1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54LVC04A . . . J OR W PACKAGE
SN74LVC04A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A V
6A
3Y
GND
NC
SN54LVC04A . . . FK PACKAGE
(TOP VIEW)
CC
NC - No internal connection
SN74LVC04A . . . RGY PACKAGE
(TOP VIEW)
1 14
7 8
2
3
4
5
6
13
12
11
10
9
6A
6Y
5A
5Y
4A
1Y
2A
2Y
3A
3Y
1A
4Y V
GND
CC
SN54LVC04A, SN74LVC04A
www.ti.com
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
HEX INVERTERS
Check for Samples: SN54LVC04A,SN74LVC04A
1FEATURES
• Operate From 1.65 V to 3.6 V • Latch-Up Performance Exceeds 250 mA Per
JESD 17
• Specified From –40°C to 85°C,
–40°C to 125°C, and –55°C to 125°C • ESD Protection Exceeds JESD 22
• Inputs Accept Voltages to 5.5 V – 2000-V Human-Body Model (A114-A)
• Max tpd of 4.5 ns at 3.3 V – 200-V Machine Model (A115-A)
• Typical VOLP (Output Ground Bounce) – 1000-V Charged-Device Model (C101)
<0.8 V at VCC = 3.3 V, TA= 25°C xxxx
xxxx
• Typical VOHV (Output VOH Undershoot) xxxx
>2 V at VCC = 3.3 V, TA= 25°C
DESCRIPTION/ORDERING INFORMATION
The SN54LVC04A hex inverter contains six independent inverters designed for 2.7-V to 3.6-V VCC operation, and
the SN74LVC04A hex inverter contains six independent inverters designed for 1.65-V to 3.6-V VCC operation.
The 'LVC04A devices perform the Boolean function Y = A.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1993–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas On products compliant to MIL-PRF-38535, all parameters are
Instruments standard warranty. Production processing does not tested unless otherwise noted. On all other products, production
necessarily include testing of all parameters. processing does not necessarily include testing of all parameters.
A Y
SN54LVC04A, SN74LVC04A
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
www.ti.com
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TAPACKAGE(1) PART NUMBER MARKING
–40°C to 85°C QFN – RGY Reel of 1000 SN74LVC04ARGYR LC04A
Tube of 50 SN74LVC04AD
SOIC – D Reel of 2500 SN74LVC04ADRG3 LVC04A
Reel of 250 SN74LVC04ADT
SOP – NS Reel of 2000 SN74LVC04ANSR LVC04A
–40°C to 125°C SSOP - DB Reel of 2000 SN74LVC04ADBR LC04A
Tube of 90 SN74LVC04APW
TSSOP – PW Reel of 2000 SN74LVC04APWR LC04A
Reel of 250 SN74LVC04APWT
TVSOP – DGV Reel of 2000 SN74LVC04ADGVR LC04A
CDIP – J Tube of 25 SNJ54LVC04AJ SNJ54LVC04AJ
–55°C to 125°C CFP – W Tube of 150 SNJ54LVC04AW SNJ54LVC04AW
LCCC – FK Tube of 55 SNJ54LVC04AFK SNJ54LVC04AFK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Table 1. FUNCTION TABLE
(EACH INVERTER)
INPUT OUTPUT
A Y
H L
L H
LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC)
2Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54LVC04A SN74LVC04A
SN54LVC04A, SN74LVC04A
www.ti.com
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VIInput voltage range(2) –0.5 6.5 V
VOOutput voltage range(2) (3) –0.5 VCC + 0.5 V
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
D package (4) 86
DB package(4) 96
DGV package(4) 127
qJA Package thermal impedance °C/W
NS package(4) 76
PW package(4) 113
RGY package(5) 47
Tstg Storage temperature range –65 150 °C
Ptot Power dissipation TA= –40°C to 125°C(6) (7) 500 mW
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) The package thermal impedance is calculated in accordance with JESD 51-5.
(6) For the D package: above 70°C, the value of Ptot derates linearly with 8 mW/K.
(7) For the DB, DGV, NS, and PW packages: above 60°C, the value of Ptot derates linearly with 5.5 mW/K.
Copyright © 1993–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN54LVC04A SN74LVC04A
SN54LVC04A, SN74LVC04A
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
www.ti.com
Recommended Operating Conditions(1)
SN54LVC04A
–55°C to 125°C UNIT
MIN MAX
Operating 2 3.6
VCC Supply voltage V
Data retention only 1.5
VIH High-level input voltage VCC = 2.7 V to 3.6 V 2 V
VIL Low-level input voltage VCC = 2.7 V to 3.6 V 0.8 V
VIInput voltage 0 5.5 V
VOOutput voltage 0 VCC V
VCC = 2.7 V –12
IOH High-level output current mA
VCC = 3 V –24
VCC = 2.7 V 12
IOL Low-level output current mA
VCC = 3 V 24
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Recommended Operating Conditions (1)
SN74LVC04A
TA= 25°C –40°C to 85°C –40°C to 125°C UNIT
MIN MAX MIN MAX MIN MAX
Operating 1.65 3.6 1.65 3.6 1.65 3.6
VCC Supply voltage V
Data retention only 1.5 1.5 1.5
VCC = 1.65 V to 1.95 V 0.65 × VCC 0.65 × VCC 0.65 × VCC
High-level
VIH VCC = 2.3 V to 2.7 V 1.7 1.7 1.7 V
input voltage VCC = 2.7 V to 3.6 V 2 2 2
VCC = 1.65 V to 1.95 V 0.35 × VCC 0.35 × VCC 0.35 × VCC
Low-level
VIL VCC = 2.3 V to 2.7 V 0.7 0.7 0.7 V
input voltage VCC = 2.7 V to 3.6 V 0.8 0.8 0.8
VIInput voltage 0 5.5 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC 0 VCC V
VCC = 1.65 V –4 –4 –4
VCC = 2.3 V –8 –8 –8
High-level
IOH mA
output current VCC = 2.7 V –12 –12 –12
VCC = 3 V –24 –24 –24
VCC = 1.65 V 4 4 4
VCC = 2.3 V 8 8 8
Low-level
IOL mA
output current VCC = 2.7 V 12 12 12
VCC = 3 V 24 24 24
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54LVC04A SN74LVC04A
SN54LVC04A, SN74LVC04A
www.ti.com
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted) SN54LVC04A
PARAMETER TEST CONDITIONS VCC –55°C to 125°C UNIT
MIN MAX
IOH = –100 mA 2.7 V to 3.6 V VCC – 0.2
2.7 V 2.2
VOH IOH = –12 mA V
3 V 2.4
IOH = –24 mA 3 V 2.2
IOL = 100 mA 2.7 V to 3.6 V 0.2
VOL IOL = 12 mA 2.7 V 0.4 V
IOL = 24 mA 3 V 0.55
IIVI= 5.5 V or GND 3.6 V ±5 mA
ICC VI= VCC or GND, IO= 0 3.6 V 10 mA
ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V 500 mA
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
SN74LVC04A
PARAMETER TEST CONDITIONS VCC TA= 25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP MAX MIN MAX MIN MAX
IOH = –100 mA 1.65 V to 3.6 V VCC – 0.2 VCC – 0.2 VCC – 0.3
IOH = –4 mA 1.65 V 1.29 1.2 1.05
IOH = –8 mA 2.3 V 1.9 1.7 1.55
VOH V
2.7 V 2.2 2.2 2.05
IOH = –12 mA 3 V 2.4 2.4 2.25
IOH = –24 mA 3 V 2.3 2.2 2
IOL = 100 mA 1.65 V to 3.6 V 0.1 0.2 0.3
IOL = 4 mA 1.65 V 0.24 0.45 0.6
VOL IOL = 8 mA 2.3 V 0.3 0.7 0.85 V
IOL = 12 mA 2.7 V 0.4 0.4 0.6
IOL = 24 mA 3 V 0.55 0.55 0.8
IIVI= 5.5 V or GND 3.6 V ±1 ±5 ±20 mA
ICC VI= VCC or GND, IO= 0 3.6 V 1 10 40 mA
One input at VCC – 0.6 V,
ΔICC Other inputs at VCC or 2.7 V to 3.6 V 500 500 5000 mA
GND
CiVI= VCC or GND 3.3 V 5 pF
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC04A
FROM TO
PARAMETER VCC –55°C to 125°C UNIT
(INPUT) (OUTPUT) MIN MAX
2.7 V 5.5
tpd A Y ns
3.3 V ± 0.3 V 0.5 4.5
Copyright © 1993–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN54LVC04A SN74LVC04A
SN54LVC04A, SN74LVC04A
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
www.ti.com
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
SN74LVC04A
FROM TO
PARAMETER VCC TA= 25°C –40°C to 85°C –40°C to 125°C UNIT
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
1.8 V ± 0.15 V 1 4.1 7.5 1 8 1 9.5
