ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 ISOLATED RS-485 PROFIBUS TRANSCEIVER Check for Samples: ISO1176 FEATURES * * * * 1 * * * * * 4000-VPEAK Isolation, 560-Vpeak VIORM - UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), IEC 61010-1, IEC 60950-1 and CSA Approved Bus-Pin ESD Protection - 16 kV HBM Between Bus Pins and GND2 - 6 kV HBM Between Bus Pins and GND1 Meets or Exceeds the Requirements of EN 50170 and TIA/EIA-485 Signaling Rates up to 40 Mbps Differential Output Exceeds 2.1 V (54 Load) Low Bus Capacitance - 10 pF (MAX) 50 kV/ms Typical Transient Immunity Failsafe Receiver for Bus Open, Short, Idle 3.3-V Inputs are 5-V Tolerant APPLICATIONS * * * * * * Profibus Factory Automation Networked Sensors Motor/Motion Control HVA and Building Automation Networks Networked Security Stations DESCRIPTION The ISO1176 is an isolated differential line transceiver designed for use in PROFIBUS applications. The device is ideal for long transmission lines since the ground loop is broken to provide for operation with a much larger common mode voltage range. The symmetrical isolation barrier of each device is tested to provide 2500 Vrms of isolation between the line transceiver and the logic level interface. The galvanically isolated differential bus transceiver is an integrated circuit designed for bi-directional data communication on multipoint bus-transmission lines. The transceiver combines a galvanically isolated differential line driver and differential input line receiver. The driver has an active-high enable with isolated enable-state output on the ISODE pin (pin 10) to facilitate direction control. The driver differential outputs and the receiver differential inputs connect internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus allowing up to 160 nodes. The PV pin (pin 7) is provided as a full-chip enable option. All device outputs become high impedance when a logic low is applied to the PV pin. For more information, see the function tables in the device information section. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration. The ISO1176 can significantly reduce the risk of data corruption and damage to expensive control circuits. The device is characterized for operation over the ambient temperature range of -40C to 85C. DW PACKAGE (TOP VIEW) 1 16 VCC2 GND 1 2 15 ISO1176 function diagram R 3 14 GND 2 NC RE 4 13 B DE D 5 12 6 11 A NC PV PV 7 10 ISODE DE GND 1 8 9 GND 2 R RE D 3 4 6 7 5 GALVANIC ISOLATION VCC1 13 12 10 B A ISODE 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2008-2010, Texas Instruments Incorporated ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS over operating junction temperature range unless otherwise noted (1) VALUE UNIT -0.5 to 7 V Voltage at any bus I/O terminal -9 to 14 V Voltage input at any D, DE or RE terminal -0.5 to 7 V 10 mA VCC1, VCC2 Supply voltage VO VI IO Receiver output current (2) Human Body Model ESD TJ (1) (2) Electrostatic discharge JEDEC Standard 22, Test Method A114-C.01 Bus pins to GND1 6 Bus pins to GND2 16 All pins 4 kV Charged Device Model JEDEC Standard 22, Test Method C101 All pins 1 Machine model ANSI/ESDS5.2-1996 All pins 200 V 170 C Maximum junction temperature Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. All voltage values except differential I/O bus voltages are with respect to the referenced network ground terminal and are peak voltage values. RECOMMENDED OPERATING CONDITIONS MIN VCC VCM 5.5 Bus side supply voltage, VCC2 (with respect to GND2) 4.75 5.25 Voltage at either bus I/O terminal