
TA=25°C,
RS=0V,
Dat0V
0
1
0.5
0 10 20 60 70 80
I -DriverOutputCurrent-mA
O
V -DriverDifferentialOutputVoltage-V
OD
2
2.5
3
3.5
4
4.5
1.5
30 40 50
VCC =5V,
TA=25°C,
RS=0V,
Dat0V
0
0.5
1
1.5
2
2.5
3
–55 –40 0 25 70 85 125
VCC = 5.5 V
VCC = 5 V
VCC = 4.5 V
RS = 0 V,
D at 0V,
RL = 60 Ω
VOD(D) – Dominant Differential Output Voltage – V
TA – Free-Air Temperature – C
0
10
20
30
40
50
60
123456
TA = 25°C,
RS = 0 V,
D at 0V,
RL = 60 Ω
IO – Driver Output Current – mA
VCC – Supply Voltage – V
0
100
200
300
400
500
600
700
800
900
1000
0 10 20 30 40 50 60 70 80 90 100
VCC = 5.5 V
VCC = 5 V
VCC = 4.5 V
TA = 25°C
tf - Differential Output Fall Time - ns
RS - Slope Resistance - kW
−3
−2.50
−2
−1.50
−1
−0.50
0
−50 0 50 100 150
VCC = 5.5 V
VCC = 5 V
VCC = 4.5 V
TA − Free-Air Temperature − °C
Input Resistance Matching − %
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TYPICAL CHARACTERISTICS
RECESSIVE-TO-DOMINANT LOOP DELAY DOMINANT-TO-RECESSIVE LOOP DELAY SUPPLY CURRENT (RMS)
vs vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE SIGNALING RATE
Figure 15. Figure 16. Figure 17.
DRIVER DRIFFERENTIAL OUTPUT DOMINANT DIFFERENTIAL
DRIVER OUTPUT VOLTAGE VOLTAGE OUTPUT VOLTAGE
vs vs vs
OUTPUT CURRENT OUTPUT CURRENT FREE-AIR TEMPERATURE
Figure 18. Figure 19. Figure 20.
DRIVER OUTPUT CURRENT DIFFERENTIAL OUTPUT TRANSITION INPUT RESISTANCE MATCHING
vs TIME vs vs
SUPPLY VOLTAGE SLOPE RESISTANCE (Rs) FREE-AIR TEMPERATURE
Figure 21. Figure 22. Figure 23.
Copyright © 2002–2010, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): SN55HVD251 SN65HVD251
500 mV Threshold
900 mV Threshold
ALLOWABLE JITTER
NOISE MARGIN
NOISE MARGIN
RECEIVER DETECTION WINDOW 75% SAMPLE POINT
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
www.ti.com
APPLICATION INFORMATION
oscillators in a system must also be accounted for
The basics of bus arbitration require that the receiver with adjustments in signaling rate and stub & bus
at the sending node designate the first bit as length. Table 4 lists the maximum signaling rates
dominant or recessive after the initial wave of the first achieved with the SN65HVD251 in high-speed mode
bit of a message travels to the most remote node on with several bus lengths of category-5, shielded
a network and back again. Typically, this sample is twisted-pair (CAT 5 STP) cable.
made at 75% of the bit width, and within this
limitation, the maximum allowable signal distortion in Table 4. Maximum Signaling Rates for Various
a CAN network is determined by network electrical Cable Lengths
parameters. BUS LENGTH (m) SIGNALING RATE (kbps)
Factors to be considered in network design include 30 1000
the 5 ns/m propagation delay of typical twisted-pair 100 500
bus cable; signal amplitude loss due to the loss 250 250
mechanisms of the cable; and the number, length,
and spacing of drop-lines (stubs) on a network. Under 500 125
strict analysis, variations among the different 1000 62.5
The ISO 11898 standard specifies a maximum bus length of 40 m and maximum stub length of 0.3 m with a
maximum of 30 nodes. However, with careful design, users can have longer cables, longer stub lengths, and
many more nodes on a bus. (Note: Non-standard application may come with a trade-off in signaling rate.) A bus
with a large number of nodes requires a transceiver with high input impedance such as the HVD251.
The Standard specifies the interconnect to be a single twisted-pair cable (shielded or unshielded) with 120-Ω
characteristic impedance (Zo). Resistors equal to the characteristic impedance of the line terminate both ends of
the cable to prevent signal reflections. Unterminated drop-lines connect nodes to the bus and should be kept as
short as possible to minimize signal reflections.
Connectors, while not specified by the ISO 11898 standard, should have as little effect as possible on standard
operating parameters such as capacitive loading. Although unshielded cable is used in many applications, data
transmission circuits employing CAN transceivers are usually used in applications requiring a rugged
interconnection with a wide common-mode voltage range. Therefore, shielded cable is recommended in these
electronically harsh environments, and when coupled with the –2-V to 7-V common-mode range of tolerable
ground noise specified in the standard, helps to ensure data integrity. The HVD251 extends data integrity beyond
that of the standard with an extended –7-V to 12-V range of common-mode operation.
Figure 24. Typical CAN Differential Signal Eye-Pattern
14 Submit Documentation Feedback Copyright © 2002–2010, Texas Instruments Incorporated
Product Folder Link(s): SN55HVD251 SN65HVD251
CANH
CANL
TMS320F243
SN65HVD251
D R
CANTX CANRX
TMS320F243
SN65HVD251
D R
GND
CANTX CANRX
TMS320LF2407A
SN65HVD230
D R
CANTX CANRX
5 V
GND
5 V
GND
3.3 V
Stub Lines –– 0.3 m max
Bus Lines – 40 m max
120
Vref
RS
0.1 F
VCC Vref
RS
VCC Vref
RS
0.1 F0.1 F
VCC
120
Sensor, Actuator, or
Control Equipment Sensor, Actuator, or
Control Equipment Sensor, Actuator, or
Control Equipment
SN55HVD251
SN65HVD251
www.ti.com
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
An eye pattern is a useful tool for measuring overall signal quality. As displayed in Figure 24, the differential
signal changes logic states in two places on the display, producing an eye. Instead of viewing only one logic
crossing on the scope, an entire bit of data is brought into view. The resulting eye pattern includes all effects of
systemic and random distortion, and displays the time during which a signal may be considered valid.
The height of the eye above or below the receiver threshold voltage level at the sampling point is the noise
margin of the system. Jitter is typically measured at the differential voltage zero-crossing during the logic state
transition of a signal. Note that jitter present at the receiver threshold voltage level is considered by some to be a
more effective representation of the jitter at the input of a receiver.
As the sum of skew and noise increases, the eye closes and data is corrupted. Closing the width decreases the
time available for accurate sampling, and lowering the height enters the 900 mV or 500 mV threshold of a
receiver.
Different sources induce noise onto a signal. The more obvious noise sources are the components of a
transmission circuit themselves; the signal transmitter, traces & cables, connectors, and the receiver. Beyond
that, there is a termination dependency, cross-talk from clock traces and other proximity effects, VCC and ground
bounce, and electromagnetic interference from near-by electrical equipment.
The balanced receiver inputs of the HVD251 mitigate most sources of signal corruption, and when used with a
quality shielded twisted-pair cable, help meet data integrity.
Typical Application
Figure 25. Typical HVD251 Application
Copyright © 2002–2010, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): SN55HVD251 SN65HVD251
SN55HVD251
SN65HVD251
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
www.ti.com
REVISION HISTORY
Changes from Original (November 2002) to Revision A Page
• Changed multiple items within the document. ...................................................................................................................... 1
Changes from Revision A (September 2003) to Revision B Page
• Changed the front page format. ............................................................................................................................................ 1
• Changed DESCRIPTION text From: and tolerance to transients of ±50 V To: and tolerance to transients of ±200 V ........ 1
Changes from Revision B (September 2003) to Revision C Page
• Changed the front page format. ............................................................................................................................................ 1
• Added the SN65HVD251P Package option to the Ordering Information table. ................................................................... 2
• Changed the ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS table values ....................................................... 2
• Changed the THERMAL CHARACTERISTICS table values ................................................................................................ 3
• Changed Junction temperature, TJ- SOIC Package MAX value From 150°C To: 145°C ................................................... 3
Changes from Revision C (September 2005) to Revision D Page
• Added device SN55HVD251 ................................................................................................................................................ 1
• Added the DRJ Package. ..................................................................................................................................................... 1
• Changed the data sheet title From: CAN TRANSCEIVER To: INDUSTRIAL CAN TRANSCEIVER ................................... 1
• Deleted APPLICATIONS bullets: DeviceNet™ Data Buses, Smart Distributed Systems (SDS™), and ISO 11783
Standard Data Bus Interface ................................................................................................................................................ 1
• Deleted last paragraph from the DESCRIPTION - "The HVD251 may be used..." .............................................................. 1
• Added the SN55HVD251DRJ Package to the Ordering Information table. .......................................................................... 2
• Added Electrical fast transient/burst to the Abs Max Ratings table ...................................................................................... 2
• Changed table title From: ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS To: PACKAGE DISSIPATION
RATINGS .............................................................................................................................................................................. 2
• Added the SON (DRJ) option to the PACKAGE DISSIPATION RATINGS table ................................................................. 2
• Added DRJ to the Junction-to-board thermal resistance ...................................................................................................... 3
• Added DRJ to the Junction-to-case thermal resistance ....................................................................................................... 3
• Deleted the condition - over recommended operating conditions (unless otherwise noted). From the
RECOMMENDED OPERATING CONDITIONS table .......................................................................................................... 3
• Added SN55HVD251 to the Operating free-air temperature, TAin the ROC table .............................................................. 3
• Added the SUPPLY CURRENT table ................................................................................................................................... 3
• Deleted ICC - Supply current from the DRIVER ELECTRICAL CHARACTERISTICS ........................................................ 4
• Added T ≥-40°C to VO(D) Test Conditions in the DRIVER ELECTRICAL CHARACTERISTICS ......................................... 4
• Added RNODE = 330 Ωto Differential output voltage (Dominant) (second line of Test Conditions) in the DRIVER
ELECTRICAL table ............................................................................................................................................................... 4
• Added a third line of Test Conditions to Differential output voltage (Dominant) in the DRIVER ELECTRICAL table .......... 4
• Added T ≤85°C to VOD(R) Test Conditions in the DRIVER ELECTRICAL CHARACTERISTICS ......................................... 4
• Added TYP values to the Differential output signal rise and fall times in the DRIVER SWITCHING
CHARACTERISTIC table ...................................................................................................................................................... 4
• Deleted ICC - Supply current from the RECEIVER ELECTRICAL CHARACTERISTICS .................................................... 5
• Added Receiver noise rejection row to the RECEIVER ELECTRICAL CHARACTERISTIC table ....................................... 5
• Changed Figure 3 - Driver VOD, lable RNODE was 330Ω±1% ................................................................................................ 6
16 Submit Documentation Feedback Copyright © 2002–2010, Texas Instruments Incorporated
Product Folder Link(s): SN55HVD251 SN65HVD251
SN55HVD251
SN65HVD251
www.ti.com
SLLS545E –NOVEMBER 2002–REVISED MARCH 2010
• Changed Table 1 header From: MEASURED To: DIFFERENTIAL INPUT ......................................................................... 8
• Added Note B to Figure 13 ................................................................................................................................................. 11
• Added a row ( X Open) to Table 2 - Driver ......................................................................................................................... 11
• Changed Figure 15 title From: tLOOP1-LOOP TIME To: RECESSIVE-TO-DOMINANT LOOP DELAY .................................. 13
• Changed Figure 16 title From: tLOOP2-LOOP TIME To: DOMINANT-TO-RECESSIVE LOOP DELAY .................................. 13
• Changed Figure 18 From: DRIVER LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE To:
DRIVER OUTPUT VOLTAGE vs OUTPUT CURRENT ..................................................................................................... 13
• Changed Figure 19 From: DRIVER HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE To:
DRIVER DRIFFERENTIAL OUTPUT VOLTAGE vs OUTPUT CURRENT ........................................................................ 13
• Changed Figure 22 title From: DIFFERENTIAL OUTPUT FALL TIME To: DIFFERENTIAL OUTPUT TRANSITION
TIME ................................................................................................................................................................................... 13
Changes from Revision D (February 2010) to Revision E Page
• Deleted device number SN65HVD251DR, added the Temperature Range to the ORDERING INFORMATION table ....... 2
Copyright © 2002–2010, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): SN55HVD251 SN65HVD251
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN55HVD251DRJR ACTIVE SON DRJ 8 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN65HVD251D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65HVD251DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65HVD251DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65HVD251DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN65HVD251P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN65HVD251PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN65HVD251 :
•Automotive: SN65HVD251-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 26-Mar-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN55HVD251DRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
SN65HVD251DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Dec-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN55HVD251DRJR SON DRJ 8 1000 210.0 185.0 35.0
SN65HVD251DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Dec-2011
Pack Materials-Page 2
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