SG1846/SG2846/SG3846 Current Mode PWM Controller Description Features The SG1846 family of control ICs provides the required features to implement Fixed Frequency, Current mode control schemes while maintaining a minimum external parts count. The advanced performance of this technique can be measured in improved line regulation, enhanced load response characteristics, and a simpler, easier-to-design control loop. Topological advantages include, inherent pulse-by-pulse current limiting capability, automatic symmetry correction for push-pull converters, and the ability to parallel "power modules" while maintaining equal current sharing. Automatic Feed-forward Compensation Programmable Pulse by Pulse Current Limiting Automatic Symmetry Correction in Push-pull Configuration Enhanced Load Response Characteristics Parallel Operation Capability for Modular Power Systems Differential Current Sense Amplifier with Wide Common-mode Range Double Pulse Suppression 200mA Totem-pole Outputs 1% Bandgap Reference Under-voltage Lockout Soft-start and Shutdown Capability 500kHz Operation Protection circuitry includes built-in under-voltage lockout and programmable current limit in addition to soft start capability. A shutdown function is also available which can initiate either a complete shutdown with automatic restart, or latch the supply off. Other features include fully latched operation, doublepulse suppression, dead-time adjust capability, and a 1% trimmed bandgap reference. High Reliability Features Available To MIL-STD-883 - 883, 1.2.1 Available to DSCC - Standard Microcircuit Drawing (SMD) SGR1846 Rad-Tolerant Version Available Block Diagram 5.1 V REFERENCE REGULATOR VIN VREF SYNC RT OSC CT U.V.LOCKOUT VC Q A OUT T -CURRENT SENSE - +CURRENT SENSE + Q SG1846 Output Stoge + X3 COMP S R - Q B OUT S GND 0.5 V 0.5 mA N.I. + E.A. INV. CURRENT LIMITADJUST SHUTDOWN + - 6K 350 mV - COMP Figure 1 * Block Diagram November 2014 Rev. 1.2 www.microsemi.com (c) 2014 Microsemi Corporation- Analog Mixed Signal Group 1 Current Mode PWM Controller Connection Diagrams and Ordering Information Ambient Temperature -55C to 125C Type Package Part Number SG1846J-883B J 16-PIN CERAMIC DUAL INLINE PACKAGE -25C to 85C N 0C to 70C DW SG2846N PACKAGE SG3846N 0C to 70C PLASTIC SOIC PACKAGE C.L./SOFTSTART VREF CERDIP C.L./SOFTSTART VREF (-) C.S. (+) C.S. SG2846DW FLAT PACK PACKAGE -55C to 125C L 20-PIN CERAMIC LLC 3 PACKAGE SG1846L CLCC 12 11 10 9 GROUND OUTPUT A SYNC RT 7 8 SHUTDOWN +VIN OUTPUT B VC 16 15 14 13 1 2 3 4 1 2 3 4 5 6 7 8 (-) C.S. (+) C.S. (+) ERROR AMP (-) ERROR AMP COMPENSATION CT SG1846L-DESC 5 6 OUTPUT B VC 12 GROUND OUTPUT A 11 SYNC 10 7 RT 8 9 DW Package: RoHS Complaint / Pb-free Transition DC: 0516 DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish FLATPAK SG1846L-883B SHUTDOWN +VIN 5 6 (+) ERROR AMP (-) ERROR AMP C.L./SOFTSTART VREF 3 16 15 14 13 COMPENSATION CT SG3846DW SG1846F-DESC 1 2 3 4 N Package: RoHS Complaint / Pb-free Transition DC: 0503 N Package: RoHS / Pb-free 100% Matte Tin Lead Finish PDIP 16-PIN CERAMIC F (-) C.S. (+) C.S. (+) ERROR AMP (-) ERROR AMP COMPENSATION CT SOWB 4 Connection Diagram SG1846J 16-PIN PLASTIC DIP 16-PIN WIDEBODY -25C to 85C SG1846J-DESC Packaging Type 1. N.C. 2. C.L./SOFTSTART 3. V REF 4. (-) C.S. 5. (+) C.S. 6. N.C. 7. (+) ERROR AMP 8. (-) ERROR AMP 9. COMPENSATION 10. C T 3 2 16 15 14 13 SHUTDOWN +VIN 12 11 10 9 GROUND OUTPUT A SYNC RT OUTPUT B VC 1 20 19 4 18 5 17 6 16 7 8 15 14 9 10 11 12 13 Notes: 1. 2. 3. 4. 5. Contact factory for DESC part availability. All parts are viewed from the top. Consult factory for product availability. The SG2846 & SG3846 is available shipped as tape & reel with the addition of a -TR suffix. Hermetic Packages J, F, & L use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions. Absolute Maximum Ratings Parameter Supply Voltage (+VIN) Collector Supply Voltage(VC) Analog Inputs (Pins 3, 4, 5, 6, and 16) Logic Input Source/Sink Load current (continuous) Source/Sink Load Current (peak, 200 ns) Reference Load Current Soft Start Sink Current Sync Output Current Error Amplifier Output Current Oscillator Charging current (Pin 9) 2 Value 40 40 Units V V -0.3V to +VIN -0.3V to 5.5V 200 500 30 50 5 5 5 V V mA mA mA mA mA mA mA 11. N.C. 12. R T 13. SYNC 14. OUTPUT A 15. GROUND 16. N.C. 17. V C 18. OUTPUT B 19. V IN 20. SHUTDOWN Thermal Data Parameter Operating Junction Temperature Hermetic (J, L, F Packages) Operating Junction Temperature Plastic (N, DW Package) Storage Temperature Range Lead Temperature (Soldering, 10 Seconds) RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.) Values beyond which damage may occur. 1. Pin numbers refer to ceramic J package. 2. Value 150 150 -65 to 150 300 260 (+0, -5) Units C C C C C Value Units 30 80 C/W C/W 40 65 C/W C/W Thermal Data Parameter J Package: Thermal Resistance-Junction to Case, JC Thermal Resistance-Junction to Ambient, JA N Package: Thermal Resistance-Junction to Case, JC Thermal Resistance-Junction to Ambient, JA DW Package: C/W Thermal Resistance-Junction to Case, JC 40 C/W Thermal Resistance-Junction to Ambient, JA 95 F Package: C/W Thermal Resistance-Junction to Case, JC 70 C/W Thermal Resistance-Junction to Ambient, JA 115 L Package: C/W Thermal Resistance-Junction to Case, JC 35 C/W Thermal Resistance-Junction to Ambient, JA 120 Notes: Junction Temperature Calculation: TJ = TA + (PD x JA). 1. The above numbers for JC are maximums for the limiting thermal resistance of the package in a standard mounting 2. configuration. The JA numbers are meant to be guidelines for the thermal performance of the device/PCBoard system. All of the above assume no ambient airflow. Recommended Operating Conditions Parameter Supply Voltage Range Collector Supply Voltage Range Source/Sink Output Current (continuous) Source/Sink Output Current (peak 200ns) Reference Load Current Oscillator Frequency Range Oscillator Timing Resistor (RT) Oscillator Timing Capacitor (CT) Value 8 to 40 4.5 to 40 100 200 0 to 10 1 to 500 2 to 100 1 to 100 Units V V mA mA mA kHz k nF Operating Ambient Temperature Range SG1846 SG2846 55 to 125 25 to 85 C C C SG3846 Note: Range over which the device is functional. 0 to 70 3 Current Mode PWM Controller Electrical Characteristics Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1846 with -55C TA 125C, SG2846 with -25C TA 85C, SG3846 with 0C TA 70C, +VIN = 15V. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature. Symbol Parameter SG1846 SG2846 Test Condition Min Typ SG3846 Units Max Min Typ Max 5.10 5.15 5.00 5.10 5.20 V Reference Section VREF Output Voltage TJ = 25C, IO = 1mA VREG Line Regulation VIN = 8V to 40V 5 20 5 20 mV IREG Load Regulation IL = 1mA to 10mA 3 15 3 15 mV Temperature Stability 1 Total Output Variation Output Noise Voltage Long Term Stability VREFISC 4 1 1 1 0.4 Line, Load and Temperature 5.00 10Hz f 10kHz. TJ = 25C TJ = 125C, 1000Hrs. Short Circuit Output Current Oscillator Section 5.05 mV/C 0.4 5.20 4.95 5.25 V 100 100 V 5 5 mV -10 -45 mA 39 43 47 kHz 1 2 % VREF = 0V -10 -45 39 43 47 2 6 OSC Initial Accuracy TJ = 25C OSCVS Voltage Stability VIN = 8V to 40V 1 OSCTS Temperature Stability Over Operating Range 1 VOH Sync Output High Level VOL Sync Output Low Level VIH Sync Input High Level Pin 8 = 0V VIL Sync Input Low Level Pin 8 = 0V IIL Sync Input Current Sync Voltage = 5.25V, Pin 8 = 0V 1 3.9 4.35 2.3 3.9 2.5 3.9 1 % 4.35 V 2.3 2.5 3.9 V 2.5 1.2 1.5 V 1.2 2.5 V 1.5 mA Electrical Characteristics Symbol Parameter SG1846 SG2846 Test Condition Min SG3846 Units Typ Max Min Typ Max Error AMP Section EAVOS Input Offset Voltage 0.5 5 0.5 10 mV EAIIB Input Bias Current -0.6 -1 -0.6 -2 A EAIOS Input Offset Current 40 250 40 250 nA EACM Common Mode Range VIN-2V V EAAV Open Loop Voltage Gain VO = 1.2V to 3V, VCM = 2V 1 VIN = 8V to 40V VIN2V 0 0 80 105 80 105 dB TJ = 25C 0.7 1.0 0.7 1.0 MHz EAUGB Unity Gain Bandwidth EACMRR CMRR VCM = 0V to 38V, VIN = 40V 75 100 75 100 dB EAPSRR PSRR VIN = 8V to 40V 80 105 80 105 dB EASNK Output Sink Current VID = - 15mV to -5V, VPIN 7 = 1.2V 2 6 2 6 mA EASRC Output Source Current VID = 15mV to 5V, VPIN 7 = 2.5V -0.4 -0.5 -0.4 -0.5 mA EAVOH High Level Output Voltage RL = 15k (Pin 7) 4.3 4.6 4.3 4.6 V EAVOL Low Level Output Voltage RL = 15k (Pin 7) 0.7 1 2.5 2.75 3.0 1.1 1.2 0.7 1 V 2.5 2.75 3.0 V 1.1 1.2 Current Sense Amplifier Section CSAV Amplifier Gain 2 &3 VPIN 3 = 0V, Pin 1 Open 3 Maximum Differential 2 Input Signal (VPIN 4 - VPIN Pin 1 Open RL = 15k (Pin 7) 3) Input Offset Voltage 2 5 VPIN 1 = 0.5V, Pin 7 Open 25 5 V 25 mV CSCMRR CMRR VCM = 1V to 12V 60 83 60 83 dB CSPSRR PSRR VIN = 8V to 40V 60 84 60 84 dB CSIIB Input Bias Current CSIOC Input Offset Current CSCM Input Common Mode Range Delay to Outputs 2 1 2 VPIN 1 = 0.5V, Pin 7 Open -2.5 -10 -2.5 -10 A VPIN 1 = 0.5V, Pin 7 Open 0.08 1 0.08 1 A VIN -3 V VIN 3 0 TJ = 25C 0 200 500 200 500 ns 0.5 0.55 0.45 0.5 0.55 V -10 -30 -10 -30 A Current Limit Adjust Section CLIIB Current Limit Offset 2 Voltage VPIN 3 = 0, VPIN 4 = 0V, Pin 7 Open Input Bias Current VPIN 5 = VREF, VPIN 6 = 0V 0.45 5 Current Mode PWM Controller Symbol Parameter SG1846 SG2846 Test Condition SG3846 Units Min Typ Max Min Typ Max 250 350 400 250 350 400 mV VIN 0 VIN V Shutdown Terminal Section SD Threshold Voltage Input Voltage Range SDLC 0 Minimum Latching 4 Current; (IPIN 1 ) 3.0 Maximum Non-Latching 5 Current; (IPIN 1 ) SDDELAY Delay to Outputs 1 TJ = 25C 1.5 3.0 1.5 mA 1.5 0.8 1.5 0.8 mA 300 600 300 600 ns Output Section Collector Emitter Voltage 40 40 Collector Leakage Current VC = 40V Output Low Level ISINK = 20mA 0.1 0.4 ISINK = 100mA 0.4 2.1 Output High Level Rise Time 1 V 200 200 A 0.1 0.4 V 0.4 2.1 V ISOURCE = 20mA 13 13.5 13 13.5 V ISOURCE = 100mA 12 13.5 12 13.5 V CL = 1nF, TJ = 25C 50 300 50 300 ns CL = 1nF, TJ = 25C 50 300 50 300 ns Start-Up Threshold 7.7 8.0 7.7 8.0 V Threshold Hysteresis 0.75 Fall Time 1 Under-Voltage Lockout Section 0.75 V Total Standby Current IQ Supply Current 17 21 17 21 mA Notes: These parameters, although guaranteed over the recommended operating conditions, are not tested in the production. 1. Parameter measured at trip point of latch with V PIN 5 = VREF , VPIN 6 = 0V. 2. Amplifier gain defined as : VPIN 4 = 0V to 1.0V 3. Current into Pin 1 guaranteed to latch circuit in shutdown state. 4. Current into Pin 1 guaranteed not to latch circuit in shutdown state. 5. RT = 10k, CT = 4.7nF 6. 6 Characteristic Curves Characteristic Curves VREF SHORT CIRCUIT CURRENT - (mA) REFERENCE VOLTAGE - (V) 5.10 5.05 5.00 4.95 4.90 -55 -25 0 25 50 90 80 70 60 50 40 30 O TJ = 125 C O TJ = 55 C 0.5 10 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -55 -25 0 50 25 100 125 75 ERROR AMPLIFIER OUTPUT VOLTAGE - (V) JUNCTION TEMPERATURE - ( C) O JUNCTION TEMPERATURE - ( C) Figure 2 * Reference Voltage Vs. Temperature Figure 3 * VREF Short Circuit Current Vs. Temperature 2.82 2.80 2.78 2.76 2.74 2.72 2.70 1.50 Figure 4 * Current Sense Threshold Vs. Error Amplifier Output OSCILLATOR PEAK VOLTAGE - (V) OSCILLATOR VALLEY VOLTAGE - (V) 2.84 CURRENT SENSE GAIN - (V/V) 1.0 20 O 1.40 1.30 1.20 3.20 3.10 3.00 2.90 1.10 2.68 -55 -25 0 50 25 2.80 100 125 75 -55 JUNCTION TEMPERATURE - (OC) -25 0 50 25 100 125 75 -55 O JUNCTION TEMPERATURE - ( C) Figure 5 * Current Sense Gain Vs. Temperature -25 0 50 25 100 125 75 O JUNCTION TEMPERATURE - ( C) Figure 6 * Oscillator Valley Voltage Vs. Temperature Figure 7 * Oscillator Peak Voltage Vs. Temperature 220 2.6 190 VIN = 15 V (10% ABOVE THRESHOLD) (10% ABOVE THRESHOLD) 2.2 2.0 1.8 1.6 1.4 1.2 200 SHUTDOWN DELAY - (ns) 2.4 CURRENT SENSE DELAY - (ns) LATCH CURRENT THRESHOLD - (mA) 1.5 0 100 125 75 C.S. VOLTAGE DIFFENTIAL - (V) 100 5.15 180 170 160 180 160 140 150 1.0 120 -55 -25 0 25 50 100 125 75 O JUNCTION TEMPERATURE - ( C) Figure 8 * Minimum SCR Latch Current -55 -25 0 25 50 75 100 125 O JUNCTION TEMPERATURE - ( C) Figure 9 * Current Sense Delay Vs. Temperature -55 -25 0 25 50 75 100 125 O JUNCTION TEMPERATURE - ( C) Figure 10 * Shutdown Delay To Output Vs. Temperature 7 Current Mode PWM Controller 1.60 1.50 1.40 1.30 11.0 4.0 SATURATION VOLTAGE - (V) ERROR AMP SINK CURRENT - (mA) INPUT OFFSET VOLTAGE - (mV) 5.0 12.0 10.0 9.0 8.0 7.0 6.0 5.0 3.0 C TJ = -55 C TJ = 25 2.0 TJ = 12 5C 1.0 4.0 0 -55 -55 -25 0 25 50 75 100 125 -25 0 50 25 0 100 125 75 1900 C 25 =1 TJ C 5 5 =C TJ 25 T J= 3.0 2.0 1.0 140 120 = C T 100 00 0. 1 SYNC PULSEWIDTH - (ns) 4.0 F 80 60 40 0 0 100 300 200 1800 1700 1600 =0 CT 1500 F . 01 1400 1300 20 500 400 RT = 8 k RT = 8 k 160 SYNC PULSEWIDTH - (ns) SATURATION VOLTAGE - (V) 2000 180 5.0 500 400 Figure 13 * Output Transistor Saturation Voltage Vs. Output Current (Sink Transistor) Figure 12 * Error AMP Sink Current Vs. Temperature 6.0 300 200 OUTPUT CURRENT - (mA) JUNCTION TEMPERATURE - ( C) O JUNCTION TEMPERATURE - ( C) Figure 11 * Error Amplifier Input Offset Voltage Vs. Temperature 100 O 1200 OUTPUT CURRENT - (mA) -55 -25 0 25 50 75 100 125 -55 JUNCTION TEMPERATURE - (O C) Figure 14 * Output Transistor Saturation Voltage Vs. Output Current (Source Transistor) 25 50 75 100 125 Figure 16 * Sync Pulsewidth Vs. Temperature RT = 8 k 2.85 26.5 26.0 C = 0.01F T 25.5 46 C = 0.001F RT = 8 k T 45 DUTY CYCLE - (%) OSCILLATOR FREQUENCY - (kHz) OSCILLATOR FREQUENCY - (kHz) 0 JUNCTION TEMPERATURE - ( C) Figure 15 * Sync Pulsewidth Vs. Temperature RT = 8 k 2.75 C = 0.1F T 44 43 42 41 40 39 2.65 25.0 38 -55 -25 0 25 50 75 100 125 O JUNCTION TEMPERATURE - ( C) Figure 17 * Oscillator Frequency Vs. Temperature 8 -25 -55 -25 0 25 50 75 100 125 O JUNCTION TEMPERATURE - ( C) -55 -25 0 25 50 75 100 O JUNCTION TEMPERATURE - ( C) Figure 18 * Oscillator Frequency Vs. Temperature Figure 19 * Duty Cycle Vs. Temperature 125 Application Information Application Information 100k .1 F nF C T = C T = 20 50 nF nF C T = C T = 5 10 nF nF C T = C T = C T = 20k R () T 2 1 nF 50k 10k 5k 2k 1k 100sec 10sec 1000sec OSCILLATOR PERIOD (s) Figure 20 * Oscillator Frequency Curves 5V 3V 1.2 V IR IR 3.7 V SAWTOOTH(Pin 8) C T R T OSC(Pin 10) Id OUTPUT DEADTIME(T ) D Oscillator frequency is approximated by the formula: f ~ T 2.2 R C T T Figure 21 * Oscillator Circuit 9 Current Mode PWM Controller VREF VREF 0.5 mA 5 + 6 Zs - 7 COMP Zf If < 0.5 mA Figure 22 * Error Amp Output Configuration (Error amplifier can source up to 0.5 mA) IS R RS 3 + CURRENT SENSE C 4 - Figure 23 * Current Sense AMP Connections A small RC filter may be required in some applications to reduce switch transients. Differential input allows remote noise free switching. 10 Application Information 15 +VIN SG1846 10 9 8 VC SYNC RT OSC A OUT NOR F/F 13 VIN 11 CT VOUT PWM LATCH VREF 2 REF B OUT NOR 14 0.5 mA 7 - 0.5 V INV 6 5 + - COMP COMP + + SENSE + EA NI I/A - SENSE SH/DN I LIMIT 1 FEEDBACK 4 3 16 S/D SFT/ST 350 mV GND 12 Figure 24 * Single Ended Boost Configuration 15 +VIN SG1846 10 9 8 2 VC SYNC RT OSC A OUT NOR F/F 13 VIN 11 CT VREF PWM LATCH REF B OUT NOR 14 0.5 mA 7 6 5 COMP + 0.5 V INV VOUT COMP + NI EA + I/A + SENSE - SENSE SH/DN FEEDBACK 1 I LIMIT SFT/ST 4 3 16 S/D GND 12 350 mV Figure 25 * Buck Converter with Current Sense Winding 11 Current Mode PWM Controller 15 +VIN SG1846 10 9 8 VC SYNC RT OSC A OUT NOR F/F 13 11 CT VREF 2 PWM LATCH VREF REF B OUT NOR 14 0.5 mA 7 6 5 COMP + - - 0.5 V INV COMP + + EA NI I/A + SENSE - SENSE SH/DN FEEDBACK 1 I LIMIT S/D 350 mV GND 12 SFT/ST Figure 26 * Push/Pull Converter with Slope Compensation IS (+) 4 RS x3 + - (-) 3 ISENSE VREF 0.5 V 0.5 mA R1 E/A CURRENT LIMIT 1 R2 COMP 7 COMP R2VREF Peak Current (IS) is determined by the formula: IS = R1+R2 -0.5 3RS Figure 27 * Pulse by Pulse Current Limiting 12 4 3 16 Application Information VREF ISENSE R1 + - CURRENT LIMIT 1 R2 + - S S 0.5 ISS E/A C VREF 16 SHUT DOWN + - + - 350 mV Figure 28 * Soft Start and Shutdown/Restart Functions ~ CURRENT LIMIT (PIN 1) ~ 0.5 V 0 ON SHUTDOWN (PIN 16) ~ OFF ~ PWM VREF < 0.8 mA R1 Figure 29 * Shutdown with Auto-Restart If < 0.8 mA, the shutdown latch commutates. when ISS < 0.8 mA, a restart cycle will be initiated. ~ ~ ~ ~ V REF > 3 mA (LATCHED OFF) R1 Figure 30 * Shutdown without Auto-Restart (Latched) If > 3 mA, the device will latch off until power is recycled. 13 Current Mode PWM Controller Package Outline Dimensions Controlling dimensions are in inches, metric equivalents are shown for general information. Dim D 16 9 H E 8 1 e L A2 A c INCHES MIN MAX A 2.06 2.65 0.081 0.104 A1 0.10 0.30 0.004 0.012 A2 2.03 2.55 0.080 0.100 B 0.25 0.51 0.010 0.020 c 0.23 0.32 0.009 0.013 D - 10.67 - 0.420 E 7.40 7.75 0.291 0.305 e B MILLIMETERS MIN MAX 1.27 BSC H 10.00 10.65 0.05 BSC 0.394 0.419 L 0.40 1.27 0.016 0.050 0 8 *LC - 0.10 0 - 8 0.004 *Lead co planarity SEATING PLANE A1 Note: Dimensions do not include protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 31 * DW 16-Pin SOWB Package Dimensions Dim D 1 b1 E A - 5.33 - 0.210 0.38 - 0.015 - A c A1 L e SEATING PLANE b 3.30 Typ. 0.130 Typ. b 0.36 0.56 0.014 0.022 b1 1.14 1.78 0.045 0.070 c 0.20 0.36 0.008 0.014 D 18.67 19.69 0.735 0.775 e A2 INCHES MIN MAX A1 A2 E1 MILLIMETERS MIN MAX 2.54 BSC E 7.62 E1 L 0.100 BSC 8.26 0.300 0.325 6.10 7.11 0.240 0.280 2.92 0.381 0.115 0.150 - 15 - 15 Note: Dimensions do not include protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 32 * N 16-Pin Plastic Dual Inline Package Dimensions 14 PACKAGE OUTLINE DIMENSIONS PACKAGE OUTLINE DIMENSIONS Dim D 16 9 1 8 E eA b2 Seating Plane L c H b e INCHES MIN MAX 0.015 0.045 0.200 0.020 0.065 0.008 0.760 0.220 0.015 0.785 0.280 A b b2 0.38 1.04 5.08 0.51 1.65 c D E 0.20 19.30 5.59 0.38 19.94 7.11 e Q A MILLIMETERS MIN MAX 2.54 BSC 0.100 BSC eA H 7.37 0.63 7.87 1.78 0.290 0.025 0.310 0.070 L Q 3.18 0.51 5.08 15 1.02 0.125 0.020 0.200 15 0.040 Note: Dimensions do not include protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 33 * J 16-Pin Ceramic Dual Inline Package Dimensions E3 D E A A1 L2 L 8 3 1 Dim MILLIMETERS MIN MAX INCHES MIN MAX D/E E3 e 8.64 9.14 8.128 1.270 BSC 0.340 0.360 0.320 0.050 BSC B1 L A 0.635 TYP 1.02 1.52 1.626 2.286 0.025 TYP 0.040 0.060 0.064 0.090 h A1 A2 1.016 TYP 1.372 1.68 1.168 0.040 TYP 0.054 0.066 0.046 L2 B3 1.91 2.41 0.203R 0.075 0.95 0.008R Note: 13 All exposed metalized area shall be gold plated 60 micro-inch minimum thickness over nickel plated unless otherwise specified in purchase order. h A2 18 B1 e B3 Figure 34 * L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Outline Dimensions 15 Current Mode PWM Controller PACKAGE OUTLINE DIMENSIONS Controlling dimensions are in inches, metric equivalents are shown for general information. Dim L B 69 85 7 4 8 3 9 2 10 1 D e 16 1 E S1 S1 E1 L L A Q A b c D E E1 e L Q C MILLIMETERS MIN MAX INCHES MIN MAX 1.65 1.91 0.38 0.48 0.102 0.152 11.18 6.22 6.74 7.62 1.27 BSC 6.35 9.40 0.51 1.02 0.20 0.057 0.067 0.010 0.019 0.004 0.006 0.290 0.238 0.252 0.272 0.050 BSC 0.250 0.370 0.020 0.040 0.008 Note: 1. Lead No. 1 is identified by tab on lead or dot on cover. 2. Leads are within 0.13mm (.0005") radius of the true position (TP) at maximum material condition. 3. Dimension "e" determines a zone within which all body and lead irregularities lie. Figure 35 * F 16-Pin Ceramic Flatpack Package Dimensions 16 Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 E-mail: sales.support@microsemi.com (c) 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. SG1846.1.2/11.14