High-level input voltage VIL Low-level input voltage VID Differential input voltage A, B PV, RE D, DE -7 12 2 VCC1 PV, RE 0 V V V 0.8 D, DE Output current UNIT 0.7 VCC1 V 0.3 VCC1 A with respect to B -12 12 Driver -70 70 -8 8 Receiver Input pulse width TJ MAX 3.15 VIH IO TYP Logic side supply voltage, VCC1 (with respect to GND1) V mA 10 Operating junction temperature ns -40 150 C SUPPLY CURRENT over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS 3V ICC1 Logic side RMS supply current 5.5 V 2 TYP MAX DE at 0 V 4 6 DE at VCC1, 2 Mbps 5 DE at VCC1, 25 Mbps 6 DE at 0 V 7 DE at VCC1, 2 Mbps 8 DE at VCC1, 25 Mbps 11 Submit Documentation Feedback MIN UNIT mA 10 mA Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 SUPPLY CURRENT (continued) over recommended operating conditions (unless otherwise noted) PARAMETER ICC2 Bus side RMS supply current TEST CONDITIONS 5.25 V MIN TYP MAX DE at 0 V 15 18 DE at VCC1, 2 Mbps, 54 load 70 DE at VCC1, 25 Mbps, 54 load 75 UNIT mA ISODE-PIN ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VOH High-level output voltage VOL Low-level output voltage MIN TYP IOH = -8 mA TEST CONDITIONS VCC2 - 0.8 4.6 IOH = -20 mA VCC2 - 0.1 5 MAX UNIT V IOL = 8 mA 0.2 0.4 IOL = 20 mA 0 0.1 V DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VOD TEST CONDITIONS Open-circuit differential output voltage MIN |VA - VB|, Figure 1 1.5 See Figure 2 and Figure 6 2.1 Common-mode loading with Vtest from -7 V to 12 V, See Figure 3 2.1 |VOD(SS)| Steady-state differential output voltage magnitude |VOD(SS)| Change in steady-state differential output voltage between logic states VOC(SS) Steady-state common-mode output voltage VOC(SS) Change in steady-state common-mode output RL = 54 , See Figure 4 and Figure 5 voltage VOC(PP) Peak-to-peak common-mode output voltage VOD(RING) Differential output voltage over and under shoot See Figure 6 and Figure 10 VI(HYS) Input voltage hysteresis See Figure 7 II Input current IO(OFF) Output current with power off VCC 2.5 V IOZ High impedance state output current DE at 0 V IOS(P) Peak short-circuit output current IOS(SS) Steady-state short-circuit output current COD Differential output capacitance CMTI Common-mode transient immunity (1) RL = 54 , See Figure 4 andFigure 5 TYP MAX UNIT VCC2 V V -0.2 0.2 2 3 -0.2 0.2 V V 0.5 10% 150 D, DE at 0 V or VCC1 mV -10 PV (1) at 0 V or VCC1 10 mA 120 See Receiver input current VOS = -7 V to 12 V DE at VCC, See Figure 8 and Figure 9 VOD(pp) -250 VOS = 12 V, D at GND1 VOS = -7 V, D at VCC1 250 135 mA -135 See Receiver CIN See Figure 20 25 kV/ms The PV pin has a 50 k pull-up resistor and leakage current depends on supply voltage. Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 3 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN tpLH, tpHL Propagation delay time tsk(p) Pulse skew (|tp HL - tpLH|) tpLH, tpHL Propagation delay time tsk(p) Pulse skew (|tp HL - tp LH|) tr Differential output signal rise time 2 tf Differential output signal fall time 2 tpDE DE to ISODE prop delay tt(MLH), tt(MHL) Output transition skew tp(AZH), tp(BZH) tp(AZL), tp(BZL) Propagation delay time, high-impedance-to-active output tp(AHZ), tp(BHZ) tp(ALZ), tp(BLZ) Propagation delay time, active-to- high-impedance output |tp(AZL) - tp(BZH)| |tp(AZH) - tp(BZL)| Enable skew time t(CFB) Time from application of short-circuit to current foldback See Figure 9 t(TSD) Time from application of short-circuit to thermal shutdown TA = 25C, See Figure 9 VCC1 at 3.3 V VCC2 at 5 V TYP MAX UNIT 35 ns 5 ns 40 ns 2 5 ns 3 7.5 ns 3 7.5 ns See Figure 