SENSITRON
SEMICONDUCTOR
Technical Data Green Products
Data Sheet M2665, Rev. -
221 West Industry Court Deer Park, NY 11729-4681 (631) 586-7600 FAX (631) 242-9798
World Wide Web Site - http://www.sensitron.com E-Mail Address - sales@sensitron.com
MBRF10150CT-G
MBRF10150CT-G SCHOTTKY RECTIFIER
Applications:
Switching power suppl y
Conve rt ers
Free-Wheeling diodes
Reverse battery protection
Features:
150 °C TJ operation
Cent e r tap configuration
Low forwar d voltage drop
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and
moisture resistance
Hig h fr e quenc y ope ration
Guard ring for enhanced ruggedness and long term reliability
Mech anical Dimensions: In Inches / mm
ITO-220AB
SENSITRON
SEMICONDUCTOR
Technical Data Green Products
Data Sheet M2665, Rev. -
221 West Industry Court Deer Park, NY 11729-4681 (631) 586-7600 FAX (631) 242-9798
World Wide Web Site - http://www.sensitron.com E-Mail Address - sales@sensitron.com
MBRF10150CT-G
Maximum Ratings:
Characteristics Symbol Condition Max. Units
Peak Inverse Voltage VRWM - 150 V
Max. Average Forward IF(AV) 50% duty cy cle @TC =145°C,
rectangular wave form 10 A
Max. Peak One Cycle Non-
Repetiti ve Surge Current
(per leg)
IFSM
8.3 ms, half Sine pulse
138
A
Electrical Characteristics:
Characteristics Symbol Condition Max. Units
VF1 @ 5A, Pulse, TJ = 25 °C
@10A, Pulse, TJ = 25 °C 0.93
1.10 V
Max. Forward Voltage Drop
(per leg) * VF2 @ 5A, Pulse, TJ = 125 °C
@10A, Pulse, TJ = 125 °C 0.73
0.86 V
Max. Reverse Current at DC
condition (per leg) IR1 @VR = rated VR
TJ = 25 °C 1 mA
Max. Reverse Current (per
leg) * IR2 @VR = rated VR
TJ = 125 °C 7 mA
Max. Junction Capacitance
(per leg) CT @VR = 5V, TC = 25 °C
fSIG = 1MHz 200 pF
Typica l Series Inductance
(per leg) LS Measured lead to lead 5 mm from
package body 8.0 nH
Max. Voltage Rate of Change dv/dt - 10,000 V/µs
Clip mounting, the epoxy body
away from the heatsink edge by
more than 0.110" along t he lead
direction.
4500
Clip mounting, the epo xy body is
inside the heatsink. 3500
RSM Isolation Vol ta ge
(t = 1.0 second, R. H. < =30%,
TA = 25 °C)
VISO
Screw mounting, the epoxy body
is inside the heatsi nk. 1500
V
* Pulse Width < 300µs, Duty Cycle <2%
Thermal -Mec hanic al Spe cif ica tions:
Characteristics Symbol Condition Specification Units
Max. Junction Temperature TJ - -55 to +150
°C
Max. Storage Temperature Tstg - -55 to +150
°C
Maximum Thermal
Resistan ce Ju n ctio n to Case
(per leg)
RθJC DC operation 4.5 °C/W
Approximate Weight wt - 2 g
Mounting Torque TM - 6(Min.)
12(Max.) Kg-cm
Case Style ITO-220AB
SENSITRON
SEMICONDUCTOR
Technical Data Green Products
Data Sheet M2665, Rev. -
221 West Industry Court Deer Park, NY 11729-4681 (631) 586-7600 FAX (631) 242-9798
World Wide Web Site - http://www.sensitron.com E-Mail Address - sales@sensitron.com
MBRF10150CT-G
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior not ice to improve product
characteristics. Before ordering, purchasers are advised to contact the Sensitron Semiconductor sales department for the latest version
of the datasheet(s).
2- In cases where extremely high reliabilit y is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall Sensitron Semiconductor be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s). Sensitron Semiconductor assumes no responsibility for any intellectual
property claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall Sensit ron Semiconductor be li able for any failure in a semiconductor device or any secondary damage resulting from
use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or Sensitron Semiconductor.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed writ ten permission of
Sensitron Semiconductor.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their appli cation wil l
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations.