Film Capacitors
EMI Suppression Capacitors (MKP)
Series/Type: B32921C/D ... B32928C/D
Date: December 2012
© EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Typical applications
X2 class for interference suppression
"Across the line" applications
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1): 40/105/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Very small dimensions
Self-healing properties
RoHS-compatible
Halogen-free capacitors available on request
Terminals
Parallel wire leads, lead-free tinned
Special lead lengths available on request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
cap. tolerance (code letter),
rated AC voltage,
series number, sub-class (X2),
dielectric code (MKP), climatic category,
passive flammability category, approvals.
Delivery mode
Bulk (untaped)
Taped (Ammo pack or reel)
For taping details, refer to chapter
"Taping and packing"
Dimensional drawing
Dimensions in mm
Lead spacing
±0.4
Lead diameter
d1
Type
10 0.6 B32921
15 0.8 B32922
22.5 0.8 B32923
27.5 0.8 B32924
37.5 1.0 B32926
52.5 1.2 B32928
Marking Examples
= 10 mm ≥15 mm/CR≤1µF
= 22.5, 27.5,
37 mm/CR>1 µF
Approvals
Approval marks Standards Certificate
EN 60384-14, IEC 60384-14 40010694
UL 1414 / UL 1283 E97863 / E157153
CSA C22.2 No.1 / No. 8 E97863 / E157153 (approved by UL)
CQC (GB/T 14472-1998) CQC06001015331 / CQC06001016454
EMI suppression capacitors (MKP) B32921C/D ... B32928C/D
X2 / 305 V AC
Page 2 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Overview of available types
Lead spacing 10 mm 15 mm 22.5 mm 27.5 mm 37.5 mm 52.5 mm
Type B32921 B32922 B32923 B32924 B32926 B32928
CR(µF)
0.010
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
3.9
4.7
5.6
6.8
8.2
10
15
20
25
30
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 3 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units
Lead spacing
mm
CR
µF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./
MOQ
Untaped
pcs./
MOQ
◆Preferred type
MOQ = Minimum Order Quantity, consisting of 4 packing units.
For new design, please refer to the B3292xE/F data sheet.
Further intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M = ±20%
K = ±10%
289 = Ammo pack
189 = Reel
000 = Untaped (lead length 6 1 mm)
(Closer tolerances on request)
10 0.010 4.0 ×9.0 ×13.0 B32921C3103+*** ◆4000 6800 4000
0.022 4.0 ×9.0 ×13.0 B32921C3223+*** ◆4000 6800 4000
0.033 4.0 ×9.0 ×13.0 B32921C3333+*** ◆4000 6800 4000
0.047 5.0 ×11.0 ×13.0 B32921C3473+*** ◆3320 5200 4000
0.068 6.0 ×12.0 ×13.0 B32921C3683+*** 2720 4400 4000
0.10 6.0 ×12.0 ×13.0 B32921C3104M*** 2720 4400 4000
15 0.033 5.0 ×10.5 ×18.0 B32922C3333K*** 4680 5200 4000
0.047 5.0 ×10.5 ×18.0 B32922C3473K*** 4680 5200 4000
0.068 5.0 ×10.5 ×18.0 B32922C3683K*** ◆4680 5200 4000
0.10 5.0 ×10.5 ×18.0 B32922C3104+*** ◆4680 5200 4000
0.15 6.0 ×12.0 ×18.0 B32922C3154+*** ◆3840 4400 4000
0.22 7.0 ×12.5 ×18.0 B32922C3224+*** ◆3320 3600 4000
0.33 8.0 ×14.0 ×18.0 B32922C3334M*** ◆2920 3000 2000
0.33 8.5 ×14.5 ×18.0 B32922D3334K*** 2720 2800 2000
0.47 9.0 ×17.5 ×18.0 B32922C3474+*** ◆2560 2800 2000
0.68 11.0 ×18.5 ×18.0 B32922C3684+*** ◆2200 1000
22.5 0.22 6.0 ×15.0 ×26.5 B32923C3224+*** 2720 2800 2880
0.33 6.0 ×15.0 ×26.5 B32923C3334M*** 2720 2800 2880
0.33 7.0 ×16.0 ×26.5 B32923D3334K*** 2320 2400 2520
0.47 8.5 ×16.5 ×26.5 B32923C3474+*** 1920 2000 2040
0.68 10.5 ×16.5 ×26.5 B32923C3684+*** 1560 1600 2160
1.0 11.0 ×20.5 ×26.5 B32923C3105+*** ◆1480 1400 2040
1.5 12.0 ×22.0 ×26.5 B32923C3155M*** 1800
2.2 14.5 ×29.5 ×26.5 B32923C3225+*** 1040
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 4 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units
Lead spacing
mm
CR
µF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./
MOQ
Untaped
pcs./
MOQ
◆Preferred type
MOQ = Minimum Order Quantity, consisting of 4 packing units.
For new design, please refer to the B3292xE/F data sheet.
Further intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M = ±20%
K = ±10%
289 = Ammo pack
189 = Reel
000 = Untaped (lead length 6 1 mm)
(Closer tolerances on request)
27.5 0.68 11.0 ×19.0 ×31.5 B32924C3684+*** 1400 1280
1.0 11.0 ×19.0 ×31.5 B32924C3105+*** 1400 1280
1.5 12.5 ×21.5 ×31.5 B32924C3155+*** ◆1200 1120
2.2 14.0 ×24.5 ×31.5 B32924C3225+*** 1040
3.3 16.0 ×32.0 ×31.5 B32924D3335K*** 880
3.3 18.0 ×27.5 ×31.5 B32924C3335M*** 800
4.7 18.0 ×33.0 ×31.5 B32924C3475M*** 800
4.7 21.0 ×31.0 ×31.5 B32924D3475K*** 720
5.6 22.0 ×36.5 ×31.5 B32924C3565+*** 784
37.5 2.2 14.0 ×25.0 ×41.5 B32926C3225+*** 1380
3.3 16.0 ×28.5 ×41.5 B32926C3335+*** 800
3.9 16.0 ×28.5 ×41.5 B32926C3395+*** 800
4.7 18.0 ×32.5 ×41.5 B32926C3475+*** 720
5.6 18.0 ×32.5 ×41.5 B32926C3565+*** 720
6.8 20.0 ×39.5 ×41.5 B32926C3685+*** 640
8.2 20.0 ×39.5 ×41.5 B32926C3825+*** 640
10 28.0 ×42.5 ×41.5 B32926C3106+*** 440
15 30.0 ×45.0 ×42.0 B32926C3156M*** 200
15 33.0 ×48.0 ×42.0 B32926D3156+*** 180
52.5 20 30.0 ×45.0 ×57.5 B32928C3206+*** 280
25 35.0 ×50.0 ×57.5 B32928C3256+*** 108
30 35.0 ×50.0 ×57.5 B32928C3306M*** 108
For the following types the safety approvals are pending:
B32926C3156M000, B32926D3156K000, B32926D3156M000
B32928C3206K000, B32928C3206M000, B32928C3256K000, B32928C3256M000,
B32928C3306M000
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 5 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Technical data
Max. operating temperature Top,max +110 °C
Dissipation factor tan δ(in 10-3)
at 20 °C (upper limit values)
CR≤0.1 µF 0.1µF<CR≤2.2 µF CR>2.2 µF
at 1 kHz 1.0 1.0 2.0
100 kHz 5.0
Insulation resistance Rins
or time constant τ= CRRins
CR≤0.33 µF CR>0.33 µF
100 000 MΩ30 000 s
at 20 °C, rel. humidity ≤65%
(minimum as-delivered values)
DC test voltage 2121 V, 2 s
Passive flammability category
to IEC 40 (CO) 752
B
Maximum continuous DC voltage VDC 630 V
Maximum continuous AC voltage VAC 310 V (50/60 Hz)
Rated AC voltage (IEC 60384-14) 305 V (50/60 Hz)
Operating AC voltage Vop at high
temperature
TA≤110 °C Vop = VAC (continuously)
TA≤110 °C Vop = 1.25 VAC (1000 h)
Damp heat test 56 days / 40 °C / 93% relative humidity
Limit values after damp heat test Capacitance change ∆C/C≤5%
Dissipation factor change ∆tan δ ≤ 0.5 10-3 (at 1 kHz)
Insulation resistance Rins ≤1.0 10-3 (at 10 kHz)
or time constant τ= CRRins ≥50% of minimum
as-delivered values
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 6 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/µs.
Note:
The values of dV/dt and k0provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0values
Lead spacing 10 mm 15 mm 22.5 mm 27.5 mm 37.5 mm 52.5 mm
dV/dt in V/µs 475 340 170 120 80 50
k0in V2/µs 408500 292400 146200 103200 68800 43200
Impedance Z versus frequency f
(typical values)
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 7 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing > 10 mm)
260 ±5°C 10 ±1 s
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1 s
MKP
MKT
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤10 mm) and
insulated (B32559)
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 8 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
∆C/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 9 of 17Please read Cautions and warnings and
Important notes at the end of this document.
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 °C
MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Application note for X1 / X2 EMI capacitors
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 10 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Application note for the different possible X1 / X2 positions
In series with the powerline
(i.e. capacitive power supply)
Typical Applications:
Power meters
ECUs for white goods and household
appliances
Different sensor applications
Severe ambient conditions
In parallel with the powerline
Typical Applications:
Standard X2 are used parallel over the mains for
reducing electromagnetic interferences coming
from the grid. For such purposes they must meet
the applicable EMC directives and standards.
Basic circuit Basic circuit
Required features
High capacitance stability over the lifetime
Narrow tolerances for a controlled current
supply
Required features
Standard safety approvals
(ENEC, UL, CSA, CQC)
High pulse load capability
Withstand surge voltages
Recommended EPCOS product series
B3293* (305 V AC) heavy duty with
EN approval for X2 (UL Q1/2010)
B3292*7 (305 V AC)
improved standard series, approved as X2
B3291* (330 V AC), approved as X1
B3265* MKP series
standard MKP capacitor without safety
approvals
B3267*L MKP series
standard MKP capacitor without safety
approvals
Recommended EPCOS product series
B3292*C/D (305 V AC)
standard series, approved as X2
B3292*E/F (305 V AC)
miniaturized series (> 2.2 µF), approved as X2
B3291* (330 V AC), approved as X1
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 11 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage conditions Make sure that capacitors are stored within the
specified range of time, temperature and humidity
conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity
(passive flammability), avoid overload of the
capacitors (active flammability) and consider the
flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand
vibration. The capacitors are tested to
IEC 60068-2-6.
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
5.2
"Resistance to vibration"
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 12 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature
limits during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
finished assemblies
When embedding finished circuit assemblies in
plastic resins, chemical and thermal influences
must be taken into account.
Caution: Consult us first, if you also wish to
embed other uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
Design of EMI Capacitors
EPCOS EMI capacitors use polypropylene (PP) film metalized with a thin layer of Zinc (Zn).
The following key points have made this design suitable to IEC/UL testing, holding a minimum
size.
Overvoltage AC capability with very high temperature Endurance test of IEC60384-14
(3rd edition, 2005-07) / UL60384-14 (1st edition, 2009-04) must be performed at 1.25 ×VRat
maximum temperature, during 1000 hours, with a capacitance drift less than 10%.
Higher breakdown voltage withstanding if compared to other film metallizations, like Aluminum.
IEC60384-14 (3rd edition, 2005-07) / UL60384-14 (1st edition, 2009-04) establishes high
voltage tests performed at 4.3 ×VR1 minute, impulse testing at 2500 V for C= 1 µF and active
flammability tests.
Damp heat steady state: 40 °C/ 93% RH / 56 days. (without voltage or current load)
Effect of humidity on capacitance stability
Long contact of a film capacitor with humidity can produce irreversible effects. Direct contact with
liquid water or excess exposure to high ambient humidity or dew will eventually remove the film
metallization and thus destroy the capacitor. Plastic boxed capacitors must be properly tested in
the final application at the worst expected conditions of temperature and humidity in order to
check if any parameter drift may provoke a circuit malfunction.
In case of penetration of humidity through the film, the layer of Zinc can be degraded, specially
under AC operation (change of polarity), accelerated by the temperature, provoking an increment
of the serial resistance of the electrode and eventually a reduction of the capacitance value.
For DC operation, the parameter drift is much less.
Plastic boxes and resins can not protect 100% against humidity. Metal enclosures, resin potting or
coatings or similar measures by customers in their applications will offer additional protection
against humidity penetration.
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 13 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A Capacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
C Capacitance Kapazität
CRRated capacitance Nennkapazität
∆C Absolute capacitance change Absolute Kapazitätsänderung
∆C/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
∆C/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
∆t Time interval Zeitintervall
∆T Absolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
∆tan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
∆V Absolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
∆V/∆t Voltage change per time interval Spannungsänderung pro Zeitintervall
E Activation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
f Frequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
i Current (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 14 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
Q Heat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
R Universal molar constant for gases Allg. Molarkonstante für Gas
R Ohmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
S severity (humidity test) Schärfegrad (Feuchtetest)
t Time Zeit
T Temperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature Beriebstemperatur
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
VAC AC voltage Wechselspannung
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 15 of 17Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
Z Impedance Scheinwiderstand
Lead spacing Rastermaß
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 16 of 17Please read Cautions and warnings and
Important notes at the end of this document.
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS,
DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Important notes
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