14 30 ns See Figure 11 1 ns 80 ns 80 ns 1.5 ns VCC1 at 5 V VCC2 at 5 V 2 See Figure 10 CL = 50 pF, RE at 0 V, See Figure 12 and Figure 13 0.55 0.5 ms 100 ms RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VIT(+) Positive-going differential input voltage threshold VIT(-) Negative-going differential input voltage threshold Vhys Hysteresis voltage (VIT+ - VIT-) VOH TEST CONDITIONS SeeFigure 15 High-level output voltage VCC1 at 3.3 V and VCC2 at 5V MIN IO = -8 mA IO = 8 mA -200 TYP MAX UNIT -80 -10 mV -120 mV 40 mV VID = 200 mV, See Figure 15 IOH = -8 mA VCC1 -0.4 3 IO H = -20 mA VCC1 -0.1 3.3 V VOL Low-level output voltage VID = -200 mV, See Figure 15 IO L = 8 mA 0.2 0.4 IOL = 20 mA 0 0.1 VOH High-level output voltage VID = 200 mV, See Figure 15 IOH = -8 mA VCC1 -0.8 4.6 IO H = -20 mA VCC1 -0.1 5 Low-level output voltage VID = -200 mV, See Figure 15 IO L = 8 mA IA(OFF) IB(OFF) Bus pin input current VI = -7 V or 12 V, Other input = 0 V II Receiver enable input current IOZ High-impedance state output current RID VCC1 at 5 V and VCC2 at 5 V VOL IA, IB IOL = -20 mA V V 0.2 0.4 0 0.1 V VCC = 4.75 V or 5.25 V -160 200 mA RE = 0 V -50 50 mA RE = VCC1 -1 1 Differential input resistance A, B 48 CID Differential input capacitance Test input signal is a 1.5 MHz sine wave with 1 Vpp amplitude , CD is measured across A and B 7 CMR Common mode rejection See Figure 19 4 4 VCC2 = 0 V Submit Documentation Feedback mA k 10 pF V Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tpLH, tpHL Propagation delay time tsk(p) Pulse skew (|tp HL - tpLH|) tpLH, tpHL Propagation delay time tsk(p) Pulse skew (|tp HL - tp LH|) tr tf tpZH Propagation delay time, high-impedance-to-high-level output tpHZ Propagation delay time, high-level-to-high-impedance output tpZL Propagation delay time, high-impedance-to-low-level output tpLZ Propagation delay time, low-level-to-high-impedance output MIN TYP MAX 50 VCC1 at 5 V, VCC2 at 5 V 2 VCC1 at 3.3 V, VCC2 at 5 V 5 55 See Figure 16 2 5 Output signal rise time 2 4 Output signal fall time 2 4 DE at VCC1, See Figure 17 13 25 13 25 DE at VCC, See Figure 18 13 25 13 25 UNIT ns ns ns ns ns PARAMETER MEASUREMENT INFORMATION VCC1 IOA DE A 0 or VCC1 I D VOD B GND 1 VI IOB GND 2 VOA VOB GND 1 GND 2 Figure 1. Open Circuit Voltage Test Circuit VCC1 IOA DE A 0 or VCC1 II D VOD B GND 1 GND 2 54 W IOB VI VOB GND 1 VOA GND 2 Figure 2. VOD Test Circuit Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 5 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC2 DE 375 W A D 0 or 3 V + VOD - B 60 W -7 V to 12 V 375 W GND 2 Figure 3. Driver VOD with Common-mode Loading Test Circuit VCC1 RL 2 IOA DE A II 0 or VCC1 D VOD B GND 1 RL 2 IOB GND 2 VI VOB VOA VOC GND 2 GND 1 Figure 4. Driver VOD and VOC Without Common-Mode Loading Test Circuit VCC1 RL 2 IOA DE A II Input Generator PRR = 500 kHz, 50% duty cycle, tr < 6 ns, tt < 6 ns, ZO = 50 D GND 1 VI VOD B GND 2 VOB GND 1 RL 2 IOB VOA A VA B VB V OC VOC(p-p) VOC VOC(SS ) GND 2 Figure 5. Steady-State Output Voltage Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 PARAMETER MEASUREMENT INFORMATION (continued) VDO(RING) VDO(SS) VOD(pp) 0 V Differential Figure 6. VOD(RING) Waveform and Definitions VCC1 IOA DE A II 0 or VCC1 D GND 1 VI VOD B GND 2 IOB VOA VOB GND 1 54 W GND 2 Figure 7. Input Voltage Hysteresis Test Circuit DE 250 I OS 0.5 W D B I OS Vos GND 1 GND 2 GND 2 Output Current - mA A 120 60 t(CFB) time t(TSD) Figure 8. Driver Short-Circuit Test Circuit and Waveforms (Short Circuit applied at Time t=0) Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 7 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) DE I OS B I OS 250 Output Current - mA A D Vos GND 1 GND 2 GND 2 120 60 t(CFB) time t(TSD) Figure 9. IOS(SS) Steady State Short Circuit Output Current Test Circuit 3V DE VCC1 A VOD D Input Generator RL = 54 W 1% B VI CL = 50 pF 20% 1.5 V VI 1.5 V tPHL tPLH 50 W CL Includes Fixture and Instrumentation Capacitance GND 1 Generator PRR = 500 kHz, 50 % Duty Cycle, tr <6 ns, ZO = 50 W 90% 0V 0V VOD VOD (H) 90% 10% tf tr 10% VOD (L) Figure 10. Driver Switching Test Circuit and Waveforms DE VCC1 50 % A D Input Generator VI RL = 54 W CL = 50 pF 20% 1% B 50 % A VO B tt(MHL) tt(MLH) 50 W GND 1 GND 2 VOA VOB Generator PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, ZO = 50 W 50 % 50 % CL Includes Fixture and Instrumentation Capacitance Figure 11. Driver Output Transition Skew Test Circuit and Waveforms RL = 110 W VCC2 A B A RL = 110 W DE 0V 50 W t(ALZ) t(AZL) VIN = 0 V D Signal Generator 1.5 V DE CL = 50 pF VOA VOB CL = 50 pF 50 % t(BZH) B VOL +0.5 V t(BHZ) 50 % VO -0.5 V GND 1 GND 2 Generator PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, ZO = 50 W Figure 12. Driver Enable/Disable Test, D at Logic Low Test Circuit and Waveforms 8 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 PARAMETER MEASUREMENT INFORMATION (continued) RL = 110 W 0V A CL = 50 pF 1.5 V DE D VIN = 3 V t(AZH) B RL = 110 W DE Signal Generator t(AHZ) A 50 W t(BZL) VOA VOB GND 1 Generator PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, ZO = 50 W VOH -0.5 V 50% VCC2 t(BLZ) B CL = 50 pF 50% VOL +0.5 V GND 2 Figure 13. Driver Enable/Disable Test, D at Logic High Test Circuit and Waveforms VCC1 VCC2 ISODE D tPDE_HL tPDE_LH CL = 15 pF 20% DE Signal Generator 50% 50% DE VIN = VCC1 50% 50% ISODE 50 W GND 2 GND 1 Generator PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, ZO = 50 W Figure 14. DE to ISODE Prop Delay Test Circuit and Waveforms IO V ID VO Figure 15. Receiver DC Parameter Definitions Signal Generator 50 W Input B A PRR = 100 kHz, 50% Duty Cycle, VID tr <6 ns, tf <6 ns, ZO = 50 W B Signal Generator 50 W R 50% IO CL= 15 pF (Includes Probe and Jig Capacitance) 1.5 V Input A 0V tpLH VO tpHL VOH 90% 1.5 V Output 10% tr tf VOL Figure 16. Receiver Switching Test Circuit and Waveforms Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 9 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC D VCC DE A 3V RE 54 W B 1.5 V 1.5 V 0V t pZH 1 kW R t pHZ CL = 15 pF 1.5 V (Includes Probe and Jig Capacitance) RE Signal Generator VO VOH -0.5 V 0V R GND 50 W PRR = 100 kHz, 50% duty cycle, tr <6 ns, tf <6 ns, ZO = 50 W Figure 17. Receiver Enable Test Circuit and Waveforms, Data Output High 0V VCC D DE A 3V RE 0V R t pZL 1 kW VCC1 tpLZ VOH R CL = 15 pF 1.5 V VOL +0.5 V VOL (Includes Probe and Jig Capacitance) RE Signal Generator 1.5 V 1.5 V 54 W B 50 W PRR = 100 kHz, 50% duty cycle, tr <6 ns, tf <6 ns, ZO = 50 W Figure 18. Receiver Enable Test Circuit and Waveforms, Data Output Low VINPUT f = 1 to 50 MHz Ampl. = 5 V A 100 nF 50 W 470 nF R B RE 50 W DE 2.2 kW V R Scope 2.2 kW D VOFFSET = -2 V to 7 V Scope GND VCC 100 nF Figure 19. Common-Mode Rejection Test Circuit 10 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 PARAMETER MEASUREMENT INFORMATION (continued) C = 0.1 mF VCC1 1% 2V VCC2 A DE GND1 S1 D C = 0.1 mF 1% 54 W B VOH or VOL 0.8 V Success / Fail Criterion: Stable VOH or VOL Outputs R VOH or VOL 1 kW RE GND 1 GND 2 CL = 15 pF (Includes Probe and Jig Capacitance) VTEST Figure 20. Common-Mode Transient Immunity Test Circuit Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 11 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS DIFFERENTIAL OUTPUT VOLTAGE vs LOAD CURRENT RMS SUPPLY CURRENT vs SIGNALING RATE 100 5 VCC = 5 V VCC = 5.25 V 4 100 50 VCC = 4.75 V 2.5 2 1.5 1 TA = 25 C 0 50 40 30 5 V VCC1 20 80 5 10 15 Signalling Rate - Mbps Figure 21. Figure 22. DRIVER OUTPUT TRANSITION SKEW vs FREE-AIR TEMPERATURE DRIVER RISE, FALL TIME vs FREE-AIR TEMPERATURE 4 RL = 54 , CL = 50 pF 3.75 VCC = 4.75 V 0.25 VCC = 5 V 0.2 0.15 VCC = 5.25 V 0.1 0.05 0 -40 20 RL = 54 , CL = 50 pF VCC = 4.75 V 3.5 3.25 VCC = 5 V 3 VCC = 5.25 V 2.75 2.5 2.25 -15 10 35 60 TA - Free-Air Temperature - C 85 2 -40 Figure 23. 12 3.3 V VCC1 ICC1 0 Driver Rise, Fall Time - ns Driver Output Transition Skew - ns 60 0 20 40 60 IL - Load Current - mA 0.35 0.3 70 10 0.5 0 ICC2 80 3.5 3 No Load TA = 25C 90 ICC - Supply Current - mA VOD - Differential Output Voltage - V 4.5 -15 10 35 60 TA - Free-Air Temperature - C 85 Figure 24. Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 TYPICAL CHARACTERISTICS (continued) DRIVER ENABLE SKEW vs FREE-AIR TEMPERATURE HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 0.7 -99 VCC = 4.75 V 15 pF Load TA = 25C -89 0.6 IO - Output Current - mA Driver Enable Skew - ns -79 0.5 0.4 VCC = 5.25 V VCC = 5 V 0.3 0.2 -69 -59 -49 -39 -29 -19 0.1 0 -40 RL = 110 , CL = 50 pF -9 -15 10 35 60 TA - Free-Air Temperature - C 85 1 0 1 2 3 4 5 VO - Output Voltage - V Figure 25. Figure 26. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 110 15 pF Load TA = 25C 100 IO - Output Current - mA 90 80 70 60 50 40 30 20 10 0 0 1 2 3 VO - Output Voltage - V Figure 27. 4 5 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 13 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com DEVICE INFORMATION DW PACKAGE (TOP VIEW) VCC1 1 16 VCC2 GND 1 2 15 R 3 14 GND 2 NC RE 4 13 B DE D 5 12 6 11 A NC PV 7 10 ISODE GND 1 8 9 GND 2 PACKAGE PIN FUNCTION DESCRIPTION 14 NAME PIN NO. Vcc1 1 FUNCTION GND1 2, 8 R 3 receiver output RE 4 receiver logic-low enable DE 5 driver logic-high enable input D 6 driver input PV 7 ISO1176 chip enable, logic high applied immediately after power-up for device operation. A logic low 3-states all outputs. logic side power supply logic side ground, internally connected GND2 9, 15 ISODE 10 bus side ground, internally connected nc 11, 14 A 12 non-inverting bus output B 13 inverting bus output Vcc2 16 bus side power supply bus-side driver enable output not connected internally, may be left floating Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 DRIVER FUNCTION TABLE VCC1 VCC2 POWER VALID (PV) (ISO1176) INPUT (D) ENABLE INPUT (DE) ENABLE OUTPUT (ISODE) H H H OUTPUTS A B H L PU PU H or open PU PU H or open L H H L H PU PU H or open X L L Z Z PU PU H or open X open L Z Z PU PU H or open open H H H L PD PU X X X L Z Z PU PD X X X L Z Z PD PD X X X L Z Z X X L X X L Z Z H = high level, L= low level, X = don't care, Z = high impedance (off), ? = indeterminate RECEIVER FUNCTION TABLE VCC1 VCC2 POWER VALID (PV) (ISO1176) DIFFERENTIAL INPUT VID = (VA - VB) ENABLE (RE) OUTPUT (R)) PU PU PU PU H or open -0.01 V VID L H H or open -0.2 V < VID < -0.01 V L PU ? PU H or open VID -0.2 V L L PU PU H or open X H Z PU PU H or open X open Z PU PU H or open Open circuit L H PU PU H or open Short Circuit L H PU PU H or open Idle (terminated) bus L H PD PU X X X Z PU PD H or open X L H PD PD X X X Z X X L X X Z H = high level, L= low level, X = don't care, Z = high impedance (off), ? = indeterminate Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 