2.5 V ± 0.2 V 1 3.6 7 1 7.5 1 9
tpd A Y ns
2.7 V 1 3 5.3 1 5.5 1 7
3.3 V ± 0.3 V 1 2.5 4.3 1 4.5 1 6
tsk(o) 3.3 V ± 0.3 V 1 1.5 ns
Operating Characteristics
TA= 25°C TEST
PARAMETER VCC TYP UNIT
CONDITIONS
1.8 V 6
Cpd Power dissipation capacitance per gate f = 10 MHz 2.5 V 7 pF
3.3 V 8
6Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54LVC04A SN74LVC04A
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VOH - V∆≈0 V
VI
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
6 V
6 V
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
2.7 V
2.7 V
VI
VCC/2
VCC/2
1.5 V
1.5 V
VM
tr/tf
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
INPUTS
SN54LVC04A, SN74LVC04A
www.ti.com
SCAS281S –JANUARY 1993–REVISED OCTOBER 2010
PARAMETER MEASUREMENT INFORMATION
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 1993–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): SN54LVC04A SN74LVC04A
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9760501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9760501QCA ACTIVE CDIP J 14 1 TBD Call TI Call TI
5962-9760501QDA ACTIVE CFP W 14 1 TBD Call TI Call TI
SN74LVC04AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LVC04ADBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
SN74LVC04ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ADTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC04ADTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74LVC04APWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWRG3 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
SN74LVC04APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC04ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC04ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SNJ54LVC04AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LVC04AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LVC04AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LVC04A, SN74LVC04A :
•Catalog: SN74LVC04A
•Automotive: SN74LVC04A-Q1, SN74LVC04A-Q1
•Enhanced Product: SN74LVC04A-EP, SN74LVC04A-EP
•Military: SN54LVC04A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 4
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC04ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LVC04ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LVC04ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC04ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC04ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC04ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LVC04APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC04APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC04APWRG3 TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC04APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC04APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC04ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC04ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LVC04ADGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74LVC04ADR SOIC D 14 2500 333.2 345.9 28.6
SN74LVC04ADR SOIC D 14 2500 367.0 367.0 38.0
SN74LVC04ADT SOIC D 14 250 367.0 367.0 38.0
SN74LVC04ANSR SO NS 14 2000 367.0 367.0 38.0
SN74LVC04APWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74LVC04APWR TSSOP PW 14 2000 364.0 364.0 27.0
SN74LVC04APWRG3 TSSOP PW 14 2000 364.0 364.0 27.0
SN74LVC04APWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
SN74LVC04APWT TSSOP PW 14 250 367.0 367.0 35.0
SN74LVC04ARGYR VQFN RGY 14 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated