Features * High Performance, Low Power AVR(R) 8-Bit Microcontroller * Advanced RISC Architecture * * * * * * * * - 120 Powerful Instructions - Most Single Clock Cycle Execution - 32 x 8 General Purpose Working Registers - Fully Static Operation - Up to 20 MIPS Througput at 20 MHz High Endurance Non-volatile Memory segments - 1K Bytes of In-System Self-programmable Flash program memory - 64 Bytes EEPROM - 64 Bytes Internal SRAM - Write/Erase Cycles: 10,000 Flash/100,000 EEPROM - Data retention: 20 Years at 85C/100 Years at 25C (see page 6) - Programming Lock for Self-Programming Flash & EEPROM Data Security Peripheral Features - One 8-bit Timer/Counter with Prescaler and Two PWM Channels - 4-channel, 10-bit ADC with Internal Voltage Reference - Programmable Watchdog Timer with Separate On-chip Oscillator - On-chip Analog Comparator Special Microcontroller Features - debugWIRE On-chip Debug System - In-System Programmable via SPI Port - External and Internal Interrupt Sources - Low Power Idle, ADC Noise Reduction, and Power-down Modes - Enhanced Power-on Reset Circuit - Programmable Brown-out Detection Circuit with Software Disable Function - Internal Calibrated Oscillator I/O and Packages - 8-pin PDIP/SOIC: Six Programmable I/O Lines - 10-pad MLF: Six Programmable I/O Lines - 20-pad MLF: Six Programmable I/O Lines Operating Voltage: - 1.8 - 5.5V Speed Grade: - 0 - 4 MHz @ 1.8 - 5.5V - 0 - 10 MHz @ 2.7 - 5.5V - 0 - 20 MHz @ 4.5 - 5.5V Industrial Temperature Range Low Power Consumption - Active Mode: * 190 A at 1.8 V and 1 MHz - Idle Mode: * 24 A at 1.8 V and 1 MHz 8-bit Microcontroller with 1K Bytes In-System Programmable Flash ATtiny13A Rev. 8126F-AVR-05/12 1. Pin Configurations Figure 1-1. Pinout of ATtiny13A 8-PDIP/SOIC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 (PCINT4/ADC2) PB4 GND 1 2 3 4 8 7 6 5 VCC PB2 (SCK/ADC1/T0/PCINT2) PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) 15 14 13 12 11 6 7 8 9 10 1 2 3 4 5 VCC PB2 (SCK/ADC1/T0/PCINT2) DNC PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) DNC DNC GND DNC DNC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 DNC DNC (PCINT4/ADC2) PB4 20 19 18 17 16 DNC DNC DNC DNC DNC 20-QFN/MLF NOTE: Bottom pad should be soldered to ground. DNC: Do Not Connect 10-QFN/MLF (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 DNC (PCINT4/ADC2) PB4 GND 1 2 3 4 5 10 9 8 7 6 VCC PB2 (SCK/ADC1/T0/PCINT2) DNC PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) NOTE: Bottom pad should be soldered to ground. DNC: Do Not Connect 2 ATtiny13A 8126F-AVR-05/12 ATtiny13A 1.1 1.1.1 Pin Description VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB5:PB0) Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny13A as listed on page 55. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 18-4 on page 120. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 3 8126F-AVR-05/12 2. Overview The ATtiny13A is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny13A achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram 8-BIT DATABUS STACK POINTER SRAM VCC PROGRAM COUNTER GND PROGRAM FLASH WATCHDOG OSCILLATOR CALIBRATED INTERNAL OSCILLATOR WATCHDOG TIMER TIMING AND CONTROL MCU CONTROL REGISTER MCU STATUS REGISTER TIMER/ COUNTER0 INSTRUCTION REGISTER INSTRUCTION DECODER CONTROL LINES GENERAL PURPOSE REGISTERS INTERRUPT UNIT X Y Z PROGRAMMING LOGIC ALU DATA EEPROM STATUS REGISTER ADC / ANALOG COMPARATOR DATA REGISTER PORT B DATA DIR. REG.PORT B PORT B DRIVERS RESET CLKI PB[0:5] 4 ATtiny13A 8126F-AVR-05/12 ATtiny13A The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATtiny13A provides the following features: 1K byte of In-System Programmable Flash, 64 bytes EEPROM, 64 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working registers, one 8-bit Timer/Counter with compare modes, Internal and External Interrupts, a 4channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The Power-down mode saves the register contents, disabling all chip functions until the next Interrupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules except ADC, to minimize switching noise during ADC conversions. The device is manufactured using Atmel's high density non-volatile memory technology. The On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code running on the AVR core. The ATtiny13A AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, and Evaluation kits. 5 8126F-AVR-05/12 3. About 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. 3.3 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85C or 100 years at 25C. 6 ATtiny13A 8126F-AVR-05/12 ATtiny13A 4. CPU Core This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 4.1 Architectural Overview Figure 4-1. Block Diagram of the AVR Architecture Data Bus 8-bit Flash Program Memory Program Counter Status and Control 32 x 8 General Purpose Registrers Control Lines Direct Addressing Instruction Decoder Indirect Addressing Instruction Register Interrupt Unit Watchdog Timer ALU Analog Comparator I/O Module1 Data SRAM I/O Module 2 I/O Module n EEPROM I/O Lines In order to maximize performance and parallelism, the AVR uses a Harvard architecture - with separate memories and buses for program and data. Instructions in the Program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the Program memory. This concept enables instructions to be executed in every clock cycle. The Program memory is In-System Reprogrammable Flash memory. 7 8126F-AVR-05/12 The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File - in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing - enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format. Every Program memory address contains a 16- or 32-bit instruction. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. 4.2 ALU - Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories - arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the "Instruction Set" section for a detailed description. 4.3 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 8 ATtiny13A 8126F-AVR-05/12 ATtiny13A 4.3.1 SREG - Status Register Bit 7 6 5 4 3 2 1 0 0x3F I T H S V N Z C Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 SREG * Bit 7 - I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference. * Bit 6 - T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. * Bit 5 - H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See the "Instruction Set Description" for detailed information. * Bit 4 - S: Sign Bit, S = N V The S-bit is always an exclusive or between the Negative Flag N and the Two's Complement Overflow Flag V. See the "Instruction Set Description" for detailed information. * Bit 3 - V: Two's Complement Overflow Flag The Two's Complement Overflow Flag V supports two's complement arithmetics. See the "Instruction Set Description" for detailed information. * Bit 2 - N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the "Instruction Set Description" for detailed information. * Bit 1 - Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the "Instruction Set Description" for detailed information. * Bit 0 - C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the "Instruction Set Description" for detailed information. 9 8126F-AVR-05/12 4.4 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: * One 8-bit output operand and one 8-bit result input * Two 8-bit output operands and one 8-bit result input * Two 8-bit output operands and one 16-bit result input * One 16-bit output operand and one 16-bit result input Figure 4-2 shows the structure of the 32 general purpose working registers in the CPU. Figure 4-2. AVR CPU General Purpose Working Registers 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 ... R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 ... R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 4-2 on page 10, each register is also assigned a Data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 4.4.1 10 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 4-3 on page 11. ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 4-3. The X-, Y-, and Z-registers 15 X-register XH XL 7 0 R27 (0x1B) YH YL 7 0 R29 (0x1D) Z-register 0 R26 (0x1A) 15 Y-register 0 7 0 7 0 R28 (0x1C) 15 ZH 7 0 ZL 7 R31 (0x1F) 0 0 R30 (0x1E) In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 4.5 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM is automaticall defined to the last address in SRAM during power on reset. The Stack Pointer must be set to point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 4.5.1 SPL - Stack Pointer Low Bit 7 6 5 4 3 2 1 0 0x3D SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 1 0 0 1 1 1 1 1 SPL 11 8126F-AVR-05/12 4.6 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 4-4 on page 12 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 4-4. The Parallel Instruction Fetches and Instruction Executions T1 T2 T3 T4 clkCPU 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch Figure 4-5 on page 12 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 4-5. Single Cycle ALU Operation T1 T2 T3 T4 clkCPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back 4.7 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the Program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. The lowest addresses in the Program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in "Interrupts" on page 45. The list also determines the priority levels of the different interrupts. The lower the address the higher is the 12 ATtiny13A 8126F-AVR-05/12 ATtiny13A priority level. RESET has the highest priority, and next is INT0 - the External Interrupt Request 0. When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction - RETI - is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence. Assembly Code Example in r16, SREG cli ; store SREG value ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ __disable_interrupt(); EECR |= (1<>EEPM0) /* Set up address and data registers */ EEARL = ucAddress; EEDR = ucData; /* Write logical one to EEMPE */ EECR |= (1< ... ; Set Stack Pointer to top of RAM ; Enable interrupts xxx ... ... 45 8126F-AVR-05/12 9.2 External Interrupts The External Interrupts are triggered by the INT0 pin or any of the PCINT[5:0] pins. Observe that, if enabled, the interrupts will trigger even if the INT0 or PCINT[5:0] pins are configured as outputs. This feature provides a way of generating a software interrupt. Pin change interrupts PCI will trigger if any enabled PCINT[5:0] pin toggles. The PCMSK Register control which pins contribute to the pin change interrupts. Pin change interrupts on PCINT[5:0] are detected asynchronously. This implies that these interrupts can be used for waking the part also from sleep modes other than Idle mode. The INT0 interrupts can be triggered by a falling or rising edge or a low level. This is set up as indicated in the specification for the MCU Control Register - MCUCR. When the INT0 interrupt is enabled and is configured as level triggered, the interrupt will trigger as long as the pin is held low. Note that recognition of falling or rising edge interrupts on INT0 requires the presence of an I/O clock, described in "Clock Systems and their Distribution" on page 23. 9.2.1 Low Level Interrupt A low level interrupt on INT0 is detected asynchronously. This implies that this interrupt can be used for waking the part also from sleep modes other than Idle mode. The I/O clock is halted in all sleep modes except Idle mode. Note that if a level triggered interrupt is used for wake-up from Power-down, the required level must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If the level disappears before the end of the Start-up Time, the MCU will still wake up, but no interrupt will be generated. The start-up time is defined by the SUT and CKSEL fuses as described in "System Clock and Clock Options" on page 23. If the low level on the interrupt pin is removed before the device has woken up then program execution will not be diverted to the interrupt service routine but continue from the instruction following the SLEEP command. 9.2.2 Pin Change Interrupt Timing An example of timing of a pin change interrupt is shown in Figure 9-1 below. Figure 9-1. Timing of pin change interrupts pin_lat PCINT(0) LE clk D pcint_in_(0) Q 0 pcint_syn pcint_setflag PCIF pin_sync x PCINT(0) in PCMSK(x) clk clk PCINT(n) pin_lat pin_sync pcint_in_(n) pcint_syn pcint_setflag PCIF 46 ATtiny13A 8126F-AVR-05/12 ATtiny13A 9.3 9.3.1 Register Description MCUCR - MCU Control Register The External Interrupt Control Register A contains control bits for interrupt sense control. Bit 7 6 5 4 3 2 1 0 0x35 - PUD SE SM1 SM0 - ISC01 ISC00 Read/Write R R/W R/W R/W R/W R R/W R/W Initial Value 0 0 0 0 0 0 0 0 MCUCR * Bits 1:0 - ISC0[1:0]: Interrupt Sense Control 0 Bit 1 and Bit 0 The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT0 pin that activate the interrupt are defined in Table 9-2 on page 47. The value on the INT0 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt. Table 9-2. 9.3.2 Interrupt 0 Sense Control ISC01 ISC00 Description 0 0 The low level of INT0 generates an interrupt request. 0 1 Any logical change on INT0 generates an interrupt request. 1 0 The falling edge of INT0 generates an interrupt request. 1 1 The rising edge of INT0 generates an interrupt request. GIMSK - General Interrupt Mask Register Bit 7 6 5 4 3 2 1 0 0x3B - INT0 PCIE - - - - - Read/Write R R/W R/W R R R R R Initial Value 0 0 0 0 0 0 0 0 GIMSK * Bits 7, 4:0 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and will always read as zero. * Bit 6 - INT0: External Interrupt Request 0 Enable When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control0 bits 1/0 (ISC01 and ISC00) in the MCU Control Register (MCUCR) define whether the external interrupt is activated on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt Request 0 is executed from the INT0 Interrupt Vector. * Bit 5 - PCIE: Pin Change Interrupt Enable When the PCIE bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt is enabled. Any change on any enabled PCINT[5:0] pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI Interrupt Vector. PCINT[5:0] pins are enabled individually by the PCMSK Register. 47 8126F-AVR-05/12 9.3.3 GIFR - General Interrupt Flag Register Bit 7 6 5 4 3 2 1 0x3A - INTF0 PCIF - - - - 0 - Read/Write R R/W R/W R R R R R Initial Value 0 0 0 0 0 0 0 0 GIFR * Bits 7, 4:0 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and will always read as zero. * Bit 6 - INTF0: External Interrupt Flag 0 When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set (one). If the I-bit in SREG and the INT0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared when INT0 is configured as a level interrupt. * Bit 5 - PCIF: Pin Change Interrupt Flag When a logic change on any PCINT[5:0] pin triggers an interrupt request, PCIF becomes set (one). If the I-bit in SREG and the PCIE bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. 9.3.4 PCMSK - Pin Change Mask Register Bit 7 6 5 4 3 2 1 0 0x15 - - PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 Read/Write R R R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PCMSK * Bits 7:6 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and will always read as zero. * Bits 5:0 - PCINT[5:0]: Pin Change Enable Mask 5:0 Each PCINT[5:0] bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT[5:0] is set and the PCIE bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT[5:0] is cleared, pin change interrupt on the corresponding I/O pin is disabled. 48 ATtiny13A 8126F-AVR-05/12 ATtiny13A 10. I/O Ports 10.1 Overview All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports. This means that the direction of one port pin can be changed without unintentionally changing the direction of any other pin with the SBI and CBI instructions. The same applies when changing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as input). Each output buffer has symmetrical drive characteristics with both high sink and source capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection diodes to both VCC and Ground as indicated in Figure 10-1. Refer to "Electrical Characteristics" on page 117 for a complete list of parameters. Figure 10-1. I/O Pin Equivalent Schematic Rpu Logic Pxn Cpin See Figure "General Digital I/O" for Details All registers and bit references in this section are written in general form. A lower case "x" represents the numbering letter for the port, and a lower case "n" represents the bit number. However, when using the register or bit defines in a program, the precise form must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers and bit locations are listed in "Register Description" on page 57. Three I/O memory address locations are allocated for each port, one each for the Data Register - PORTx, Data Direction Register - DDRx, and the Port Input Pins - PINx. The Port Input Pins I/O location is read only, while the Data Register and the Data Direction Register are read/write. However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding bit in the Data Register. In addition, the Pull-up Disable - PUD bit in MCUCR disables the pull-up function for all pins in all ports when set. Using the I/O port as General Digital I/O is described in "Ports as General Digital I/O" on page 50. Most port pins are multiplexed with alternate functions for the peripheral features on the device. How each alternate function interferes with the port pin is described in "Alternate Port Functions" on page 54. Refer to the individual module sections for a full description of the alternate functions. 49 8126F-AVR-05/12 Note that enabling the alternate function of some of the port pins does not affect the use of the other pins in the port as general digital I/O. 10.2 Ports as General Digital I/O The ports are bi-directional I/O ports with optional internal pull-ups. Figure 10-2 on page 50 shows a functional description of one I/O-port pin, here generically called Pxn. Figure 10-2. General Digital I/O(1) PUD Q D DDxn Q CLR WDx RESET DATA BUS RDx 1 Q Pxn D 0 PORTxn Q CLR RESET WRx WPx RRx SLEEP SYNCHRONIZER D Q L Q D RPx Q PINxn Q clk I/O PUD: SLEEP: clkI/O: Note: 10.2.1 PULLUP DISABLE SLEEP CONTROL I/O CLOCK WDx: RDx: WRx: RRx: RPx: WPx: WRITE DDRx READ DDRx WRITE PORTx READ PORTx REGISTER READ PORTx PIN WRITE PINx REGISTER 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in "Register Description" on page 57, the DDxn bits are accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address. The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input pin. 50 ATtiny13A 8126F-AVR-05/12 ATtiny13A If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to be configured as an output pin. The port pins are tri-stated when reset condition becomes active, even if no clocks are running. If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port pin is driven low (zero). 