15 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com EQUIVALENT CIRCUIT SCHEMATICS D, RE Input VCC1 DE Input VCC1 VCC1 VCC1 VCC1 1 MW 500 W 500 W 1 MW ISODE Output PV Input VCC2 VCC1 VCC1 VCC1 50 kW 5.5 W 500 W 11 W 3.3 V R Output 5 V R Output VCC1 16 VCC1 4W 5.5 W 6.4 W 11 W Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 A Input B Input VCC2 16 V VCC2 16 V 18 kW 90 kW 18 kW 90 kW Input Input 16 V 16 V 18 kW 18 kW A and B Outputs VCC2 16 V Output 16 V IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A Failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS IS Safety input, output, or supply current DW-16 TS Maximum case temperature DW-16 MIN qJA = 212C/W, VI = 5.5 V, TJ = 170C, TA = 25C TYP MAX UNIT 128 mA 150 C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 17 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com THERMAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP Low-K thermal resistance (1) 168 High-K board(1) 96.1 MAX UNIT qJA Junction-to-air qJB Junction-to-board thermal resistance 61 C/W qJC Junction-to-case thermal resistance 48 C/W PD (1) VCC1 = VCC2 = 5.25 V, TJ = 150C, CL = 15 pF, Input a 20 MHz 50% duty cycle square wave Device power dissipation C/W 220 mW Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages. 150 VCC1,2 at 5.5 V Safety Limiting Current - mA 125 100 75 50 25 0 0 50 100 150 TC - Case Temperature - C 200 Figure 28. DW-16 qJC Thermal Derating Curve per IEC 60747-5-2 PACKAGE CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air 8.34 mm L(I02) Minimum external tracking (Creepage) (1) Shortest terminal to terminal distance across the package surface 8.1 mm CTI Tracking resistance (Comparative Tracking Index) DIN IEC 60112 / VDE 0303 Part 1 175 V Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.008 mm Isolation resistance Input to output, VIO = 500 V, all pins on each side of the barrier tied together creating a two-terminal device RIO >1012 CIO Barrier capacitance Input to output VI = 0.4 sin (4E6pt) 2 pF CI Input capacitance to ground VI = 0.4 sin (4E6pt) 2 pF (1) 18 Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 REGULATORY INFORMATION VDE CSA UL Certified according to IEC 60747-5-2 Approved under CSA Component Acceptance Notice Recognized under 1577 Component Recognition Program (1) File Number: 40014131 File Number: 1698195 File Number: E181974 (1) Production tested 3000 Vrms for 1 second in accordance with UL 1577. IEC 60554-1 RATINGS TABLE PARAMETER Basic isolation group Installation classification TEST CONDITIONS SPECIFICATION Material group IIIa Rated mains voltage < 150 VRMS I-IV Rated mains voltage < 300 VRMS I-III Rated mains voltage < 400 VRMS I-II IEC 60747-5-2 INSULATION CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VIORM Maximum working insulation voltage VPR Input to output test voltage VIOTM Transient overvoltage RS Insulation resistance TEST CONDITIONS SPECIFICATION UNIT 560 V Method b1, VPR = VIORM x 1.875, 100% Production test with t = 1 s, Partial discharge <5 pC 1050 V t = 60 s 4000 V 9 VIO = 500 V at TS Pollution degree >10 2 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 19 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com APPLICATION INFORMATION Transient Voltages Isolating of a circuit insulates it from other circuits and earth, so that noise voltage develops across the insulation rather than circuit components. The most common noise threat to data-line circuits is voltage surges or electrical fast transients that occur after installation. The transient ratings of the ISO1176 standard are sufficient for all but the most severe installations. However, some equipment manufacturers use ESD generators to test equipment transient susceptibility. This practice can exceed insulation ratings. ESD generators simulate static discharges that may occur during device or equipment handling with low-energy but high-voltage transients. Figure 29 models the ISO1176 bus IO connected to a noise generator. CIN and RIN is the device, and any other stray or added capacitance or resistance across the A or B pin to GND2. CISO and RISO is the capacitance and resistance between GND1 and GND2 of the ISO1176, plus those of any other insulation (transformer, etc.). Stray inductance is assumed to be negligible. From this model, the voltage at the isolated bus return is ZISO v GND2 = v N ZISO + ZIN (1) and is always less than 16 V from VN. If the ISO1176 is tested as a stand-alone device, * RIN= 6 x 104 , * CIN= 16 x 10-12 F, * RISO= 109 and * CISO= 10-12 F. A or B CIN RIN VN Bus Return (GND2) CISO Notice from Figure 29 that the resistor ratio determines the voltage ratio at low frequencies, and that the inverse capacitance ratio determines the voltage ration at high frequencies. In the stand-alone case and for low frequencies, 16V RISO System Ground (GND1) 9 v GND2 RISO 10 = = 9 vN RISO + RIN 10 + 6 x10 4 (2) or essentially all of the noise appears across the barrier. At high frequencies, 1 v GND2 1 CISO = = C 1 1 vN + ISO CISO CIN 1 + C IN = Figure 29. Device Model For Static Discharge Testing 1 = 0.94 1+ 1 16 (3) and 94% of VN appears across the barrier. As long as RISO is greater than RIN and CISO is less than CIN, most of the transient noise appears across the isolation barrier, as it should. Using ESD generators to test equipment transient susceptibility, or considering product claims of ESD ratings above the barrier transient ratings of an isolated interface is not recommended. ESD is best managed through recessing or covering connector pins in a conductive connector shell, and by proper installer training. 20 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 ISO1176 www.ti.com SLLS897D - MARCH 2008 - REVISED MARCH 2010 ISO1176 "Sticky Bit" Issue (Under Certain Conditions) Summary: In applications with sufficient differential noise on the bus, the output of the ISO1176 receiver may "stick" at an incorrect state for up to 30 s. Description: The ISO1176 isolated Profibus (RS-485) transceiver is rated for signaling up to 40 Mbps on twisted-pair bus lines. The receiver thresholds comply with RS-485 and Profibus specifications; an input differential voltage VID = VA - VB > 200 mV causes a logic High on the R output, and VID < -200 mV causes a logic Low on the R output. To assure a known receiver output when the bus is shorted or idle, the upper threshold is set below zero, such that VID = 0 mV causes a logic High on the R output. The data sheet specifies a typical upper threshold (VIT+) of -80 mV and a typical lower threshold (VIT-) of -120 mV. At a signaling rate of 40 Mbps, each valid data bit has a duration of 25 ns. At typical Profibus signaling rates of 12 Mbps or lower, each valid data bit has a duration of 83 ns or more. The ISO1176 correctly sets the R output for each of these valid data bits. In applications with a high degree of differential noise on the bus lines, it is possible to get short periods when an invalid bus voltage triggers a change in state of the internal receiver circuits. An issue with the digital isolation channel in the ISO1176 may cause