10.2.2 Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port. 10.2.3 Switching Between Input and Output When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn} = 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully acceptable, as a high-impedant environment will not notice the difference between a strong high driver and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all pull-ups in all ports. Switching between input with pull-up and output low generates the same problem. The user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn} = 0b10) as an intermediate step. Table 10-1 summarizes the control signals for the pin value. Table 10-1. 10.2.4 Port Pin Configurations DDxn PORTxn PUD (in MCUCR) I/O Pull-up 0 0 X Input No Tri-state (Hi-Z) 0 1 0 Input Yes Pxn will source current if ext. pulled low. 0 1 1 Input No Tri-state (Hi-Z) 1 0 X Output No Output Low (Sink) 1 1 X Output No Output High (Source) Comment Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the PINxn Register bit. As shown in Figure 10-2 on page 50, the PINxn Register bit and the preceding latch constitute a synchronizer. This is needed to avoid metastability if the physical pin changes value near the edge of the internal clock, but it also introduces a delay. Figure 10-3 on page 52 shows a timing diagram of the synchronization when reading an externally applied pin value. The maximum and minimum propagation delays are denoted t pd,max and t pd,min respectively. 51 8126F-AVR-05/12 Figure 10-3. Synchronization when Reading an Externally Applied Pin value SYSTEM CLK INSTRUCTIONS XXX XXX in r17, PINx SYNC LATCH PINxn r17 0x00 0xFF t pd, max t pd, min Consider the clock period starting shortly after the first falling edge of the system clock. The latch is closed when the clock is low, and goes transparent when the clock is high, as indicated by the shaded region of the "SYNC LATCH" signal. The signal value is latched when the system clock goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed between 1/2 and 11/2 system clock period depending upon the time of assertion. When reading back a software assigned pin value, a nop instruction must be inserted as indicated in Figure 10-4 on page 52. The out instruction sets the "SYNC LATCH" signal at the positive edge of the clock. In this case, the delay tpd through the synchronizer is one system clock period. Figure 10-4. Synchronization when Reading a Software Assigned Pin Value SYSTEM CLK r16 INSTRUCTIONS 0xFF out PORTx, r16 nop in r17, PINx SYNC LATCH PINxn r17 0x00 0xFF t pd 52 ATtiny13A 8126F-AVR-05/12 ATtiny13A The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and define the port pins from 4 to 5 as input with a pull-up assigned to port pin 4. The resulting pin values are read back again, but as previously discussed, a nop instruction is included to be able to read back the value recently assigned to some of the pins. Assembly Code Example(1) ... ; Define pull-ups and set outputs high ; Define directions for port pins ldi r16,(1< CSn[2:0] > 1). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the Prescaler Reset for synchronizing the Timer/Counter to program execution. 12.3 External Clock Source An external clock source applied to the T0 pin can be used as Timer/Counter clock (clkT0). The T0 pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 12-1 on page 77 shows a functional equivalent block diagram of the T0 synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clk T 0 pulse for each positive (CSn[2:0] = 7) or negative (CSn[2:0] = 6) edge it detects. Figure 12-1. T0 Pin Sampling Tn D Q D Q D Tn_sync (To Clock Select Logic) Q LE clk I/O Synchronization Edge Detector The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the T0 pin to the counter is updated. Enabling and disabling of the clock input must be done when T0 has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses 77 8126F-AVR-05/12 sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 12-2. Prescaler for Timer/Counter0 clk I/O Clear PSR10 T0 Synchronization clkT0 Note: 12.4 12.4.1 1. The synchronization logic on the input pins (T0) is shown in Figure 12-1 on page 77. Register Description. GTCCR - General Timer/Counter Control Register Bit 7 6 5 4 3 2 1 0 0x28 TSM - - - - - - PSR10 Read/Write R/W R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0 GTCCR * Bit 7 - TSM: Timer/Counter Synchronization Mode Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the value that is written to the PSR10 bit is kept, hence keeping the Prescaler Reset signal asserted. This ensures that the Timer/Counter is halted and can be configured without the risk of advancing during configuration. When the TSM bit is written to zero, the PSR10 bit is cleared by hardware, and the Timer/Counter start counting. * Bit 0 - PSR10: Prescaler Reset Timer/Counter0 When this bit is one, the Timer/Counter0 prescaler will be Reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. 78 ATtiny13A 8126F-AVR-05/12 ATtiny13A 13. Analog Comparator The Analog Comparator compares the input values on the positive pin AIN0 and negative pin AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pin AIN1, the Analog Comparator output, ACO, is set. The comparator can trigger a separate interrupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on comparator output rise, fall or toggle. A block diagram of the comparator and its surrounding logic is shown in Figure 13-1 on page 79. Figure 13-1. Analog Comparator Block Diagram BANDGAP REFERENCE ACBG ACME ADEN ADC MULTIPLEXER OUTPUT (1) See Figure 1-1 on page 2, Table 10-5 on page 57, and Table 13-2 on page 81 for Analog Comparator pin placement. 13.1 Analog Comparator Multiplexed Input It is possible to select any of the ADC[3:0] pins to replace the negative input to the Analog Comparator. The ADC multiplexer is used to select this input, and consequently, the ADC must be switched off to utilize this feature. If the Analog Comparator Multiplexer Enable bit (ACME in ADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is zero), MUX[1:0] in ADMUX select the input pin to replace the negative input to the Analog Comparator, as shown in Table 13-1. If ACME is cleared or ADEN is set, AIN1 is applied to the negative input to the Analog Comparator. Table 13-1. Analog Comparator Multiplexed Input ACME ADEN MUX[1:0] Analog Comparator Negative Input 0 x xx AIN1 1 1 xx AIN1 1 0 00 ADC0 1 0 01 ADC1 1 0 10 ADC2 1 0 11 ADC3 79 8126F-AVR-05/12 13.2 13.2.1 Register Description ADCSRB - ADC Control and Status Register Bit 7 6 5 4 3 2 1 0 0x03 - ACME - - - ADTS2 ADTS1 ADTS0 Read/Write R R/W R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADCSRB * Bit 6 - ACME: Analog Comparator Multiplexer Enable When this bit is written logic one and the ADC is switched off (ADEN in ADCSRA is zero), the ADC multiplexer selects the negative input to the Analog Comparator. When this bit is written logic zero, AIN1 is applied to the negative input of the Analog Comparator. For a detailed description of this bit, see "Analog Comparator Multiplexed Input" on page 79. 13.2.2 ACSR- Analog Comparator Control and Status Register Bit 7 6 5 4 3 2 1 0 0x08 ACD ACBG ACO ACI ACIE - ACIS1 ACIS0 Read/Write R/W R/W R R/W R/W R R/W R/W Initial Value 0 0 N/A 0 0 0 0 0 ACSR * Bit 7 - ACD: Analog Comparator Disable When this bit is written logic one, the power to the Analog Comparator is switched off. This bit can be set at any time to turn off the Analog Comparator. This will reduce power consumption in Active and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must be disabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit is changed. * Bit 6 - ACBG: Analog Comparator Bandgap Select When this bit is set, a fixed bandgap reference voltage replaces the positive input to the Analog Comparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog Comparator. When the bandgap reference is used as input to the Analog Comparator, it will take certain time for the voltage to stabilize. If not stabilized, the first value may give a wrong value. * Bit 5 - ACO: Analog Comparator Output The output of the Analog Comparator is synchronized and then directly connected to ACO. The synchronization introduces a delay of 1 - 2 clock cycles. * Bit 4 - ACI: Analog Comparator Interrupt Flag This bit is set by hardware when a comparator output event triggers the interrupt mode defined by ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is set and the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag. * Bit 3 - ACIE: Analog Comparator Interrupt Enable When the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Comparator interrupt is activated. When written logic zero, the interrupt is disabled. * Bit 2 - Res: Reserved Bit This bit is a reserved bit in the ATtiny13A and will always read as zero. 80 ATtiny13A 8126F-AVR-05/12 ATtiny13A * Bits 1:0 - ACIS[1:0]: Analog Comparator Interrupt Mode Select These bits determine which comparator events that trigger the Analog Comparator interrupt. The different settings are shown in Table 13-2 on page 81. Table 13-2. ACIS1/ACIS0 Settings ACIS1 ACIS0 Interrupt Mode 0 0 Comparator Interrupt on Output Toggle. 0 1 Reserved 1 0 Comparator Interrupt on Falling Output Edge. 1 1 Comparator Interrupt on Rising Output Edge. When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled by clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when the bits are changed. 13.2.3 DIDR0 - Digital Input Disable Register 0 Bit 7 6 5 4 3 2 1 0 0x14 - - ADC0D ADC2D ADC3D ADC1D AIN1D AIN0D Read/Write R R R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DIDR0 * Bits 1:0 - AIN1D, AIN0D: AIN[1:0] Digital Input Disable When this bit is written logic one, the digital input buffer on the AIN1/0 pin is disabled. The corresponding PIN Register bit will always read as zero when this bit is set. When an analog signal is applied to the AIN1/0 pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. 81 8126F-AVR-05/12 14. Analog to Digital Converter 14.1 Features * * * * * * * * * * * * * 14.2 10-bit Resolution 0.5 LSB Integral Non-linearity 2 LSB Absolute Accuracy 13 - 260 s Conversion Time Up to 15 kSPS at Maximum Resolution Four Multiplexed Single Ended Input Channels Optional Left Adjustment for ADC Result Readout 0 - VCC ADC Input Voltage Range Selectable 1.1V ADC Reference Voltage Free Running or Single Conversion Mode ADC Start Conversion by Auto Triggering on Interrupt Sources Interrupt on ADC Conversion Complete Sleep Mode Noise Canceler Overview The ATtiny13A features a 10-bit successive approximation ADC. A block diagram of the ADC is shown in Figure 14-1. Figure 14-1. Analog to Digital Converter Block Schematic ADC CONVERSION COMPLETE IRQ INTERRUPT FLAGS ADTS[2:0] 15 TRIGGER SELECT ADC[9:0] ADPS0 ADPS1 ADPS2 ADIF ADATE ADEN 0 ADC DATA REGISTER (ADCH/ADCL) ADC CTRL. & STATUS REGISTER (ADCSRA) ADSC MUX0 MUX1 ADLAR REFS1 ADC MULTIPLEXER SELECT (ADMUX) ADIE ADIF 8-BIT DATA BUS MUX DECODER CHANNEL SELECTION PRESCALER VCC START CONVERSION LOGIC INTERNAL 1.1V REFERENCE SAMPLE & HOLD COMPARATOR 10-BIT DAC + ADC3 ADC2 ADC1 INPUT MUX ADC MULTIPLEXER OUTPUT ADC0 82 ATtiny13A 8126F-AVR-05/12 ATtiny13A The ADC is connected to a 4-channel Analog Multiplexer which allows four single-ended voltage inputs constructed from the pins of Port B. The single-ended voltage inputs refer to 0V (GND). The ADC contains a Sample and Hold circuit which ensures that the input voltage to the ADC is held at a constant level during conversion. Internal reference voltages of nominally 1.1V or VCC are provided On-chip. 14.3 Operation The ADC converts an analog input voltage to a 10-bit digital value through successive approximation. The minimum value represents GND and the maximum value represents the voltage on VCC or an internal 1.1V reference voltage. The analog input channel is selected by writing to the MUX bits in ADMUX. Any of the ADC input pins, can be selected as single ended inputs to the ADC. The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Voltage reference and input channel selections will not go into effect until ADEN is set. The ADC does not consume power when ADEN is cleared, so it is recommended to switch off the ADC before entering power saving sleep modes. The ADC generates a 10-bit result which is presented in the ADC Data Registers, ADCH and ADCL. By default, the result is presented right adjusted, but can optionally be presented left adjusted by setting the ADLAR bit in ADMUX. If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content of the data registers belongs to the same conversion. Once ADCL is read, ADC access to data registers is blocked. This means that if ADCL has been read, and a conversion completes before ADCH is read, neither register is updated and the result from the conversion is lost. When ADCH is read, ADC access to the ADCH and ADCL Registers is re-enabled. The ADC has its own interrupt which can be triggered when a conversion completes. When ADC access to the data registers is prohibited between reading of ADCH and ADCL, the interrupt will trigger even if the result is lost. 14.4 Starting a Conversion A single conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC. This bit stays high as long as the conversion is in progress and will be cleared by hardware when the conversion is completed. If a different data channel is selected while a conversion is in progress, the ADC will finish the current conversion before performing the channel change. Alternatively, a conversion can be triggered automatically by various sources. Auto Triggering is enabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB (see description of the ADTS bits for a list of the trigger sources). When a positive edge occurs on the selected trigger signal, the ADC prescaler is reset and a conversion is started. This provides a method of starting conversions at fixed intervals. If the trigger signal still is set when the conversion completes, a new conversion will not be started. If another positive edge occurs on the trigger signal during conversion, the edge will be ignored. Note that an Interrupt Flag will be set even if the specific interrupt is disabled or the Global Interrupt Enable bit in SREG is cleared. A conversion can thus be triggered without causing an interrupt. However, the Interrupt Flag must be cleared in order to trigger a new conversion at the next interrupt event. 83 8126F-AVR-05/12 Figure 14-2. ADC Auto Trigger Logic ADTS[2:0] PRESCALER START ADIF CLKADC ADATE SOURCE 1 . . . . CONVERSION LOGIC EDGE DETECTOR SOURCE n ADSC Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion as soon as the ongoing conversion has finished. The ADC then operates in Free Running mode, constantly sampling and updating the ADC Data Register. The first conversion must be started by writing a logical one to the ADSC bit in ADCSRA. In this mode the ADC will perform successive conversions independently of whether the ADC Interrupt Flag, ADIF is cleared or not. If Auto Triggering is enabled, single conversions can be started by writing ADSC in ADCSRA to one. ADSC can also be used to determine if a conversion is in progress. The ADSC bit will be read as one during a conversion, independently of how the conversion was started. 14.5 Prescaling and Conversion Timing By default, the successive approximation circuitry requires an input clock frequency between 50 kHz and 200 kHz to get maximum resolution. If a lower resolution than 10 bits is needed, the input clock frequency to the ADC can be higher than 200 kHz to get a higher sample rate. Figure 14-3. ADC Prescaler ADEN START Reset 7-BIT ADC PRESCALER CK/64 CK/128 CK/32 CK/8 CK/16 CK/4 CK/2 CK ADPS0 ADPS1 ADPS2 ADC CLOCK SOURCE The ADC module contains a prescaler, which generates an acceptable ADC clock frequency from any CPU frequency above 100 kHz. The prescaling is set by the ADPS bits in ADCSRA. 84 ATtiny13A 8126F-AVR-05/12 ATtiny13A The prescaler starts counting from the moment the ADC is switched on by setting the ADEN bit in ADCSRA. The prescaler keeps running for as long as the ADEN bit is set, and is continuously reset when ADEN is low. When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the conversion starts at the following rising edge of the ADC clock cycle. A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is switched on (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize the analog circuitry, as shown in Figure 14-4 below. Figure 14-4. ADC Timing Diagram, First Conversion (Single Conversion Mode) Next Conversion First Conversion Cycle Number 1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3 ADC Clock ADEN ADSC ADIF Sign and MSB of Result ADCH LSB of Result ADCL MUX and REFS Update Conversion Complete Sample & Hold MUX and REFS Update When the bandgap reference voltage is used as input to the ADC, it will take a certain time for the voltage to stabilize. If not stabilized, the first value read after the first conversion may be wrong. The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal conversion and 14.5 ADC clock cycles after the start of an first conversion. When a conversion is complete, the result is written to the ADC Data Registers, and ADIF is set. In Single Conversion mode, ADSC is cleared simultaneously. The software may then set ADSC again, and a new conversion will be initiated on the first rising ADC clock edge. Figure 14-5. ADC Timing Diagram, Single Conversion One Conversion Cycle Number 1 2 3 4 5 6 7 8 9 Next Conversion 10 11 12 13 1 2 3 ADC Clock ADSC ADIF ADCH Sign and MSB of Result ADCL LSB of Result Sample & Hold MUX and REFS Update Conversion Complete MUX and REFS Update 85 8126F-AVR-05/12 When Auto Triggering is used, the prescaler is reset when the trigger event occurs, as shown in Figure 14-6 below. This assures a fixed delay from the trigger event to the start of conversion. In this mode, the sample-and-hold takes place two ADC clock cycles after the rising edge on the trigger source signal. Three additional CPU clock cycles are used for synchronization logic. Figure 14-6. ADC Timing Diagram, Auto Triggered Conversion One Conversion 1 Cycle Number 2 3 4 5 6 7 8 Next Conversion 10 9 11 12 13 1 2 ADC Clock Trigger Source ADATE ADIF ADCH Sign and MSB of Result ADCL LSB of Result Prescaler Reset Sample & Hold Prescaler Reset Conversion Complete MUX and REFS Update In Free Running mode, a new conversion will be started immediately after the conversion completes, while ADSC remains high. Figure 14-7. ADC Timing Diagram, Free Running Conversion One Conversion Cycle Number 11 12 Next Conversion 13 1 2 3 4 ADC Clock ADSC ADIF ADCH Sign and MSB of Result ADCL LSB of Result Conversion Complete 86 Sample & Hold MUX and REFS Update ATtiny13A 8126F-AVR-05/12 ATtiny13A For a summary of conversion times, see Table 14-1. Table 14-1. ADC Conversion Time Condition Conversion Time (Cycles) First conversion 13.5 25 Normal conversions 1.5 13 2 13.5 Auto Triggered conversions 14.6 Sample & Hold (Cycles from Start of Conversion) Changing Channel or Reference Selection The MUXn and REFS[1:0] bits in the ADMUX Register are single buffered through a temporary register to which the CPU has random access. This ensures that the channels and reference selection only takes place at a safe point during the conversion. The channel and reference selection is continuously updated until a conversion is started. Once the conversion starts, the channel and reference selection is locked to ensure a sufficient sampling time for the ADC. Continuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF in ADCSRA is set). Note that the conversion starts on the following rising ADC clock edge after ADSC is written. The user is thus advised not to write new channel or reference selection values to ADMUX until one ADC clock cycle after ADSC is written. If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Special care must be taken when updating the ADMUX Register, in order to control which conversion will be affected by the new settings. If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If the ADMUX Register is changed in this period, the user cannot tell if the next conversion is based on the old or the new settings. ADMUX can be safely updated in the following ways: * When ADATE or ADEN is cleared. * During conversion, minimum one ADC clock cycle after the trigger event. * After a conversion, before the Interrupt Flag used as trigger source is cleared. When updating ADMUX in one of these conditions, the new settings will affect the next ADC conversion. 14.6.1 ADC Input Channels When changing channel selections, the user should observe the following guidelines to ensure that the correct channel is selected: In Single Conversion mode, always select the channel before starting the conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the conversion to complete before changing the channel selection. In Free Running mode, always select the channel before starting the first conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the first conversion to complete, and then change the channel selection. Since the next conversion has already started automatically, the next result will reflect the previous channel selection. Subsequent conversions will reflect the new channel selection. 87 8126F-AVR-05/12 14.6.2 14.7 ADC Voltage Reference The reference voltage for the ADC (VREF) indicates the conversion range for the ADC. Single ended channels that exceed VREF will result in codes close to 0x3FF. VREF can be selected as either VCC, or internal 1.1V reference. The first ADC conversion result after switching reference voltage source may be inaccurate, and the user is advised to discard this result. ADC Noise Canceler The ADC features a noise canceler that enables conversion during sleep mode to reduce noise induced from the CPU core and other I/O peripherals. The noise canceler can be used with ADC Noise Reduction and Idle mode. To make use of this feature, the following procedure should be used: * Make sure that the ADC is enabled and is not busy converting. Single Conversion mode must be selected and the ADC conversion complete interrupt must be enabled. * Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion once the CPU has been halted. * If no other interrupts occur before the ADC conversion completes, the ADC interrupt will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If another interrupt wakes up the CPU before the ADC conversion is complete, the interrupt will be executed, and an ADC Conversion Complete interrupt request will be generated when the ADC conversion completes. The CPU will remain in active mode until a new sleep command is executed. Note that the ADC will not be automatically turned off when entering other sleep modes than Idle mode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before entering such sleep modes to avoid excessive power consumption. 14.8 Analog Input Circuitry The analog input circuitry for single ended channels is shown in Figure 14-8 An analog source applied to ADCn is subjected to pin capacitance and input leakage of that pin, regardless if the channel is chosen as input for the ADC, or not. When the channel is selected, the source drives the S/H capacitor through the series resistance (combined resistance in input path). Figure 14-8. Analog Input Circuitry IIH n 1..100 kohm CS/H= 14 pF IIL Note: 88 The capacitor in the figure depicts the total capacitance, including the sample/hold capacitor and any stray or parasitic capacitance inside the device. The value given is worst case. ATtiny13A 8126F-AVR-05/12 ATtiny13A The ADC is optimized for analog signals with an output impedance of approximately 10 k or less. If such a source is used, the sampling time will be negligible. If a source with higher impedance is used, the sampling time will depend on how long time the source needs to charge the S/H capacitor, with can vary widely. The user is recommended to only use low impedant sources with slowly varying signals, since this minimizes the required charge transfer to the S/H capacitor. Signal components higher than the Nyquist frequency (fADC/2) should not be present to avoid distortion from unpredictable signal convolution. The user is advised to remove high frequency components with a low-pass filter before applying the signals as inputs to the ADC. 14.9 Analog Noise Canceling Techniques Digital circuitry inside and outside the device generates EMI which might affect the accuracy of analog measurements. When conversion accuracy is critical, the noise level can be reduced by applying the following techniques: * Keep analog signal paths as short as possible. * Make sure analog tracks run over the analog ground plane. * Keep analog tracks well away from high-speed switching digital tracks. * If any port pin is used as a digital output, it mustn't switch while a conversion is in progress. * Place bypass capacitors as close to VCC and GND pins as possible. Where high ADC accuracy is required it is recommended to use ADC Noise Reduction Mode, as described in Section 14.7 on page 88. This is especially the case when system clock frequency is above 1 MHz. A good system design with properly placed, external bypass capacitors does reduce the need for using ADC Noise Reduction Mode 14.10 ADC Accuracy Definitions An n-bit single-ended ADC converts a voltage linearly between GND and V REF in 2 n steps (LSBs). The lowest code is read as 0, and the highest code is read as 2n-1. Several parameters describe the deviation from the ideal behavior: 89 8126F-AVR-05/12 * Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal transition (at 0.5 LSB). Ideal value: 0 LSB. Figure 14-9. Offset Error Output Code Ideal ADC Actual ADC Offset Error VREF Input Voltage * Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the last transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below maximum). Ideal value: 0 LSB Figure 14-10. Gain Error Output Code Gain Error Ideal ADC Actual ADC VREF Input Voltage 90 ATtiny13A 8126F-AVR-05/12 ATtiny13A * Integral Non-linearity (INL): After adjusting for offset and gain error, the INL is the maximum deviation of an actual transition compared to an ideal transition for any code. Ideal value: 0 LSB. Figure 14-11. Integral Non-linearity (INL) Output Code INL Ideal ADC Actual ADC VREF Input Voltage * Differential Non-linearity (DNL): The maximum deviation of the actual code width (the interval between two adjacent transitions) from the ideal code width (1 LSB). Ideal value: 0 LSB. Figure 14-12. Differential Non-linearity (DNL) Output Code 0x3FF 1 LSB DNL 0x000 0 VREF Input Voltage 91 8126F-AVR-05/12 * Quantization Error: Due to the quantization of the input voltage into a finite number of codes, a range of input voltages (1 LSB wide) will code to the same value. Always 0.5 LSB. * Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition compared to an ideal transition for any code. This is the compound effect of offset, gain error, differential error, non-linearity, and quantization error. Ideal value: 0.5 LSB. 14.11 ADC Conversion Result After the conversion is complete (ADIF is high), the conversion result can be found in the ADC Result Registers (ADCL, ADCH). For single ended conversion, the result is V IN 1024 ADC = -------------------------V REF where VIN is the voltage on the selected input pin and VREF the selected voltage reference (see Table 14-2 on page 92 and Table 14-3 on page 93). 0x000 represents analog ground, and 0x3FF represents the selected reference voltage minus one LSB. 14.12 Register Description 14.12.1 ADMUX - ADC Multiplexer Selection Register Bit 7 6 5 4 3 2 1 0 0x07 - REFS0 ADLAR - - - MUX1 MUX0 Read/Write R R/W R/W R R R R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADMUX * Bits 7, 4:2 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and will always read as zero. * Bit 6 - REFS0: Reference Selection Bit This bit selects the voltage reference for the ADC, as shown in Table 14-2. If this bit is changed during a conversion, the change will not go in effect until this conversion is complete (ADIF in ADCSRA is set). Table 14-2. Voltage Reference Selections for ADC REFS0 Voltage Reference Selection 0 VCC used as analog reference. 1 Internal Voltage Reference. * Bit 5 - ADLAR: ADC Left Adjust Result The ADLAR bit affects the presentation of the ADC conversion result in the ADC Data Register. Write one to ADLAR to left adjust the result. Otherwise, the result is right adjusted. Changing the ADLAR bit will affect the ADC Data Register immediately, regardless of any ongoing conversions. For a complete description of this bit, see "ADCL and ADCH - The ADC Data Register" on page 94. 92 ATtiny13A 8126F-AVR-05/12 ATtiny13A * Bits 1:0 - MUX[1:0]: Analog Channel Selection Bits The value of these bits selects which combination of analog inputs are connected to the ADC. See Table 14-3 for details. If these bits are changed during a conversion, the change will not go in effect until this conversion is complete (ADIF in ADCSRA is set). Table 14-3. Input Channel Selections MUX[1:0] 14.12.2 Single Ended Input 00 ADC0 (PB5) 01 ADC1 (PB2) 10 ADC2 (PB4) 11 ADC3 (PB3) ADCSRA - ADC Control and Status Register A Bit 7 6 5 4 3 2 1 0 ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 0x06 ADCSRA * Bit 7 - ADEN: ADC Enable Writing this bit to one enables the ADC. By writing it to zero, the ADC is turned off. Turning the ADC off while a conversion is in progress, will terminate this conversion. * Bit 6 - ADSC: ADC Start Conversion In Single Conversion mode, write this bit to one to start each conversion. In Free Running mode, write this bit to one to start the first conversion. The first conversion after ADSC has been written after the ADC has been enabled, or if ADSC is written at the same time as the ADC is enabled, will take 25 ADC clock cycles instead of the normal 13. This first conversion performs initialization of the ADC. ADSC will read as one as long as a conversion is in progress. When the conversion is complete, it returns to zero. Writing zero to this bit has no effect. * Bit 5 - ADATE: ADC Auto Trigger Enable When this bit is written to one, Auto Triggering of the ADC is enabled. The ADC will start a conversion on a positive edge of the selected trigger signal. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB. * Bit 4 - ADIF: ADC Interrupt Flag This bit is set when an ADC conversion completes and the data registers are updated. The ADC Conversion Complete Interrupt is executed if the ADIE bit and the I-bit in SREG are set. ADIF is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ADIF is cleared by writing a logical one to the flag. Beware that if doing a Read-Modify-Write on ADCSRA, a pending interrupt can be disabled. This also applies if the SBI and CBI instructions are used. 93 8126F-AVR-05/12 * Bit 3 - ADIE: ADC Interrupt Enable When this bit is written to one and the I-bit in SREG is set, the ADC Conversion Complete Interrupt is activated. * Bits 2:0 - ADPS[2:0]: ADC Prescaler Select Bits These bits determine the division factor between the system clock frequency and the input clock to the ADC. Table 14-4. 14.12.3 14.12.3.1 ADPS2 ADPS1 ADPS0 Division Factor 0 0 0 2 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 ADCL and ADCH - The ADC Data Register ADLAR = 0 Bit 15 14 13 12 11 10 9 8 0x05 - - - - - - ADC9 ADC8 ADCH 0x04 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL 7 6 5 4 3 2 1 0 R R R R R R R R R R R R R R R R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write Initial Value 14.12.3.2 ADC Prescaler Selections ADLAR = 1 Bit 15 14 13 12 11 10 9 8 0x05 ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH 0x04 ADC1 ADC0 - - - - - - ADCL 7 6 5 4 3 2 1 0 R R R R R R R R R R R R R R R R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write Initial Value When an ADC conversion is complete, the result is found in these two registers. When ADCL is read, the ADC Data Register is not updated until ADCH is read. Consequently, if the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH. 94 ATtiny13A 8126F-AVR-05/12 ATtiny13A The ADLAR bit in ADMUX, and the MUXn bits in ADMUX affect the way the result is read from the registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared (default), the result is right adjusted. * ADC[9:0]: ADC Conversion Result These bits represent the result from the conversion, as detailed in "ADC Conversion Result" on page 92. 14.12.4 ADCSRB - ADC Control and Status Register B Bit 7 6 5 4 3 2 1 0 0x03 - ACME - - - ADTS2 ADTS1 ADTS0 Read/Write R R/W R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADCSRB * Bits 7, 5:3 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and will always read as zero. * Bits 2:0 - ADTS[2:0]: ADC Auto Trigger Source If ADATE in ADCSRA is written to one, the value of these bits selects which source will trigger an ADC conversion. If ADATE is cleared, the ADTS[2:0] settings will have no effect. A conversion will be triggered by the rising edge of the selected Interrupt Flag. Note that switching from a trigger source that is cleared to a trigger source that is set, will generate a positive edge on the trigger signal. If ADEN in ADCSRA is set, this will start a conversion. Switching to Free Running mode (ADTS[2:0]=0) will not cause a trigger event, even if the ADC Interrupt Flag is set. Table 14-5. 14.12.5 ADC Auto Trigger Source Selections ADTS2 ADTS1 ADTS0 Trigger Source 0 0 0 Free Running mode 0 0 1 Analog Comparator 0 1 0 External Interrupt Request 0 0 1 1 Timer/Counter Compare Match A 1 0 0 Timer/Counter Overflow 1 0 1 Timer/Counter Compare Match B 1 1 0 Pin Change Interrupt Request DIDR0 - Digital Input Disable Register 0 Bit 7 6 5 4 3 2 1 0 0x14 - - ADC0D ADC2D ADC3D ADC1D AIN1D AIN0D Read/Write R R R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DIDR0 * Bits 5:2 - ADC3D:ADC0D: ADC[3:0] Digital Input Disable When a bit is written logic one, the digital input buffer on the corresponding ADC pin is disabled. The corresponding PIN register bit will always read as zero when this bit is set. When an analog signal is applied to the ADC[7:0] pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. 95 8126F-AVR-05/12 15. debugWIRE On-chip Debug System 15.1 Features * * * * * * * * * * 15.2 Complete Program Flow Control Emulates All On-chip Functions, Both Digital and Analog, except RESET Pin Real-time Operation Symbolic Debugging Support (Both at C and Assembler Source Level, or for Other HLLs) Unlimited Number of Program Break Points (Using Software Break Points) Non-intrusive Operation Electrical Characteristics Identical to Real Device Automatic Configuration System High-Speed Operation Programming of Non-volatile Memories Overview The debugWIRE On-chip debug system uses a One-wire, bi-directional interface to control the program flow, execute AVR instructions in the CPU and to program the different non-volatile memories. 15.3 Physical Interface When the debugWIRE Enable (DWEN) fuse is programmed and lock bits are unprogrammed, the debugWIRE system within the target device is activated. The RESET port pin is configured as a wire-AND (open-drain) bi-directional I/O pin with pull-up enabled and becomes the communication gateway between target and emulator. Figure 15-1 shows the schematic of a target MCU, with debugWIRE enabled, and the emulator connector. The system clock is not affected by debugWIRE and will always be the clock source selected by the CKSEL fuses. Figure 15-1. The debugWIRE Setup 1.8 - 5.5V VCC dW dW(RESET) GND 96 ATtiny13A 8126F-AVR-05/12 ATtiny13A When designing a system where debugWIRE will be used, the following must be observed: * Pull-Up resistor on the dW/(RESET) line must be in the range of 10k to 20 k. However, the pull-up resistor is optional. * Connecting the RESET pin directly to VCC will not work. * Capacitors inserted on the RESET pin must be disconnected when using debugWire. * All external reset sources must be disconnected. 15.4 Software Break Points debugWIRE supports Program memory Break Points by the AVR Break instruction. Setting a Break Point in AVR Studio(R) will insert a BREAK instruction in the Program memory. The instruction replaced by the BREAK instruction will be stored. When program execution is continued, the stored instruction will be executed before continuing from the Program memory. A break can be inserted manually by putting the BREAK instruction in the program. The Flash must be re-programmed each time a Break Point is changed. This is automatically handled by AVR Studio through the debugWIRE interface. The use of Break Points will therefore reduce the Flash Data retention. Devices used for debugging purposes should not be shipped to end customers. 15.5 Limitations of debugWIRE The debugWIRE communication pin (dW) is physically located on the same pin as External Reset (RESET). An External Reset source is therefore not supported when the debugWIRE is enabled. The debugWIRE system accurately emulates all I/O functions when running at full speed, i.e., when the program in the CPU is running. When the CPU is stopped, care must be taken while accessing some of the I/O Registers via the debugger (AVR Studio). See the debugWIRE documentation for detailed description of the limitations. The debugWIRE interface is asynchronous, which means that the debugger needs to synchronize to the system clock. If the system clock is changed by software (e.g. by writing CLKPS bits) communication via debugWIRE may fail. Also, clock frequencies below 100 kHz may cause communication problems. A programmed DWEN fuse enables some parts of the clock system to be running in all sleep modes. This will increase the power consumption while in sleep. Thus, the DWEN fuse should be disabled when debugWire is not used. 15.6 Register Description The following section describes the registers used with the debugWire. 15.6.1 DWDR -debugWire Data Register Bit 7 6 5 0x2E 4 3 2 1 0 DWDR[7:0] DWDR Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The DWDR Register provides a communication channel from the running program in the MCU to the debugger. This register is only accessible by the debugWIRE and can therefore not be used as a general purpose register in the normal operations. 97 8126F-AVR-05/12 16. Self-Programming the Flash The device provides a Self-Programming mechanism for downloading and uploading program code by the MCU itself. The Self-Programming can use any available data interface and associated protocol to read code and write (program) that code into the Program memory. The SPM instruction is disabled by default but it can be enabled by programming the SELFPRGEN fuse (to "0"). The Program memory is updated in a page by page fashion. Before programming a page with the data stored in the temporary page buffer, the page must be erased. The temporary page buffer is filled one word at a time using SPM and the buffer can be filled either before the Page Erase command or between a Page Erase and a Page Write operation: Alternative 1, fill the buffer before a Page Erase * Fill temporary page buffer * Perform a Page Erase * Perform a Page Write Alternative 2, fill the buffer after Page Erase * Perform a Page Erase * Fill temporary page buffer * Perform a Page Write If only a part of the page needs to be changed, the rest of the page must be stored (for example in the temporary page buffer) before the erase, and then be re-written. When using alternative 1, the Boot Loader provides an effective Read-Modify-Write feature which allows the user software to first read the page, do the necessary changes, and then write back the modified data. If alternative 2 is used, it is not possible to read the old data while loading since the page is already erased. The temporary page buffer can be accessed in a random sequence. It is essential that the page address used in both the Page Erase and Page Write operation is addressing the same page. 16.1 Performing Page Erase by SPM To execute Page Erase, set up the address in the Z-pointer, write "00000011" to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer will be ignored during this operation. Note: 16.2 The CPU is halted during the Page Erase operation. Filling the Temporary Buffer (Page Loading) To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write "00000001" to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The content of PCWORD in the Z-register is used to address the data in the temporary buffer. The temporary buffer will auto-erase after a Page Write operation or by writing the CTPB bit in SPMCSR. It is also erased after a system reset. Note that it is not possible to write more than one time to each address without erasing the temporary buffer. 98 ATtiny13A 8126F-AVR-05/12 ATtiny13A If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will be lost. 16.3 Performing a Page Write To execute Page Write, set up the address in the Z-pointer, write "00000101" to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE. Other bits in the Z-pointer must be written to zero during this operation. Note: 16.4 The CPU is halted during the Page Write operation. Addressing the Flash During Self-Programming The Z-pointer is used to address the SPM commands. Bit 15 14 13 12 11 10 9 8 ZH (R31) Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8 ZL (R30) Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0 7 6 5 4 3 2 1 0 Since the Flash is organized in pages (see Table 17-5 on page 105), the Program Counter can be treated as having two different sections. One section, consisting of the least significant bits, is addressing the words within a page, while the most significant bits are addressing the pages. This is shown in Figure 16-1. Note that the Page Erase and Page Write operations are addressed independently. Therefore it is of major importance that the software addresses the same page in both the Page Erase and Page Write operation. Figure 16-1. Addressing the Flash During SPM(1) BIT 15 ZPCMSB ZPAGEMSB Z - REGISTER 1 0 0 PCMSB PROGRAM COUNTER PAGEMSB PCPAGE PAGE ADDRESS WITHIN THE FLASH PROGRAM MEMORY PAGE PCWORD WORD ADDRESS WITHIN A PAGE PAGE INSTRUCTION WORD PCWORD[PAGEMSB:0]: 00 01 02 PAGEEND Note: 1. The variables used in Figure 16-1 are listed in Table 17-5 on page 105. 99 8126F-AVR-05/12 The LPM instruction uses the Z-pointer to store the address. Since this instruction addresses the Flash byte-by-byte, also the LSB (bit Z0) of the Z-pointer is used. 16.5 EEPROM Write Prevents Writing to SPMCSR Note that an EEPROM write operation will block all software programming to Flash. Reading the fuses and lock bits from software will also be prevented during the EEPROM write operation. It is recommended that the user checks the status bit (EEPE) in the EECR Register and verifies that the bit is cleared before writing to the SPMCSR Register. 16.6 Reading Fuse and Lock Bits from Firmware It is possible to read fuse and lock bits from software. 16.6.1 Reading Lock Bits from Firmware Issuing an LPM instruction within three CPU cycles after RFLB and SELFPRGEN bits have been set in SPMCSR will return lock bit values in the destination register. The RFLB and SELFPRGEN bits automatically clear upon completion of reading the lock bits, or if no LPM instruction is executed within three CPU cycles, or if no SPM instruction is executed within four CPU cycles. When RFLB and SELFPRGEN are cleared, LPM functions normally. To read the lock bits, follow the below procedure. 1. Load the Z-pointer with 0x0001. 2. Set RFLB and SELFPRGEN bits in SPMCSR. 3. Issuing an LPM instruction within three clock cycles will return lock bits in the destination register. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd - - - - - - LB2 LB1 See section "Program And Data Memory Lock Bits" on page 103 for more information on lock bits. 16.6.2 Reading Fuse Bits from Firmware The algorithm for reading fuse bytes is similar to the one described above for reading lock bits, only the addresses are different. To read the Fuse Low Byte (FLB), follow the below procedure: 1. Load the Z-pointer with 0x0000. 2. Set RFLB and SELFPRGEN bits in SPMCSR. 3. Issuing an LPM instruction within three clock cycles will FLB in the destination register. If successful, the contents of the destination register are as follows. 100 Bit 7 6 5 4 3 2 1 0 Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0 ATtiny13A 8126F-AVR-05/12 ATtiny13A To read the Fuse High Byte (FHB), simply replace the address in the Z-pointer with 0x0003 and repeat the procedure above. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0 See sections "Program And Data Memory Lock Bits" on page 103 and "Fuse Bytes" on page 104 for more information on fuse and lock bits. 16.7 Preventing Flash Corruption During periods of low VCC, the Flash program can be corrupted because the supply voltage is too low for the CPU and the Flash to operate properly. These issues are the same as for board level systems using the Flash, and the same design solutions should be applied. A Flash program corruption can be caused by two situations when the voltage is too low. First, a regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions is too low. Flash corruption can easily be avoided by following these design recommendations (one is sufficient): 1. Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD) if the operating voltage matches the detection level. If not, an external low VCC reset protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient. 2. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will prevent the CPU from attempting to decode and execute instructions, effectively protecting the SPMCSR Register and thus the Flash from unintentional writes. 16.8 Programming Time for Flash when Using SPM The calibrated RC Oscillator is used to time Flash accesses. Table 16-1 on page 101 shows the typical programming time for Flash accesses from the CPU. Table 16-1. SPM Programming Time(1) Symbol Min Programming Time Max Programming Time Flash write (Page Erase, Page Write, and write lock bits by SPM) 3.7 ms 4.5 ms Note: 1. The min and max programming times is per individual operation. 101 8126F-AVR-05/12 16.9 16.9.1 Register Description SPMCSR - Store Program Memory Control and Status Register The Store Program Memory Control and Status Register contains the control bits needed to control the Program memory operations. Bit 7 6 5 4 3 2 1 0 0x37 - - - CTPB RFLB PGWRT PGERS SELFPRGEN Read/Write R R R R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 SPMCSR * Bits 7:5 - Res: Reserved Bits These bits are reserved bits in the ATtiny13A and always read as zero. * Bit 4 - CTPB: Clear Temporary Page Buffer If the CTPB bit is written while filling the temporary page buffer, the temporary page buffer will be cleared and the data will be lost. * Bit 3 - RFLB: Read Fuse and Lock Bits An LPM instruction within three cycles after RFLB and SELFPRGEN are set in the SPMCSR Register, will read either the lock bits or the fuse bits (depending on Z0 in the Z-pointer) into the destination register. See "EEPROM Write Prevents Writing to SPMCSR" on page 100 for details. * Bit 2 - PGWRT: Page Write If this bit is written to one at the same time as SELFPRGEN, the next SPM instruction within four clock cycles executes Page Write, with the data stored in the temporary buffer. The page address is taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bit will auto-clear upon completion of a Page Write, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation. * Bit 1 - PGERS: Page Erase If this bit is written to one at the same time as SELFPRGEN, the next SPM instruction within four clock cycles executes Page Erase. The page address is taken from the high part of the Zpointer. The data in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation. * Bit 0 - SELFPRGEN: Self Programming Enable This bit enables the SPM instruction for the next four clock cycles. If written to one together with either CTPB, RFLB, PGWRT, or PGERS, the following SPM instruction will have a special meaning, see description above. If only SELFPRGEN is written, the following SPM instruction will store the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB of the Z-pointer is ignored. The SELFPRGEN bit will auto-clear upon completion of an SPM instruction, or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write, the SELFPRGEN bit remains high until the operation is completed. Writing any other combination than "10001", "01001", "00101", "00011" or "00001" in the lower five bits will have no effect. 102 ATtiny13A 8126F-AVR-05/12 ATtiny13A 17. Memory Programming This section describes how ATtiny13A memories can be programmed. 17.1 Program And Data Memory Lock Bits ATtiny13A provides two lock bits which can be left unprogrammed ("1") or can be programmed ("0") to obtain the additional security listed in Table 17-2 on page 103. The lock bits can be erased to "1" with the Chip Erase command, only. Program memory can be read out via the debugWIRE interface when the DWEN fuse is programmed, even if the lock bits are set. Thus, when lock bit security is required, debugWIRE should always be disabled by clearing the DWEN fuse. Table 17-1. Lock Bit Byte Description Default Value (1) 7 - 1 (unprogrammed) 6 - 1 (unprogrammed) 5 - 1 (unprogrammed) 4 - 1 (unprogrammed) 3 - 1 (unprogrammed) 2 - 1 (unprogrammed) LB2 1 Lock bit 1 (unprogrammed) LB1 0 Lock bit 1 (unprogrammed) Lock Bit Byte Note: Bit No 1. "1" means unprogrammed, "0" means programmed Table 17-2. Lock Bit Protection Modes Memory Lock Bits (1) (2) LB Mode LB2 LB1 1 1 1 No memory lock features enabled. 0 Further programming of the Flash and EEPROM is disabled in High-voltage and Serial Programming mode. Fuse bits are locked in both Serial and High-voltage Programming mode. debugWire is disabled. 0 Further programming and verification of the Flash and EEPROM is disabled in High-voltage and Serial Programming mode. Fuse bits are locked in both Serial and High-voltage Programming mode. debugWire is disabled. 2 3 Notes: 1 0 Protection Type 1. Program fuse bits before lock bits. See section "Fuse Bytes" on page 104. 2. "1" means unprogrammed, "0" means programmed 103 8126F-AVR-05/12 17.2 Fuse Bytes The ATtiny13A has two fuse bytes. Table 17-3 on page 104 and Table 17-4 on page 104 describe briefly the functionality of all the fuses and how they are mapped into the fuse bytes. Note that the fuses are read as logical zero, "0", if they are programmed. Table 17-3. Fuse High Byte Fuse Bit Bit No Description Default Value - 7 - 1 (unprogrammed) - 6 - 1 (unprogrammed) - 5 - 1 (unprogrammed) SELFPRGEN(1) 4 Self Programming Enable 1 (unprogrammed) (2) 3 debugWire Enable 1 (unprogrammed) (3) 2 Brown-out Detector trigger level 1 (unprogrammed) (3) BODLEVEL0 1 Brown-out Detector trigger level 1 (unprogrammed) RSTDISBL(4) 0 External Reset disable 1 (unprogrammed) DWEN BODLEVEL1 Notes: 1. Enables SPM instruction. See "Self-Programming the Flash" on page 98. 2. DWEN must be unprogrammed when lock Bit security is required. See "Program And Data Memory Lock Bits" on page 103. 3. See Table 18-6 on page 120 for BODLEVEL fuse decoding. 4. See "Alternate Functions of Port B" on page 55 for description of RSTDISBL and DWEN fuses. When programming the RSTDISBL fuse, High-voltage Serial programming has to be used to change fuses to perform further programming. Table 17-4. Fuse Bit Bit No Description Default Value SPIEN(1) 7 Enable Serial Programming and Data Downloading 0 (programmed) (SPI prog. enabled) EESAVE 6 Preserve EEPROM memory through Chip Erase 1 (unprogrammed) (memory not preserved) WDTON(2) 5 Watchdog Timer always on 1 (unprogrammed) (3) CKDIV8 4 Divide clock by 8 0 (programmed) SUT1(4) 3 Select start-up time 1 (unprogrammed) (4) 2 Select start-up time 0 (programmed) CKSEL1 (5) 1 Select Clock source 1 (unprogrammed) CKSEL0 (5) 0 Select Clock source 0 (programmed) SUT0 Notes: 104 Fuse Low Byte 1. The SPIEN fuse is not accessible in SPI Programming mode. 2. Programming this fues will disable the Watchdog Timer Interrupt. See "Watchdog Timer" on page 38 for details. 3. See "System Clock Prescaler" on page 26 for details. 4. The default value of SUT[1:0] results in maximum start-up time for the default clock source. See Table 18-3 on page 119 for details. 5. The default setting of CKSEL[1:0] results in internal RC Oscillator @ 9.6 MHz. See Table 18-3 on page 119 for details. ATtiny13A 8126F-AVR-05/12 ATtiny13A Note that fuse bits are locked if Lock Bit 1 (LB1) is programmed. Program the fuse bits before programming the lock bits. The status of the fuse bits is not affected by Chip Erase. Fuse bits can also be read by the device firmware. See section "Reading Fuse and Lock Bits from Firmware" on page 100. 17.2.1 17.3 Latching of Fuses The fuse values are latched when the device enters programming mode and changes of the fuse values will have no effect until the part leaves Programming mode. This does not apply to the EESAVE fuse which will take effect once it is programmed. The fuses are also latched on Power-up in Normal mode. Calibration Bytes The signature area of the ATtiny13A contains two bytes of calibration data for the internal oscillator. The calibration data in the high byte of address 0x00 is for use with the oscillator set to 9.6 MHz operation. During reset, this byte is automatically written into the OSCCAL register to ensure correct frequency of the oscillator. There is a separate calibration byte for the internal oscillator in 4.8 MHz mode of operation but this data is not loaded automatically. The hardware always loads the 9.6 MHz calibration data during reset. To use separate calibration data for the oscillator in 4.8 MHz mode the OSCCAL register must be updated by firmware. The calibration data for 4.8 MHz operation is located in the high byte at address 0x01 of the signature area. 17.4 Signature Bytes All Atmel microcontrollers have a three-byte signature code which identifies the device. This code can be read in both serial and high-voltage programming mode, even when the device is locked. The three bytes reside in a separate address space. For the ATtiny13A the signature bytes are: * 0x000: 0x1E (indicates manufactured by Atmel). * 0x001: 0x90 (indicates 1 KB Flash memory). * 0x002: 0x07 (indicates ATtiny13A device when 0x001 is 0x90). 17.5 Page Size Table 17-5. No. of Words in a Page and No. of Pages in the Flash Flash Size 512 words (1K byte) Table 17-6. Page Size PCWORD No. of Pages PCPAGE PCMSB 16 words PC[3:0] 32 PC[8:4] 8 No. of Words in a Page and No. of Pages in the EEPROM EEPROM Size Page Size PCWORD No. of Pages PCPAGE EEAMSB 64 bytes 4 bytes EEA[1:0] 16 EEA[5:2] 5 105 8126F-AVR-05/12 17.6 Serial Programming Both the Flash and EEPROM memory arrays can be programmed using the serial SPI bus while RESET is pulled to GND. The serial interface consists of pins SCK, MOSI (input) and MISO (output). See Figure 17-1. Figure 17-1. Serial Programming and Verify +1.8 - 5.5V RESET PB5 GND Note: VCC PB2 SCK PB1 MISO PB0 MOSI If clocked by internal oscillator there is no need to connect a clock source to the CLKI pin. After RESET is set low, the Programming Enable instruction needs to be executed first before program/erase operations can be executed. Table 17-7. Note: Pin Mapping Serial Programming Symbol Pins I/O Description MOSI PB0 I Serial Data in MISO PB1 O Serial Data out SCK PB2 I Serial Clock In Table 17-7 above, the pin mapping for SPI programming is listed. Not all parts use the SPI pins dedicated for the internal SPI interface. When programming the EEPROM, an auto-erase cycle is built into the self-timed programming operation (in the Serial mode ONLY) and there is no need to first execute the Chip Erase instruction. The Chip Erase operation turns the content of every memory location in both the Program and EEPROM arrays into 0xFF. Depending on CKSEL fuses, a valid clock must be present. The minimum low and high periods for the serial clock (SCK) input are defined as follows: Low: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz High: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz 106 ATtiny13A 8126F-AVR-05/12 ATtiny13A 17.6.1 Serial Programming Algorithm When writing serial data to the ATtiny13A, data is clocked on the rising edge of SCK. When reading data from the ATtiny13A, data is clocked on the falling edge of SCK. See Figure 18-4 on page 122 and Figure 18-3 on page 122 for timing details. To program and verify the ATtiny13A in the Serial Programming mode, the following sequence is recommended (see four byte instruction formats in Table 17-9 on page 108): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to "0". In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse after SCK has been set to "0". The pulse duration must be at least tRST (miniumum pulse widht of RESET pin, see Table 18-4 on page 120 and Figure 19-58 on page 153) plus two CPU clock cycles. 2. Wait for at least 20 ms and enable serial programming by sending the Programming Enable serial instruction to pin MOSI. 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 4 LSB of the address and data together with the Load Program memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program memory Page is stored by loading the Write Program memory Page instruction with the 5 MSB of the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 17-8 on page 108.) Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. A: The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte. (See Table 17-8 on page 108.) In a chip erased device, no 0xFFs in the data file(s) need to be programmed. B: The EEPROM array is programmed one page at a time. The Memory page is loaded one byte at a time by supplying the 2 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading the Write EEPROM Memory Page Instruction with the 4 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is not used, the used must wait at least tWD_EEPROM before issuing the next page (See Table 17-6 on page 105). In a chip erased device, no 0xFF in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO. 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to "1". Turn VCC power off. 107 8126F-AVR-05/12 . Table 17-8. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location Symbol 17.6.2 Minimum Wait Delay tWD_FLASH 4.5 ms tWD_EEPROM 4.0 ms tWD_ERASE 9.0 ms tWD_FUSE 4.5 ms Serial Programming Instruction set The instruction set is described in Table 17-9. Table 17-9. Serial Programming Instruction Set Instruction Format Instruction Byte 1 Byte 2 Byte 3 Byte4 Operation Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after RESET goes low. Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash. Read Program Memory 0010 H000 0000 000a bbbb bbbb oooo oooo Read H (high or low) data o from Program memory at word address a:b. Write H (high or low) data i to Program memory page at word address b. Data low byte must be loaded before Data high byte is applied within the same address. Load Program Memory Page 0100 H000 000x xxxx xxxx bbbb iiii iiii Write Program Memory Page 0100 1100 0000 000a bbbb xxxx xxxx xxxx Read EEPROM Memory 1010 0000 000x xxxx xxbb bbbb oooo oooo Write EEPROM Memory 1100 0000 000x xxxx xxbb bbbb iiii iiii Write data i to EEPROM memory at address b. Load EEPROM Memory Page (page access) 1100 0001 0000 0000 0000 00bb iiii iiii Load data i to EEPROM memory page buffer. After data is loaded, program EEPROM page. Write EEPROM Memory Page (page access) 1100 0010 00xx xxxx xxbb bb00 xxxx xxxx Read Lock Bits 0101 1000 0000 0000 xxxx xxxx xxoo oooo Read lock bits. "0" = programmed, "1" = unprogrammed. See Table 17-1 on page 103 for details. Write Lock Bits 1010 1100 111x xxxx xxxx xxxx 11ii iiii Write lock bits. Set bits = "0" to program lock bits. See Table 17-1 on page 103 for details. 108 Write Program memory Page at address a:b. Read data o from EEPROM memory at address b. Write EEPROM page at address b. ATtiny13A 8126F-AVR-05/12 ATtiny13A Table 17-9. Serial Programming Instruction Set (Continued) Instruction Format Instruction Byte 1 Byte 2 Byte 3 Byte4 Operation Read fuse low/high byte. Bit "0" = programmed, "1" = unprogrammed. See "Fuse Bytes" on page 104 for details. Read Fuse Byte 0101 H000 0000 H000 xxxx xxxx oooo oooo Write Fuse Byte 1010 1100 1010 H000 xxxx xxxx iiii iiii Read Signature Byte 0011 0000 000x xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b. Read Calibration Byte 0011 1000 000x xxxx 0000 000b oooo oooo Read Calibration Byte. See "Calibration Bytes" on page 105 Poll RDY/BSY 1111 0000 0000 0000 xxxx xxxx xxxx xxxo Set fuse low/high byte. Set bit to "0" to program, "1" to unprogram. See "Fuse Bytes" on page 104 for details. If o = "1", a programming operation is still busy. Wait until this bit returns to "0" before applying another command. Note: a = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don't care 17.7 High-Voltage Serial Programming This section describes how to program and verify Flash Program memory, EEPROM Data memory, lock bits and fuse bits in the ATtiny13A. Figure 17-2. High-voltage Serial Programming +11.5 - 12.5V SCI +1.8 - 5.5V PB5 (RESET) VCC PB3 PB2 SDO PB1 SII PB0 SDI GND 109 8126F-AVR-05/12 Table 17-10. Pin Name Mapping Signal Name in High-voltage Serial Programming Mode Pin Name I/O Function SDI PB0 I Serial Data Input SII PB1 I Serial Instruction Input SDO PB2 O Serial Data Output SCI PB3 I Serial Clock Input (min. 220ns period) The minimum period for the Serial Clock Input (SCI) during High-voltage Serial Programming is 220 ns. Table 17-11. Pin Values Used to Enter Programming Mode 17.7.1 Pin Symbol Value SDI Prog_enable[0] 0 SII Prog_enable[1] 0 SDO Prog_enable[2] 0 High-Voltage Serial Programming Algorithm To program and verify the ATtiny13A in the High-voltage Serial Programming mode, the following sequence is recommended (See instruction formats in Table 17-13 on page 111): The following algorithm puts the device in High-voltage Serial Programming mode: 1. Set Prog_enable pins listed in Table 17-11 to "000", RESET pin to "0" and Vcc to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. Ensure that Vcc reaches at least 1.8V within the next 20 s. 3. Wait 20 - 60 s, and apply 11.5 - 12.5V to RESET. 4. Keep the Prog_enable pins unchanged for at least 10s after the High-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin to avoid drive contention on the Prog_enable[2]/SDO pin. 6. Wait at least 300s before giving any serial instructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. If the rise time of the Vcc is unable to fulfill the requirements listed above, the following alternative algorithm can be used. 1. Set Prog_enable pins listed in Table 17-11 to "000", RESET pin to "0" and Vcc to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. 3. Monitor Vcc, and as soon as Vcc reaches 0.9 - 1.1V, apply 11.5 - 12.5V to RESET. 4. Keep the Prog_enable pins unchanged for at least 10s after theHigh-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin to avoid drive contention on the Prog_enable[2]/SDO pin. 110 ATtiny13A 8126F-AVR-05/12 ATtiny13A 6. Wait until Vcc actually reaches 4.5 - 5.5V before giving any serialinstructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. Table 17-12. High-voltage Reset Characteristics RESET Pin High-voltage Threshold Minimum High-voltage Period for Latching Prog_enable VCC VHVRST tHVRST 4.5V 12V 100 ns 5.5V 12 100 ns Supply Voltage 17.7.2 High-Voltage Serial Programming Instruction set The instruction set is described in Table 17-13. Table 17-13. High-Voltage Serial Programming Instruction Set for ATtiny13A Instruction Format Instruction Chip Erase Load "Write Flash" Command Load Flash Page Buffer Instr.1/5 Instr.2/6 Instr.3 SDI 0_1000_0000_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0001_0000_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_ bbbb_bbbb _00 0_eeee_eeee_00 0_dddd_dddd_00 0_0000_0000_00 SII 0_0000_1100_00 0_0010_1100_00 0_0011_1100_00 0_0111_1101_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0000_00 SII 0_0111_1100_00 SDO x_xxxx_xxxx_xx Load Flash High SDI Address and SII Program Page SDO Load "Read Flash" Command Operation Remarks Wait after Instr.3 until SDO goes high for the Chip Erase cycle to finish. Enter Flash Programming code. Repeat after Instr. 1 - 5 until the entire page buffer is filled or until all data within the page is filled. See Note 1. Instr 5. 0_0000_000a_00 0_0000_0000_00 0_0000_0000_00 0_0001_1100_00 0_0110_0100_00 0_0110_1100_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx Wait after Instr 3 until SDO goes high. Repeat Instr. 2 - 3 for each loaded Flash Page until the entire Flash or all data is programmed. Repeat Instr. 1 for a new 256 byte page. See Note 1. SDI 0_0000_0010_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_bbbb_bbbb_00 0_0000_000a_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0001_1100_00 0_0110_1000_00 0_0110_1100_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqqx_xx 0_0000_0000_00 0_0000_0000_00 Read Flash Low SDO and High Bytes SDI Load "Write EEPROM" Command Instr.4 Enter Flash Read mode. SII 0_0111_1000_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx p_pppp_pppx_xx SDI 0_0001_0001_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx Repeat Instr. 1, 3 - 6 for each new address. Repeat Instr. 2 for a new 256 byte page. Instr 5 - 6. Enter EEPROM Programming mode. 111 8126F-AVR-05/12 Table 17-13. High-Voltage Serial Programming Instruction Set for ATtiny13A (Continued) Instruction Format Instruction Load EEPROM Page Buffer Program EEPROM Page Write EEPROM Byte Load "Read EEPROM" Command Read EEPROM Byte Write Fuse Low Bits Instr.1/5 Instr.2/6 Instr.3 Instr.4 SDI 0_00bb_bbbb_00 0_eeee_eeee_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0010_1100_00 0_0110_1101_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0000_00 0_0000_0000_00 SII 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_00bb_bbbb_00 0_eeee_eeee_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0010_1100_00 0_0110_1101_00 0_0110_0100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0000_00 SII 0_0110_1100_00 SDO x_xxxx_xxxx_xx SDI 0_0000_0011_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_bbbb_bbbb_00 0_aaaa_aaaa_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0001_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqq0_00 SDI 0_0100_0000_00 0_A987_6543_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx 0_0100_0000_00 0_000F_EDCB_00 0_0000_0000_00 0_0000_0000_00 0_0100_1100_00 0_0010_1100_00 0_0111_0100_00 0_0111_1100_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0010_0000_00 0_0000_0021_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx A_9876_543x_xx 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 0_0100_1100_00 0_0111_1010_00 0_0111_1110_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxFE_DCBx_xx SDI 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0111_1000_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_x21x_xx SDI Write Fuse High SII Bits SDO Write Lock Bits Read Fuse Low Bits SDI Read Fuse High SII Bits SDO Read Lock Bits 112 Operation Remarks Repeat Instr. 1 - 4 until the entire page buffer is filled or until all data within the page is filled. See Note 2. Wait after Instr. 2 until SDO goes high. Repeat Instr. 1 - 2 for each loaded EEPROM page until the entire EEPROM or all data is programmed. Repeat Instr. 1 - 5 for each new address. Wait after Instr. 5 until SDO goes high. See Note 3. Instr. 5 Enter EEPROM Read mode. Repeat Instr. 1, 3 - 4 for each new address. Repeat Instr. 2 for a new 256 byte page. Wait after Instr. 4 until SDO goes high. Write A - 3 = "0" to program the Fuse bit. Wait after Instr. 4 until SDO goes high. Write F - B = "0" to program the Fuse bit. Wait after Instr. 4 until SDO goes high. Write 2 - 1 = "0" to program the Lock Bit. Reading A - 3 = "0" means the Fuse bit is programmed. Reading F - B = "0" means the fuse bit is programmed. Reading 2, 1 = "0" means the lock bit is programmed. ATtiny13A 8126F-AVR-05/12 ATtiny13A Table 17-13. High-Voltage Serial Programming Instruction Set for ATtiny13A (Continued) Instruction Format Instruction Read Signature Bytes Instr.1/5 Instr.2/6 Instr.3 Instr.4 SDI 0_0000_1000_00 0_0000_00bb_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0000_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqqx_xx 0_0000_1000_00 0_0000_000b_00 0_0000_0000_00 0_0000_0000_00 0_0100_1100_00 0_0000_1100_00 0_0111_1000_00 0_0111_1100_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx p_pppp_pppx_xx SDI Read SII Calibration Byte SDO Load "No Operation" Command SDI 0_0000_0000_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx Operation Remarks Repeats Instr 2 4 for each signature byte address. Note: a = address high bits, b = address low bits, d = data in high bits, e = data in low bits, p = data out high bits, q = data out low bits, x = don't care, 1 = Lock Bit1, 2 = Lock Bit2, 3 = CKSEL0 fuse, 4 = CKSEL1 fuse, 5 = SUT0 fuse, 6 = SUT1 fuse, 7 = CKDIV8, fuse, 8 = WDTON fuse, 9 = EESAVE fuse, A = SPIEN fuse, B = RSTDISBL fuse, C = BODLEVEL0 fuse, D= BODLEVEL1 fuse, E = MONEN fuse, F = SELFPRGEN fuse Note: The EEPROM is written page-wise. But only the bytes that are loaded into the page are actually written to the EEPROM. Pagewise EEPROM access is more efficient when multiple bytes are to be written to the same page. Note that auto-erase of EEPROM is not available in High-voltage Serial Programming, only in SPI Programming. 17.8 Considerations for Efficient Programming The loaded command and address are retained in the device during programming. For efficient programming, the following should be considered. * The command needs only be loaded once when writing or reading multiple memory locations. * Skip writing the data value 0xFF that is the contents of the entire EEPROM (unless the EESAVE fuse is programmed) and Flash after a Chip Erase. * Address High byte needs only be loaded before programming or reading a new 256 word window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes reading. 17.8.1 Chip Erase The Chip Erase will erase the Flash and EEPROM(1) memories plus lock bits. The lock bits are not reset until the Program memory has been completely erased. The fuse bits are not changed. A Chip Erase must be performed before the Flash and/or EEPROM are re-programmed. 1. Load command "Chip Erase" (see Table 17-13 on page 111). 2. Wait after Instr. 3 until SDO goes high for the "Chip Erase" cycle to finish. 3. Load Command "No Operation". Note: 1. The EEPROM memory is preserved during Chip Erase if the EESAVE fuse is programmed. 113 8126F-AVR-05/12 17.8.2 Programming the Flash The Flash is organized in pages, see Table 17-9 on page 108. When programming the Flash, the program data is latched into a page buffer. This allows one page of program data to be programmed simultaneously. The following procedure describes how to program the entire Flash memory: 1. Load Command "Write Flash" (see Table 17-13 on page 111). 2. Load Flash Page Buffer. 3. Load Flash High Address and Program Page. Wait after Instr. 3 until SDO goes high for the "Page Programming" cycle to finish. 4. Repeat 2 through 3 until the entire Flash is programmed or until all data has been programmed. 5. End Page Programming by Loading Command "No Operation". When writing or reading serial data to the ATtiny13A, data is clocked on the rising edge of the serial clock, see Figure 17-4 on page 115, Figure 18-5 on page 123 and Table 18-10 on page 123 for details. Figure 17-3. Addressing the Flash which is Organized in Pages PCMSB PROGRAM COUNTER PAGEMSB PCPAGE PAGE ADDRESS WITHIN THE FLASH PROGRAM MEMORY PAGE PCWORD WORD ADDRESS WITHIN A PAGE PAGE INSTRUCTION WORD PCWORD[PAGEMSB:0]: 00 01 02 PAGEEND 114 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 17-4. High-voltage Serial Programming Waveforms SDI PB0 MSB LSB SII PB1 MSB LSB SDO PB2 SCI PB3 17.8.3 MSB 0 LSB 1 2 3 4 5 6 7 8 9 10 Programming the EEPROM The EEPROM is organized in pages, see Table 18-9 on page 122. When programming the EEPROM, the data is latched into a page buffer. This allows one page of data to be programmed simultaneously. The programming algorithm for the EEPROM Data memory is as follows (refer to Table 17-13 on page 111): 1. Load Command "Write EEPROM". 2. Load EEPROM Page Buffer. 3. Program EEPROM Page. Wait after Instr. 2 until SDO goes high for the "Page Programming" cycle to finish. 4. Repeat 2 through 3 until the entire EEPROM is programmed or until all data has been programmed. 5. End Page Programming by Loading Command "No Operation". 17.8.4 Reading the Flash The algorithm for reading the Flash memory is as follows (refer to Table 17-13 on page 111): 1. Load Command "Read Flash". 2. Read Flash Low and High Bytes. The contents at the selected address are available at serial output SDO. 17.8.5 Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to Table 17-13 on page 111): 1. Load Command "Read EEPROM". 2. Read EEPROM Byte. The contents at the selected address are available at serial output SDO. 17.8.6 Programming and Reading the Fuse and Lock Bits The algorithms for programming and reading the fuse low/high bits and lock bits are shown in Table 17-13 on page 111. 115 8126F-AVR-05/12 17.8.7 Reading the Signature Bytes and Calibration Byte The algorithms for reading the Signature bytes and Calibration byte are shown in Table 17-13 on page 111. 17.8.8 Power-off sequence Set SCI to "0". Set RESET to "1". Turn VCC power off. 116 ATtiny13A 8126F-AVR-05/12 ATtiny13A 18. Electrical Characteristics 18.1 Absolute Maximum Ratings* Operating Temperature.................................. -55C to +125C *NOTICE: Storage Temperature ..................................... -65C to +150C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins ................................ 200.0 mA 18.2 DC Characteristics Table 18-1. Symbol DC Characteristics, TA = -40C to +85C Parameter Input Low Voltage, Any Pin as I/O VIL Input Low Voltage, RESET Pin as Reset (4) Input High Voltage, Any Pin as I/O VIH Input High Voltage, RESET Pin as Reset (4) Condition VCC = 1.8 - 2.4V Min -0.5 Typ(1) Max Units 0.2VCC (2) V (2) V VCC = 2.4 - 5.5V -0.5 0.3VCC VCC = 1.8 - 5.5 -0.5 0.2VCC(2) V VCC = 1.8 - 2.4V 0.7VCC(3) VCC + 0.5 V VCC = 2.4 - 5.5V 0.6VCC(3) VCC + 0.5 V VCC = 1.8 - 5.5V 0.9VCC(3) VCC + 0.5 V Output Low Voltage, Pins PB0 and PB1 (5) IOL = 20 mA, VCC = 5V 0.8 V IOL = 10 mA, VCC = 3V 0.6 V Output Low Voltage, Pins PB2, PB3 and PB4 (5) IOL = 10 mA, VCC = 5V 0.8 V IOL = 5 mA, VCC = 3V 0.6 V Output High Voltage, Pins PB0 and PB1 (6) IOH = -20 mA, VCC = 5V 4.0 V IOH = -10 mA, VCC = 3V 2.3 V Output High Voltage, Pins PB2, PB3 and PB4 (6) IOH = -10 mA, VCC = 5V 4.2 V IOH = -5 mA, VCC = 3V 2.5 V VOL VOH ILIL Input Leakage Current I/O Pin VCC = 5.5V, pin low -1 1 A ILIH Input Leakage Current I/O Pin VCC = 5.5V, pin high -1 1 A Pull-Up Resistor, I/O Pin VCC = 5.5V, input low 20 50 k Pull-Up Resistor, Reset Pin VCC = 5.5V, input low 30 80 k RPU 117 8126F-AVR-05/12 Table 18-1. Symbol DC Characteristics, TA = -40C to +85C (Continued) Parameter Supply Current, Active Mode (7) ICC Supply Current, Idle Mode (7) Supply Current, Power-Down Mode (8) Notes: Typ(1) Max Units f = 1MHz, VCC = 2V 0.2 0.35 mA f = 4MHz, VCC = 3V 1.2 1.8 mA f = 8MHz, VCC = 5V 3.6 6 mA f = 1MHz, VCC = 2V 0.03 0.2 mA f = 4MHz, VCC = 3V 0.2 1 mA f = 8MHz, VCC = 5V 0.7 3 mA WDT enabled, VCC = 3V 3.9 10 A WDT disabled, VCC = 3V 0.15 2 A Condition Min 1. Typical values at +25C. 2. "Max" means the highest value where the pin is guaranteed to be read as low. 3. "Min" means the lowest value where the pin is guaranteed to be read as high. 4. Not tested in production. 5. Although each I/O port can under non-transient, steady state conditions sink more than the test conditions, the sum of all IOL (for all ports) should not exceed 60 mA. If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 6. Although each I/O port can under non-transient, steady state conditions source more than the test conditions, the sum of all IOH (for all ports) should not exceed 60 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 7. Values are with external clock using methods described in "Minimizing Power Consumption" on page 32. Power Reduction is enabled (PRR = 0xFF) and there is no I/O drive. 8. BOD Disabled. 18.3 Speed The maximum operating frequency of the device depends on supply voltage, VCC. As shown in Figure 18-1, the relationship between maximum frequency and VCC is linear in the range of 1.8V to 4.5V. Figure 18-1. Maximum Frequency vs. VCC 20 MHz 4 MHz 1.8V 118 4.5V 5.5V ATtiny13A 8126F-AVR-05/12 ATtiny13A 18.4 Clock Characteristics 18.4.1 Calibrated Internal RC Oscillator Accuracy It is possible to manually calibrate the internal oscillator to be more accurate than default factory calibration. Note that the oscillator frequency depends on temperature and voltage. Voltage and temperature characteristics can be found in Figure 19-59 on page 154, Figure 19-60 on page 154, Figure 19-61 on page 155, Figure 19-62 on page 155, Figure 19-63 on page 156, and Figure 19-64 on page 156. Table 18-2. Calibration Accuracy of Internal RC Oscillator Calibration Method Target Frequency VCC Temperature Accuracy at given Voltage & Temperature(1) 4.8 / 9.6 MHz 3V 25C 10% Fixed frequency within: 4 - 5 MHz / 8 - 10 MHz Fixed voltage within: 1.8 - 5.5V Fixed temperature within: -40C to +85C 2% Factory Calibration User Calibration Notes: 18.4.2 1. Accuracy of oscillator frequency at calibration point (fixed temperature and fixed voltage). External Clock Drive Figure 18-2. External Clock Drive Waveform V IH1 V IL1 Table 18-3. External Clock Drive VCC = 1.8 - 5.5V VCC = 2.7 - 5.5V VCC = 4.5 - 5.5V Symbol Parameter 1/tCLCL Clock Frequency tCLCL Clock Period 250 100 50 ns tCHCX High Time 100 40 20 ns tCLCX Low Time 100 40 20 ns tCLCH Rise Time 2.0 1.6 0.5 s tCHCL Fall Time 2.0 1.6 0.5 s tCLCL Change in period from one clock cycle to the next 2 2 2 % Min. Max. Min. Max. Min. Max. Units 0 4 0 10 0 20 MHz 119 8126F-AVR-05/12 18.5 System and Reset Characteristics Table 18-4. Symbol Reset, Brown-out, and Internal Voltage Characteristics Parameter VRST RESET Pin Threshold Voltage tRST Minimum pulse width on RESET Pin (1) Condition Min Typ 0.2 VCC VCC = 1.8V VCC = 3V VCC = 5V Max Units 0.9VCC V 2500 2500 2500 ns 2000 700 400 VHYST Brown-out Detector Hysteresis (2) 50 mV tBOD Min Pulse Width on Brown-out Reset (2) 2 s VBG Internal bandgap reference voltage VCC = 5V TA = 25C tBG Internal bandgap reference start-up time (2) IBG Internal bandgap reference current consumption (2) Note: 1.0 1.1 1.2 V VCC = 5V TA = 25C 40 70 s VCC = 5V TA = 25C 15 A 1. When RESET pin used as reset (not as I/O). 2. Not tested in production. 18.5.1 Enhanced Power-On Reset Table 18-5. Symbol Characteristics of Enhanced Power-On Reset. TA = -40 to +85C Parameter Release threshold of power-on reset (2) VPOR VPOA Activation threshold of power-on reset SRON Power-On Slope Rate Note: (3) Min(1) Typ(1) Max(1) Units 1.1 1.4 1.6 V 0.6 1.3 1.6 V 0.01 V/ms 1. Values are guidelines only. 2. Threshold where device is released from reset when voltage is rising. 3. The Power-on Reset will not work unless the supply voltage has been below VPOA. 18.5.2 Brown-Out Detection Table 18-6. VBOT vs. BODLEVEL Fuse Coding BODLEVEL[1:0] Fuses Min(1) 11 Note: 120 Typ(1) Max(1) Units BOD Disabled 10 1.7 1.8 2.0 01 2.5 2.7 2.9 00 4.1 4.3 4.5 V 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. ATtiny13A 8126F-AVR-05/12 ATtiny13A 18.6 Analog Comparator Characteristics Table 18-7. Analog Comparator Characteristics, TA = -40C to +85C Symbol Parameter Condition VAIO Input Offset Voltage VCC = 5V, VIN = VCC / 2 ILAC Input Leakage Current VCC = 5V, VIN = VCC / 2 Analog Propagation Delay (from saturation to slight overdrive) VCC = 2.7V 750 VCC = 4.0V 500 Analog Propagation Delay (large step change) VCC = 2.7V 100 VCC = 4.0V 75 Digital Propagation Delay VCC = 1.8 - 5.5V 1 2 CLK Typ Max Units 10 Bits tAPD tDPD Note: All parameters are based on simulation results. 18.7 ADC Characteristics Table 18-8. Symbol Min Typ Max Units < 10 40 mV 50 nA -50 ns ADC Characteristics, Single Ended Channels. TA = -40C to +85C Parameter Condition Min Resolution Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) 3 LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz 4 LSB VREF = 4V, VCC = 4V, ADC clock = 200 kHz, Noise Reduction Mode 2.5 LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz, Noise Reduction Mode 3.5 LSB Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 1 LSB Differential Non-linearity (DNL) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 0.5 LSB Gain Error VREF = 4V, VCC = 4V, ADC clock = 200 kHz 3.5 LSB Offset Error VREF = 4V, VCC = 4V, ADC clock = 200 kHz 2.5 LSB Conversion Time Free Running Conversion Clock Frequency VIN VREF = 4V, VCC = 4V, ADC clock = 200 kHz Input Voltage 13 260 s 50 1000 kHz GND VREF V Input Bandwidth VINT Internal Voltage Reference RAIN Analog Input Resistance 38.5 1.0 1.1 100 kHz 1.2 V M 121 8126F-AVR-05/12 18.8 Serial Programming Characteristics Figure 18-3. Serial Programming Timing MOSI SCK tSLSH tSHOX tOVSH tSHSL MISO Figure 18-4. Serial Programming Waveform SERIAL DATA INPUT (MOSI) MSB LSB SERIAL DATA OUTPUT (MISO) MSB LSB SERIAL CLOCK INPUT (SCK) SAMPLE Table 18-9. Symbol Parameter 1/tCLCL Oscillator Frequency Oscillator Period tCLCL 1/tCLCL 1/tCLCL tCLCL tSHSL Oscillator Period tOVSH MOSI Setup to SCK High tSHOX MOSI Hold after SCK High Typ VCC = 1.8 - 5.5V Units 1 MHz ns 9.6 104 MHz ns 0 VCC = 4.5 - 5.5V Max 1000 0 VCC = 2.7 - 5.5V SCK Pulse Width High SCK Pulse Width Low Min 0 VCC = 1.8 - 5.5V Oscillator Frequency tSLSH Note: Condition Oscillator Frequency Oscillator Period tCLCL 122 Serial Programming Characteristics, TA = -40C to +85C 20 50 MHz ns 2 tCLCL (1) ns 2 tCLCL (1) ns tCLCL ns 2 tCLCL ns 1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz ATtiny13A 8126F-AVR-05/12 ATtiny13A 18.9 High-voltage Serial Programming Characteristics Figure 18-5. High-voltage Serial Programming Timing SDI (PB0), SII (PB1) tIVSH SCI (PB3) tSLSH tSHIX tSHSL SDO (PB2) tSHOV Table 18-10. High-voltage Serial Programming Characteristics TA = 25C, VCC = 5.0V 10% (Unless otherwise noted) Symbol Parameter Min Typ Max Units tSHSL SCI (PB3) Pulse Width High 110 ns tSLSH SCI (PB3) Pulse Width Low 110 ns tIVSH SDI (PB0), SII (PB1) Valid to SCI (PB3) High 50 ns tSHIX SDI (PB0), SII (PB1) Hold after SCI (PB3) High 50 ns tSHOV SCI (PB3) High to SDO (PB2) Valid 16 ns tWLWH_PFB Wait after Instr. 3 for Write Fuse Bits 2.5 ms 123 8126F-AVR-05/12 19. Typical Characteristics The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave. The following charts show typical behavior. These figures are not tested during manufacturing. During characterisation devices are operated at frequencies higher than test limits but they are not guaranteed to function properly at frequencies higher than the ordering code indicates. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. Current consumption is a function of several factors such as operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. A sine wave generator with rail-to-rail output is used as clock source but current consumption in Power-Down mode is independent of clock selection. The difference between current consumption in Power-Down mode with Watchdog Timer enabled and Power-Down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. The current drawn from pins with a capacitive load may be estimated (for one pin) as follows: I CP V CC x C L x f SW where VCC = operating voltage, CL = load capacitance and fSW = average switching frequency of I/O pin. 19.1 Supply Current of I/O Modules Using Table 19-1, the typical characteristics of this section and the equation given one can calculate the additional current consumption for peripheral modules in active and idle mode. Peripheral modules are enabled and disabled via control bits in the Power Reduction Register. See "Power Reduction Register" on page 31 for details. Table 19-1. Additional Current Consumption (Absolute) for Peripherals Typical numbers 19.1.1 PRR bit VCC = 2V, f = 1MHz VCC = 3V, f = 4MHz VCC = 5V, f = 8MHz PRTIM0 4 A 25 A 115 A PRADC 180 A 260 A 460 A Example Estimate current consumption in idle mode, with Timer/Counter0 and ADC enabled, the device running at 2V and with 1MHz external clock. From Figure 19-7 on page 128 we find idle supply current ICC = 0.03 mA. Using Figure 19-18 on page 133 we find ADC supply current I ADC = 0.18 mA, and using Table 19-1 we find Timer/Counter0 supply current ITC0 = 0.004 mA. The total current consumption in idle mode is therefore ICCTOT = 0.214 mA, approximately 0.21 mA. 124 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.2 Current Consumption in Active Mode Figure 19-1. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) ACTIVE SUPPLY CURRENT vs. LOW FREQUENCY (PRR=0xFF) 1 ICC (mA) 0.9 0.8 5.5 V 0.7 5.0 V 0.6 4.5 V 0.5 4.0 V 0.4 3.3 V 0.3 2.7 V 0.2 1.8 V 0.1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Figure 19-2. Active Supply Current vs. Frequency (1 - 20 MHz) ACTIVE SUPPLY CURRENT vs. FREQUENCY (PRR=0xFF) 12 10 5.5 V 8 ICC (mA) 5.0 V 4.5 V 6 4.0 V 4 3.3 V 2 2.7 V 1.8 V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) 125 8126F-AVR-05/12 Figure 19-3. Active Supply Current vs. VCC (Internal RC Oscillator, 9.6 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 9.6 MHz 8 7 6 85 C 25 C -40 C ICC (mA) 5 4 3 2 1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-4. Active Supply Current vs. VCC (Internal RC Oscillator, 4.8 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 4.8 MHz 3.5 85 C 25 C -40 C 3 ICC (mA) 2.5 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 126 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-5. Active Supply Current vs. VCC (Internal WDT Oscillator, 128 kHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL WD OSCILLATOR, 128 KHz 0.12 25 C -40 C 85 C 0.1 ICC (mA) 0.08 0.06 0.04 0.02 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-6. Active Supply Current vs. VCC (32 kHz External Clock) ACTIVE SUPPLY CURRENT vs. VCC 32 KHz EXTERNAL CLOCK, PRR = 0xFF 0.03 85 C 25 C -40 C 0.025 ICC (mA) 0.02 0.015 0.01 0.005 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 127 8126F-AVR-05/12 19.3 Current Consumption in Idle Mode Figure 19-7. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz) IDLE SUPPLY CURRENT vs. LOW FREQUENCY (PRR=0xFF) 0.1 5.5 V 0.08 5.0 V 4.5 V 0.06 ICC (mA) 4.0 V 3.3 V 0.04 2.7 V 1.8 V 0.02 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Figure 19-8. Idle Supply Current vs. Frequency (1 - 20 MHz) IDLE SUPPLY CURRENT vs. FREQUENCY (PRR=0xFF) 2 5.5 V 1.5 5.0 V ICC (mA) 4.5 V 1 4.0 V 3.3 V 0.5 2.7 V 1.8 V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) 128 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 9.6 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 9.6 MHz 1.6 1.4 85 C 25 C -40 C 1.2 ICC (mA) 1 0.8 0.6 0.4 0.2 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 4.8 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 4.8 MHz 0.7 85 C 0.6 25 C -40 C ICC (mA) 0.5 0.4 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 129 8126F-AVR-05/12 Figure 19-11. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 kHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL WD OSCILLATOR, 128 KHz 0.025 -40 C 25 C 85 C 0.02 ICC (mA) 0.015 0.01 0.005 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-12. Idle Supply Current vs. VCC (32 kHz External Clock) IDLE SUPPLY CURRENT vs. VCC 32 KHz EXTERNAL OSCILLATOR, PRR=0xFF 0.006 0.005 85 C 25 C -40 C ICC (mA) 0.004 0.003 0.002 0.001 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 130 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.4 Current Consumption in Power-down Mode Figure 19-13. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER DISABLED 1 0.9 0.8 85 C -40 C 0.7 ICC (uA) 0.6 25 C 0.5 0.4 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-14. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER ENABLED 10 9 -40 C 8 25 C 85 C 7 ICC (uA) 6 5 4 3 2 1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 131 8126F-AVR-05/12 19.5 Current Consumption in Reset Figure 19-15. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, Excluding Current through the Reset Pull-up) RESET SUPPLY CURRENT vs. VCC EXCLUDING CURRENT THROUGH THE RESET PULLUP 0.08 5.5 V 0.07 5.0 V 0.06 4.5 V ICC (mA) 0.05 4.0 V 0.04 3.3 V 0.03 2.7 V 0.02 1.8 V 0.01 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Figure 19-16. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current through the Reset Pull-up) RESET SUPPLY CURRENT vs. VCC EXCLUDING CURRENT THROUGH THE RESET PULLUP 1.4 5.5 V 1.2 5.0 V 1 ICC (mA) 4.5 V 0.8 4.0 V 0.6 3.3 V 0.4 2.7 V 0.2 1.8 V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) 132 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.6 Current Consumption of Peripheral Units Figure 19-17. Brownout Detector Current vs. VCC BROWNOUT DETECTOR CURRENT vs. VCC 30 25 85 C 25 C -40 C ICC (uA) 20 15 10 5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-18. ADC Current vs. VCC ADC CURRENT vs. VCC f = 1.0 MHz 400 85 C 25 C -40 C 350 300 ICC (uA) 250 200 150 100 50 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 133 8126F-AVR-05/12 Figure 19-19. Analog Comparator Current vs. VCC ANALOG COMPARATOR CURRENT vs. VCC f = 1.0 MHz 100 90 85 C 80 25 C -40 C 70 ICC (uA) 60 50 40 30 20 10 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-20. Programming Current vs. VCC PROGRAMMING CURRENT vs. VCC 9000 8000 -40 C ICC (uA) 7000 6000 25 C 5000 85 C 4000 3000 2000 1000 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 134 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.7 Pull-up Resistors Figure 19-21. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 1.8V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 1.8V 60 50 IOP (uA) 40 30 20 10 25 C 85 C -40 C 0 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VOP (V) Figure 19-22. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 3V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 3V 100 90 80 70 IOP (uA) 60 50 40 30 20 10 25 C 85 C -40 C 0 0 0,5 1 1,5 2 2,5 3 3,5 VOP (V) 135 8126F-AVR-05/12 Figure 19-23. Pull-up Resistor Current vs. Input Voltage (I/O Pin, VCC = 5V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 5V 160 85 C 140 25 C -40 C 120 IOP (uA) 100 80 60 40 20 0 0 1 2 3 4 5 6 VOP (V) Figure 19-24. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 1.8V 45 40 35 IRESET (uA) 30 25 20 15 10 25 C -40 C 85 C 5 0 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 VRESET (V) 136 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-25. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 3V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 3V 80 70 60 IRESET (uA) 50 40 30 20 10 25 C -40 C 85 C 0 0 0,5 1 1,5 2 2,5 3 3,5 VRESET (V) Figure 19-26. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 5V 140 120 25 C -40 C 100 IRESET (uA) 85 C 80 60 40 20 0 0 1 2 3 4 5 6 VRESET (V) 137 8126F-AVR-05/12 19.8 Output Driver Strength (Low Power Pins) Figure 19-27. VOH: I/O Pin Output Voltage vs. Source Current (Low Power Pins, VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT LOW POWER PINS, VCC = 1.8V 2 1.8 1.6 1.4 VOH (V) 1.2 -40 C 1 25 C 0.8 85 C 0.6 0.4 0.2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 IOH (mA) Figure 19-28. VOH: I/O Pin Output Voltage vs. Source Current (Low Power Pins, VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT LOW POWER PINS, VCC = 3V 3.5 3 -40 C 25 C 85 C VOH (V) 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10 IOH (mA) 138 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-29. VOH: I/O Pin Output Voltage vs. Source Current (Low Power Pins, VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT LOW POWER PINS, VCC = 5V 5.2 5 VOH (V) 4.8 4.6 -40 C 4.4 25 C 85 C 4.2 4 0 2 4 6 8 10 12 14 16 18 20 IOH (mA) Figure 19-30. VOL: I/O Pin Output Voltage vs. Sink Current (Low Power Pins, VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT LOW POWER PINS, VCC = 1.8V 3 2.5 85 C 25 C VOL (V) 2 1.5 1 -40 C 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 IOL (mA) 139 8126F-AVR-05/12 Figure 19-31. VOL: I/O Pin Output Voltage vs. Sink Current (Low Power Pins, VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT LOW POWER PINS, VCC = 3V 0.9 85 C 0.8 0.7 25 C VOL (V) 0.6 -40 C 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 6 7 8 9 10 IOL (mA) Figure 19-32. VOL: I/O Pin Output Voltage vs. Sink Current (Low Power Pins, VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT LOW POWER PINS, VCC = 5V 1.2 85 C 1 25 C VOL (V) 0.8 -40 C 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) 140 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.9 Output Driver Strength (Regular Pins) Figure 19-33. VOH: I/O Pin Output Voltage vs. Source Current (VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 1.8V 2 1.8 1.6 1.4 -40 C 25 C 85 C VOH (V) 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 IOH (mA) Figure 19-34. VOH: I/O Pin Output Voltage vs. Source Current (VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 3V 3.1 2.9 -40 C 25 C 85 C 2.7 VOH (V) 2.5 2.3 2.1 1.9 1.7 1.5 0 1 2 3 4 5 6 7 8 9 10 IOH (mA) 141 8126F-AVR-05/12 Figure 19-35. VOH: I/O Pin Output Voltage vs. Source Current (VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT V CC = 5V 5.2 5 V OH (V) 4.8 4.6 -40 C 25 C 85 C 4.4 4.2 4 0 2 4 6 8 10 12 14 16 18 20 I OH (mA) Figure 19-36. VOL: I/O Pin Output Voltage vs. Sink Current (VCC = 1.8V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 1.8V 0.5 85 C 0.45 0.4 25 C 0.35 VOL (V) 0.3 -40 C 0.25 0.2 0.15 0.1 0.05 0 0 1 2 3 4 5 6 IOL (mA) 142 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-37. VOL: I/O Pin Output Voltage vs. Sink Current (VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 3V 0.45 0.4 85 C 0.35 25 C 0.3 VOL (V) -40 C 0.25 0.2 0.15 0.1 0.05 0 0 1 2 3 4 5 6 7 8 9 10 IOL (mA) Figure 19-38. VOL: I/O Pin Output Voltage vs. Sink Current (VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 5V 0.7 0.6 85 C VOL (V) 0.5 25 C -40 C 0.4 0.3 0.2 0.1 0 0 2 4 6 8 10 12 14 16 18 20 IOL (mA) 143 8126F-AVR-05/12 Figure 19-39. VOH: Reset Pin as I/O, Output Voltage vs. Source Current (VCC = 1.8V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 1.8V 1,6 1,4 1,2 VOH (V) 1 0,8 0,6 -40 C 0,4 25 C 85 C 0,2 0 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 IOH (mA) Figure 19-40. VOH: Reset Pin as I/O, Output Voltage vs. Source Current (VCC = 3V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 3V 4,5 4 3,5 VOH (V) 3 2,5 2 1,5 -40 C 25 C 85 C 1 0,5 0 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 IOH (mA) 144 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-41. VOH: Reset Pin as I/O, Output Voltage vs. Source Current (VCC = 5V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 5V 4,5 4 3,5 -40 C 25 C 85 C VOH (V) 3 2,5 2 1,5 1 0,5 0 0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1 IOH (mA) Figure 19-42. VOL: Reset Pin as I/O, Output Voltage vs. Sink Current (VCC = 1.8V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 1.8V 1 0,8 VOL (V) 0,6 0,4 85 C 25 C -40 C 0,2 0 0 0,1 0,2 0,3 0,4 0,5 0,6 IOL (mA) 145 8126F-AVR-05/12 Figure 19-43. VOL: Reset Pin as I/O, Output Voltage vs. Sink Current (VCC = 3V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 3V 1,6 1,4 1,2 85 C VOL (V) 1 0,8 25 C 0,6 -40 C 0,4 0,2 0 0 0,5 1 1,5 2 2,5 3 IOL (mA) Figure 19-44. VOL: Reset Pin as I/O, Output Voltage vs. Sink Current (VCC = 5V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 5V 1,6 1,4 VOL (V) 1,2 1 85 C 0,8 25 C 0,6 -40 C 0,4 0,2 0 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 IOL (mA) 146 ATtiny13A 8126F-AVR-05/12 ATtiny13A 19.10 Input Thresholds and Hysteresis (for I/O Ports) Figure 19-45. VIH: Input Threshold Voltage vs. VCC (I/O Pin, Read as '1') I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIH, I/O PIN READ AS '1' 3.5 85 C 25 C -40 C 3 Threshold (V) 2.5 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-46. VIL: Input Threshold Voltage vs. VCC (I/O Pin, Read as '0') I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIL, I/O PIN READ AS '0' 2.5 85 C 25 C -40 C Threshold (V) 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 147 8126F-AVR-05/12 Figure 19-47. VIH-VIL: Input Hysteresis vs. VCC (I/O Pin) I/O PIN INPUT HYSTERESIS vs. VCC 0.6 -40 C 0.5 Input Hysteresis (V) 25 C 0.4 85 C 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-48. VIH: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as '1') RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC VIH, RESET READ AS '1' 3 -40 C 25 C 85 C 2.5 Threshold (V) 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 148 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-49. VIL: Input Threshold Voltage vs. VCC (Reset Pin as I/O, Read as '0') RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC VIL, RESET READ AS '0' 2.5 85 C 25 C -40 C Threshold (V) 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-50. VIH-VIL: Input Hysteresis vs. VCC (Reset Pin as I/O) RESET PIN AS IO, INPUT HYSTERESIS vs. VCC V IL , I/O PIN READ AS "0" 1 0.9 0.8 0.7 Input Hysteresis (V) -40 C 0.6 0.5 25 C 0.4 85 C 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 V CC (V) 149 8126F-AVR-05/12 19.11 BOD, Bandgap and Reset Figure 19-51. BOD Thresholds vs. Temperature (BODLEVEL is 4.3V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL = 4.3V 4.4 VCC RISING Threshold (V) 4.35 4.3 VCC FALLING 4.25 4.2 -60 -40 -20 0 20 40 60 80 100 Temperature (C) Figure 19-52. BOD Thresholds vs. Temperature (BODLEVEL is 2.7V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL = 2.7V 2.8 VCC RISING Threshold (V) 2.75 VCC FALLING 2.7 2.65 2.6 -60 -40 -20 0 20 40 60 80 100 Temperature (C) 150 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-53. BOD Thresholds vs. Temperature (BODLEVEL is 1.8V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL = 1.8V 1.9 1.85 Threshold (V) VCC RISING VCC FALLING 1.8 1.75 1.7 -60 -40 -20 0 20 40 60 80 100 Temperature (C) Figure 19-54. Bandgap Voltage vs. VCC BANDGAP VOLTAGE vs. VCC 1.14 Bandgap Voltage (V) 1.12 85 C 25 C 1.1 -40 C 1.08 1.06 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Vcc (V) 151 8126F-AVR-05/12 Figure 19-55. VIH: Reset Input Threshold Voltage vs. VCC (Reset Pin Read as '1') RESET INPUT THRESHOLD VOLTAGE vs. VCC VIH, I/O PIN READ AS '1' 2.5 -40 C 25 C 85 C Threshold (V) 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-56. VIL: Reset Input Threshold Voltage vs. VCC (Reset Pin Read as '0') RESET INPUT THRESHOLD VOLTAGE vs. VCC VIL, I/O PIN READ AS '0' 2.5 85 C 25 C -40 C Threshold (V) 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 152 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-57. VIH-VIL: Reset Input Pin Hysteresis vs. VCC RESET PIN INPUT HYSTERESIS vs. VCC 1 0.9 Input Hysteresis (V) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -40 C 25 C 85 C 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-58. Minimum Reset Pulse Width vs. VCC MINIMUM RESET PULSE WIDTH vs. VCC 2000 Pulsewidth (ns) 1500 1000 500 85 C 25 C -40 C 0 0 1 2 3 4 5 6 VCC (V) 153 8126F-AVR-05/12 19.12 Internal Oscillator Speed Figure 19-59. Calibrated 9.6 MHz RC Oscillator Frequency vs. Temperature CALIBRATED 9.6MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 10 9.9 5.5 V 4.5 V 9.8 2.7 V 1.8 V Frequency (MHz) 9.7 9.6 9.5 9.4 9.3 9.2 9.1 9 -40 -20 0 20 40 60 80 100 Temperature (C) Figure 19-60. Calibrated 9.6 MHz RC Oscillator Frequency vs. VCC CALIBRATED 9.6MHz RC OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE 10 85 C Frequency (MHz) 9.8 9.6 25 C 9.4 9.2 -40 C 9 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 154 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-61. Calibrated 9.6 MHz RC Oscillator Frequency vs. Osccal Value CALIBRATED 9.6MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE VCC = 3V 20 18 25 C 16 Frequency (MHz) 14 12 10 8 6 4 2 0 0 16 32 48 64 80 96 112 OSCCAL Figure 19-62. Calibrated 4.8 MHz RC Oscillator Frequency vs. Temperature CALIBRATED 4.8MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 5 1.8 V 5.5 V 2.7 V 4.0 V 4.9 Frequency (MHz) 4.8 4.7 4.6 4.5 4.4 4.3 -60 -40 -20 0 20 40 60 80 100 Temperature 155 8126F-AVR-05/12 Figure 19-63. Calibrated 4.8 MHz RC Oscillator Frequency vs. VCC CALIBRATED 4.8MHz RC OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE 5.2 5 Frequency (MHz) 85 C 4.8 25 C 4.6 -40 C 4.4 4.2 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-64. Calibrated 4.8 MHz RC Oscillator Frequency vs. Osccal Value CALIBRATED 4.8MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE VCC = 3V 10 25 C 9 8 Frequency (MHz) 7 6 5 4 3 2 1 0 0 16 32 48 64 80 96 112 OSCCAL 156 ATtiny13A 8126F-AVR-05/12 ATtiny13A Figure 19-65. 128 kHz Watchdog Oscillator Frequency vs. VCC WATCHDOG OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE 116000 114000 Frequency (Hz) 112000 -40 C 25 C 110000 108000 106000 85 C 104000 102000 100000 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 19-66. 128 kHz Watchdog Oscillator Frequency vs. Temperature WATCHDOG OSCILLATOR FREQUENCY vs. TEMPERATURE 115000 114000 113000 Frequency (kH) 112000 111000 110000 1.8 V 109000 2.7 V 108000 107000 4.0 V 106000 5.5 V 105000 -60 -40 -20 0 20 40 60 80 100 Temperature 157 8126F-AVR-05/12 20. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F SREG I T H S V N Z C page 9 0x3E Reserved - - - - - - - - - - - - - - - 158 0x3D SPL 0x3C Reserved - 0x3B GIMSK - INT0 PCIE - - - - - page 47 0x3A GIFR - INTF0 PCIF - - - - - page 48 0x39 TIMSK0 - - - - OCIE0B OCIE0A TOIE0 - page 75 0x38 TIFR0 - - - - OCF0B OCF0A TOV0 0x37 SPMCSR - - - CTPB RFLB PGWRT PGERS - SELFPR- page 98 - PUD SE SM1 0x36 OCR0A 0x35 MCUCR SP[7:0] page 11 Timer/Counter - Output Compare Register A page 76 page 75 SM0 - ISC01 ISC00 pages 33, 47, 57 0x34 MCUSR - - - - WDRF BORF EXTRF PORF page 42 0x33 TCCR0B FOC0A FOC0B - - WGM02 CS02 CS01 CS00 page 73 0x32 TCNT0 Timer/Counter (8-bit) 0x31 OSCCAL Oscillator Calibration Register 0x30 BODCR - - - - - - BODS BODSE page 33 0x2F TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 - - WGM01 WGM00 page 70 0x2E DWDR DWDR[7:0] 0x2D Reserved - 0x2C Reserved - 0x2B Reserved - 0x2A Reserved - 0x29 OCR0B Timer/Counter - Output Compare Register B 0x28 GTCCR 0x27 Reserved 0x26 CLKPR CLKPCE - - 0x25 PRR - - - 0x24 Reserved - 0x23 Reserved - 0x22 Reserved 0x21 WDTCR 0x20 Reserved TSM - - - page 74 page 27 page 97 page 75 - - - PSR10 page 78 - CLKPS3 CLKPS2 CLKPS1 CLKPS0 page 28 - - - PRTIM0 PRADC page 34 WDE WDP2 WDP1 WDP0 page 42 - - WDTIF WDTIE WDP3 WDCE - - 0x1F Reserved 0x1E EEARL 0x1D EEDR 0x1C EECR 0x1B Reserved - 0x1A Reserved - 0x19 Reserved 0x18 PORTB - - PORTB5 0x17 DDRB - - 0x16 PINB - 0x15 PCMSK 0x14 DIDR0 - - EEPROM Address Register page 20 EEPROM Data Register - - EEPM1 EEPM0 page 20 EERIE EEMPE EEPE EERE page 21 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 page 57 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 page 57 - PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 page 58 - - PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 page 48 - - ADC0D ADC2D ADC3D ADC1D AIN1D AIN0D pages 81, 95 - 0x13 Reserved - 0x12 Reserved - 0x11 Reserved - 0x10 Reserved - 0x0F Reserved - 0x0E Reserved - 0x0D Reserved - 0x0C Reserved - 0x0B Reserved - 0x0A Reserved - 0x09 Reserved 0x08 ACSR ACD ACBG ACO ACI ACIE - ACIS1 ACIS0 page 80 0x07 ADMUX - REFS0 ADLAR - - - MUX1 MUX0 page 92 0x06 ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 page 93 0x05 ADCH ADC Data Register High Byte 0x04 ADCL ADC Data Register Low Byte 0x03 ADCSRB 0x02 Reserved - 0x01 Reserved - 0x00 Reserved - - - ACME - - - page 94 page 94 ADTS2 ADTS1 ADTS0 pages 80, 95 ATtiny13A 8126F-AVR-05/12 ATtiny13A Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.ome of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 159 8126F-AVR-05/12 21. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd Rd * Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd Rd * K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd Rd Rr Z,N,V 1 COM Rd One's Complement Rd 0xFF - Rd Z,C,N,V 1 NEG Rd Two's Complement Rd 0x00 - Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd Rd * (0xFF - K) Z,N,V 1 INC Rd Increment Rd Rd + 1 Z,N,V 1 DEC Rd Decrement Rd Rd - 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd Rd * Rd Z,N,V 1 CLR Rd Clear Register Rd Rd Rd Z,N,V 1 SER Rd Set Register Rd 0xFF None 1 2 BRANCH INSTRUCTIONS RJMP k IJMP RCALL k Relative Jump PC PC + k + 1 None Indirect Jump to (Z) PC Z None 2 Relative Subroutine Call PC PC + k + 1 None 3 ICALL Indirect Call to (Z) PC Z None 3 RET Subroutine Return PC STACK None 4 RETI Interrupt Return PC STACK I 4 Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1/2/3 CPSE Rd,Rr CP Rd,Rr Compare Rd - Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd - Rr - C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd - K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PCPC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PCPC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N V= 1) then PC PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC PC + k + 1 None 1/2 SBI P,b Set Bit in I/O Register I/O(P,b) 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) 0 None 2 LSL Rd Logical Shift Left Rd(n+1) Rd(n), Rd(0) 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) Rd(n+1), Rd(7) 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)C,Rd(n+1) Rd(n),CRd(7) Z,C,N,V 1 BIT AND BIT-TEST INSTRUCTIONS 160 ATtiny13A 8126F-AVR-05/12 ATtiny13A Mnemonics Operands Description Operation Flags ROR Rd Rotate Right Through Carry Rd(7)C,Rd(n) Rd(n+1),CRd(0) Z,C,N,V #Clocks 1 ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)Rd(7..4),Rd(7..4)Rd(3..0) None 1 BSET s Flag Set SREG(s) 1 SREG(s) 1 BCLR s Flag Clear SREG(s) 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) T None 1 1 SEC Set Carry C1 C CLC Clear Carry C0 C 1 SEN Set Negative Flag N1 N 1 CLN Clear Negative Flag N0 N 1 SEZ Set Zero Flag Z1 Z 1 CLZ Clear Zero Flag Z0 Z 1 SEI Global Interrupt Enable I1 I 1 CLI Global Interrupt Disable I0 I 1 SES Set Signed Test Flag S1 S 1 CLS Clear Signed Test Flag S0 S 1 SEV Set Twos Complement Overflow. V1 V 1 CLV Clear Twos Complement Overflow V0 V 1 SET Set T in SREG T1 T 1 CLT Clear T in SREG T0 T 1 SEH CLH Set Half Carry Flag in SREG Clear Half Carry Flag in SREG H1 H0 H H 1 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers 1 Rd, Rr Copy Register Word Rd Rr Rd+1:Rd Rr+1:Rr None MOVW None 1 LDI Rd, K Load Immediate Rd K None 1 LD Rd, X Load Indirect Rd (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd (X), X X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X X - 1, Rd (X) None 2 LD Rd, Y Load Indirect Rd (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd (Y), Y Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y Y - 1, Rd (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd (Y + q) None 2 LD Rd, Z Load Indirect Rd (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd (Z), Z Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z Z - 1, Rd (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd (k) None 2 ST X, Rr Store Indirect (X) Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) Rr, X X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X X - 1, (X) Rr None 2 ST Y, Rr Store Indirect (Y) Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) Rr, Y Y + 1 None 2 2 ST - Y, Rr Store Indirect and Pre-Dec. Y Y - 1, (Y) Rr None STD Y+q,Rr Store Indirect with Displacement (Y + q) Rr None 2 ST Z, Rr Store Indirect (Z) Rr None 2 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) Rr, Z Z + 1 None ST -Z, Rr Store Indirect and Pre-Dec. Z Z - 1, (Z) Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2 STS k, Rr Store Direct to SRAM (k) Rr None 2 Load Program Memory R0 (Z) None 3 LPM LPM Rd, Z Load Program Memory Rd (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd (Z), Z Z+1 None 3 Store Program Memory (z) R1:R0 None SPM IN Rd, P In Port Rd P None 1 OUT P, Rr Out Port P Rr None 1 PUSH Rr Push Register on Stack STACK Rr None 2 POP Rd Pop Register from Stack Rd STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR BREAK Watchdog Reset Break (see specific descr. for WDR/Timer) For On-chip Debug Only None None 1 N/A 161 8126F-AVR-05/12 22. Ordering Information Speed (MHz) Power Supply (V) 20 Notes: 1.8 - 5.5 Ordering Code(1) Package(2) Operation Range 8P3 8S2 8S2 8S2 8S2 8S1 8S1 8S1 8S1 20M1 20M1 10M1(3) 10M1(3) Industrial (-40C to +85C)(4) ATtiny13A-SN ATtiny13A-SNR ATtiny13A-SS7 ATtiny13A-SS7R 8S2 8S2 8S1 8S1 Industrial (-40C to +105C)(5) ATtiny13A-SF ATtiny13A-SFR ATtiny13A-MMF ATtiny13A-MMFR 8S2 8S2 10M1(3) 10M1(3) Industrial (-40C to +125C)(6) ATtiny13A-PU ATtiny13A-SU ATtiny13A-SUR ATtiny13A-SH ATtiny13A-SHR ATtiny13A-SSU ATtiny13A-SSUR ATtiny13A-SSH ATtiny13A-SSHR ATtiny13A-MU ATtiny13A-MUR ATtiny13A-MMU(3) ATtiny13A-MMUR(3) 1. Code indicators: - H or 7: NiPdAu lead finish - U, N or F: matte tin - R: tape & reel 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Topside marking for ATtiny13A: - 1st Line: T13 - 2nd Line: Axx - 3rd Line: xxx 4. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 5. For typical and Electrical characteristics for this device please consult Appendix A, ATtiny13A Specification at 105C. 6. For typical and Electrical characteristics for this device please consult Appendix B, ATtiny13A Specification at 125C. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S2 8-lead, 0.209" Wide, Plastic Small Outline Package (EIAJ SOIC) 8S1 8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF) 10M1 10-pad, 3 x 3 x 1 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF) 162 ATtiny13A 8126F-AVR-05/12 ATtiny13A 23. Packaging Information 23.1 8P3 E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN NOM A b2 b3 b 4 PLCS Side View L 0.210 NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 0.100 BSC eA 0.300 BSC 0.115 3 3 e L Notes: MAX 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B 163 8126F-AVR-05/12 23.2 8S2 C 1 E E1 L N TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D SIDE VIEW NOTE 1.70 2.16 A1 0.05 0.25 b 0.35 0.48 4 C 0.15 0.35 4 D 5.13 5.35 E1 5.18 5.40 E 7.70 8.26 L 0.51 0.85 0 8 1.27 BSC 2 3 This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. Mismatch of the upper and lower dies and resin burrs aren't included. Determines the true geometric position. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. Package Drawing Contact: packagedrawings@atmel.com 164 MAX NOM A e Notes: 1. 2. 3. 4. MIN TITLE 8S2, 8-lead, 0.208" Body, Plastic Small Outline Package (EIAJ) GPC STN 4/15/08 DRAWING NO. REV. 8S2 F ATtiny13A 8126F-AVR-05/12 ATtiny13A 23.3 8S1 4 2 3 1 H N Top View e B A D COMMON DIMENSIONS (Unit of Measure = mm) Side View A2 C L SYMBOL MIN NOM MAX A - - 1.75 B - - 0.51 C - - 0.25 D - - 5.00 E - - 4.00 e E End View NOTE 1.27 BSC H - - 6.20 L - - 1.27 Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc. 2010-10-20 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. REV. 8S1 B 165 8126F-AVR-05/12 23.4 20M1 D 1 Pin 1 ID 2 SIDE VIEW E 3 TOP VIEW A2 D2 A1 A 0.08 1 2 Pin #1 Notch (0.20 R) 3 COMMON DIMENSIONS (Unit of Measure = mm) E2 b L e BOTTOM VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 - 0.01 0.05 A2 b 0.18 D D2 E2 L 0.23 0.30 4.00 BSC 2.45 2.60 2.75 4.00 BSC 2.45 e Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. NOTE 0.20 REF E Note: C 2.60 2.75 0.50 BSC 0.35 0.40 0.55 10/27/04 R 166 2325 Orchard Parkway San Jose, CA 95131 TITLE 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 20M1 REV. B ATtiny13A 8126F-AVR-05/12 ATtiny13A 23.5 10M1 D y Pin 1 ID SIDE VIEW E TOP VIEW A1 A D1 K COMMON DIMENSIONS (Unit of Measure = mm) 1 2 b E1 e SYMBOL MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D 2.90 3.00 3.10 D1 1.40 - 1.75 E 2.90 3.00 3.10 E1 2.20 - 2.70 e L BOTTOM VIEW NOTE 0.50 L 0.30 - 0.50 y - - 0.08 K 0.20 - - Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5. 2. The terminal #1 ID is a Lasser-marked Feature. R TITLE 2325 Orchard Parkway 10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm, San Jose, CA 95131 1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package 7/7/06 DRAWING NO. REV. 10M1 A 167 8126F-AVR-05/12 24. Errata The revision letters in this section refer to the revision of the ATtiny13A device. 24.1 ATtiny13A Rev. G - H * EEPROM can not be written below 1.9 Volt 1. EEPROM can not be written below 1.9 Volt Writing the EEPROM at VCC below 1.9 volts might fail. Problem Fix/Workaround Do not write the EEPROM when VCC is below 1.9 volts. 24.2 ATtiny13A Rev. E - F These device revisions were not sampled. 24.3 ATtiny13 Rev. A - D These device revisions were referred to as ATtiny13/ATtiny13V. 168 ATtiny13A 8126F-AVR-05/12 ATtiny13A 25. Datasheet Revision History Please note that page numbers in this section refer to the current version of this document and may not apply to previous versions. 25.1 Rev. 8126F - 05/12 1. Updated Table 10-5 on page 57. 2. Updated order codes on page 162. 25.2 Rev. 8126E - 07/10 1. Updated description in Section 6.4.2 "CLKPR - Clock Prescale Register" on page 28. 2. Adjusted notes in Table 18-1, "DC Characteristics, TA = -40C to +85C," on page 117. 3. Updated plot order in Section 19. "Typical Characteristics" on page 124, added some plots, also some headers and figure titles adjusted. 4. Updated Section 22. "Ordering Information" on page 162, added extended temperature part numbers, as well tape & reel part numbers. Notes adjusted. 5. Updated bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0]. 25.3 Rev. 8126D - 11/09 1. Added note "If the RSTDISPL fuse is programmed..." in Startup-up Times Table 6-5 and Table 6-6 on page 26. 2. Added addresses in all Register Description tables and cross-references to Register Summary. 3. Updated naming convention for -COM bits in tables from Table 11-2 on page 70 to Table 11-7 on page 72. 4. Updated value for tWD_ERASE in Table 17-8, "Minimum Wait Delay Before Writing the Next Flash or EEPROM Location," on page 108. 5. Added NiPdAU note for -SH and -SSH in Section 22. "Ordering Information" on page 162. 25.4 Rev. 8126C - 09/09 1. Added EEPROM errata for rev. G - H on page 168. 2. Added a note about topside marking in Section 22. "Ordering Information" on page 162. 25.5 Rev. 8126B - 11/08 1. Updated order codes on page 162 to reflect changes in material composition. 2. Updated sections: - "DIDR0 - Digital Input Disable Register 0" on page 81 - "DIDR0 - Digital Input Disable Register 0" on page 95 3. Updated "Register Summary" on page 158. 25.6 Rev. 8126A - 05/08 1. Initial revision, created from document 2535I - 04/08. 2. Updated characteristic plots of section "Typical Characteristics" , starting on page 124. 3. Updated "Ordering Information" on page 162. 4. Updated section: 169 8126F-AVR-05/12 - "Speed" on page 118 5. Update tables: - "DC Characteristics, TA = -40C to +85C" on page 117 - "Calibration Accuracy of Internal RC Oscillator" on page 119 - "Reset, Brown-out, and Internal Voltage Characteristics" on page 120 - "ADC Characteristics, Single Ended Channels. TA = -40C to +85C" on page 121 - "Serial Programming Characteristics, TA = -40C to +85C" on page 122 6. Added description of new function, "Power Reduction Register": - Added functional description on page 31 - Added bit description on page 34 - Added section "Supply Current of I/O Modules" on page 124 - Updated Register Summary on page 158 7. Added description of new function, "Software BOD Disable": - Added functional description on page 31 - Updated section on page 32 - Added register description on page 33 - Updated Register Summary on page 158 8. Added description of enhanced function, "Enhanced Power-On Reset": - Updated Table 18-4 on page 120, and Table 18-5 on page 120 170 ATtiny13A 8126F-AVR-05/12 ATtiny13A Table of Contents Features ..................................................................................................... 1 1 Pin Configurations ................................................................................... 2 1.1 2 Overview ................................................................................................... 4 2.1 3 4 5 6 7 Pin Description ..................................................................................................3 Block Diagram ...................................................................................................4 About ......................................................................................................... 6 3.1 Resources .........................................................................................................6 3.2 Code Examples .................................................................................................6 3.3 Data Retention ...................................................................................................6 CPU Core .................................................................................................. 7 4.1 Architectural Overview .......................................................................................7 4.2 ALU - Arithmetic Logic Unit ...............................................................................8 4.3 Status Register ..................................................................................................8 4.4 General Purpose Register File ........................................................................10 4.5 Stack Pointer ...................................................................................................11 4.6 Instruction Execution Timing ...........................................................................12 4.7 Reset and Interrupt Handling ...........................................................................12 Memories ................................................................................................ 15 5.1 In-System Reprogrammable Flash Program Memory .....................................15 5.2 SRAM Data Memory ........................................................................................15 5.3 EEPROM Data Memory ..................................................................................16 5.4 I/O Memory ......................................................................................................20 5.5 Register Description ........................................................................................20 System Clock and Clock Options ......................................................... 23 6.1 Clock Systems and their Distribution ...............................................................23 6.2 Clock Sources .................................................................................................24 6.3 System Clock Prescaler ..................................................................................26 6.4 Register Description ........................................................................................27 Power Management and Sleep Modes ................................................. 30 7.1 Sleep Modes ....................................................................................................30 7.2 Software BOD Disable .....................................................................................31 7.3 Power Reduction Register ...............................................................................31 i 8126F-AVR-05/12 8 9 7.4 Minimizing Power Consumption ......................................................................32 7.5 Register Description ........................................................................................33 System Control and Reset .................................................................... 35 8.1 Resetting the AVR ...........................................................................................35 8.2 Reset Sources .................................................................................................36 8.3 Internal Voltage Reference ..............................................................................38 8.4 Watchdog Timer ..............................................................................................38 8.5 Register Description ........................................................................................42 Interrupts ................................................................................................ 45 9.1 Interrupt Vectors ..............................................................................................45 9.2 External Interrupts ...........................................................................................46 9.3 Register Description ........................................................................................47 10 I/O Ports .................................................................................................. 49 10.1 Overview ..........................................................................................................49 10.2 Ports as General Digital I/O .............................................................................50 10.3 Alternate Port Functions ..................................................................................54 10.4 Register Description ........................................................................................57 11 8-bit Timer/Counter0 with PWM ............................................................ 59 11.1 Features ..........................................................................................................59 11.2 Overview ..........................................................................................................59 11.3 Timer/Counter Clock Sources .........................................................................60 11.4 Counter Unit ....................................................................................................60 11.5 Output Compare Unit .......................................................................................61 11.6 Compare Match Output Unit ............................................................................63 11.7 Modes of Operation .........................................................................................64 11.8 Timer/Counter Timing Diagrams .....................................................................68 11.9 Register Description ........................................................................................70 12 Timer/Counter Prescaler ....................................................................... 77 12.1 Overview ..........................................................................................................77 12.2 Prescaler Reset ...............................................................................................77 12.3 External Clock Source .....................................................................................77 12.4 Register Description. .......................................................................................78 13 Analog Comparator ............................................................................... 79 13.1 ii Analog Comparator Multiplexed Input .............................................................79 ATtiny13A 8126F-AVR-05/12 ATtiny13A 13.2 Register Description ........................................................................................80 14 Analog to Digital Converter .................................................................. 82 14.1 Features ..........................................................................................................82 14.2 Overview ..........................................................................................................82 14.3 Operation .........................................................................................................83 14.4 Starting a Conversion ......................................................................................83 14.5 Prescaling and Conversion Timing ..................................................................84 14.6 Changing Channel or Reference Selection .....................................................87 14.7 ADC Noise Canceler .......................................................................................88 14.8 Analog Input Circuitry ......................................................................................88 14.9 Analog Noise Canceling Techniques ...............................................................89 14.10 ADC Accuracy Definitions ...............................................................................89 14.11 ADC Conversion Result ...................................................................................92 14.12 Register Description ........................................................................................92 15 debugWIRE On-chip Debug System .................................................... 96 15.1 Features ..........................................................................................................96 15.2 Overview ..........................................................................................................96 15.3 Physical Interface ............................................................................................96 15.4 Software Break Points .....................................................................................97 15.5 Limitations of debugWIRE ...............................................................................97 15.6 Register Description ........................................................................................97 16 Self-Programming the Flash ................................................................. 98 16.1 Performing Page Erase by SPM ......................................................................98 16.2 Filling the Temporary Buffer (Page Loading) ...................................................98 16.3 Performing a Page Write .................................................................................99 16.4 Addressing the Flash During Self-Programming .............................................99 16.5 EEPROM Write Prevents Writing to SPMCSR ..............................................100 16.6 Reading Fuse and Lock Bits from Firmware .................................................100 16.7 Preventing Flash Corruption ..........................................................................101 16.8 Programming Time for Flash when Using SPM ............................................101 16.9 Register Description ......................................................................................102 17 Memory Programming ......................................................................... 103 17.1 Program And Data Memory Lock Bits ...........................................................103 17.2 Fuse Bytes .....................................................................................................104 17.3 Calibration Bytes ...........................................................................................105 iii 8126F-AVR-05/12 17.4 Signature Bytes .............................................................................................105 17.5 Page Size ......................................................................................................105 17.6 Serial Programming .......................................................................................106 17.7 High-Voltage Serial Programming .................................................................109 17.8 Considerations for Efficient Programming .....................................................113 18 Electrical Characteristics .................................................................... 117 18.1 Absolute Maximum Ratings* .........................................................................117 18.2 DC Characteristics .........................................................................................117 18.3 Speed ............................................................................................................118 18.4 Clock Characteristics .....................................................................................119 18.5 System and Reset Characteristics ................................................................120 18.6 Analog Comparator Characteristics ...............................................................121 18.7 ADC Characteristics ......................................................................................121 18.8 Serial Programming Characteristics ..............................................................122 18.9 High-voltage Serial Programming Characteristics .........................................123 19 Typical Characteristics ........................................................................ 124 19.1 Supply Current of I/O Modules ......................................................................124 19.2 Current Consumption in Active Mode ............................................................125 19.3 Current Consumption in Idle Mode ................................................................128 19.4 Current Consumption in Power-down Mode ..................................................131 19.5 Current Consumption in Reset ......................................................................132 19.6 Current Consumption of Peripheral Units ......................................................133 19.7 Pull-up Resistors ...........................................................................................135 19.8 Output Driver Strength (Low Power Pins) .....................................................138 19.9 Output Driver Strength (Regular Pins) ...........................................................141 19.10 Input Thresholds and Hysteresis (for I/O Ports) ............................................147 19.11 BOD, Bandgap and Reset .............................................................................150 19.12 Internal Oscillator Speed ...............................................................................154 20 Register Summary ............................................................................... 158 21 Instruction Set Summary .................................................................... 160 22 Ordering Information ........................................................................... 162 23 Packaging Information ........................................................................ 163 iv 23.1 8P3 ................................................................................................................163 23.2 8S2 ................................................................................................................164 ATtiny13A 8126F-AVR-05/12 ATtiny13A 23.3 8S1 ................................................................................................................165 23.4 20M1 ..............................................................................................................166 23.5 10M1 ..............................................................................................................167 24 Errata ..................................................................................................... 168 24.1 ATtiny13A Rev. G - H ...................................................................................168 24.2 ATtiny13A Rev. E - F ....................................................................................168 24.3 ATtiny13 Rev. A - D ......................................................................................168 25 Datasheet Revision History ................................................................ 169 25.1 Rev. 8126F - 05/12 .......................................................................................169 25.2 Rev. 8126E - 07/10 .......................................................................................169 25.3 Rev. 8126D - 11/09 .......................................................................................169 25.4 Rev. 8126C - 09/09 .......................................................................................169 25.5 Rev. 8126B - 11/08 .......................................................................................169 25.6 Rev. 8126A - 05/08 .......................................................................................169 v 8126F-AVR-05/12 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL'S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL'S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel's products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. (c) 2012 Atmel Corporation. All rights reserved. Atmel(R), logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 8126F-AVR-05/12