the invalid receiver state to "stick" rather than immediately transition back to the correct state. The receiver output will always transition to the correct state, but may stick in the incorrect state for up to 30 s. This can cause a temporary loss of data. Figure 30 shows two cases which could result in temporary loss of data. ACTIVE DRIVER STATE RECEIVER POSITIVE THRESHOLD BUS DIFFERENTIAL VOLTAGE RECEIVER NEGATIVE THRESHOLD EFFECTIVE PULSE WIDTH REFRESH TIME ISO1176 RECEIVER OUTPUT ACTIVE DRIVER STATE DISABLED RECEIVER POSITIVE THRESHOLD BUS DIFFERENTIAL VOLTAGE RECEIVER NEGATIVE THRESHOLD EFFECTIVE PULSE WIDTH ISO1176 RECEIVER OUTPUT REFRESH TIME Figure 30. Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 21 ISO1176 SLLS897D - MARCH 2008 - REVISED MARCH 2010 www.ti.com REVISION HISTORY Changes from Original (March 2008) to Revision A Page * Added the Bus-Pin ESD Protection bullet and sub bullets to the Features List ................................................................... 1 * Added 3.3-V Inputs are 5-V Tolerant to the Features List .................................................................................................... 1 * Added Bus pins to GND1 and Bus pins to GND2 to the ESD information of the Abs Max Ratings table ........................... 2 * Added the APPLICATION INFORMATION section ............................................................................................................ 20 Changes from Revision A (May 2008) to Revision B * Changed L(IO1), Minimum air gap (Clearance) in the PACKAGE CHARACTERISTICS table From: MIN = 7.7mm To: 8.34mm. ........................................................................................................................................................................ 18 Changes from Revision B (June 2008) to Revision C * Page Page Changed the text in the second paragraph of the DESCRIPTON From: whenever the driver is disabled or VCC2 = 0 To: allowing up to 160 nodes. ............................................................................................................................................... 1 Changes from Revision C (October 2008) to Revision D Page * Added 560-Vpeak VIORM to the first Features List ................................................................................................................ 1 * Added UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), to the Features List .......................................................................... 1 * Added Input pulse width MIN = 10 ns to the RECOMMENDED OPERATING CONDITIONS table .................................... 2 * Added the CSA column to the Regulatory Information table .............................................................................................. 19 * Changed the ISO1176 "Sticky Bit" Issue section ................................................................................................................ 21 22 Submit Documentation Feedback Copyright (c) 2008-2010, Texas Instruments Incorporated Product Folder Link(s) :ISO1176 PACKAGE OPTION ADDENDUM www.ti.com 5-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ISO1176DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO1176DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO1176DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO1176DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device ISO1176DWR Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ISO1176DWR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated