M1A3PE3000-FG896YC - Microsemi Corp.

March 2012 I

ProASIC3E Flash Family FPGAs

with Optional Sof t ARM Support

Features and Benefits

High Capacity

• 600 k to 3 Million System Gates

• 108 to 5 04 kb its of True Dual-Por t SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Live at Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

• 1 kbit of FlashROM with Synchronous Interfacing

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock® Designed to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5-V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• Ultra-Fast Local and Long-Line Network

• Enhanced High-S peed, Very-Long-Line Network

• High-Per f or ma nce , Lo w-Sk ew Gl oba l Net wor k

• Architecture Supports Ultra-High Utilization

Pro (Professional) I/O

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-V oltage Operation

• Bank-Selectable I/O V oltages—up to 8 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Cla ss I and II, SSTL3

Class I and II

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold S p aring I/Os

• Programmable Output Slew Rate and Drive S trength

• Programmable Input Delay

• Schmitt Trigger Option on Single-Ended Inputs

• Weak Pull-Up/- Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Comp a tib l e Pack age s ac ro ss t he Pro ASIC ®3E Family

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 200 MHz)

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• T rue Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous Operation

up to 350 MHz

ARM® Processor Support in ProASIC3E FPGAs

• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available

with or without Debug

Table 1-1 • Pro ASIC3E Product Family

ProASIC3E Devices A3PE600 A3PE1500 A3PE3000

Cortex-M1 Devices 1M1A3PE1500 M1A3PE3000

System Gates 600,000 1,500,000 3,000,000

VersaTiles (D-flip-flops) 13,824 38,400 75,264

RAM Kbits (1,024 bits) 108 270 504

4,608-Bit Blocks 24 60 112

FlashROM Kbits 11 1

Secure (AES) ISP Yes Yes Yes

CCCs with Integrated PLLs266 6

VersaNet Globals318 18 18

I/O Banks 88 8

Maximum User I/Os 270 444 620

Package Pins

PQFP

FBGA PQ208

FG256, FG484 PQ208

FG484, FG676 PQ208

FG324, FG484, FG896

Notes:

1. Refer to the Cortex-M1 product brief for more information.

2. The PQ208 package supports six CCCs and two PLLs.

3. Six chip (main) and three quadrant global networks are available.

4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.

Revision 10

ProASIC3E Flash Family FPGAs

II Revision 10

I/Os Per Package1

ProASIC3E Device Status

ProASIC3E Devices A3PE600 A3PE1500 3A3PE3000 3

Cortex-M1 Devices 2M1A3PE1500 M1A3PE3000

Package

I/O Types

Single-Ended I/O1

Differential I/O Pairs

Single-Ended I/O1

Differential I/O Pairs

Single-Ended I/O1

Differential I/O Pairs

PQ208 147 65 147 65 147 65

FG256 16579––––

FG324 ––––221110

FG484 270 135 280 139 341 168

FG676 – – 444 222 – –

FG896 ––––620310

Notes:

1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3E FPGA Fabric User’s

Guide to ensure compliance with design and board migration requirements.

2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.

3. For A3PE1500 and A3PE3000 devices, the usage of certain I/O standards is limited as follows:

– SSTL3(I) and (II): up to 40 I/Os per no rth or south bank

– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank

– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank

4. FG256 and FG484 are footprint-compatible packages.

5. When using voltage-referenced I/O standards, one I/O pin should be assigned as a voltage-referenced pin (VREF) per

minibank (group of I/Os).

6. "G" indicates RoHS-compliant packages. Refer to the "ProASIC3E Orderi ng Information" on page III for the location of the "G"

in the part number.

Table 1-2 • ProASIC3E FPGAs Package Sizes Dimensio ns

Package PQ208 FG256 FG324 FG484 FG676 FG896

Length × Width (mm\mm) 28 × 28 17 × 17 19 × 19 23 × 23 27 × 27 31 × 31

Nominal Area (mm2)784 289 361 529 729 961

Pitch (mm) 0.5 1.0 1.0 1.0 1.0 1.0

Height (mm) 3.40 1.60 1.63 2.23 2.23 2.23

ProASIC3E Devices Status M1 ProASIC3E Devices Status

A3PE600 Production

A3PE1500 Production M1A3PE1500 Production

A3PE3000 Production M1A3PE3000 Production

ProASIC3E Flash Family FPGAs

Revision 10 III

ProASIC3E Ordering Information

A3PE3000 FG

Part Number

Speed Grade

1 = 15% Faster than Standard

2 = 25% Faster than Standard

Package Type

PQ =Plastic Quad Flat Pack (0.5 mm pitch)

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

896 I

Package Lead Count

Application (Temperature Range)

Blank = Commercial (0°C to +70°C Ambient Temperature)

I = Industrial (–40°C to +85°C Ambient Temperature)

PP = Pre-Production

ES = Engineering Sample (Room Temperature Only)

600,000 System Gates

A3PE600 =

1,500,000 System Gates

A3PE1500 =

3,000,000 System Gates

A3PE3000 =

1,500,000 System Gates

M1A3PE1500 =

3,000,000 System Gates

M1A3PE3000 =

Lead-Free Packaging

Blank =Standard Packaging

G =RoHS-Compliant (Green) Packaging

ProASIC3E Devices

ProASIC3E Devices with Cortex-M1

Security Feature

Y = Device Includes License to Implement IP Based on the

Cryptography Research, Inc. (CRI) Patent Portfolio

ProASIC3E Flash Family FPGAs

IV Revision 10

Temperature Grade Offerings

Speed Grade and Temperature Grade Matrix

References made to ProASIC3E devices also apply to ARM-enabled ProASIC3E devices. The ARM-enabled part numbers start with

M1 (Cortex-M1).

Contact your local Microsemi SoC Products Group representative for devi c e availability:

http://www.microsemi.com/soc/contact/default.aspx.

Package A3PE600 A3PE1500 A3PE3000

Cortex-M1 Devices M1A3PE1500 M1A3PE3000

PQ208 C, I C, I C, I

FG256 C, I – –

FG324 – – C, I

FG484 C, I C, I C, I

FG676 – C, I –

FG896 – – C, I

Note: C = Commercial temperature range: 0°C to 70°C ambient temperature

I = Industrial temperature range: –40°C to 85°C ambient temperature

Temperature Gr ade Std. –1 –2

C1333

I2333

Notes:

1. C = Commercial temperature range: 0°C to 70°C ambient temperature

2. I = Industrial temperature range: –40°C to 85°C ambient temperature

ProASIC3E Flash Family FPGAs

Revision 10 V

Table of Content s

ProASIC3E Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3E DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-68

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-70

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-72

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82

Pin Descriptions and Packaging

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

User-Defined Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

Package Pin Assignments

PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

FG256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

FG324 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12

FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16

FG676 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32

FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-40

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

Safety Critical, Life Support, and High -R eliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

Revision 10 1-1

1 – ProASIC3E Device Family Overview

General Description

ProASIC3E, the third-generation family of Microsemi flash FPGAs, offers performance, density, and

features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3E

devices the advantage of being a secure, low power, single-chip solution that is live at power-up (LAPU).

ProASIC3E is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These

features enable designers to create high-density systems using existing ASIC or FPGA design flows and

tools.

ProASIC3E devices offer 1 kbit of on-chip, programmable, nonvolatile FlashROM storage as well as

clock conditioning circuitry based on six integrated phase-locked loops (PLLs). ProASIC3E devices have

up to three million system gates, supported with up to 504 kbits of true dual-port SRAM and up to 620

user I/Os.

Several ProASIC3E devices support the Cortex-M1 soft IP cores, and the ARM-Enabled devices have

Microsemi ordering numbers that begin with M1A3PE.

Flash Advantages

Reduced Cost of Ownership

Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAM-

based FPGAs, flash-based ProASIC 3E devices allow all function ality to be live at power-up; no external

boot PROM is required. On-board security mechanisms prevent access to all the programming

information and enable secure remote updates of the FPGA logic. Designers can perform secure remote

in-system reprogramming to support future design iterations and field upgrades with confidence that

valuable intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using

the industry-standard AES algorithm. The ProASIC3E family device architecture mitigates the need for

ASIC migration at higher user volumes. This makes the ProASIC3E family a cost-effective ASIC

replacement solution, especially for applications in the consumer, networking/ communications,

computing, and avionics markets.

Security

The nonvolatile, flash -based ProASIC3 E devices do no t require a boot PROM, so there is no vul nerable

external bitstream that can be easily copied. ProASIC3E devices incorporate FlashLock, which provides

a unique combination of reprogrammability and design security without external overhead, advantages

that only an FPGA with nonvolatile flash programming can offer.

ProASIC3E devices utilize a 128-bit flash-based lock and a sep arate AES key to pr ovide the highest level

of protection in the FPGA industry for programmed intellectual property and configuration data. In

addition, all FlashROM data in ProASIC3E devices can be encrypted prior to loading, using the industry-

leading AES-128 (FIPS192) bit block cipher encryption standard. The AES standard was adopted by the

National Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard.

ProASIC3E devices have a built-in AES decryption engine and a flash-based AES key that make them

the most comprehensive programmable logic device security solution available today. ProASIC3E

devices with AES-based securi ty provide a high level of protection for secu re, remote field updates over

public networks such as the Internet, and ensure that valuable IP remains out of the hands of system

overbuilders, system cloners, and IP thieves. Th e contents of a programmed ProASIC3E device cannot

be read back, although secure design verification is possible.

Security, built into the FPGA fabric, is an inherent component of the ProASIC3E family. The flash cells

are located beneath seven metal layers, and many device design and layout techniques have been used

to make invasive attacks extremely difficult. The ProASIC3E family, with FlashLock and AES security, is

unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected

with industry-standard security, making remote ISP possible. A ProASIC3E device provides the best

available security for programmable logic designs.

ProASIC3E Device Family Overview

1-2 Revision 10

Single Chip

Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the

configuration data is an inherent part of the FPGA structu re, a nd no exte rnal configuratio n data needs to

be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based ProASIC3E FPGAs

do not require system configuration components such as EEPROMs or microcontrollers to load device

configuration data. This reduces bill-of-materials costs and PCB area, and increases security and system

reliability.

Live at Power-Up

Flash-based ProASIC3E devices support Leve l 0 o f the LAPU classi fica tion standard. This fe ature he lps

in system component initialization, execution of critical tasks before the processor wakes up, setup and

configuration of memory blocks, clock generation, and bus activity management. The LAPU feature of

flash-based ProASIC3E devices greatly simplifies total system design and reduces total system cost,

often eliminating the need for CPLDs and clock generation PLLs that are used for these purposes in a

system. In addition, glitches and brownouts in system power will not corrupt the ProASIC3E device's

flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when

system power is restored. This enables the reduction or complete removal of the configuration PROM,

expensive voltage monitor , brownout detection, and clock generator devices from the PCB design. Flash-

based ProASIC3E devices simplify total system design and reduce cost and design risk while increasing

system reliability and improving system initialization time.

Firm Errors

Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere, strike

a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the

configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way. These

errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be a

complete system failure. Firm errors do not exist in the configuration memory of ProASIC3E flash-based

FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3E FPGAs cannot be

altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft) errors occur in

the user data SRAM of all FPGA devices. These can easily be mitigated by using error detection and

correction (EDAC) circuitry built into the FPGA fabric.

Low Power

Flash-based ProASIC3E device s exhibit power ch aracteristics similar to an ASIC, making them an ideal

choice for power-sensitive applications. ProASIC3E devices have only a very limited power-on current

surge and no high-current transition period, both of which occur on many FPGAs.

ProASIC3E devices also have low dynamic power consumption to further maximize power savings.

Advanced Flash Technology

The ProASIC3E family offers many benefits, including nonvolatility and reprogrammability through an

advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS design

techniques are used to implement logic and control functions. The combination of fine granularity,

enhanced flexible routing resources, and abundant flash switches allows for very high logic utilization

without compromising device routability or performance. Logic functions within the device are

interconnected through a four-level routing hierarchy.

ProASIC3E Flash Family FPGAs

Revision 10 1-3

Advanced Architecture

The proprietary ProASIC3E architecture provides granularity comparable to standard-cell ASICs. The

ProASIC3E device consists of five distinct and programmable architectural features (Figure 1-1 on

page 3):

• FPGA VersaTiles

• Dedicated FlashROM

• Dedicated SRAM/FIFO memory

• Extensive CCCs and PLLs

• Pro I/O structure

The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input logic

function, a D-flip-flop (with or without enable), or a latch by programming the appropriate flash switch

interconnections. The versatility of the ProASIC3E core tile as either a three-input lookup table (LUT)

equivalent or as a D-flip-fl op/latch with enable allows for efficient use of the FPGA fabric. Th e VersaTile

capability is unique to the ProASIC famil y of third-generation architecture Flash FPGAs. VersaTiles are

connected with an y of the four levels of routing hi erarchy. Flash switches are distribute d throughout the

device to provide nonvolatile, reconfigurable interconnect programming. Maximum core utilization is

possible for virtually any design.

Figure 1-1 • ProASIC3E Device Arc hitectu re Overview

4,608-Bit Dual-Port SRAM

or FIFO Block

VersaTile

RAM Block

CCC

Pro I/Os

ISP AES Decryption User Nonvolatile

FlashROM Charge Pumps

4,608-Bit Dual-Port SRAM

or FIFO Block

RAM Block

ProASIC3E Device Family Overview

1-4 Revision 10

VersaTiles

The ProASIC3E core consists of V ersaTiles, which have been enhanced beyond the ProASICPLUS® core

tiles. The ProASIC3E VersaTile supports the following:

• All 3-input logic functions—L UT-3 equivalent

• Latch with clear or set

• D-flip-flop with clear or set

• Enable D-flip-flop with clear or set

Refer to Figure 1-2 for VersaTile configurations.

User Nonvolatile FlashROM

ProASIC3E devices have 1 kbit of on-chip, use r-accessible, nonvolatile FlashROM. The FlashROM can

be used in diverse system applications:

• Internet protocol addressing (wireless or fixed)

• System calibration settings

• Device serialization and/or inventory control

• Subscription-based business models (for example, set-top boxes)

• Secure key storage for secure communications algorithms

• Asset management/tracking

• Date stamping

• Version management

The FlashROM is w ritten using the standard ProASIC3E IEEE 1532 JTAG programming interface. The

core can be individually programmed (erased and written), and on-chip AES decryption can be used

selectively to securely load data over public networks, as in security keys stored i n the FlashROM for a

user design.

The FlashROM can be programmed via the JTAG progr amming interface, and its contents can be read

back either through the JTAG programmin g interface or via direct FPGA core addressing. Note that the

FlashROM can only be programmed from the JTAG interface and cannot be programmed from the

internal logic array.

The FlashROM is programmed as 8 banks of 128 bi ts; however, reading is performed on a byte-by-byte

basis using a synchronous interface. A 7-bit address from the FPGA core defin es which of the 8 banks

and which of the 16 byte s within that bank are being read. T he three most significa nt bits (MSBs) of the

FlashROM address determine the bank, and the four least significant bits (LSBs) of the FlashROM

address define the byte.

The ProASIC3E development software solutions, Libero® Integrated Design Environment (IDE) and

Designer, have extensive support for the FlashROM. One such feature is auto-generation of sequenti al

programming files for a pplications requiring a unique seria l number in each part. Another featur e allows

the inclusion of static data for system version control. D ata for the Flash ROM can be generated quickly

and easily using Libero IDE and Designer software tools. Comprehensive programming file support is

also included to allow for easy programming of large numbers of parts with differing FlashROM contents.

Figure 1-2 • VersaTile Configurations

X1 Y

X3 LUT-3 Data Y

CLK

Enable

CLR

D-FF

Data Y

CLK

CLR D-FF

LUT-3 Equivalent D-Flip-Flop with Clear or Set Enable D-Flip-Flop with Clear or Set

ProASIC3E Flash Family FPGAs

Revision 10 1-5

SRAM and FIFO

ProASIC3E devices have embedded SRAM blocks along their north and south sides. Each variable-

aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18, 512×9,

1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that can be

configured with different bit widths on each port. For example, data can be sent through a 4-bit port a nd

read as a single bitstream. The embedded SRAM blocks can be initialized via the device JTAG port

(ROM emulation mode) using the UJTAG macro.

In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM

block to be con figured as a synchro nous FIFO with out using additi onal core VersaTiles. The FIFO width

and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and

Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The embedded FIFO control

unit contains the counters necessary for generation of the read and write address pointers. The

embedded SRAM/FIFO blocks can be cascaded to create larger configurations.

PLL and CCC

ProASIC3E devices provide designers with very flexible clock conditioning capabilities. Each member of

the ProASIC3E family contains six CCCs, each with an integrated PLL.

The six CCC blocks are located at the four corners and the centers of the east and west sides.

To maximize user I/Os, only the center east and west PLLs are available in devices using the PQ208

package. However, all six CCC blocks are still usable; the four corner CCCs allow simple clock delay

operations as well as clock spine access.

The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs

located near the CCC that have dedicated connections to the CCC block.

The CCC block has these key features:

• Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz

• Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz

• Clock delay adjustment via programmable and fixed delays from –7.56 ns to +11.12 ns

• 2 programmable delay typ es for clock skew minimization

• Clock frequency synthesis

Additional CCC specifications:

• Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output divider

configuration.

• Output duty cycle = 50% ± 1.5% or better

• Low output jitter: worst case < 2.5% × clock per iod peak-to-peak period jitter when single global

network used

• Maximum acquisition time = 300 µs

• Low power consumption of 5 mW

• Exceptional tolerance to input perio d jitter— allowable input jitter is up to 1.5 ns

• Four precise phases; maximum misalignment between adjacent phases of 40 ps × (350 MHz /

fOUT_CCC)

Global Clocking

ProASIC3E devices have extensive support for multiple clocking domains. In addition to the CCC and

PLL support described above, there is a comprehensive global clock distribution network.

Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three quadrant

global networks. The VersaNets can be driven by the CCC or directly accessed from the core via

multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for rapid

distribution of high fanout nets.

ProASIC3E Device Family Overview

1-6 Revision 10

Pro I/Os with Advanced I/O Standards

The ProASIC3E family of FPGAs feat ures a flexible I/O structure, s upporting a range of voltages (1.5 V,

1.8 V, 2.5 V, and 3.3 V). ProASIC3E FPGAs support 19 different I/O standards, including single-ended,

differential, and voltage-referenced. The I/Os are or ganized into banks, with eigh t banks per de vice (two

per side). The configuration of these banks determines the I/O standards supported. Each I/O bank is

subdivided into VREF minibanks, which are used by voltage-referenced I/Os. VREF minibanks contain 8

to 18 I/Os. All the I/Os in a given minibank share a common VREF line. Therefore, if any I/O in a given

VREF minibank is configured a s a VREF pin, the remaini ng I/Os in th at miniba nk w ill be a ble to use that

reference voltage.

Each I/O module contains several input, output, and enable registers. These registers allow the

implementation of the following:

• Single-Data-Rate applications (e.g., PCI 66 MHz, bidirectional SSTL 2 and 3, Class I and II)

• Double-Data-Rate applications (e.g., DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point

communications, and DDR 200 MHz SRAM using bidirectional HSTL Class II)

ProASIC3E banks support M-LVDS with 20 multi-drop points.

Hot-swap (also called hot-pl ug, or hot-insertion ) is t he opera tion of h ot-insertion or hot-remova l of a card

in a powered-up system.

Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data undisturbed

when the system is powered up, while the component itself is powered down, or when power supplies

are floating.

Specifying I/O States During Programming

You can modi fy the I/O states during programming in FlashPro. In F lashP ro, thi s fea tu re is sup ported for

PDB files generated from Designer v8.5 or greater. See the FlashPro User’s Guide for more information.

Note: PDB files generated from Designer v8.1 to Designer v8.4 (including all service packs) have

limited display of Pin Numbers only.

1. Load a PDB from the FlashPro GUI. You must have a PDB loaded to modify the I/O states during

programming.

2. From the FlashPro GUI, click PDB Configuration. A FlashPoint – Programming File Generator

window appears.

3. Click the Specify I/O States During Programming button to display the Specify I/O States During

Programming dialog box.

4. Sort the pins as desired by clicking any of the column headers to sort the entries by that head er.

Select the I/Os you wish to modify ( Figure 1-3 on page 1-7).

5. Set the I/O Output State. You can set Basic I/O settings if you want to use the default I/O settings

for your pins, or use Custom I/O settings to customize the settings for each pin. Basic I/O state

settings:

1 – I/O is set to drive out logic High

0 – I/O is set to drive out logic Low

Last Known State – I/O is set to the last value that was driven out prior to entering the

programming mode, and then held at that value during programmi ng

Z -Tri-State: I/O is tristated

ProASIC3E Flash Family FPGAs

Revision 10 1-7

6. Click OK to return to the FlashPoint – Programming File Generator window.

Note: I/O States During programming are saved to the ADB and resulting programming files after

completing programming file generation.

Figure 1- 3 • I/O States During Programming Window

Revision 10 2-1

2 – ProASIC3E DC and Switching Characteristics

General Specifications

DC and switching characteristics for –F speed grade targets are based only on simulation.

The characteristics provided for the –F speed grade are subject to change after establishing FPGA

specifications. Some restrictions might be added and will be reflected in future revisions of this

document. The –F speed grade is only suppo rted in the commercial temperature range.

Operating Conditions

Stresses beyond those listed in Table 2-1 may cause permanent damage to the device.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Absolute Maximum Ratings are stress ratings only; functional operation of the device at these or any

other conditions beyond those listed under the Recommended Operating Conditions specified in

Table 2-2 on page 2-2 is not implied.

Table 2-1 • Absolute Maximum Ratings

Symbol Parameter Limits Units

VCC DC core supply voltage –0.3 to 1.65 V

VJTAG JTAG DC voltage –0.3 to 3.75 V

VPUMP Programming voltage –0.3 to 3.75 V

VCCPLL Analog power supply (PLL) –0.3 to 1.65 V

VCCI DC I/O output buffer supply voltage –0.3 to 3.75 V

VMV DC I/O input buffer supply voltage –0.3 to 3.75 V

VI I/O input voltage –0.3 V to 3.6 V (when I/O hot insertion mode is enabled)

–0.3 V to (VCCI + 1 V) or 3.6 V, which ever voltage is lower

(when I/O hot-in se rti o n mo de is di sa b le d )

TSTG 2Storage temperature –65 to +150 °C

TJ2Junction temperature +125 °C

Notes:

1. The device should be operated within the limits specified by the datasheet. During transitions, the input signal may

undershoot or overshoot according to the limits shown in Table 2-3 on page 2-2.

2. For flash programming and retention maximum limits, refer to Table 2-3 on page 2-2, and for recommended operating

limits, re fer to Table 2-2 on page 2-2.

ProASIC3E DC and Switching Characteristics

2-2 Revision 10

Table 2-2 • Recommended Operating Conditions1

Symbol Parameter Commercial Industrial Units

TAAmbient temperature 0 to +70 –40 to +85 °C

TJJunction temperature 0 to +85 –40 to +100 °C

VCC 1.5 V DC core supply voltage 1.425 to 1.575 1.425 to 1.575 V

VJTAG JTAG DC voltage 1.4 to 3.6 1 .4 to 3.6 V

VPUMP Programming voltage Programming Mode 3.15 to 3.45 3.15 to 3.45 V

Operation30 to 3.6 0 to 3.6 V

VCCPLL Analog power supply (PLL) 1.425 to 1.575 1.425 to 1.575 V

VCCI and VMV 21.5 V DC supply voltage 1.425 to 1.575 1.425 to 1.575 V

1.8 V DC supply voltage 1.7 to 1.9 1.7 to 1.9 V

2.5 V DC supply voltage 2.3 to 2.7 2.3 to 2.7 V

3.3 V DC supply voltage 3.0 to 3.6 3.0 to 3.6 V

3.0 V DC supply voltage52.7 to 3.6 2.7 to 3.6 V

LVDS/B-LVDS/M-LVDS differential I/O 2.375 to 2.625 2.375 to 2.625 V

LVPECL differential I/O 3.0 to 3.6 3.0 to 3.6 V

Notes:

1. All parameters representing voltages are measured with respect to GND unless otherwise specified.

2. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each I/O

standard are given in Table 2-13 on p age 2-17. VMV and VCCI should be at the same volt age within a given I/O bank.

3. VPUMP can be left floating during normal operation (not programming mode).

4. To ensure targeted reliability standards are met across ambient and junction operating temperatures, Microsemi

recommends that the user fol low best design practices using Microsemi’s timing and power simulati on tools.

5. 3.3 V wide range is compliant to the JDEC8b specification and supports 3.0 V VCCI operation.

Table 2-3 • Flash Programming Limits – Retention, Storage and Operating Temperat ure 1

Product Gr ade Programming

Cycles Program Retention

(biased/unbiased) Maximum Storage

Temperature TSTG (° C) 2 Maximum Operating Junction

Temperatur e TJ (°C) 2

Commercial 500 20 years 110 100

Industrial 500 20 years 110 100

Notes:

1. This is a stress rating only; functional operation at any condition other than those indicated is not implied.

2. These limits apply for program/data retention only. Refer to Table 2-1 on page 2-1 and Table 2-2 for device operating

conditions and absolut e limits.

ProASIC3E Flash Family FPGAs

Revision 10 2-3

I/O Power-Up and Supply Voltage Thresholds for Power-On Reset

(Commercial and Industrial)

Sophisticated power-up management circuitry is designed into every ProASIC®3E device. These circuits

ensure easy transition from the powered-off state to the powered-up state of the device. The many

different supplies can power up in any sequence with minimized current spikes or surges. In addition, the

I/O will be in a known state through the power-up sequence. The basic principl e is shown in Figure 2-1

on page 2-4.

There are five regions to consider durin g power-up.

ProASIC3E I/Os are activated only if ALL of the following three cond itions are met:

1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 on page 2-4).

2. VCCI > VCC – 0.75 V (typical)

3. Chip is in the operating mode.

VCCI Trip Point:

Ramping up: 0.6 V < trip_point_up < 1.2 V

Ramping down: 0.5 V < trip_point_down < 1.1 V

VCC Trip Point:

Ramping up: 0.6 V < trip_point_up < 1.1 V

Ramping down: 0.5 V < trip_point_down < 1 V

VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This specifically

built-in hysteresis prevents undesirable power-up oscillations and current surges. Note the follow ing:

• During programming, I/Os become tristated and weakly pulled up to VCCI.

• JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O

behavior.

Table 2-4 • Overshoot and Undershoot Limits 1

VCCI and VMV

Average VCCI–GND Overshoot or

Undershoot Duration

as a Percentage of Clock Cycle2Maximum Overshoot/

Undershoot2

2.7 V or less 10% 1.4 V

5% 1.49 V

3 V 10% 1.1 V

5% 1.19 V

3.3 V 10% 0.79 V

5% 0.88 V

3.6 V 10% 0.45 V

5% 0.54 V

Notes:

1. Based on reliability requirements at 85°C.

2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two cycles, the

maximum overshoot/undershoot has to be reduced by 0.15 V.

3. This table does not provide PCI overshoot/undershoot limits.

ProASIC3E DC and Switching Characteristics

2-4 Revision 10

PLL Behavior at Brownout Condition

Microsemi recommends using monotonic power supplies or voltage regulators to ensure proper

power-up behavior. Power ramp-up should be monotonic at least until VCC and VCCPLXL exceed

brownout activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 2-1 on

page 2-4 for more details).

When PLL power supply voltage and/or VCC le vels dro p below the VCC b rownout level s (0.75 V ± 0.25

V), the PLL output lock signal goes low and/or the output clock is lost. Refer to the "Power-Up/-Down

Behavior of Low Power Flash Devices" chapter of the ProASIC3E FPGA Fabric User’s Guide for

information on clock and lock recovery.

Internal Power-Up Activation Sequence

1. Core

2. Input buffers

3. Output buffers, after 200 ns delay from input buffer activation

Figure 2-1 • I/O State as a Function of VCCI and VCC Voltage Levels

Region 1: I/O buffers are OFF

Region 2: I/O buffers are ON.

I/Os are functional (except differential inputs)

but slower because VCCI / VCC are below

specification. For the same reason, input

buffers do not meet VIH / VIL levels, and

output buffers do not meet VOH / VOL levels.

Min VCCI datasheet specification

voltage at a selected I/O

standard; i.e., 1.425 V or 1.7 V

or 2.3 V or 3.0 V

VCC

VCC = 1.425 V

Region 1: I/O Buffers are OFF

Activation trip point:

= 0.85 V ± 0.25 V

Deactivation trip point:

= 0.75 V ± 0.25 V

Activation trip point:

= 0.9 V ± 0.3 V

Deactivation trip point:

= 0.8 V ± 0.3 V

VCC = 1.575 V

Region 5: I/O buffers are ON

and power supplies are within

specification.

I/Os meet the entire datasheet

and timer specifications for

speed, VIH / VIL, VOH / VOL,

etc.

Region 4: I/O

buffers are ON.

I/Os are functional

(except differential

but slower because VCCI

is below specification. For the

same reason, input buffers do not

meet VIH / VIL levels, and output

buffers do not meet VOH / VOL levels.

where VT can be from 0.58 V to 0.9 V (typically 0.75 V)

VCCI

Region 3: I/O buffers are ON.

I/Os are functional; I/O DC

specifications are met,

but I/Os are slower because

the VCC is below specification.

VCC = VCCI + VT

ProASIC3E Flash Family FPGAs

Revision 10 2-5

Thermal Characteristics

Introduction

The temperature variable in Designer software refers to the junction temperature, not the ambient

temperature. This is an important distinction becau se dynamic and static power consumption cause the

chip junction to be higher than the ambient temperature.

EQ 1 can be used to calculate junction temperature.

TJ = Junction Temperature = ΔT + TA EQ 1

where:

TA = Ambient Temperature

ΔT = Temperature gradient between ju nction (silicon) and ambient ΔT = θja * P

θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.

P = Power dissipation

Package Thermal Characteristics

The device junction-to-case thermal resistivity is θjc and the juncti on-to-ambient air thermal resistivity is

θja. The thermal characteristics for θja are shown for two air flow rates. The absolute maximum juncti on

temperature is 110°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation

allowed for an 896-pin FBGA package at commercial temperature and in still air.

EQ 2

Temperature and Voltage Derating Factors

Maximum Power Allowed Max. junction temp. (°C) Max. ambient temp. (°C)–

θja(°C/W)

--------------------------------------------------------------------------------------------------------------------------------------- 110°C70°C–

13.6°C/W

------------------------------------ 5 . 8 8 W===

Table 2-5 • Package Thermal Resistivities

Package Type Pin Count θjc

θja

UnitsStill Air 200 ft./min. 500 ft./min.

Plastic Quad Flat Package (PQFP) 208 8.0 26.1 22.5 20.8 C/W

Plastic Quad Flat Package (PQFP) with

embedded heat spreader 208 3.8 16.2 13.3 11.9 C/W

Fine Pitch Ball Grid Array (FBGA) 256 3.8 26.9 22.8 21.5 C/W

484 3.2 20.5 17.0 15.9 C/W

676 3.2 16.4 13.0 12.0 C/W

896 2.4 13.6 10.4 9.4 C/W

Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays

(normalized to TJ= 70°C, VCC = 1.425 V)

Array Voltage

VCC (V)

Junction Temperature (°C)

–40°C 0°C 25°C 70°C 85°C 100°C

1.425 0.87 0.92 0.95 1.00 1.02 1.04

1.500 0.83 0.88 0.90 0.95 0.97 0.98

1.575 0.80 0.85 0.87 0.92 0.93 0.95

ProASIC3E DC and Switching Characteristics

2-6 Revision 10

Calculating Power Dissipation

Quiescent Supply Current

Power per I/O Pin

Table 2-7 • Quiescent Supply Current Characteristics

A3PE600 A3PE1500 A3PE3000

Typical (25°C) 5 mA 12 mA 25 mA

Maximum (Commercial) 30 mA 70 mA 150 mA

Maximum (Industrial) 45 mA 105 mA 22 5 mA

Notes:

1. IDD Includes VCC, VPUMP, VCCI, and VMV currents. Values do not include I/O static contribution, which is shown in

Table 2-8 and Table 2-9 on page 2-8.

2. –F speed grade devices may experience higher standby IDD of up to five times the standard IDD and higher I/O

leakage.

Table 2-8 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings

VMV

(V) Static Power

PDC2 (mW)1Dynamic Power

PAC9 (µW/MHz)2

Single-Ended

3.3 V LVTTL /LVCMOS 3.3 – 17.39

3.3 V LVTTL/LVCMOS – Schmitt trigger 3.3 – 25.51

3.3 V LVTTL/LVCMOS Wide Range33.3 – 16.34

3.3 V LVTTL/LVCMOS Wide Range – Schmitt trigger33.3 – 24.49

2.5 V LVCMOS 2.5 – 5.76

2.5 V LVCMOS – Schmitt trigger 2.5 – 7.16

1.8 V LVCMOS 1.8 – 2.72

1.8 V LVCMOS – Schmitt trigger 1.8 – 2.80

1.5 V LVCMOS (JESD8-11) 1.5 – 2.08

1.5 V LVCMOS (JESD8-11) – Schmitt trigger 1.5 – 2.00

3.3 V PCI 3.3 – 18.82

3.3 V PCI – Schmitt trigger 3.3 – 20.12

3.3 V PCI-X 3.3 – 18.82

3.3 V PCI-X – Schmitt trigger 3.3 – 20.12

Voltage-Referenced

3.3 V GTL 3.3 2.90 8.23

2.5 V GTL 2.5 2.13 4.78

3.3 V GTL+ 3.3 2.81 4.14

2.5 V GTL+ 2.5 2.57 3.71

Notes:

1. PDC2 is the static po wer (where applicable) measured on VMV.

2. PAC9 is the total dynamic power measured on VCC and VMV.

3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8b specification.

ProASIC3E Flash Family FPGAs

Revision 10 2-7

HSTL (I) 1.5 0.17 2.03

HSTL (II) 1.5 0.17 2.03

SSTL2 (I) 2.5 1.38 4.48

SSTL2 (II) 2.5 1.38 4.48

SSTL3 (I) 3.3 3.21 9.26

SSTL3 (II) 3.3 3.21 9.26

Table 2-8 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings (continued)

VMV

(V) Static Power

PDC2 (mW)1Dynamic Power

PAC9 (µW/MHz)2

Notes:

1. PDC2 is the static po wer (where applicable) measured on VMV.

2. PAC9 is the total dynamic power measured on VCC and VMV.

3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8b specification.

ProASIC3E DC and Switching Characteristics

2-8 Revision 10

Differential

LVDS/B-LVDS/M-LVDS 2.5 2.26 1.50

LVPECL 3.3 5.71 2.17

Table 2-9 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1

CLOAD

(pF) VCCI

(V) Static Power

PDC3 (mW)2

Dynamic Pow er

PAC10

(μW/MHz)3

Single-Ended

3.3 V LVT TL /LVCMOS 35 3.3 – 474.70

3.3 V LVTTL/LVCMOS Wide

Range435 3.3 – 474.70

2.5 V LVCMOS 35 2.5 – 270.73

1.8 V LVCMOS 35 1.8 – 151.78

1.5 V LVCMOS (JESD8-11) 35 1.5 – 104.55

3.3 V PCI 10 3.3 – 204.61

3.3 V PCI-X 10 3.3 – 204.61

Voltage-Referenced

3.3 V GTL 10 3.3 – 24.08

2.5 V GTL 10 2.5 – 13.52

3.3 V GTL+ 10 3.3 – 24.10

2.5 V GTL+ 10 2.5 – 13.54

HSTL (I) 2 0 1.5 7.08 26.22

HSTL (II) 20 1.5 13.88 27.22

SSTL2 (I) 30 2.5 16.69 105.56

SSTL2 (II) 30 2.5 25.91 116.60

SSTL3 (I) 30 3.3 26.02 114.87

SSTL3 (II) 30 3.3 42.21 131.76

Differential

LVDS/B-LVDS/M-LVDS – 2.5 7.70 89.62

LVPECL – 3.3 19.42 168.02

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength and output slew.

2. PDC3 is the static po wer (where applicable) measured on VCCI.

3. PAC10 is the total dynamic power measured on VCC and VCCI.

4. All LVCMOS 3.3 V software macros support LVCMOS 3. 3 V wide range as specified in the JESD8-B specification.

Table 2-8 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings (continued)

VMV

(V) Static Power

PDC2 (mW)1Dynamic Power

PAC9 (µW/MHz)2

Notes:

1. PDC2 is the static po wer (where applicable) measured on VMV.

2. PAC9 is the total dynamic power measured on VCC and VMV.

3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8b specification.

ProASIC3E Flash Family FPGAs

Revision 10 2-9

Power Consumption of Va ri ous Internal Resources

Table 2-10 • Different Components Contributing to the Dynamic Power Consumption in ProASIC3E Devices

Parameter Definition

Device-Specific Dynamic Contributions

(µW/MHz)

A3PE600 A3PE1500 A3PE3000

PAC1 Clock contribution of a Global Rib 12.77 16.21 19.7

PAC2 Clock contribution of a Global Spine 1.85 3.06 4.16

PAC3 Clock contribution of a VersaTile row 0.88

PAC4 Clock contribution of a VersaTile used as a sequential

module 0.12

PAC5 First contribution of a VersaTile used as a sequential

module 0.07

PAC6 Se cond contribution of a VersaTile used as a sequentia l

module 0.29

PAC7 Contribution of a VersaTile used as a combinatorial

module 0.29

PAC8 Average contribution of a ro uting net 0.70

PAC9 Co ntribution of an I/O input pin (standard-dependent) See Table 2-8 on page 2-6.

PAC10 Contribution of an I/O output pin (standard-dependent) See Table 2-9 on page 2-8

PAC11 Average contribution of a RAM block during a read

operation 25.00

PAC12 Average contribution of a RAM block during a write

operation 30.00

PAC13 Static PLL contribution 2.55 mW

PAC14 Dynamic contribution for PLL 2.60

Note: For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power

calculator or SmartPower in Libero IDE.

ProASIC3E DC and Switching Characteristics

2-10 Revision 10

Power Calculation Methodology

This section describes a simplified method to estimate power consumption of an application. For more

accurate and detailed power estimations, use the SmartPower tool in the Libero IDE software.

The power calculation methodology described below uses the following variables:

• The number of PLLs as well as the number and the frequency of each output clock generated

• The number of combinatorial an d sequential cells used in th e design

• The internal clock frequencies

• The number and the standard of I/O pins used in the design

• The number of RAM blocks used in the design

• Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 2-11 on

page 2-12.

• Enable rates of output buffers—guidelines are provided for typical applications in Table 2-12 on

page 2-12.

• Read rate and write rate to the memory—guidelines are provided for typical applications in

Table 2-12 on page 2-12. The calculation should be repeated for each clock domain defined in the

design.

Methodology

Total Power Consumption—PTOTAL

PTOTAL = PSTAT + PDYN

PSTAT is the total static power consumption.

PDYN is the total dynamic power consumption.

Total Static Power Consumption—PSTAT

PSTAT = PDC1 + NINPUTS * PDC2 + NOUTPUTS * PDC3

NINPUTS is the number of I/O input buffers used in the design.

NOUTPUTS is the number of I/O output buffers used in the design.

Total Dynamic Power Consumption—PDYN

PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL

Global Clock Contribution—PCLOCK

PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL * PAC4) * FCLK

NSPINE is the number o f global spines used in the user design—gu idelines are provided in the

"Spine Architecture" section of the Global Resources chapter in the ProASIC3E FPGA Fabric

User's Guide.

NROW is the number of VersaTile rows used in the design—guidelines are provided in the

"Spine Architecture" section of the Global Resources chapter in the ProASIC3E FPGA Fabric

User's Guide.

FCLK is the global clock signal frequency.

NS-CELL is the number of VersaTiles used as sequential modules in the design.

PAC1, PAC2, PAC3, and PAC4 are device-dependent.

Sequential Cells Contribution—PS-CELL

PS-CELL = NS-CELL * (PAC5 + α1 / 2 * PAC6) * FCLK

NS-CELL is the number of VersaTiles used as sequential modules in the design. When a

multi-tile sequential cell is used, it should be accounted for as 1.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-11 on

page 2-12.

FCLK is the global clock signal frequency.

ProASIC3E Flash Family FPGAs

Revision 10 2-11

Combinatorial Cells Contribution—PC-CELL

PC-CELL = NC-CELL* α1 / 2 * PAC7 * FCLK

NC-CELL is the number of VersaTiles used as combinatorial modules in the design.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-11 on

page 2-12.

FCLK is the global clock signal frequency.

Routing Net Contribution—PNET

PNET = (NS-CELL + NC-CELL) * α1 / 2 * PAC8 * FCLK

NS-CELL is the number of VersaTiles used as sequential modules in the design.

NC-CELL is the number of VersaTiles used as combinatorial modules in the design.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-11 on

page 2-12.

FCLK is the global clock signal frequency.

I/O Input Buffer Contribution—PINPUTS

PINPUTS = NINPUTS * α2 / 2 * PAC9 * FCLK

NINPUTS is the number of I/O input buffers used in the design.

α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-11 on page 2-12.

FCLK is the global clock signal frequency.

I/O Output Buffer Contribution—POUTPUTS

POUTPUTS = NOUTPUTS * α2 / 2 * β1 * PAC10 * FCLK

NOUTPUTS is the number of I/O output buffers used in the design.

α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-11 on page 2-12.

β1 is the I/O buffer enable rate—guidelines are provided in Table 2 -12 on page 2-12.

FCLK is the global clock signal frequency.

RAM Contribution—PMEMORY

PMEMORY = PAC11 * NBLOCKS * FREAD-CLOCK * β2 + PAC12 * NBLOCK * FWRITE-CLOCK * β3

NBLOCKS is the number of RAM blocks used in the design.

FREAD-CLOCK is the memory read clock frequency.

β2 is the RAM enable rate for read operations—guidelines are provided in Table 2-12 on

page 2-12.

FWRITE-CLOCK is the memory write clock frequency.

β3 is the RAM enable rate for write operations—guidelines are provided in Table 2-12 on

page 2-12.

PLL Contribution—PPLL

PPLL = PA C13 + PAC14 * FCLKOUT

FCLKOUT is the output clock frequency.1

1. The PLL dynamic contribution depends on the input clock frequency, the number of output clock signals generated by the

PLL, and the frequency of each output clock. If a PLL is used to generate more than one output clock, include each output

clock in the formula by adding its corresponding contribution (PAC14 * FCLKOUT product) to the total PLL contribution.

ProASIC3E DC and Switching Characteristics

2-12 Revision 10

Guidelines

Toggle Rate Definition

A toggle rate defines the freque ncy of a net or logic elem ent relative to a clock. It is a percentage. If the

toggle rate of a net is 100%, this means that this net switches at half the clock frequency. Below are

some examples:

• The average toggle rate of a shift register is 100% as all flip-flop outputs toggle at half of the clock

frequency.

• The average toggle rate of an 8-bit counter is 25%:

– Bit 0 (LSB) = 100%

– Bit 1 = 50%

– Bit 2 = 25%

–…

– Bit 7 (MSB) = 0.78125%

– Average toggle rate = (100% + 50% + 25% + 12.5% + . . . + 0.78125%) / 8

Enable Rate Definition

Output enable rate is the average percentage of time during which tristate outputs are enabled. When

nontristate output buffers are used, the enable rate should be 100%.

Table 2-11 • Toggle Rate Guidelines Recommended for Power Calculation

Component Definition Guideline

α1Togg le rate of VersaTile outputs 10%

α2I/O buffer toggle rate 10%

Table 2-12 • Enable Rate Guidelines Recommended for Power Calculation

Component Definition Guideline

β1I/O output buffer enable rate 100%

β2RAM enable rate for read operations 12.5%

β3RAM enable rate for write operations 12.5%

ProASIC3E Flash Family FPGAs

Revision 10 2-13

User I/O Characteristics

Timing Model

Figure 2-2 • Timi ng Model

Operating Conditions: –2 Speed, Commercial Temperature Range (TJ= 70°C), Worst-Case

VCC = 1.425 V

DQ DQ

Combinational Cell

I/O Module

(Registered)

I/O Module

(Non-Registered)

(Registered)

I/O Module

(Non-Registered)

LVPECL

LVDS,

BLVDS,

M-LVDS

GTL+ 3.3V

Combinational Cell

I/O Module

(Non-Registered)

LVTTL/LVCMOS

Output drive strength = 24 mA

High slew rate

I/O Module

(Non-Registered)

LVCMOS 1.5V

Output drive strength = 12 mA

High slew

LVTTL/LVCMOS

Output drive strength = 12 mA

High slew rate

I/O Module

(Non-Registered)

Input LVTTL/LVCMOS

Clock

Input LVTTL/LVCMOS

Clock

Input LVTTL/LVCMOS

Clock

= 0.56 ns t

= 0.49 ns t

= 1.36 ns

= 0.87 ns t

= 2.74 ns

= 0.51 ns

= 0.47 ns

= 2.39 ns

= 3.30 ns

CLKQ

= 0.59 ns

= 1.53 ns

SUD

= 0.31 ns

= 0.90 ns

CLKQ

= 0.55 ns

SUD

= 0.43 ns

= 0.90 ns

= 0.47 ns

CLKQ

= 0.55 ns

SUD

= 0.43 ns

= 1.36 ns

= 0.90 ns

ICLKQ

= 0.24 ns

ISUD

= 0.26 ns

= 1.22 ns

ProASIC3E DC and Switching Characteristics

2-14 Revision 10

Figure 2-3 • Input Buffer Timing Model an d Del ays (ex amp le )

(R)

PAD

YGND (F)

50%

(R) (F)

(R)

DIN

GND (F)

50%50%

PAD Y

CLK

I/O Interface

DIN

To Array

tDIN tDIN

VCC

tPYS

tPY

tPYS

tPY

VCC

Vtrip Vtrip

VIH

VIL

tPY = MAX(tPY(R), tPY(F))

tDIN = MAX(tDIN(R), tDIN(F))

tPY tDIN

ProASIC3E Flash Family FPGAs

Revision 10 2-15

Figure 2-4 • Output Buffer Model and Delays (example)

tDP

(R)

PAD VOL

tDP

(F)

Vtrip

VOH

VCC

D50% 50%

VCC

0 V

DOUT 50% 50% 0 V

tDOUT

(R) tDOUT

(F)

From Array

PAD

tDP

Std

Load

CLK

I/O Interface

DOUT

tDOUT

tDP = MAX(tDP(R), tDP(F))

tDOUT = MAX(tDOUT(R), tDOUT(F))

ProASIC3E DC and Switching Characteristics

2-16 Revision 10

Figure 2-5 • Tris tate Output Buffer Timing Model and Del ays (example)

CLK

10% V

CCI

Vtrip

50%

90% VCCI

Vtrip

50% 50% t

50%

EOUT

PAD

E50%

EOUT (R)

50%t

EOUT (F)

PAD

DOUT

EOUT

I/O Interface

EOUT

ZLS

Vtrip

50%

ZHS

Vtrip

50%

EOUT

PAD

E50% 50%

EOUT (R)

EOUT (F)

50%

VCC

VCCI

VCC

VOH

VOL

, t

ZLS

, t

ZHS

EOUT

= MAX(t

EOUT

(r), t

EOUT

(f))

ProASIC3E Flash Family FPGAs

Revision 10 2-17

Overview of I/O Performance

Summary of I/O DC Input and Output Levels – Default I/O Software

Settings

Table 2-13 • Summary of Maximum and Minimum DC Input and Output Levels

Applicable to Commercial and Industrial Conditions

I/O Standard Drive

Strength

Equivalent

Software

Default

Drive

Strength

Option1Slew

Rate

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

3.3V LVTTL/

3.3 V

LVCMOS

12 mA 12 mA High –0.3 0.8 2 3.6 0.4 2.4 12 12

3.3 V

LVCMOS

Wide Range

100 µA 12 mA High –0.3 0.8 2 3.6 0.2 VCCI – 0.2 0.1 0.1

2.5 V

LVCMOS 12 mA 12 mA High –0.3 0.7 1.7 3.6 0.7 1.7 12 12

1.8 V

LVCMOS 12 mA 12 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 12 12

1.5 V

LVCMOS 12 mA 12 mA High –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 12 12

3.3 V PCI Per PCI Specification

3.3 V PCI-X Per PCI-X Specification

3.3 V GTL 25 mA225 mA2High –0.3 VREF – 0.05 VREF + 0.05 3.6 0.4 – 25 25

2.5 V GTL 25 mA225 mA2High –0.3 VREF – 0.05 VREF + 0.05 3.6 0.4 – 25 25

3.3 V GTL+ 35 mA 35 mA High –0.3 VREF – 0.1 VREF + 0.1 3.6 0.6 – 51 51

2.5 V GTL+ 33 mA 33 mA High –0.3 VREF – 0.1 VREF + 0.1 3.6 0.6 – 40 40

HSTL (I) 8 mA 8 mA High –0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCI – 0.4 8 8

HSTL (II) 15 mA215 mA2High –0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCI – 0.4 15 15

SSTL2 (I) 15 mA 15 mA High –0.3 VREF – 0.2 VREF + 0.2 3.6 0.54 VCCI – 0.62 15 15

SSTL2 (II) 18 mA 18 mA Hig h –0.3 VREF – 0.2 VREF + 0.2 3.6 0.35 VCCI – 0.43 18 18

SSTL3 (I) 14 mA 14 mA High –0.3 VREF – 0.2 VREF + 0.2 3.6 0.7 VCCI – 1.1 14 14

SSTL3 (II) 21 mA 21 mA High –0.3 VREF – 0.2 VREF + 0.2 3.6 0.5 VCCI – 0.9 21 21

Notes:

1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive

strength displa yed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.

2. Output drive strength is below JEDEC specification.

3. Currents are measured at 85°C junction temperature.

4. Output Slew Rates can be extr acted from IBIS Models, located at

http://www.microsemi.com/soc/download/ibis/default.aspx.

ProASIC3E DC and Switching Characteristics

2-18 Revision 10

Table 2-14 • Summary of Maximum and Minimum DC Inp ut Le vels

Applicable to Commercial and Industrial Conditions

DC I/O Sta ndards

Commercial1Industrial2

IIL3IIH4IIL3IIH4

µA µA µA µA

3.3 V LVTTL / 3.3 V LVCMOS 10 10 15 15

3.3 V LVCMOS Wide Range 10 10 15 15

2.5 V LVCMOS 10 10 15 15

1.8 V LVCMOS 10 10 15 15

1.5 V LVCMOS 10 10 15 15

3.3 V PCI 10101515

3.3 V PCI-X 10101515

3.3 V GTL 10101515

2.5 V GTL 10101515

3.3 V GTL+ 10 10 15 15

2.5 V GTL+ 10 10 15 15

HSTL (I) 10101515

HSTL (II) 10 10 15 15

SSTL2 (I) 10101515

SSTL2 (II) 10 10 15 15

SSTL3 (I) 10101515

SSTL3 (II) 10 10 15 15

Notes:

1. Commercial range (0°C < TA < 70°C)

2. Industrial range (–40°C < TA < 85°C)

3. IIL is the input leak age current per I/O pin over recommended operation conditions where –0.3 V < VIN <

VIL.

4. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI.

Input current is larger when operating outside recommended ranges.

ProASIC3E Flash Family FPGAs

Revision 10 2-19

Summary of I/O Timing Characteristics – Default I/O Software

Settings

Table 2-15 • Summary of AC Measuring Points

Standard Input Reference Voltage

(VREF_TYP) Board Termination

Voltage (VTT_REF) Measuring Trip Point

(Vtrip)

3.3 V LVTTL / 3.3 V

LVCMOS – – 1.4 V

3.3 V LVCMOS Wide Range – – 1.4 V

2.5 V LVCMOS – – 1.2 V

1.8 V LVC MOS – – 0.90 V

1.5 V LVC MOS – – 0.75 V

3.3 V PCI – – 0 .285 * VCCI (RR)

0.615 * VCCI (FF))

3.3 V PCI-X – – 0.285 * VCCI (RR)

0.615 * VCCI (FF)

3.3 V GTL 0.8 V 1.2 V VREF

2.5 V GTL 0.8 V 1.2 V VREF

3.3 V GTL+ 1.0 V 1.5 V VREF

2.5 V GTL+ 1.0 V 1.5 V VREF

HSTL (I) 0.75 V 0.75 V VREF

HSTL (II) 0.75 V 0.75 V VREF

SSTL2 (I) 1.25 V 1.25 V VREF

SSTL2 (II) 1.25 V 1.25 V VREF

SSTL3 (I) 1.5 V 1.485 V VREF

SSTL3 (II) 1.5 V 1.485 V VREF

LVDS – – Cross point

LVPECL – – Cross point

Table 2-16 • I/O AC Parameter Definitions

Parameter Definition

tDP Data to Pad delay through the Output Buffer

tPY Pad to Data delay through the Input Buffer with Schmitt trigger disabled

tDOUT Data to Output Buffer delay through the I/O interface

tEOUT Enable to Output Buffer Tristate Control delay through the I/O interface

tDIN Input Buffer to Data delay through the I/O interface

tPYS Pad to Data delay through the Input Buffer with Schmitt trigger enabled

tHZ Enable to Pad delay through the Output Buffer—High to Z

tZH Enable to Pad delay through the Output Buffer—Z to High

tLZ Enable to Pad delay through the Output Buffer—Low to Z

tZL Enable to Pad delay through the Output Buffer—Z to Low

tZHS Enable to Pad delay through the Output Buffer with delayed enable —Z to High

tZLS Enable to Pad delay through the Output Buffer with delayed enable —Z to Low

ProASIC3E DC and Switching Characteristics

2-20 Revision 10

Table 2-17 • Summary of I/O Timing Characteristics—Software Default Settings

–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V

I/O Standard

Drive

Strength

(mA)

Equivalent

Software

Default

Drive

Strength

Option)1

Slew Rate

Capacitive Load (pF)

External Resistor (Ω)

tDOUT (ns)

tDP (ns)

tDIN (ns)

tPY (ns)

tPYS (ns)

tEOUT (ns)

tZL (ns)

tZH (ns)

tLZ (ns)

tHZ (ns)

tZLS (ns)

tZHS (ns)

3.3 V LVTTL /

3.3 V L V CMOS 12 12 High 35 – 0.49 2.74 0.03 0.90 1.17 0.32 2.79 2.14 2.45 2.70 4.46 3.81

3.3 V LVCMOS

Wide Range2100 µA 12 High 35 – 0.49 4.24 0.03 1.36 1.78 0.32 4.24 3.25 3.78 4.17 6.77 5.79

2.5 V LVCMOS 12 12 High 35 – 0.49 2.80 0.03 1.13 1.24 0.32 2.85 2.61 2.51 2.61 4.52 4.28

1.8 V LVCMOS 12 12 High 35 – 0.49 2.83 0.03 1.08 1.42 0.32 2.89 2.31 2.79 3.16 4.56 3.98

1.5 V LVCMOS 12 12 High 35 – 0.49 3.30 0.03 1.27 1.60 0.32 3.36 2.70 2.96 3.27 5.03 4.37

3.3 V PCI Per PCI

spec – High 10 25 3 0.49 2.09 0.03 0.78 1.17 0.32 2.13 1.49 2.45 2.70 3.80 3.16

3.3 V PCI-X Per PCI-X

spec – High 10 253 0.49 2.09 0.03 0.78 1.17 0.32 2.13 1.49 2.45 2.70 3.80 3.16

3.3 V GTL 25 – High 10 25 0.45 1.55 0.03 2.19 – 0.32 1.52 1.55 – – 3.19 3.22

2.5 V GTL 25 – High 10 25 0.45 1.59 0.03 1.83 – 0.32 1.61 1.59 – – 3.28 3.26

3.3 V GTL+ 35 – High 10 25 0.45 1.53 0.03 1.19 – 0.32 1.56 1.53 – – 3.23 3.20

2.5 V GTL+ 33 – High 10 25 0.45 1.65 0.03 1.13 – 0.32 1.68 1.57 – – 3.35 3.24

HSTL (I) 8 – High 20 50 0 .49 2.37 0.03 1.59 – 0.32 2.42 2.35 – – 4.09 4.02

HSTL (II) 15 – High 20 25 0.49 2.26 0.03 1.59 – 0.32 2.30 2.03 – – 3.97 3.70

SSTL2 (I) 15 – High 30 50 0.49 1.59 0.03 1.00 – 0.32 1.62 1.38 – – 3.29 3.05

SSTL2 (II) 18 – High 30 25 0.49 1.62 0.03 1.00 – 0.32 1.65 1.32 – – 3.32 2.99

SSTL3 (I) 14 – High 30 50 0.49 1.72 0.03 0.93 – 0.32 1.75 1.37 – – 3.42 3.04

SSTL3 (II) 21 – High 30 25 0.49 1.54 0.03 0.93 – 0.32 1.57 1.25 – – 3.24 2.92

LVDS/B-LVDS/

M-LVDS 24 – High – – 0.49 1.40 0.03 1.36 – – – – – – – –

LVPECL 24 – High – – 0.49 1.36 0.03 1.22 – – – – – – – –

Notes:

1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive

strength displayed in the software is supported for normal range only. Fo r a detailed I/V curve, refer to the IBIS models.

2. All LVCMOS 3.3 V software macros support LVCMOS 3.3V wide range as specified in the JESD8b specification.

3. Resistance is us ed t o measu re I/O pro pagati on del ays as define d in PCI specifi cat ion s. See Figu re 2-11 on page 2-38 for

connectivity. This resistor is not required during no rmal operation.

4. For specific junct ion temperature and voltage supply levels, refer to Table 2-6 on page 2-5..

ProASIC3E Flash Family FPGAs

Revision 10 2-21

Detailed I/O DC Characteristics

Table 2-18 • Input Capacitance

Symbol Definition Conditions Min. Max. Units

CIN Input capacitance VIN = 0, f = 1.0 MHz 8 pF

CINCLK Input capacitance on the clock pin VIN = 0, f = 1.0 MHz 8 pF

Table 2-19 • I/O Output Buffer Maximum Resistances1

Standard Drive Strength RPULL-DOWN (Ω)2RPULL-UP (Ω)3

3.3 V LVT TL / 3.3 V LVCMOS 4 mA 100 300

8 mA 50 150

12 mA 25 75

16 mA 17 50

24 mA 11 33

3.3 V LVCMOS Wide Range 100 µA Same as regular

3.3 V LVCMOS Same as regular

3.3 V LVCMOS

2.5 V LVCMOS 4 mA 100 200

8 mA 50 100

12 mA 25 50

16 mA 20 40

24 mA 11 22

1.8 V LVCMOS 2 mA 200 225

4 mA 100 112

6 mA 50 56

8 mA 50 56

12 mA 20 22

16 mA 20 22

1.5 V LVCMOS 2 mA 200 224

4 mA 100 112

6 mA 67 75

8 mA 33 37

12 mA 33 37

3.3 V PCI/PCI-X Per PCI/PCI-X

specification 25 75

3.3 V GTL 25 mA 11 –

2.5 V GTL 25 mA 14 –

3.3 V GTL+ 35 mA 12 –

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer resistance

values depend on VCCI, drive strength selection, temperature, and process. For board design

considerations and detailed output buffer resistances, use the corresponding IBIS models located on the

Microsemi SoC Products Group website at http://www.microsemi.com/soc/techdocs/models/ibis.html.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

ProASIC3E DC and Switching Characteristics

2-22 Revision 10

2.5 V GTL+ 33 mA 15 –

HSTL (I) 8 mA 50 50

HSTL (II) 15 mA 25 25

SSTL2 (I) 15 mA 27 31

SSTL2 (II) 18 mA 13 15

SSTL3 (I) 14 mA 44 69

SSTL3 (II) 21 mA 18 32

Table 2-20 • I/O Weak Pull-Up/Pull-Down Resistances

Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values

VCCI

R((WEAK PULL-UP)1

(Ω)R(WEAK PULL-DOWN)2

(Ω)

Min. Max. Min. Max.

3.3 V 10 k 45 k 10 k 45 k

3.3 V (Wide

Range I/Os) 10 k 45 k 10 k 45 k

2.5 V 11 k 55 k 12 k 74 k

1.8 V 18 k 70 k 17 k 110 k

1.5 V 19 k 90 k 19 k 140 k

Notes:

1. R(WEAK PULL-UP -MA X) = (VCCImax – VOHspec) / I(WEAK PULL-UP-MIN)

2. R(WEAK PULL-DO W N -MAX) = (VOLspec) / I(WEAK PULL-D O W N -MIN)

Table 2-19 • I/O Output Buffer Maximum Resistances1 (continued)

Standard Drive Strength RPULL-DOWN (Ω)2RPULL-UP (Ω)3

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer resistance

values depend on VCCI, drive strength selection, temperature, and process. For board design

considerations and detailed output buffer resistances, use the corresponding IBIS models located on the

Microsemi SoC Products Group website at http://www.microsemi.com/soc/techdocs/models/ibis.html.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

ProASIC3E Flash Family FPGAs

Revision 10 2-23

The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The

reliability data below is based on a 3.3 V, 36 mA I/O setting, which is the worst case for this type of

analysis.

For example, at 110°C, the short current condition would have to be sustained for more than three

months to cause a reliability concern. The I/O design does not contain any short circuit protection, but

such protection would only be needed in extremely prolonged stre ss conditions.

Table 2-21 • I/O Short Currents IOSH/IOSL

Drive Strength IOSH (mA)* IOSL (mA)*

3.3 V LVTTL / 3.3 V LVCMOS 4 mA 25 27

8 mA 51 54

12 mA 103 109

16 mA 132 127

24 mA 268 181

3.3 V LVCMOS Wide Range 100 µA Same as regular

3.3 V LVCMOS Same as regular

3.3 V LVCMOS

2.5 V LVC MOS 4 mA 16 18

8 mA 32 37

12 mA 65 74

16 mA 83 87

24 mA 169 124

1.8 V LVC MOS 2 mA 9 11

4 mA 17 22

6 mA 35 44

8 mA 45 51

12 mA 91 74

16 mA 91 74

1.5 V LVC MOS 2 mA 13 16

4 mA 25 33

6 mA 32 39

8 mA 66 55

12 mA 66 55

Notes:

1. TJ = 100°C

2. Applicable to 3.3 V LVCMOS Wide Range. IOSL/IOSH dependent on the I/O buffer drive strength

selected for wide range applications. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide

range as specified in the JESD8b specification.

Table 2-22 • Duration of Short Circuit Event before Failure

Temperature Time before Failure

–40°C > 20 years

0°C > 20 years

25°C > 20 years

70°C 5 years

85°C 2 years

ProASIC3E DC and Switching Characteristics

2-24 Revision 10

100°C 6 months

110°C 3 months

Table 2-23 • Schmitt Trigger Input Hysteresis

Hysteresis Voltage Value (typ.) for Schmitt Mode Input Buffers

Input Buffer Configuration Hysteresis Value (typ.)

3.3 V LVT TL /LVCMOS/PCI/PCI-X (Schmitt trigger mode) 240 mV

2.5 V LVCMOS (Schmitt trigger mode) 140 mV

1.8 V LVCMOS (Schmitt trigger mode) 80 mV

1.5 V LVCMOS (Schmitt trigger mode) 60 mV

Table 2-24 • I/O Input Rise Time, Fall Time, and Related I/O Reliability*

Input Buffer Input Rise/Fall Time

(min.) Input Rise/Fall Time (max.) Reliability

LVTTL/LVCMOS

(Schmitt trigger disabled) No requirement 10 ns * 20 years

(110°C)

LVTTL/LVCMOS

(Schmitt trigger enabled) No requirement No requirement, but input noise

voltage cannot exceed Schmitt

hysteresis.

20 years

(110°C)

HSTL/SSTL/GTL No requirement 10 ns * 10 years

(100°C)

LVDS/B-LVDS/M-LVDS/

LVPECL No requirement 10 ns * 10 years

(100°C)

Note: *For clock signals and similar edge-generating signals, refer to the "ProASIC3/E SSO and Pin

Placement Guidelines" chapter of the ProASIC3E FPGA Fabric User’s Guide. The maximum i nput

rise/fall time is related to the noise induced into the input buffer trace. If the noise is low, then the

rise time and fall time of input buffers ca n be increased beyond the maximum value . The longer the

rise/fall times, the more susceptible the input signal is to the board noise. Microsemi recommends

signal integrity evaluation/characterization of the system to ensure that there is no excessive noise

coupling into inp ut sig nals.

Table 2-22 • Duration of Short Circuit Event before Failure

Temperature Time before Failure

ProASIC3E Flash Family FPGAs

Revision 10 2-25

Single-Ended I/O Characteristics

3.3 V LVTTL / 3.3 V LVCMOS

Low-Voltage Transistor–Transistor Logic is a general-purpose standard (EIA/JESD) for 3.3 V

applications. It uses an LV TTL input buffer and push-pull output buffer. The 3.3 V LVCMOS standard is

supported as part of the 3.3 V LVTTL support.

Table 2-25 • Minimum and Maximum DC Input and Output Levels

3.3 V LVTTL /

3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2

Drive Strength Min.

VMax.

VMin.,

VMax.

VMin.

VmAmAMax.

mA3Max.

mA3µA4µA4

4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 27 25 10 10

8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 54 51 10 10

12 mA –0.3 0.8 23.6 0.4 2.4 12 12 109 103 10 10

16 mA –0.3 0.8 2 3.6 0.4 2.4 16 16 127 132 10 10

24 mA –0.3 0.8 2 3.6 0.4 2.4 24 24 181 268 10 10

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V< VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN< VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

5. Software default selection highlighted in gray.

Figure 2-6 • AC Loading

Table 2-26 • 3.3 V LVTTL / 3.3 V LVCMOS AC Waveforms, Measur ing Points, and Capacitive Load s

Input Low (V) Input High (V) M easuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 3.3 1.4 – 35

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ / tZL / tZLS

R to GND for tHZ / tZH / tZHS

35 pF for tZH / tZHS / tZL / tZLS

35 pF for tHZ / tLZ

ProASIC3E DC and Switching Characteristics

2-26 Revision 10

Timing Characteristics

Table 2-27 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3. 0 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA Std. 0.66 7.88 0.04 1.20 1.57 0.43 8.03 6.70 2.69 2.59 10.26 8.94 ns

–1 0.56 6.71 0.04 1.02 1.33 0.36 6.83 5.70 2.29 2.20 8.73 7.60 ns

–2 0.49 5.89 0.03 0.90 1.17 0.32 6.00 5.01 2.01 1.93 7.67 6.67 ns

8 mA Std. 0.66 5.08 0.04 1.20 1.57 0.43 5.17 4.14 3.05 3.21 7.41 6.38 ns

–1 0.56 4.32 0.04 1.02 1.33 0.36 4.40 3.52 2.59 2.73 6.30 5.43 ns

–2 0.49 3.79 0.03 0.90 1.17 0.32 3.86 3.09 2.28 2.40 5.53 4.76 ns

12 mA Std. 0.66 3.67 0.04 1.20 1.57 0.43 3.74 2.87 3.28 3.61 5.97 5.11 ns

–1 0.56 3.12 0.04 1.02 1.33 0.36 3.18 2.44 2.79 3.07 5.08 4.34 ns

–2 0.49 2.74 0.03 0.90 1.17 0.32 2.79 2.14 2.45 2.70 4.46 3.81 ns

16 mA Std. 0.66 3.46 0.04 1.20 1.57 0.43 3.53 2.61 3.33 3.72 5.76 4.84 ns

–1 0.56 2.95 0.04 1.02 1.33 0.36 3.00 2.22 2.83 3.17 4.90 4.12 ns

–2 0.49 2.59 0.03 0.90 1.17 0.32 2.63 1.95 2.49 2.78 4.30 3.62 ns

24 mA Std. 0.66 3.21 0.04 1.20 1.57 0.43 3.27 2.16 3.39 4.13 5.50 4.39 ns

–1 0.56 2.73 0.04 1.02 1.33 0.36 2.78 1.83 2.88 3.51 4.68 3.74 ns

–2 0.49 2.39 0.03 0.90 1.17 0.32 2.44 1.61 2.53 3.08 4.11 3.28 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

Table 2-28 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3. 0 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA Std. 0.66 11.01 0.04 1.20 1.57 0.43 11.21 9.05 2.69 2.44 13.45 11.29 ns

–1 0.56 9.36 0.04 1.02 1.33 0.36 9.54 7.70 2.29 2.08 11.44 9.60 ns

–2 0.49 8.22 0.03 0.90 1.17 0.32 8.37 6.76 2.01 1.82 10.04 8.43 ns

8 mA Std. 0.66 7.86 0.04 1.20 1.57 0.43 8.01 6.44 3.04 3.06 10.24 8.68 ns

–1 0.56 6.69 0.04 1.02 1.33 0.36 6.81 5.48 2.58 2.61 8.71 7.38 ns

–2 0.49 5.87 0.03 0.90 1.17 0.32 5.98 4.81 2.27 2.29 7.65 6.48 ns

12 mA Std. 0.66 6.03 0.04 1.20 1.57 0.43 6.14 5.02 3.28 3.47 8.37 7.26 ns

–1 0.56 5.13 0.04 1.02 1.33 0.36 5.22 4.27 2.79 2.95 7.12 6.17 ns

–2 0.49 4.50 0.03 0.90 1.17 0.32 4.58 3.75 2.45 2.59 6.25 5.42 ns

16 mA Std. 0.66 5.62 0.04 1.20 1.57 0.43 5.72 4.72 3.32 3.58 7.96 6.96 ns

–1 0.56 4.78 0.04 1.02 1.33 0.36 4.87 4.02 2.83 3.04 6.77 5.92 ns

–2 0.49 4.20 0.03 0.90 1.17 0.32 4.27 3.53 2.48 2.67 5.94 5.20 ns

24 mA Std. 0.66 5.24 0.04 1.20 1.57 0.43 5.34 4.69 3.39 3.96 7.58 6.93 ns

–1 0.56 4.46 0.04 1.02 1.33 0.36 4.54 3.99 2.88 3.37 6.44 5.89 ns

–2 0.49 3.92 0.03 0.90 1.17 0.32 3.99 3.50 2.53 2.96 5.66 5.17 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-27

3.3 V LVCMOS Wide Range

Table 2-29 • Minimum and Maximum DC Input and Output Levels

3.3 V

LVCMOS

Wide

Range

Equivalent

Software

Default

Drive

Strength

Option1

VIL VIH VOL VOH IOL IOH IOSL IOSH IIL2IIH3

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VµAµA

Max.

mA4Max.

mA4µA5µA5

100 µA 2 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 27 25 10 10

100 µA 4 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 27 25 10 10

100 µA 6 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 54 51 10 10

100 µA 8 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 54 51 10 10

100 µA 12 mA –0.3 0.8 23.6 0.2 VDD – 0.2 100 100 109 103 10 10

100 µA 16 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 127 132 10 10

100 µA 24 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 181 268 10 10

Notes:

1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive

strength displayed in the software is supported for normal range only. Fo r a detailed I/V curve, refer to the IBIS models.

2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.

3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN< VCCI. Input current is

larger when operating outside recommended ranges.

4. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

5. Currents are measured at 85°C junction temperature.

6. Software default selection highlighted in gray.

Figure 2-7 • AC Loading

Table 2-30 • 3.3 V LVCMOS Wide Range AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) M easuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 3.3 1.4 – 35

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ / tZL / tZLS

R to GND for tHZ / tZH / tZHS

35 pF for tZH / tZHS / tZL / tZLS

35 pF for tHZ / tLZ

ProASIC3E DC and Switching Characteristics

2-28 Revision 10

Timing Characteristics

Table 2-31 • 3.3 V LVCMOS Wide Range High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.7 V

Drive

Strength

Equivalent

Software

Default

Drive

Strength

Option1 Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

100 µA 4 mA Std. 0.66 12.19 0.04 1.83 2.38 0.43 12.19 10.17 4.16 4.00 15.58 13.57 ns

–1 0.56 10.37 0.04 1.55 2.02 0.36 10.37 8.66 3.54 3.41 13.26 11.54 ns

–2 0.49 9.10 0.03 1.36 1.78 0.32 9.10 7.60 3.11 2.99 11.64 10.13 ns

100 µA 8 mA S td. 0.66 7.85 0.04 1.83 2.38 0.43 7.85 6.29 4.71 4.97 11.24 9.68 ns

–1 0.56 6.68 0.04 1.55 2.02 0.36 6.68 5.35 4.01 4.22 9.57 8.24 ns

–2 0.49 5.86 0.03 1.36 1.78 0.32 5.86 4.70 3.52 3.71 8.40 7.23 ns

100 µA 12 mA Std. 0.66 5.67 0.04 1.83 2.38 0.43 5.67 4.36 5.06 5.59 9.07 7.75 ns

–1 0.56 4.82 0.04 1.55 2.02 0.36 4.82 3.71 4.31 4.75 7.71 6.59 ns

–2 0.49 4.24 0.03 1.36 1.78 0.32 4.24 3.25 3.78 4.17 6.77 5.79 ns

100 µA 16 mA Std. 0.66 5.35 0.04 1.83 2.38 0.43 5.35 3.96 5.15 5.76 8.75 7.35 ns

–1 0.56 4.55 0.04 1.55 2.02 0.36 4.55 3.36 4.38 4.90 7.44 6.25 ns

–2 0.49 4.00 0.03 1.36 1.78 0.32 4.00 2.95 3.85 4.30 6.53 5.49 ns

100 µA 24 mA Std. 0.66 4.96 0.04 1.83 2.38 0.43 4.96 3.27 5.23 6.38 8.35 6.67 ns

–1 0.56 4.22 0.04 1.55 2.02 0.36 4.22 2.78 4.45 5.43 7.11 5.67 ns

–2 0.49 3.70 0.03 1.36 1.78 0.32 3.70 2.44 3.91 4.76 6.24 4.98 ns

Notes:

1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive

strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.

2. Software default selection highlighted in gray.

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-29

Table 2-32 • 3.3 V LVCMOS Wide Range Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.7 V

Drive

Strength

Equivalent

Software

Default

Drive

Strength

Option1 Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

100 µA 4 mA Std. 0.66 17.02 0.04 1.83 2.38 0.43 17.02 13.74 4.16 3.78 20.42 17.14 ns

–1 0.56 14.48 0.04 1.55 2.02 0.36 14.48 11.69 3.54 3.21 17.37 14.58 ns

–2 0.49 12.71 0.03 1.36 1.78 0.32 12.71 10.26 3.11 2.82 15.25 12.80 ns

100 µA 8 mA Std. 0.66 12.16 0.04 1.83 2.38 0.43 12.16 9.78 4.70 4.74 15.55 13.17 ns

–1 0.56 10.34 0.04 1.55 2.02 0.36 10.34 8.32 4.00 4.03 13.23 11.20 ns

–2 0.49 9.08 0.03 1.36 1.78 0.32 9.08 7.30 3.51 3.54 11.61 9.84 ns

100µA 12 mA Std. 0.66 9.32 0.04 1.83 2.38 0.43 9.32 7.62 5.06 5.36 12.71 11.02 ns

–1 0.56 7.93 0.04 1.55 2.02 0.36 7.93 6.48 4.31 4.56 10.81 9.37 ns

–2 0.49 6.96 0.03 1.36 1.78 0.32 6.96 5.69 3.78 4.00 9.49 8.23 ns

100 µA 16 mA Std. 0.66 8.69 0.04 1.83 2.38 0.43 8.69 7.17 5.14 5.53 12.08 10.57 ns

–1 0.56 7.39 0.04 1.55 2.02 0.36 7.39 6.10 4.37 4.71 10.28 8.99 ns

–2 0.49 6.49 0.03 1.36 1.78 0.32 6.49 5.36 3.83 4.13 9.02 7.89 ns

100 µA 24 mA Std. 0.66 8.11 0.04 1.83 2.38 0.43 8.11 7.13 5.23 6.13 11.50 10.52 ns

–1 0.56 6.90 0.04 1.55 2.02 0.36 6.90 6.06 4.45 5.21 9.78 8.95 ns

–2 0.49 6.05 0.03 1.36 1.78 0.32 6.05 5.32 3.91 4.57 8.59 7.86 ns

Notes:

1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive

strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.

2. Software default selection highlighted in gray.

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-30 Revision 10

2.5 V LVCMOS

Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 2.5 V applications.

Table 2-33 • Minimum and Maximum DC Input and Output Levels

2.5 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2

Drive

Strength Min.

VMax.

VMin.

VMax.

VMax.,

VMin.

VmAmA Max.

mA3Max.

mA3µA4µA4

4 mA –0.3 0.7 1.7 3.6 0.7 1.7 4 4 18 16 10 10

8 mA –0.3 0.7 1.7 3.6 0.7 1.7 8 8 37 32 10 10

12 mA –0.3 0.7 1.7 3.6 0.7 1.7 12 12 74 65 10 10

16 mA –0.3 0 .7 1.7 3.6 0.7 1.7 16 16 87 83 10 10

24 mA –0.3 0 .7 1.7 3.6 0.7 1.7 24 24 124 169 10 10

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

5. Software default selection highlighted in gray.

Figure 2-8 • AC Loading

Table 2-34 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) M easuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 2.5 1.2 – 35

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ / tZL / tZLS

R to GND for tHZ / tZH / tZHS

35 pF for tZH / tZHS / tZL / tZLS

35 pF for tHZ / tLZ

ProASIC3E Flash Family FPGAs

Revision 10 2-31

Timing Characteristics

Table 2-35 • 2.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 2.3 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA Std. 0.66 8.82 0.04 1.51 1.66 0.43 8.13 8.82 2.72 2.29 10.37 11.05 ns

–1 0.56 7.50 0.04 1.29 1.41 0.36 6.92 7.50 2.31 1.95 8.82 9.40 ns

–2 0.49 6.58 0.03 1.13 1.24 0.32 6.07 6.58 2.03 1.71 7.74 8.25 ns

8 mA Std. 0.66 5.27 0.04 1.51 1.66 0.43 5.27 5.27 3.10 3.03 7.50 7.51 ns

–1 0.56 4.48 0.04 1.29 1.41 0.36 4.48 4.48 2.64 2.58 6.38 6.38 ns

–2 0.49 3.94 0.03 1.13 1.24 0.32 3.93 3.94 2.32 2.26 5.60 5.61 ns

12 mA Std. 0.66 3.74 0.04 1.51 1.66 0.43 3.81 3.49 3.37 3.49 6.05 5.73 ns

–1 0.56 3.18 0.04 1.29 1.41 0.36 3.24 2.97 2.86 2.97 5.15 4.87 ns

–2 0.49 2.80 0.03 1.13 1.24 0.32 2.85 2.61 2.51 2.61 4.52 4.28 ns

16 mA Std. 0.66 3.53 0.04 1.51 1.66 0.43 3.59 3.12 3.42 3.62 5.83 5.35 ns

–1 0.56 3.00 0.04 1.29 1.41 0.36 3.06 2.65 2.91 3.08 4.96 4.55 ns

–2 0.49 2.63 0.03 1.13 1.24 0.32 2.68 2.33 2.56 2.71 4.35 4.00 ns

24 mA Std. 0.66 3.26 0.04 1.51 1.66 0.43 3.32 2.48 3.49 4.11 5.56 4.72 ns

–1 0.56 2.77 0.04 1.29 1.41 0.36 2.83 2.11 2.97 3.49 4.73 4.01 ns

–2 0.49 2.44 0.03 1.13 1.24 0.32 2.48 1.85 2.61 3.07 4.15 3.52 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-32 Revision 10

Table 2-36 • 2.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 2.3 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA Std. 0.66 12.00 0.04 1.51 1.66 0.43 12.23 11.61 2.72 2.20 14.46 13.85 ns

–1 0.56 10.21 0.04 1.29 1.41 0.36 10.40 9.88 2.31 1.87 12.30 11.78 ns

–2 0.49 8.96 0.03 1.13 1.24 0.32 9.13 8.67 2.03 1.64 10.80 10.34 ns

8 mA Std. 0.66 8.73 0.04 1.51 1.66 0.43 8.89 8.01 3.10 2.93 11.13 10.25 ns

–1 0.56 7.43 0.04 1.29 1.41 0.36 7.57 6.82 2.64 2.49 9.47 8.72 ns

–2 0.49 6.52 0.03 1.13 1.24 0.32 6.64 5.98 2.32 2.19 8.31 7.65 ns

12 mA Std. 0.66 6.77 0.04 1.51 1.66 0.43 6.90 6.11 3.37 3.39 9.14 8.34 ns

–1 0.56 5.76 0.04 1.29 1.41 0.36 5.87 5.20 2.86 2.89 7.77 7.10 ns

–2 0.49 5.06 0.03 1.13 1.24 0.32 5.15 4.56 2.51 2.53 6.82 6.23 ns

16 mA Std. 0.66 6.31 0.04 1.51 1.66 0.43 6.42 5.73 3.42 3.52 8.66 7.96 ns

–1 0.56 5.37 0.04 1.29 1.41 0.36 5.46 4.87 2.91 3.00 7.37 6.77 ns

–2 0.49 4.71 0.03 1.13 1.24 0.32 4.80 4.28 2.56 2.63 6.47 5.95 ns

24 mA Std. 0.66 5.93 0.04 1.51 1.66 0.43 6.04 5.70 3.49 4.00 8.28 7.94 ns

–1 0.56 5.05 0.04 1.29 1.41 0.36 5.14 4.85 2.97 3.40 7.04 6.75 ns

–2 0.49 4.43 0.03 1.13 1.24 0.32 4.51 4.26 2.61 2.99 6.18 5.93 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-33

1.8 V LVCMOS

Low-Voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 1.8 V applica ti ons. It uses a 1.8 V input buffer and a push-pull output buffer.

Table 2-37 • Minimum and Maximum DC Input and Output Levels

1.8 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA3Max.

mA3µA4µA4

2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 11 9 10 10

4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 22 17 10 10

6 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 6 6 44 35 10 10

8 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 8 8 51 45 10 10

12 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 12 12 74 91 10 10

16 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 16 16 74 91 10 10

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

5. Software default selection highlighted in gray.

Figure 2-9 • AC Loading

Table 2-38 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) M easuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 1.8 0.9 – 35

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ / tZL / tZLS

R to GND for tHZ / tZH / tZHS

35 pF for tZH / tZHS / tZL / tZLS

35 pF for tHZ / tLZ

ProASIC3E DC and Switching Characteristics

2-34 Revision 10

Timing Characteristics

Table 2-39 • 1.8 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 1.7 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA Std. 0.66 12.10 0.04 1.45 1.91 0.43 9.59 12.10 2.78 1.64 11.83 14.34 ns

–1 0.56 10.30 0.04 1.23 1.62 0.36 8.16 10.30 2.37 1.39 10.06 12.20 ns

–2 0.49 9.04 0.03 1.08 1.42 0.32 7.16 9.04 2.08 1.22 8.83 10.71 ns

4 mA Std. 0.66 7.05 0.04 1.45 1.91 0.43 6.20 7.05 3.25 2.86 8.44 9.29 ns

–1 0.56 6.00 0.04 1.23 1.62 0.36 5.28 6.00 2.76 2.44 7.18 7.90 ns

–2 0.49 5.27 0.03 1.08 1.42 0.32 4.63 5.27 2.43 2.14 6.30 6.94 ns

6 mA Std. 0.66 4.52 0.04 1.45 1.91 0.43 4.47 4.52 3.57 3.47 6.70 6.76 ns

–1 0.56 3.85 0.04 1.23 1.62 0.36 3.80 3.85 3.04 2.95 5.70 5.75 ns

–2 0.49 3.38 0.03 1.08 1.42 0.32 3.33 3.38 2.66 2.59 5.00 5.05 ns

8 mA Std. 0.66 4.12 0.04 1.45 1.91 0.43 4.20 3.99 3.63 3.62 6.43 6.23 ns

–1 0.56 3.51 0.04 1.23 1.62 0.36 3.57 3.40 3.09 3.08 5.47 5.30 ns

–2 0.49 3.08 0.03 1.08 1.42 0.32 3.14 2.98 2.71 2.71 4.81 4.65 ns

12 mA Std. 0.66 3.80 0.04 1.45 1.91 0.43 3.87 3.09 3.73 4.24 6.10 5.32 ns

–1 0.56 3.23 0.04 1.23 1.62 0.36 3.29 2.63 3.18 3.60 5.19 4.53 ns

–2 0.49 2.83 0.03 1.08 1.42 0.32 2.89 2.31 2.79 3.16 4.56 3.98 ns

16 mA Std. 0.66 3.80 0.04 1.45 1.91 0.43 3.87 3.09 3.73 4.24 6.10 5.32 ns

–1 0.56 3.23 0.04 1.23 1.62 0.36 3.29 2.63 3.18 3.60 5.19 4.53 ns

–2 0.49 2.83 0.03 1.08 1.42 0.32 2.89 2.31 2.79 3.16 4.56 3.98 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-35

Table 2-40 • 1.8 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 1.7 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA Std. 0.66 15.84 0.04 1.45 1.91 0.43 15.65 15.84 2.78 1.58 17.89 18.07 ns

–1 0.56 13.47 0.04 1.23 1.62 0.36 13.31 13.47 2.37 1.35 15.22 15.37 ns

–2 0.49 11.83 0.03 1.08 1.42 0.32 11.69 11.83 2.08 1.18 13.36 13.50 ns

4 mA Std. 0.66 11.39 0.04 1.4 5 1.91 0.43 11.60 10.76 3.26 2.77 13.84 12.99 ns

–1 0.56 9.69 0.04 1.23 1.62 0.36 9.87 9.15 2.77 2.36 11.77 11.05 ns

–2 0.49 8.51 0.03 1.08 1.42 0.32 8.66 8.03 2.43 2.07 10.33 9.70 ns

6 mA Std. 0.66 8.97 0.04 1.45 1.91 0.43 9.14 8.10 3.57 3.36 11.37 10.33 ns

–1 0.56 7.63 0.04 1.23 1.62 0.36 7.77 6.89 3.04 2.86 9.67 8.79 ns

–2 0.49 6.70 0.03 1.08 1.42 0.32 6.82 6.05 2.66 2.51 8.49 7.72 ns

8 mA Std. 0.66 8.35 0.04 1.45 1.91 0.43 8.50 7.59 3.64 3.52 10.74 9.82 ns

–1 0.56 7.10 0.04 1.23 1.62 0.36 7.23 6.45 3.10 3.00 9.14 8.35 ns

–2 0.49 6.24 0.03 1.08 1.42 0.32 6.35 5.66 2.72 2.63 8.02 7.33 ns

12 mA Std. 0.66 7.94 0.04 1.45 1.91 0.43 8.09 7.56 3.74 4.11 10.32 9.80 ns

–1 0.56 6.75 0.04 1.23 1.62 0.36 6.88 6.43 3.18 3.49 8.78 8.33 ns

–2 0.49 5.93 0.03 1.08 1.42 0.32 6.04 5.65 2.79 3.07 7.71 7.32 ns

16 mA Std. 0.66 7.94 0.04 1.45 1.91 0.43 8.09 7.56 3.74 4.11 10.32 9.80 ns

–1 0.56 6.75 0.04 1.23 1.62 0.36 6.88 6.43 3.18 3.49 8.78 8.33 ns

–2 0.49 5.93 0.03 1.08 1.42 0.32 6.04 5.65 2.79 3.07 7.71 7.32 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-36 Revision 10

1.5 V LVCMOS (JESD8-11)

Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 1.5 V applica ti ons. It uses a 1.5 V input buffer and a push-pull output buffer.

Table 2-41 • Minimum and Maximum DC Input and Output Levels

1.5 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA3Max.

mA3µA4µA4

2 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 2 2 16 13 10 10

4 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 4 4 33 25 10 10

6 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 6 6 39 32 10 10

8 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 8 8 55 66 10 10

12 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 12 12 55 66 10 10

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V< VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

5. Software default selection highlighted in gray.

Figure 2-10 • AC Loading

Table 2-42 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) M easuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 1.5 0.75 – 35

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ / tZL / tZLS

R to GND for tHZ / tZH / tZHS

35 pF for tZH / tZHS / tZL / tZLS

35 pF for tHZ / tLZ

ProASIC3E Flash Family FPGAs

Revision 10 2-37

Timing Characteristics

Table 2-43 • 1.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 1.4 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA Std. 0.66 8.53 0.04 1.70 2.14 0.43 7.26 8.53 3.39 2.79 9.50 10.77 ns

–1 0.56 7.26 0.04 1.44 1.82 0.36 6.18 7.26 2.89 2.37 8.08 9.16 ns

–2 0.49 6.37 0.03 1.27 1.60 0.32 5.42 6.37 2.53 2.08 7.09 8.04 ns

4 mA Std. 0.66 5.41 0.04 1.70 2.14 0.43 5.22 5.41 3.75 3.48 7.45 7.65 ns

–1 0.56 4.60 0.04 1.44 1.82 0.36 4.44 4.60 3.19 2.96 6.34 6.50 ns

–2 0.49 4.04 0.03 1.27 1.60 0.32 3.89 4.04 2.80 2.60 5.56 5.71 ns

6 mA Std. 0.66 4.80 0.04 1.70 2.14 0.43 4.89 4.75 3.83 3.67 7.13 6.98 ns

–1 0.56 4.09 0.04 1.44 1.82 0.36 4.16 4.04 3.26 3.12 6.06 5.94 ns

–2 0.49 3.59 0.03 1.27 1.60 0.32 3.65 3.54 2.86 2.74 5.32 5.21 ns

8 mA Std. 0.66 4.42 0.04 1.70 2.14 0.43 4.50 3.62 3.96 4.37 6.74 5.86 ns

–1 0.56 3.76 0.04 1.44 1.82 0.36 3.83 3.08 3.37 3.72 5.73 4.98 ns

–2 0.49 3.30 0.03 1.27 1.60 0.32 3.36 2.70 2.96 3.27 5.03 4.37 ns

12 mA Std. 0.66 4.42 0.04 1.70 2.14 0.43 4.50 3.62 3.96 4.37 6.74 5.86 ns

–1 0.56 3.76 0.04 1.44 1.82 0.36 3.83 3.08 3.37 3.72 5.73 4.98 ns

–2 0.49 3.30 0.03 1.27 1.60 0.32 3.36 2.70 2.96 3.27 5.03 4.37 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

Table 2-44 • 1.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 1.4 V

Drive

Strength Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA Std. 0.66 14 .11 0.04 1.70 2.14 0.43 14.37 13.14 3.40 2.68 16.61 15.37 ns

–1 0.56 12.00 0.04 1.44 1.82 0.36 12.22 11.17 2.90 2.28 14.13 13.08 ns

–2 0.49 10.54 0.03 1.27 1.60 0.32 10.73 9.81 2.54 2.00 12.40 11.48 ns

4 mA Std. 0.66 11.23 0.04 1.70 2.14 0.43 11.44 9.87 3.77 3.36 13.68 12.10 ns

–1 0.56 9.55 0.04 1.44 1.82 0.36 9.73 8.39 3.21 2.86 11.63 10.29 ns

–2 0.49 8.39 0.03 1.27 1.60 0.32 8.54 7.37 2.81 2.51 10.21 9.04 ns

6 mA Std. 0.66 10.45 0.04 1.7 0 2.14 0.43 10.65 9.24 3.84 3.55 12.88 11.48 ns

–1 0.56 8.89 0.04 1.44 1.82 0.36 9.06 7.86 3.27 3.02 10.96 9.76 ns

–2 0.49 7.81 0.03 1.27 1.60 0.32 7.95 6.90 2.87 2.65 9.62 8.57 ns

8 mA Std. 0.66 10.02 0.04 1.7 0 2.14 0.43 10.20 9.23 3.97 4.22 12.44 11.47 ns

–1 0.56 8.52 0.04 1.44 1.82 0.36 8.68 7.85 3.38 3.59 10.58 9.75 ns

–2 0.49 7.48 0.03 1.27 1.60 0.32 7.62 6.89 2.97 3.15 9.29 8.56 ns

12 mA Std. 0.66 10.02 0.04 1.70 2.14 0.43 10.20 9.23 3.97 4.22 12.44 11.47 ns

–1 0.56 8.52 0.04 1.44 1.82 0.36 8.68 7.85 3.38 3.59 10.58 9.75 ns

–2 0.49 7.48 0.03 1.27 1.60 0.32 7.62 6.89 2.97 3.15 9.29 8.56 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-38 Revision 10

3.3 V PCI, 3.3 V PCI-X

Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus

applications.

AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable

path characterization are described in Figure 2-11.

AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is

described in Table 2-46.

Timing Characteristics

Table 2-45 • Minimum and Maximum DC Input and Output Levels

3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2

Drive Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmAMax.

mA3Max.

mA3µA4µA4

Per PCI specification P er PCI curves 10 10

Notes:

1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V< VIN < VIL.

2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN< VCCI. Input current is

larger when operating outside recommended ranges.

3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

4. Currents are measured at 85°C junction temperature.

Figure 2-11 • AC Loading

Test Point

Enable Path

R to VCCI for tLZ / tZL / tZLS

10 pF for tZH / tZHS / tZL / tZLS

5 pF for tHZ / tLZ

R to GND for tHZ / tZH / tZHS

R = 1 k

Test Point

Datapath

R = 25 R to VCCI for tDP (F)

R to GND for tDP (R)

Table 2-46 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ.) (V) CLOAD (pF)

0 3.3 0.285 * VCCI for tDP(R)

0.615 * VCCI for tDP(F)

–10

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Table 2-47 • 3.3 V PCI/PCI-X

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1. 42 5 V, Wor s t-C as e VCCI = 3.0 V

Speed

Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 2.81 0.04 1.05 1.67 0.43 2.86 2.00 3.28 3.61 5.09 4.23 ns

–1 0.56 2.39 0.04 0.89 1.42 0.36 2.43 1.70 2.79 3.07 4.33 3.60 ns

–2 0.49 2.09 0.03 0.78 1.25 0.32 2.13 1.49 2.45 2.70 3.80 3.16 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-39

Voltage-Referenced I/O Characteristics

3.3 V GTL

Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential amplifier

input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.

Timing Characteristics

Table 2-48 • Minimum and Maximum DC Input and Output Levels

3.3 V GTL VIL VIH VOL VOH IOL IOH IOSL IOSH I IL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmAMax.

mA1Max.

mA1µA2µA2

25 mA3–0.3 VREF – 0.05 VREF + 0.05 3.6 0.4 – 25 25 181 268 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Output drive strength is below JEDEC specification.

Figure 2-12 • AC Loading

Table 2-49 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.05 VREF + 0.05 0.8 0.8 1.2 10

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point 10 pF

GTL

VTT

Table 2-50 • 3.3 V GTL

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V VREF = 0.8 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.60 2.08 0.04 2.93 0.43 2.04 2.08 4.27 4.31 ns

–1 0.51 1.77 0.04 2.50 0.36 1.73 1.77 3.63 3.67 ns

–2 0.45 1.55 0.03 2.19 0.32 1.52 1.55 3.19 3.22 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-40 Revision 10

2.5 V GTL

Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential amplifier

input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.

Timing Characteristics

Table 2-51 • Minimum and Maximum DC Input and Output Levels

2.5 GTL VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.,

VMax.

VMin.

VMax.

VMin.

VmAmAMax.

mA1Max.

mA1µA2µA2

25 mA3–0.3 VREF – 0.05 VREF + 0.05 3.6 0.4 – 25 25 124 169 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Output drive strength is below JEDEC specification.

Figure 2-13 • AC Loading

Table 2-52 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.05 VREF + 0.05 0.8 0.8 1.2 10

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point 10 pF

GTL

VTT

Table 2-53 • 2.5 V GTL

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V VREF = 0.8 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.60 2.13 0.04 2.46 0.43 2.16 2.13 4.40 4.36 ns

–1 0.51 1.81 0.04 2.09 0.36 1.84 1.81 3.74 3.71 ns

–2 0.45 1.59 0.03 1.83 0.32 1.61 1.59 3.28 3.26 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-41

3.3 V GTL+

Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential

amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.

Timing Characteristics

Table 2-54 • Minimum and Maximum DC Input and Output Levels

3.3 V GTL+ VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmAMax.

mA1Max.

mA1µA2µA2

35 mA –0.3 VREF – 0.1 VREF + 0.1 3.6 0.6 – 3 5 35 181 268 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-14 • AC Loading

Table 2-55 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.1 VREF + 0.1 1.0 1.0 1.5 10

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point 10 pF

GTL+

VTT

Table 2-56 • 3.3 V GTL+

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V, VREF = 1.0 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.60 2.06 0.04 1.59 0.43 2.09 2.06 4.33 4.29 ns

–1 0.51 1.75 0.04 1.35 0.36 1.78 1.75 3.68 3.65 ns

–2 0.45 1.53 0.03 1.19 0.32 1.56 1.53 3.23 3.20 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-42 Revision 10

2.5 V GTL+

Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential

amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.

Timing Characteristics

Table 2-57 • Minimum and Maximum DC Input and Output Levels

2.5 V GTL+ VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmAMax.

mA1Max.

mA1µA2µA2

33 mA –0.3 VREF – 0.1 VREF + 0.1 3.6 0.6 – 33 33 124 169 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-15 • AC Loading

Table 2-58 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.1 VREF + 0.1 1.0 1.0 1.5 10

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point 10 pF

GTL+

VTT

Table 2-59 • 2.5 V GTL+

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 2.3 V, VREF = 1.0 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.60 2.21 0.04 1.51 0.43 2.25 2.10 4.48 4.34 ns

–1 0.51 1.88 0.04 1.29 0.36 1.91 1.79 3.81 3.69 ns

–2 0.45 1.65 0.03 1.13 0.32 1.68 1.57 3.35 3.24 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-43

HSTL Class I

High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).

ProASIC3E devices support Class I. This provides a differential amplifier input buffer and a push-pull

output buffer.

Timing Characteristics

Table 2-60 • Minimum and Maximum DC Input and Output Levels

HSTL Class I VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

8 mA –0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCI – 0.4 8 8 39 32 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-16 • AC Loading

Table 2-61 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point*

(V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.1 VREF + 0.1 0.75 0.75 0.75 20

Note: *Measuri ng poi nt = Vtrip. See Table 2-15 on page 2-19 for a complete table of trip points.

Test Point 20 pF

HSTL

Class I

VTT

Table 2-62 • HSTL Class I

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = .4 V, VREF = 0.75 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 3.18 0.04 2.12 0.43 3.24 3.14 5.47 5.38 ns

–1 0.56 2.70 0.04 1.81 0.36 2.75 2.67 4.66 4.58 ns

–2 0.49 2.37 0.03 1.59 0.32 2.42 2.35 4.09 4.02 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-44 Revision 10

HSTL Class II

High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).

ProASIC3E devices support Class II. This provides a differential amplifier input buffer and a push-pull

output buffer.

Timing Characteristics

Table 2-63 • Minimum and Maximum DC Input and Output Levels

HSTL Class II VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMax.,

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

15 mA3–0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCCI – 0.4 15 15 55 66 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Output drive strength is below JEDEC specification.

Figure 2-17 • AC Loading

Table 2-64 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.1 V REF + 0.1 0.75 0.75 0.75 20

Note: *Measuring point = Vtrip. See Table 2-15 on page 2-19 for a complete table of trip points.

Test Point 20 pF

HSTL

Class II

VTT

Table 2-65 • HSTL Class II

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 1.4 V, VREF = 0.75 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 3.02 0.04 2.12 0.43 3.08 2.71 5.32 4.95 ns

–1 0.56 2.57 0.04 1.81 0.36 2.62 2.31 4.52 4.21 ns

–2 0.49 2.26 0.03 1.59 0.32 2.30 2.03 3.97 3.70 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-45

SSTL2 Class I

Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). ProASIC3E devices support

Class I. This provides a differential amplifier input buffer and a push-pull output buffer.

Timing Characteristics

Table 2-66 • Minimum and Maximum DC Input and Output Levels

SSTL2 Class I VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

15 mA –0.3 VREF – 0.2 VREF + 0.2 3.6 0.54 VCCI – 0.62 15 15 87 83 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-18 • AC Loading

Table 2-67 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.2 VREF + 0.2 1.25 1.25 1.25 30

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point

30 pF

SSTL2

Class I

VTT

Table 2-68 • SSTL 2 Class I

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 2.3 V, VREF = 1.25 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 2.13 0.04 1.33 0.43 2.17 1.85 4.40 4.08 ns

–1 0.56 1.81 0.04 1.14 0.36 1.84 1.57 3.74 3.47 ns

–2 0.49 1.59 0.03 1.00 0.32 1.62 1.38 3.29 3.05 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-46 Revision 10

SSTL2 Class II

Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). ProASIC3E devices support

Class II. This provides a differential amplifier input buffer and a push-pull output buffer.

Timing Characteristics

Table 2-69 • Minimum and Maximum DC Input and Output Levels

SSTL2 Class II VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

18 mA –0.3 VREF – 0.2 VREF + 0.2 3.6 0.35 VCCI – 0.43 18 18 124 169 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-19 • AC Loading

Table 2-70 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.2 V REF + 0.2 1.25 1.25 1.25 30

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point

30 pF

SSTL2

Class II

VTT

Table 2-71 • SSTL 2 Class II

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 2.3 V, VREF = 1.25 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 0.66 2.17 0.04 1.33 0.43 2.21 1.77 4.44 ns

–1 0.56 0.56 1.84 0.04 1.14 0.36 1.88 1.51 3.78 ns

–2 0.49 0.49 1.62 0.03 1.00 0.32 1.65 1.32 3.32 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-47

SSTL3 Class I

Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). ProASIC3E devices support

Class I. This provides a differential amplifier input buffer and a push-pull output buffer.

Timing Characteristics

Table 2-72 • Minimum and Maximum DC Input and Output Levels

SSTL3 Class I VIL VIH VOL VOH IO L IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

14 mA –0.3 VREF – 0.2 VREF + 0.2 3.6 0.7 VCCI – 1.1 14 14 54 51 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-20 • AC Loading

Table 2-73 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.2 VREF + 0.2 1.5 1.5 1.485 30

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point

30 pF

SSTL3

Class I

VTT

Table 2-74 • SSTL3 Class I

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V, VREF = 1.5 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 2.31 0.04 1.25 0.43 2.35 1.84 4.59 4.07 ns

–1 0.56 1.96 0.04 1.06 0.36 2.00 1.56 3.90 3.46 ns

–2 0.49 1.72 0.03 0.93 0.32 1.75 1.37 3.42 3.04 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-48 Revision 10

SSTL3 Class II

Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). ProASIC3E devices support

Class II. This provides a differential amplifier input buffer and a push-pull output buffer.

Timing Characteristics

Table 2-75 • Minimum and Maximum DC Input and Output Levels

SSTL3 Class II VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

Max.

mA1Max.

mA1µA2µA2

21 mA –0.3 VREF – 0.2 VREF + 0.2 3.6 0.5 VCCI – 0.9 21 21 109 103 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-21 • AC Loading

Table 2-76 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring

Point* (V) VREF (typ.) (V) VTT (typ.) (V) CLOAD (pF)

VREF – 0.2 VREF + 0.2 1.5 1.5 1.485 30

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

Test Point

30 pF

SSTL3

Class II

VTT

Table 2-77 • SSTL3 Class II

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V, VREF = 1.5 V

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

Std. 0.66 2.07 0.04 1.25 0.43 2.10 1.67 4.34 3.91 ns

–1 0.56 1.76 0.04 1.06 0.36 1.79 1.42 3.69 3.32 ns

–2 0.49 1.54 0.03 0.93 0.32 1.57 1.25 3.24 2.92 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-49

Differential I/O Characteristics

Physical Implementation

Configuration of the I/O modules as a differential pair is handled by the Designer software when the user

instantiates a differential I/O macro in the design.

Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output

I/Os or tristates with the LVPECL standards.

LVDS

Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It

requires that one data bit be carried through two signal lines, so two pins are needed. It also requires

external resistor termination.

The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-22. The

building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three

board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver

resistors are different from those used in the LVPECL implementation because the output standard

specifications are different.

Along with LVDS I/O, ProASIC3E also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)

configuration (up to 40 nodes).

Figure 2-22 • LVDS Circuit Diagram and Board-Level Imple mentation

140 Ω100 Ω

= 50 Ω

165 Ω

–

INBUF_LVDS

OUTBUF_LVDS

FPGA FPGA

Bourns Part Number: CAT16-LV4F12

ProASIC3E DC and Switching Characteristics

2-50 Revision 10

Table 2-78 • LVDS Minimum and Maximum DC Input and Output Levels

DC Parameter Description Min. Typ. Max. Units

VCCI Supply Voltage 2.375 2.5 2.625 V

VOL Output Low Voltage 0.9 1.075 1.25 V

VOH Output High Voltage 1.25 1.425 1.6 V

IOL1 Output Lower Current 0.65 0.91 1.16 mA

IOH1 Output High Current 0.65 0.91 1.16 mA

VI Input Voltage 0 2.925 V

IIH2Input High Leakage Current 10 µA

IIL2Input Low Leakage Current 10 µA

VODIFF Differential Output Voltage 250 350 450 mV

VOCM Output Common Mode Voltage 1.125 1.25 1.375 V

VICM Input Common Mode Voltage 0.05 1.25 2.35 V

VIDIFF Input Differential Vo ltage 2 100 350 mV

Notes:

1. IOL/IOH defined by VODIFF/(Resistor Network).

2. Currents are measured at 85°C junction temperature.

Table 2-79 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ.) (V)

1.075 1.325 Cross point –

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

ProASIC3E Flash Family FPGAs

Revision 10 2-51

Timing Characteristics

B-LVDS/M-LVDS

Bus LVDS (B-LVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to

high-performance multipoint bus applications. Multidrop and multipoint bus configurations may contain

any combination of drivers, receivers, and transceivers. Microsemi LVDS drivers provide the higher drive

current required by B-LVDS and M-LVDS to accommodate the loading. The drivers require series

terminations for better signal quality and to control voltage swing. Termination is also required at both

ends of the bus since the driver can be located anywhere on the bus. These configurations can be

implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations.

Multipoint designs using Microsemi LVDS macros can achieve up to 200 MHz with a maximum of 20

loads. A sample application is given in Figure 2-23. The input and output buffer delays are available in

the LVDS section in Table 2-80.

Example: For a bus consisting of 20 equidistant loads, the following terminations provide the required

differential voltage, in worst-case Industrial operating conditions, at the farthest receiver: RS=60Ω and

RT=70Ω, given Z0=50Ω (2") and Zstub =50Ω (~1.5").

Table 2-80 • LVDS

Commercial-Case Conditions: TJ = 70°C, Worst-C ase VCC = 1.425 V, Worst-Case

VCCI = 2.3 V

Speed Grade tDOUT tDP tDIN tPY Units

Std. 0.66 1.87 0.04 1.82 ns

–1 0.56 1.59 0.04 1.55 ns

–2 0.49 1.40 0.03 1.36 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for

derating values.

Figure 2-23 • B-LVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers

...

RTRT

BIBUF_LVDS

-T

-R

-T

EN EN EN EN EN

Receiver Transceiver Receiver TransceiverDriver

stub

ProASIC3E DC and Switching Characteristics

2-52 Revision 10

LVPECL

Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires

that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It also requires

external resistor termination.

The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-24. The

building blocks of the LVPECL transmitter-receiver are one transmitter macro, one receiver macro, three

board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver

resistors are different from those used in the LVDS implementation because the output standard

specifications are different.

Timing Characteristics

Figure 2-24 • LVPECL Circuit Diagram and Board-Level Implementation

Table 2-81 • Minimum and Maximum DC Input and Output Levels

DC Parameter Description Min. Max. Min. Max. Min. Max. Units

VCCI Supply V o ltage 3.0 3.3 3.6 V

VOL Output Low Voltage 0.96 1.27 1.06 1.43 1.30 1.57 V

VOH Outpu t High Vo ltage 1.8 2.11 1.92 2.28 2.13 2.41 V

VIL, VIH Input Low, Input High Voltages 0 3.3 0 3.6 0 3.9 V

VODIFF Differential Output Voltage 0.625 0.97 0.625 0.97 0.625 0.97 V

VOCM Output Common-Mode Voltage 1.762 1.98 1.762 1.98 1.762 1.98 V

VICM Input Common-Mode Voltage 1.01 2.57 1.01 2.57 1.01 2.57 V

VIDIFF Input Differential Voltage 300 300 300 mV

Table 2-82 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ.) (V)

1.64 1.94 Cross point –

Note: *Measuring point = Vtrip. See Table 2-15 on p a g e 2-19 for a complete table of trip points.

187 W 100 Ω

Z0 = 50 Ω

100 Ω

–

INBUF_LVPECL

OUTBUF_LVPECL

FPGA FPGA

Bourns Part Number: CAT16-PC4F12

Table 2-83 • LVPECL

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Speed Grade tDOUT tDP tDIN tPY Units

Std. 0.66 1.83 0.04 1.63 ns

–1 0.56 1.55 0.04 1.39 ns

–2 0.49 1.36 0.03 1.22 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-53

I/O Register Specifications

Fully Registered I/O Buffers with Synchronous Enable and

Asynchronous Preset

Figure 2-25 • Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset

INBUF

INBUF INBUF

TRIBUF

CLKBUF

INBUF

CLKBUF

Data Input I/O Register with:

Active High Enable

Active High Preset

Positive-Edge Triggered Data Output Register and

Enable Output Register with:

Active High Enable

Active High Preset

Postive-Edge Triggered

Pad Out

CLK

Enable

Preset

Data_out

Data

EOUT

DOUT

Enable

CLK

DFN1E1P1

PRE

DFN1E1P1

PRE

DFN1E1P1

PRE

D_Enable

YCore

Array

ProASIC3E DC and Switching Characteristics

2-54 Revision 10

Table 2-84 • Parameter Definitio n an d Measuring Nodes

Parameter Name Parameter Definition Measuring Nodes

(from, to)*

tOCLKQ Clock-to-Q of the Output Data Register H, DOUT

tOSUD Data Setup Time for the Output Data Register F, H

tOHD Data Hold Time for the Output Data Register F, H

tOSUE Enable Setup Time for the Output Data Register G, H

tOHE Enable Hold Time for the Output Data Register G, H

tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register L, DOUT

tOREMPRE Asynchronous Preset Removal Time for the Output Data Register L, H

tORECPRE Asynchronous Preset Recovery Time for the Output Data Register L, H

tOECLKQ Clock-to-Q of the Output Enable Register H, EOUT

tOESUD Data Setup Time for the Output Enable Register J, H

tOEHD Data Hold Time for the Output Enable Register J, H

tOESUE Enable Setup Time for the Output Enable Register K, H

tOEHE Enable Hold Time for the Output Enable Register K, H

tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Registe r I, EOUT

tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Reg ister I, H

tOERECPRE Asynch ronous Preset Recovery Time for the Output Enable Register I, H

tICLKQ Clock-to-Q of the Input Data Register A, E

tISUD Dat a Setup Time for the Input Data Register C, A

tIHD Data Hold Time for the Input Data Register C, A

tISUE Enable Setup Time for the Input Data Register B, A

tIHE Enable Hold Time for the Input Data Register B, A

tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register D, E

tIREMPRE Asynchronous Preset Removal Time for the Input Data Register D, A

tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register D, A

Note: *See Figure 2-25 on page 2-53 for more information.

ProASIC3E Flash Family FPGAs

Revision 10 2-55

Fully Registered I/O Buffers with Synchronous Enable and

Asynchronous Clear

Figure 2-26 • Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronou s Clear

Enable

CLK

Pad Out

CLK

Enable

CLR

Data_out

Data Y

EOUT

DOUT

Core

Array

DFN1E1C1

CLR

DFN1E1C1

CLR

DFN1E1C1

CLR

D_Enable

CLKBUF

INBUF

TRIBUF

INBUF INBUF CLKBUF

INBUF

Data Input I/O Register with

Active High Enable

Active High Clear

Positive-Edge Triggered Data Output Register and

Enable Output Register with

Active High Enable

Active High Clear

Positive-Edge Triggered

ProASIC3E DC and Switching Characteristics

2-56 Revision 10

Table 2-85 • Parameter Definitio n an d Measuring Nodes

Parameter Name Parameter Definition Measuring Nodes

(from, to)*

tOCLKQ Clock-to-Q of the Output Data Register HH, DOUT

tOSUD Data Setup Time for the Output Data Register FF, HH

tOHD Data Hold Time for the Output Data Register FF, HH

tOSUE Enable Setup Time for the Output Data Register GG, HH

tOHE Enable Hold Time for the Output Data Register GG, HH

tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register LL, DOUT

tOREMCLR Asynchronous Clear Removal Time for the Output Data Register LL, HH

tORECCLR Asynchronous Clear Reco very Time for the Output Data Register LL, HH

tOECLKQ Clock-to-Q of the Output Enable Register HH, EOUT

tOESUD Data Setup Time for the Output Enable Register JJ, HH

tOEHD Data Hold Time for the Output Enable Register JJ, HH

tOESUE Enable Setup Time for the Output Enable Register KK, HH

tOEHE Enable Hold Time for the Output Enable Register KK, HH

tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register II, EOUT

tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Reg ister II, HH

tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Regi ster II, HH

tICLKQ Clock-to-Q of the Input Data Register AA, EE

tISUD Data Setu p Time for the Input Data Register CC, AA

tIHD Data Hold Time for the Input Data Register CC, AA

tISUE Enable Setup Time for the Input Data Register BB, AA

tIHE Enable Hold T ime for the Input Data Register BB, AA

tICLR2Q Asynchronous Clear-to-Q of the Input Data Register DD, EE

tIREMCLR Asynchronous Clear Removal Time for the Input Data Register DD, AA

tIRECCLR Asynchronous Clear Reco very Time for the Input Data Register DD, AA

Note: *See Figure 2-26 on page 2-55 for more information.

ProASIC3E Flash Family FPGAs

Revision 10 2-57

Input Register

Timing Characteristics

Figure 2-27 • Input Register Timing Diagram

50%

Preset

Clear

Out_1

CLK

Data

Enable

ISUE

50%

ISUD

IHD

50% 50%

ICLKQ

IHE

IRECPRE

IREMPRE

IRECCLR

IREMCLR

IWCLR

IWPRE

IPRE2Q

ICLR2Q

ICKMPWH

ICKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-86 • Input Data Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tICLKQ Clock-to-Q of the Input Data Register 0.24 0.27 0.32 ns

tISUD Data Setup Time for the Input Data Register 0.26 0.30 0.35 ns

tIHD Data Hold Time for the Input Data Register 0.00 0.00 0.00 ns

tISUE Enable Setup Time for the Input Data Register 0.37 0.42 0.50 ns

tIHE Enable Hold Time for the Input Data Register 0.00 0.00 0.00 ns

tICLR2Q Asynchronous Clear-to-Q of the Input Data Register 0.45 0.52 0.61 ns

tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register 0.45 0.52 0.61 ns

tIREMCLR Asynchronous Clear Remo val Time for the Input Data Register 0.00 0.00 0.00 ns

tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register 0.22 0.25 0.30 ns

tIREMPRE Asynchronous Preset Removal Time for the Input Data Register 0.00 0.00 0.00 ns

tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register 0.22 0.25 0.30 ns

tIWCLR Asynchronous Clear Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 ns

tIWPRE Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 ns

tICKMPWH Clock Minimum Pulse Width High for the Input Data Register 0.36 0.41 0.48 ns

tICKMPWL Clock Minimum Pulse Width Low for the Input Data Register 0.32 0.37 0.43 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-58 Revision 10

Output Register

Timing Characteristics

Figure 2-28 • Output Register Timing Diagram

Preset

Clear

DOUT

CLK

Data_out

Enable

OSUE

50%

OSUD

OHD

50% 50%

OCLKQ

OHE

ORECPRE

OREMPRE

ORECCLR

OREMCLR

OWCLR

OWPRE

OPRE2Q

OCLR2Q

OCKMPWH

OCKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-87 • Output Data Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tOCLKQ Clock-to-Q of the Output Data Register 0.59 0.67 0.79 ns

tOSUD Data Setup Time for the Output Data Register 0.31 0.36 0.42 n s

tOHD Data Hold Time for the Output Data Register 0.00 0.00 0.00 ns

tOSUE Enable Setup Time for the Output Data Register 0.44 0.50 0.59 ns

tOHE Enable Hold Time for the Output Data Register 0.00 0.00 0.00 ns

tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register 0.80 0.91 1.07 ns

tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register 0.80 0.91 1.07 ns

tOREMCLR Asynchronous Clear Removal Time for the Output Data Register 0.00 0.00 0.00 ns

tORECCLR Asynchronous Clear Recovery Time for the Output Data Register 0.22 0.25 0.30 ns

tOREMPRE Asynchronous Preset Removal Time for the Output Data Register 0.00 0.00 0.00 ns

tORECPRE Asynchronous Preset Recovery Time for the Output Data Register 0.22 0.25 0.30 ns

tOWCLR Asynchronous Clear Minimum Pulse Width for the Output Data Register 0.22 0.25 0.30 ns

tOWPRE Asynchronous Preset Minimum Pulse Width for the Output Data Register 0.22 0.25 0.30 ns

tOCKMPWH Clock Minimum Pulse Width High for the Output Data Register 0.36 0.41 0.48 ns

tOCKMPWL Clock Minimum Pulse Width Low for the Output Data Register 0.32 0.37 0.43 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-59

Output Enable Register

Timing Characteristics

Figure 2-29 • Output Enable Register Timing Diagram

50%

Preset

Clear

EOUT

CLK

D_Enable

Enable

OESUE

50%

OESUD

OEHD

50% 50%

OECLKQ

OEHE

OERECPRE

OEREMPRE

OERECCLR

OEREMCLR

OEWCLR

OEWPRE

OEPRE2Q

OECLR2Q

OECKMPWH

OECKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-88 • Output Enable Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tOECLKQ Clock-to-Q of the Output Enable Register 0.59 0.67 0.79 ns

tOESUD Data Setup Time for the Output Enable Register 0.31 0.36 0.42 ns

tOEHD Data Hold Time for the Output Enable Register 0.00 0.00 0.00 ns

tOESUE Enable Setup Time for the Output Enable Register 0.44 0.50 0.58 ns

tOEHE Enable Hold Time for the Output Enable Register 0.00 0.00 0.00 ns

tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register 0.67 0.76 0.89 ns

tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Regist er 0.67 0.76 0.89 ns

tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register 0.00 0.00 0.00 ns

tOERECCLR Asynchronous Cle ar Recovery Time for the Output Enable Register 0.22 0.25 0.30 ns

tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register 0.00 0.00 0.00 ns

tOERECPRE Asynchro nous Preset Recovery Time for the Output Enable Register 0.22 0.25 0.30 ns

tOEWCLR Asynchronous Clear Minimum Pulse Width for the Output Enable Register 0.22 0.25 0.30 ns

tOEWPRE Asynchronous Preset Minimum Pulse Width for the Output Enable Register 0.22 0.25 0.30 ns

tOECKMPWH Clock Minimum Pulse Width High for the Output Enable Register 0.36 0.41 0.48 ns

tOECKMPWL Clock Minimum Pulse Width Low for the Output Enable Register 0.32 0.37 0.43 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-60 Revision 10

DDR Module Specifications

Input DDR Module

Figure 2-30 • Input DDR Timing Model

Table 2-89 • Parameter Definitions

Parameter Name Parameter Definition Measuring Nodes (from, to)

tDDRICLKQ1 Clock-to-Out Out_QR B, D

tDDRICLKQ2 Clock-to-Out Out_QF B, E

tDDRISUD Data Setup Time of DDR input A, B

tDDRIHD Data Hold Time of DDR input A, B

tDDRICLR2Q1 Clear-to-Out Out_QR C, D

tDDRICLR2Q2 Clear-to-Out Out_QF C, E

tDDRIREMCLR Clear Removal C, B

tDDRIRECCLR Clear Recovery C, B

Input DDR

Data

CLK

CLKBUF

INBUF Out_QF

(to core)

FF2

FF1

INBUF

CLR

DDR_IN

Out_QR

(to core)

ProASIC3E Flash Family FPGAs

Revision 10 2-61

Timing Characteristics

Figure 2-31 • Input DDR Timing Diagram

DDRICLR2Q2

DDRIREMCLR

DDRIRECCLR

DDRICLR2Q1

12 3 4 5 6 7 8 9

CLK

Data

CLR

Out_QR

Out_QF

DDRICLKQ1

246

357

DDRIHD

DDRISUD

DDRICLKQ2

Table 2-90 • Input DDR Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tDDRICLKQ1 Clock -to-Out Out_QR for Input DDR 0.39 0.44 0.52 ns

tDDRICLKQ2 Clock-to-Out Out_QF for Input DDR 0.27 0.31 0.37 ns

tDDRISUD Data Setup for Input DDR 0.28 0.32 0.38 ns

tDDRIHD Data Hold for Input DDR 0.00 0.00 0.00 ns

tDDRICLR2Q1 Asynchronous Clear to Out Out_QR for Input DDR 0.57 0.65 0.76 ns

tDDRICLR2Q2 Asynchronous Clear-to-Out Out_QF for Input DDR 0.46 0.53 0.62 ns

tDDRIREMCLR Asynchronous Clear Removal Time for Input DDR 0.00 0.00 0.00 ns

tDDRIRECCLR Asynchronous Clear Recovery Time for Input DDR 0.22 0.25 0.30 ns

tDDRIWCLR Asynchronous Clear Minimum Pulse Width for Input DDR 0.22 0.25 0.30 ns

tDDRICKMPWH Clock Minimum Pulse Width High for Input DDR 0.36 0.41 0.48 ns

tDDRICKMPWL Clock Minimum Pulse Width Low for Input DDR 0.32 0.37 0.43 ns

FDDRIMAX Maximum Frequency for Input DDR 1404 1232 1048 MHz

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-62 Revision 10

Output DDR Module

Figure 2-32 • Output DDR Timing Model

Table 2-91 • Parameter Definitions

Parameter Name Parameter Definition Measuring Nodes (from, to)

tDDROCLKQ Clock-to-Out B, E

tDDROCLR2Q Asynchronous Clear-to-Out C, E

tDDROREMCLR Clear Removal C, B

tDDRORECCLR Clear Recovery C, B

tDDROSUD1 Data Setup Data_F A, B

tDDROSUD2 Data Setup Data_R D, B

tDDROHD1 Data Hold Data_F A, B

tDDROHD2 Data Hold Data_R D, B

Data_F

(from core)

CLK CLKBUF

Out

FF2

INBUF

CLR

DDR_OUT

Output DDR

FF1

OUTBUF

Data_R

(from core)

ProASIC3E Flash Family FPGAs

Revision 10 2-63

Timing Characteristics

Figure 2-33 • Output DDR Timing Diagram

116

910

28 3 9

DDROREMCLR

DDROHD1

DDROREMCLR

DDROHD2

DDROSUD2

DDROCLKQ

DDRORECCLR

CLK

Data_R

Data_F

CLR

Out

DDROCLR2Q

7104

Table 2-92 • Output DDR Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tDDROCLKQ Clock-to-Out of DDR for Output DDR 0.70 0.80 0.94 ns

tDDROSUD1 Data_F Data Setup for Output DDR 0.38 0.43 0.51 ns

tDDROSUD2 Data_R Data Setup for Output DDR 0.38 0.43 0.51 ns

tDDROHD1 Data_F Data Hold for Output DDR 0.00 0.00 0.00 ns

tDDROHD2 Data_R Data Hold for Output DDR 0.00 0.00 0.00 ns

tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 0.80 0.91 1.07 ns

tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 0.00 0.00 ns

tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.22 0.25 0.30 ns

tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.22 0.25 0.30 ns

tDDROCKMPWH Clock Minimum Pulse Width High for the Output DDR 0.36 0.41 0.48 ns

tDDROCKMPWL Clock Minimum Pulse Width Low for the Output DDR 0.32 0.37 0.43 ns

FDDOMAX Maximum Frequency for the Output DDR 1404 1232 1048 MHz

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-64 Revision 10

VersaTile Characteristics

Ve rsaTile Specifications as a Combinatorial Module

The ProASIC3E library offers all combinations of LUT-3 combinatorial functions. In this section, timing

characteristics are presented for a sample of the library. For more details, refer to the Fusion, IGLOO®/e,

and ProASIC3/E Macro Library Guide.

Figure 2-34 • Sample of Combinatorial Cells

MAJ3

MUX2

AXOR2 Y

NOR2

AYOR2

INV

AND2

NAND3

XOR3 Y

NAND2

ProASIC3E Flash Family FPGAs

Revision 10 2-65

Figure 2-35 • Timing Mode l and Waveforms

tPD

tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR))

where edges are applicable for the particular

combinatorial cell

NAND2 or

Any Combinatorial

Logic

tPD

50%

VCC

50%

GND

A, B, C 50% 50%

50%

(RR)

(RF) GND

OUT

GND

50%

(FF)

(FR)

tPD

ProASIC3E DC and Switching Characteristics

2-66 Revision 10

Timing Characteristics

Ve rsaTile Specifications as a Sequential Module

The ProASIC3E library offers a wide variety of sequential cells, including flip-flops and latches. Each has

a data input and optional enable, clear, or preset. In this section , timing characteristi cs are p resented for

a representative sample from the library . For more details, refer to the Fusion, IGLOO/e, and ProASIC3/E

Macro Library Guide.

Table 2-93 • Combinatorial Cell Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Combinatorial Cell Equation Parameter –2 –1 Std. Units

INV Y = !A tPD 0.40 0.46 0.54 ns

AND2 Y = A · B tPD 0.47 0.54 0.63 ns

NAND2 Y = !(A · B) tPD 0.47 0.54 0.63 ns

OR2 Y = A + B tPD 0.49 0.55 0.65 ns

NOR2 Y = !(A + B) tPD 0.49 0.55 0.65 ns

XOR2 Y = A ⊕ Bt

PD 0.74 0.84 0.99 ns

MAJ3 Y = MAJ(A , B, C) tPD 0.70 0.79 0.93 ns

XOR3 Y = A ⊕ B ⊕ Ct

PD 0.87 1.00 1.17 ns

MUX2 Y = A !S + B S tPD 0.51 0.58 0.68 ns

AND3 Y = A · B · C tPD 0.56 0.64 0.75 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

Figure 2- 36 • Sample of Sequential Cells

DFN1

Data

CLK

Out

DFN1C1

Data

CLK

Out

CLR

DFI1E1P1

Data

CLK

Out

PRE

DFN1E1

Data

CLK

Out

ProASIC3E Flash Family FPGAs

Revision 10 2-67

Timing Characteristics

Figure 2-37 • Timing Mode l and Waveforms

PRE

CLR

Out

CLK

Data

SUE

50%

SUD

50% 50%

CLKQ

RECPRE

REMPRE

RECCLR

REMCLR

WCLR

WPRE

PRE2Q

CLR2Q

CKMPWH

CKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-94 • Register Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tCLKQ Clock-to-Q of the Core Register 0.55 0.63 0.74 ns

tSUD Dat a Set up Time for the Core Register 0.43 0.49 0.57 ns

tHD Data Hold Time for the Core Register 0.00 0.00 0.00 ns

tSUE Enable Setu p Time for the Core Regist er 0.45 0.52 0.61 ns

tHE Enable Hold Time for the Core Register 0.00 0.00 0.00 ns

tCLR2Q Asynchronous Clear-to-Q of the Core Register 0.40 0.45 0.53 ns

tPRE2Q Asynchronous Preset-to-Q of the Core Register 0.40 0.45 0.53 ns

tREMCLR Asynchronous Clear Removal Time for the Core Registe r 0.00 0.00 0.00 ns

tRECCLR Asynchronous Clear Recovery Time for the Core Register 0.22 0.25 0.30 ns

tREMPRE Asynchronous Preset Removal Time for the Core Register 0.00 0.00 0.00 ns

tRECPRE Asynchronous Preset Recovery Time for the Core Register 0.22 0.25 0.30 ns

tWCLR Asynchronous Clear Minimum Pulse Width for the Core Register 0.22 0.25 0.30 ns

tWPRE Asynchronous Preset Minimum Pulse Width for the Core Register 0 .22 0.25 0.30 ns

tCKMPWH Clock Minimum Pulse Width High for the Core Register 0.32 0.37 0.43 ns

tCKMPWL Clock Minimum Pulse Width Low for the Core Register 0.36 0.41 0.48 ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-68 Revision 10

Global Resource Characteristics

A3PE600 Clock Tree Topology

Clock delays are device-specific. Figure 2-38 is an example of a global tree used for cl ock routing. The

global tree presented in Figure 2-38 is driven by a CCC located on the west side of the A3PE600 device.

It is used to drive all D-flip-flops in the device.

Global Tree Timing Characteristics

Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not

include I/O input buffer clock delays, as th ese are I/O standard–depe nde nt, and th e cl ock may be d riven

and conditioned i nternally by the CCC mo dule. For more details on clock conditioning capabilities, refer

to the "Clock Conditioning Circuits" section on page 2-70. Table 2-95 on page 2-69, Table 2-96 on

page 2-69, and Tab le 2-97 on page 2-69 present minimum and maximum g lobal clock delays within the

device. Minimum and ma ximum delays are measured with minimum and maximum loading.

Figure 2-38 • Examp le of Global Tree Use in an A3PE600 Device for Clock Routing

Central

Global Rib

VersaTile

Rows

Global Spine

CCC

ProASIC3E Flash Family FPGAs

Revision 10 2-69

Timing Characteristics

Table 2-95 • A3PE600 Global Resou rce

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std.

UnitsMin.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input Low Delay for Global Clock 0.83 1.04 0.94 1.18 1.11 1.39 ns

tRCKH Input High Delay for Global Clock 0.81 1.06 0.93 1.21 1.09 1.42 ns

tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns

tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns

tRCKSW Maximum Skew for Global Clock 0.25 0.28 0.33 ns

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,

located in a lightly loaded row (single element is connected to the global net).

2. Value reflect s maximum lo ad. The del ay is measu red on the cl ock pin of the fart hest seq uential el ement, located i n a full y

loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

Table 2-96 • A3PE1500 Glob al Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std.

UnitsMin.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input Low Delay for Global Clock 1.071.291.221.471.431.72 ns

tRCKH Input High Delay for Global Clock 1.061.321.211.501.421.76 ns

tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns

tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,

located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maxi mum load. The delay is meas ured on the clock pin of the farthest sequenti al element, located in a full y

loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

Table 2-97 • A3PE3000 Glob al Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std.

UnitsMin.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input Low Delay for Global Clock 1.411.621.601.851.882.17 ns

tRCKH Input High Delay for Global Clock 1.401.661.591.891.872.22 ns

tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns

tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.35 ns

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,

located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maxi mum load. The delay is meas ured on the clock pin of the farthest sequenti al element, located in a full y

loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-70 Revision 10

Clock Conditioning Circuits

CCC Electrical Specifications

Timing Characteristics

Table 2-98 • ProASIC3E CCC/PLL Specification

Parameter Minimum Typical Maximum Units

Clock Conditioning Circuitry Input Frequency fIN_CCC 1.5 350 MHz

Clock Conditioning Circuitry Output Frequency fOUT_CCC 0.75 350 MHz

Delay Increments in Programmable Delay Blocks1, 2 1603ps

Serial Clock (SCLK) for Dynamic PLL4125 MHz

Number of Programmable Values in Each

Programmable Delay Block 32

Input Period Jitter 1.5 ns

CCC Output Peak-to-Peak Period Jitter FCCC_OUT Max Peak-to-Peak Period Jitter

1 Global

Network Used 3 Gl obal

Networks Used

0.75 MHz to 24 MHz 0.50% 0.70%

24 MHz to 100 MHz 1.00% 1 .20%

100 MHz to 250 MHz 1.75% 2.00%

250 MHz to 350 MHz 2.50% 5.60%

Acquisition Time LockControl = 0 300 µs

LockControl = 1 6.0 ms

Tracking Jitter 5 LockControl = 0 1.6 ns

LockControl = 1 0.8 ns

Output Duty Cycle 48.5 51.5 %

Delay Range in Block: Programmable Delay 11, 2 0.6 5.56 ns

Delay Range in Block: Programmable Delay 2 1,2 0.025 5.56 ns

Delay Range in Block: Fixed Delay1,4 2.2 ns

Notes:

1. This delay is a function of voltage and temperature. See Table 2-6 on page 2-5 for deratings

2. TJ = 25°C, VCC = 1.5 V.

3. When the CCC/PLL core is generated by Microsemi core generator software, not all delay values of the specified delay

increments are available. Refer to SmartGen online help for more information.

4. Maximum value obtained for a –2 speed-grade device in worst-case commercial conditions. For specific junction

temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

5. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to the PLL input clock

edge. Tracking jitter does not measure the variation in PLL output period, which is covered by the period jitter

parameter.

ProASIC3E Flash Family FPGAs

Revision 10 2-71

Note: Peak-to-peak jitter measurements are defi ned by T peak-to-peak = Tperiod_max – Tperiod_min.

Figure 2-39 • Peak-to-Peak Jitter Definition

period_max

period_min

Output Signal

ProASIC3E DC and Switching Characteristics

2-72 Revision 10

Embedded SRAM and FIFO Characteristics

SRAM

Figure 2- 40 • RAM Models

ADDRA11 DOUTA8

DOUTA7

DOUTA0

DOUTB8

DOUTB7

DOUTB0

ADDRA10

ADDRA0

DINA8

DINA7

DINA0

WIDTHA1

WIDTHA0

PIPEA

WMODEA

BLKA

WENA

CLKA

ADDRB11

ADDRB10

ADDRB0

DINB8

DINB7

DINB0

WIDTHB1

WIDTHB0

PIPEB

WMODEB

BLKB

WENB

CLKB

RAM4K9

RADDR8 RD17

RADDR7 RD16

RADDR0 RD0

WD17

WD16

WD0

WW1

WW0

RW1

RW0

PIPE

REN

RCLK

RAM512X18

WADDR8

WADDR7

WADDR0

WEN

WCLK

RESET

ProASIC3E Flash Family FPGAs

Revision 10 2-73

Timing Waveforms

Figure 2-41 • RAM Read for Pass-Through Output. Applicable to Bo th RAM4K9 and RAM512x18.

Figure 2-42 • RAM Read for Pipelined Output. Applicable to Both RAM4K9 and RAM512x18.

CLK

[R|W]ADDR

BLK

WEN

DOUT|RD

A0A1A2

D0D1D2

tCYC

tCKH tCKL

tAS tAH

tBKS

tENS tENH

tDOH1

tBKH

tCKQ1

CLK

[R|W]ADDR

BLK

WEN

DOUT|RD

A0A1A2

D0D1

tCYC

tCKH tCKL

tAS tAH

tBKS

tENS tENH

tDOH2

tCKQ2

tBKH

ProASIC3E DC and Switching Characteristics

2-74 Revision 10

Figure 2-43 • RAM Write, Output Retained . Applicable to Both RAM4K9 and RAM512x18.

Figure 2-44 • RAM Write, Output as Write Data. Applicable to RAM4K9 Only.

tCYC

tCKH tCKL

A0A1A2

DI0DI1

tAS tAH

tBKS

tENS tENH

tDS tDH

CLK

BLK

WEN

[R|W]ADDR

DIN|WD

DOUT|RD

tBKH

tCYC

tCKH tCKL

A0A1A2

DI0DI1

tAS tAH

tBKS

tENS

tDS tDH

CLK

BLK

WEN

ADDR

DIN

tBKH

DOUT

(pass-through) DI1

DnDI0

DOUT

(pipelined) DI0DI1

DI2

ProASIC3E Flash Family FPGAs

Revision 10 2-75

Figure 2-45 • RAM Reset. Applicable to Both RAM4K9 and RAM5 12x18.

CLK

RESET

DOUT|RD D

CYC

CKH

CKL

RSTBQ

ProASIC3E DC and Switching Characteristics

2-76 Revision 10

Timing Characteristics

Table 2-99 • RAM4K9

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tAS Address setup time 0.25 0.28 0.33 ns

tAH Address hold time 0.00 0.00 0.00 ns

tENS REN, WEN setup time 0.14 0.16 0.19 ns

tENH REN, WEN hold time 0.10 0.11 0.13 ns

tBKS BLK setup time 0.23 0.27 0.31 ns

tBKH BLK hold time 0.02 0.02 0.02 ns

tDS Input data (DIN) setup time 0.18 0.21 0.25 ns

tDH Input data (DIN) hold time 0.00 0.00 0.00 ns

tCKQ1 Clock High to new data valid on DOUT (output retained, WMODE = 0) 1.79 2.03 2.39 ns

Clock High to new data valid on DOUT (flow-through, WMODE = 1) 2.36 2.68 3.15 ns

tCKQ2 Clock High to new data valid on DOUT (pipelined) 0.89 1.02 1.20 ns

tC2CWWL1Address collision clk-to-clk delay for reliable write after write on same

address—Applicable to Closing Edge 0.33 0.28 0.25 ns

tC2CWWH1Address collision clk-to-clk delay for reliable write after write on same

address—Applicable to Rising Edge 0.30 0.26 0.23 ns

tC2CRWH1Address collision clk-to-clk delay for reliable read access after write on same

address—Applicable to Opening Edge 0.45 0.38 0.34 ns

tC2CWRH1Address collision clk-to-clk delay for relia ble write a ccess after read on same

address— Applicable to Openi ng Edge 0.49 0.42 0.37 ns

tRSTBQ RESET Low to data out Low on DO (flow-through) 0.92 1.05 1.23 ns

RESET Low to Data Out Low on DO (pipelined) 0.92 1.05 1.23 ns

tREMRSTB RESET removal 0.29 0.33 0.38 ns

tRECRSTB RESET recovery 1.50 1.71 2.01 ns

tMPWRSTB RESET minimum pulse width 0.21 0.24 0.29 ns

tCYC Clock cycle time 3.23 3.68 4.32 ns

FMAX Maximum frequency 310 272 231 MHz

Notes:

1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-

Based cSoCs and FPGAs.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E Flash Family FPGAs

Revision 10 2-77

Table 2-100 • RAM512X18

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tAS Address setup time 0.25 0.28 0.33 ns

tAH Address hold time 0.00 0.00 0.00 ns

tENS REN, WEN setup time 0.18 0.20 0.24 ns

tENH REN, WEN hold time 0.06 0.07 0.08 ns

tDS Input data (WD) setup time 0.18 0.21 0.25 ns

tDH Input data (WD) hold time 0.00 0.00 0.00 ns

tCKQ1 Clock High to new data valid on RD (output retained) 2.16 2.46 2.89 ns

tCKQ2 Clock High to new data valid on RD (pipelined) 0.90 1.02 1.20 ns

tC2CRWH1Address collision clk-to-clk delay for reliable read access after write on same

address—Applicable to Opening Edge 0.50 0.43 0.38 ns

tC2CWRH1Address collision clk-to-clk delay for reliable write access after read on same

address— Applicable to Opening Edge 0.59 0.50 0.44 ns

tRSTBQ RESET Low to data out Low on RD (flow-through) 0.92 1.05 1.23 ns

RESET Low to data out Low on RD (pipelined) 0.92 1.05 1.23 ns

tREMRSTB RESET removal 0.29 0.33 0.38 ns

tRECRSTB RESET recovery 1.50 1.71 2.01 ns

tMPWRSTB RESET minimum pulse width 0.21 0.24 0.29 ns

tCYC Clock cycle time 3.23 3.68 4.32 ns

FMAX Maximum frequency 310 272 231 MHz

Notes:

1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-

Based cSoCs and FPGAs.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-78 Revision 10

FIFO

Figure 2- 46 • FIFO Model

FIFO4K18

RW2

RD17

RW1

RD16

RW0

WW2

WW1

WW0 RD0

ESTOP

FSTOP

FULL

AFULL

EMPTY

AFVAL11

AEMPTY

AFVAL10

AFVAL0

AEVAL11

AEVAL10

AEVAL0

REN

RBLK

RCLK

WEN

WBLK

WCLK

RPIPE

WD17

WD16

WD0

RESET

ProASIC3E Flash Family FPGAs

Revision 10 2-79

Timing Waveforms

Figure 2-47 • FIF O Rese t

Figure 2-48 • FIF O EMPT Y Fl ag and AEMPTY Flag Assertion

MATCH (A0)

tMPWRSTB

tRSTFG

tRSTCK

tRSTAF

RCLK/

WCLK

RESET

EMPTY

AEMPTY

WA/RA

(Address Counter)

tRSTFG

tRSTAF

FULL

AFULL

RCLK

NO MATCH NO MATCH Dist = AEF_TH MATCH (EMPTY)

tCKAF

tRCKEF

EMPTY

AEMPTY

tCYC

WA/RA

(Address Counter)

ProASIC3E DC and Switching Characteristics

2-80 Revision 10

Figure 2-49 • FIFO FULL Flag and AFULL Flag Assertion

Figure 2-50 • FIF O EMPT Y Flag and AEMPTY Flag Deassertion

Figure 2-51 • FIF O FUL L F la g an d AFULL Flag Deassertion

NO MATCH NO MATCH Dist = AFF_TH MATCH (FULL)

tCKAF

tWCKFF

tCYC

WCLK

FULL

AFULL

WA/RA

(Address Counter)

WCLK

WA/RA

(Address Counter) MATCH

(EMPTY) NO MATCH NO MATCH NO MATCH Dist = AEF_TH + 1

NO MATCH

RCLK

EMPTY

1st Rising

Edge

After 1st

Write

2nd Rising

Edge

After 1st

Write t

RCKEF

CKAF

AEMPTY

Dist = AFF_TH – 1

MATCH (FULL) NO MATCH NO MATCH NO MATCH NO MATCH

WCKF

CKAF

1st Rising

Edge

After 1st

Read

1st Rising

Edge

After 2nd

Read

RCLK

WA/RA

(Address Counter)

WCLK

FULL

AFULL

ProASIC3E Flash Family FPGAs

Revision 10 2-81

Timing Characteristics

Table 2-101 • FIFO

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tENS REN, WEN Setup Time 1.38 1.57 1.84 ns

tENH REN, WEN Hold Time 0.02 0.02 0.02 ns

tBKS BLK Setup T ime 0.19 0.22 0.26 ns

tBKH BLK Hold Time 0.00 0.00 0.00 ns

tDS Input Data (WD) Setup Ti me 0.18 0.21 0.25 ns

tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns

tCKQ1 Clock High to New Data Valid on RD (pass-through) 2.36 2.68 3.15 ns

tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.89 1.02 1.20 ns

tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns

tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 n s

tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns

tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns

tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns

tRSTBQ RESET Low to Data Out Low on RD (pass-through) 0.92 1.05 1.23 ns

RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns

tREMRSTB RESET Removal 0.29 0.33 0.38 ns

tRECRSTB RESET Recovery 1.50 1.71 2.01 ns

tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 ns

FMAX Maximum Frequency 310 272 231 MHz

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

ProASIC3E DC and Switching Characteristics

2-82 Revision 10

Embedded FlashROM Characteristics

Timing Characteristics

JTAG 1532 Characteristics

JTAG timing delays do not incl ude JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays to

the corresponding standard selected; refer to the I/O timing characteristics in the "User I/O

Characteristics" section on page 2-13 for more details.

Timing Characteristics

Figure 2-52 • Timing Diagram

HOLD

CKQ2

CLK

Address

Data D

Table 2-102 • Embedded FlashROM Access Time

Parameter Description –2 –1 Std. Units

tSU Address Setup Time 0.53 0.61 0 .71 ns

tHOLD Address Hold Time 0.00 0.00 0.00 ns

tCK2Q Clock to Out 16.23 18.48 21.73 ns

FMAX Maximum Clock Frequency 15 15 15 MHz

Table 2-103 • JTAG 1532

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tDISU Test Data Input Setup Time 0.50 0.57 0.67 ns

tDIHD Test Data Input Hold Time 1.00 1.13 1.33 ns

tTMSSU Test Mode Select Setup Time 0.50 0.57 0.67 ns

tTMDHD Test Mode Select Hold Time 1.00 1.13 1.33 ns

tTCK2Q Clock to Q (data out) 6.00 6.80 8.00 n s

tRSTB2Q Reset to Q (data out) 20.00 22.67 26.67 ns

FTCKMAX TCK Maximum Frequency 25.00 22.00 19.00 MHz

tTRSTREM ResetB Removal Time 0.00 0.00 0.00 ns

tTRSTREC ResetB Recovery Time 0.20 0.23 0.27 ns

tTRSTMPW ResetB Minimum Pulse TBD TBD TBD ns

Note: For specific junction temperature and voltag e supply levels, refer to Table 2-6 on page 2-5 for derating values.

Revision 10 3-1

3 – Pin Descriptions and Packaging

Supply Pins

GND Ground

Ground supply voltage to the core, I/O outputs, and I/O logic.

GNDQ Ground (quiet)

Quiet ground supply voltage to input buffers of I/O banks. Within the package, the GNDQ plane is

decoupled from the simultaneous sw itching noise orig inated from the outpu t buffer ground domain. This

minimizes the noise transfer within th e package and improves input signal in tegrity. GNDQ must always

be connected to GND on the board.

VCC Core Supply Voltage

Supply voltage to the FPGA core, nominally 1.5 V. VCC is required for powering the JTAG state machine

in addition to VJTAG. Even when a device is in bypass mode in a JTAG chain of intercon nected devices,

both VCC and VJTAG must remain powered to allow JTAG signals to pass through the device.

VCCIBx I/O Supply Voltage

Supply voltage to the bank's I/O output buffers and I/O logic. Bx is the I/O bank number. There are up to

eight I/O banks on low power flash devices plus a dedicated VJTAG bank. Each bank can have a

separate VCCI connection. All I/Os in a bank will run off the same VCCIBx supply. VCCI can be 1.5 V,

1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their corresponding VCCI pins tied

to GND.

VMVx I/O Supply Volt age (quiet)

Quiet supply voltage to the input b uffers of each I/O bank. x is the bank number. Within the package, the

VMV plane is decoupled from th e simultaneous switching noise originating from the output buffer VCCI

domain. This minimizes the noise transfer within the package and improves input signal integrity. Each

bank must have at least one VMV connection, and no VMV should be left unconnected. All I/Os in a bank

run off the same VMVx supply. VMV is used to provide a quiet supply voltage to the input buffers of each

I/O b ank . V MV x ca n be 1.5 V, 1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their

corresponding VMV pins tied to GND. VMV and VCCI should be at the same voltage within a given I/O

bank. Used VMV pins must be connected to the corre sponding VCCI pins of th e same bank (i.e., VMV0

to VCCIB0, VMV1 to VCCIB1, etc.).

VCCPLA/B/C/D/E/F PLL Supply Voltage

Supply voltage to analog PLL, nominally 1.5 V.

When the PLLs are not used, th e place-and-route tool automatically disable s the unused PLLs to lower

power consumption. The user should tie unused VCCPLx and VCOMPLx pins to ground. Microsemi

recommends tying VCCPLx to VCC and using proper filtering circuits to decouple VCC noise from the

PLLs. Refer to the PLL Power Supply Decoupling section of the "Clock Conditioning Circuits in Low

Power Flash Devices and Mixed Signal FPGAs" chapter of the ProASIC3E FPGA Fabric User’s Guide

for a complete board solution for the PLL analog power supply and ground.

There are six VCCPLX pins on ProASIC3E devices.

VCOMPLA/B/C/D/E/F PLL Ground

Ground to analog PLL power supplies. When the PLLs are not used, the place-and-route tool

automatically disables the unused PLLs to lower power consumption. The user should tie unused

VCCPLx and VCOMPLx pins to ground.

There are six VCOMPL pins (PLL ground) on ProASIC3E devices.

VJTAG JTAG Supply Voltage

Low power flash devices ha ve a separate bank for the dedicated JTAG pins. T he JTAG pins can be run

at any voltage from 1.5 V to 3.3 V (nominal). Isolating the JTAG power supply in a separate I/O bank

gives greater flexibility in supply selection and simplifies power supply and PCB design. If the JTAG

interface is neither used nor plann ed for use, the VJ TAG p in together w ith the TRST pi n could be tied to

Pin Descriptions and Packaging

3-2 Revision 10

GND. It should be noted that VCC is required to be powered for JTAG operation; VJTAG alone is

insufficient. If a device is in a JTAG chain o f interconnected board s, the board containing the device can

be powered down, provided b oth VJTA G and VCC to the part remain powered; otherwise, JTAG signals

will not be able to transition the device, even in bypass mode.

Microsemi recommends that VPUMP and VJTAG power supplies be kept separate with independent

filtering capacitors rather than supplying them from a common rail.

VPUMP Programming Supply Volta ge

For programming, VPUMP should be 3.3 V nominal. During normal device operation, VPUMP can be left

floating or can be tied (pulled u p) to any voltage between 0 V and the VPUMP ma ximum. Programming

power supply voltage (VPUMP) range is listed in the datasheet.

When the VPUMP pin is tied to ground, it will shut off the charge pump circuitry, resulting in no sources of

oscillation from the charge pump circuitry.

For proper programming, 0.01 µF and 0.33 µF capacitors (both rated at 16 V) are to be connected in

parallel across VPUMP and GND, and positioned as close to the FPGA pins as possible.

Microsemi recommends that VPUMP and VJTAG power supplies be kept separate with independent

filtering capacitors rather than supplying them from a common rail.

User-Defined Supply Pins

VREF I/O Voltage Reference

Reference voltage for I/O minibanks. VREF pins are configured by the user from regular I/Os, and any

I/O in a bank, except JTAG I/Os, can be designated the voltage reference I/O. Only certain I/O standards

require a voltage reference—HSTL (I) and (II), SSTL2 (I) and (II), SSTL3 (I) and (II), and GTL/GTL+. One

VREF pin can support the numbe r of I/Os available in its minibank.

User Pins

I/O User Input/Output

The I/O pin functions as an input, output, tristate, or bidirectional buffer. Input and output signal levels are

compatible with the I/O standard selected.

During programming, I/Os become tristated and weakly pulled up to VCCI. With VCCI, VMV, and VCC

supplies continuously powered up, when the device transitions from programming to operating mode, the

I/Os are instantly configured to the desired user configuration.

Unused I/Os are configured as follows:

• Output buffer is disabled (with tristate value of high impedance)

• Input buffer is disabled (with tristate value of high impedance)

• Weak pull-up is programmed

GL Globals

GL I/Os have access to certain clock conditioning circuitry (and the PLL) and/or have direct access to the

global network (spines). Additionally, the global I/Os can be used as regular I/Os, since they have

identical capabilities. Unused GL pins are configured as inputs with pull-up resistors.

See more detailed descriptions of global I/O connectivity in the "Clock Conditioning Circuits in Low Power

Flash Devices and Mixed Signal FPGAs" chapter of the ProASIC3E FPGA Fabric User’s Guide. All

inputs labeled GC/GF are direct inputs into the quadrant clocks. For example, if GAA0 is used for an

input, GAA1 and GAA2 are no longer available for input to the quadrant globals. All inputs labeled

GC/GF are direct inputs into the chip-level globals, and th e rest are connected to the quadrant globals.

The inputs to the global network are multiplexed, and only one input can be used as a global input.

Refer to the I/O Structure section of the ProASIC3E FPGA Fabric User’s Guide for an explanation of the

naming of global pins.

ProASIC3E Flash Family FPGAs

Revision 10 3-3

JTAG Pins

Low power flash devices ha ve a separate bank for the dedicated JTAG pins. T he JTAG pins can be run

at any voltage from 1.5 V to 3.3 V (nominal). VCC must also be powered for the JTAG state machine to

operate, even if the device is in bypass mode; VJTAG alone is insufficient. Both VJTAG and VCC to the

part must be supplied to allow JTAG signals to transition the device. Isolating the JTAG power supply in a

separate I/O bank gives greater flexibility in supply selection and simplifies power supply and PCB

design. If the JTAG interface is neith er u sed nor pl anned for use , the VJTAG pin together with the T RST

pin could be tied to GND.

TCK Test Clock

Test clock input for JTAG bou ndary scan, ISP, and UJTAG. The TCK pin does not have an internal pull-

up/-down resistor. If JTAG is n ot used, Microsemi recommends tying off TCK to GND through a resistor

placed close to the FPGA pin. This prevents JTAG operation in case TMS enters an undesired state.

Note that to operate at all VJTAG voltages, 500 W to 1 kΩ will satisfy the requirements. Refer to

Table 3-1 for more information.

TDI Test Data Input

Serial input for JTAG bound ary scan, ISP, and UJTAG usag e. There is an internal weak pull-up resistor

on the TDI pin.

TDO Test Data Output

Serial output for JTAG bound ary scan, ISP, and UJTAG usage.

TMS Test Mode Select

The TMS pin controls the use of the IEEE 1532 boundary scan pins (TCK, TDI, TDO, TRST). There is an

internal weak pull-up resistor on the TMS pin.

TRST Boundary Scan Reset Pin

The TRST pin fun ctions as an active-low inpu t to asynchronously initialize (or reset) the boundary scan

circuitry. There is an internal weak pull-up resistor on the TRST pin. If JTAG is not used, an external pull-

down resistor could be include d to ensure the test access port (TAP) is held in reset mode . The resistor

values must be chosen from Table 3-1 and must satisfy the parallel resistance value requirement. The

values in Table 3-1 correspond to the resistor recommended when a single device is used, and the

equivalent parallel resistor when multiple devices are connected via a JTAG chain.

In critical applications, an upset in the JTAG circui t could allow en trance to an undesired JTAG state. In

such cases, Microsemi recommends tying off TRST to GND through a resistor placed close to the FPGA

pin.

Note that to operate at all VJTAG voltages, 500 Ω to 1 kΩ will satisfy the requirements.

Table 3-1 • Recommended Tie-Off Values for the TCK and TRST Pins

VJTAG Tie-Off Resistance

VJTAG at 3.3 V 200 Ω to 1 kΩ

VJTAG at 2.5 V 200 Ω to 1 kΩ

VJTAG at 1.8 V 500 Ω to 1 kΩ

VJTAG at 1.5 V 500 Ω to 1 kΩ

Notes:

1. Equivalent parallel resistance if more than one device is on the JTAG chain

2. The TCK pin can be pulled up/down.

3. The TRST pin is pulled do wn.

Pin Descriptions and Packaging

3-4 Revision 10

Special Function Pins

NC No Connect

This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be

left floating with no effect on the operation of the device.

DC Do Not Connect

This pin should not be connected to any signals on the PCB. These pins should be left unconnected.

Packaging

Semiconductor technology is constantly shrinking in size while growing in capability and functional

integration. To ena ble next-generation silicon technologies, semiconductor packages have also evolved

to provide improved performance and flexibility.

Microsemi consistently delivers packages that provide the necessary mechanical and environmental

protection to ensure consistent reliability and performance. Microsemi IC packaging technology

efficiently supports high-density FPGAs wi th large-p in-count Bal l Grid Arrays (BGAs), but is also flexible

enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,

Microsemi offers a variety of p ackages designed to meet your most demanding application and economic

requirements for today's embedded and mobile systems.

Related Documents

User’s Guides

ProASIC3E FPGA Fabric User’s Guide

http://www.microsemi.com/soc/documents/PA3E_UG.pdf

Packaging

The following documents provide packaging information and device selection for low power flash

devices.

Product Catalog

http://www.microsemi.com/soc/documents/ProdCat_PIB.pdf

Lists devices currently recommended for new designs and the packages available for each member of

the family. Use this document or the datasheet tables to determine the best package for your design, and

which package drawing to use.

Package Mechanical Drawings

http://www.microsemi.com/soc/documents/PckgMechDrwngs.pdf

This document contains the package mechanical drawings for all packages currently or previously

supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.

Additional packaging materials: http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Revision 10 4-1

4 – Package Pin Assignment s

PQ208

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the top view of the package.

208-Pin PQFP

1208

Package Pin Assignments

4-2 Revision 10

PQ208

Pin Number A3PE600 Function

1GND

2 GNDQ

3VMV7

4 GAB2/IO133PSB7V1

5 GAA2/IO134PDB7V1

6 IO134NDB7V1

7 GAC2/IO132PDB7V1

8 IO132NDB7V1

9 IO130PDB7V1

10 IO130NDB7V1

11 IO127PDB7V1

12 IO127NDB7V1

13 IO126PDB7V0

14 IO126NDB7V0

15 IO124PSB7V0

16 VCC

17 GND

18 VCCIB7

19 IO122PPB7V0

20 IO121PSB7V0

21 IO122NPB7V0

22 GFC1/IO120PSB7V0

23 GFB1/IO119PDB7V0

24 GFB0/IO119NDB7V0

25 VCOMPLF

26 GFA0/IO118NPB6V1

27 VCCPLF

28 GFA1/IO118PPB6V1

29 GND

30 GFA2/IO117PDB6V1

31 IO117NDB6V1

32 GFB2/IO116PPB6V1

33 GFC2/IO115PPB6V1

34 IO116NPB6V1

35 IO115NPB6V1

36 VCC

37 IO112PDB6V1

38 IO112NDB6V1

39 IO108PSB6V0

40 VCCIB6

41 GND

42 IO106PDB6V0

43 IO106NDB6V0

44 GEC1/IO104PDB6V0

45 GEC0/IO104NDB6V

46 GEB1/IO103PPB6V0

47 GEA1/IO102PPB6V0

48 GEB0/IO103NPB6V0

49 GEA0/IO102NPB6V0

50 VMV6

51 GNDQ

52 GND

53 VMV5

54 GNDQ

55 IO101NDB5V2

56 GEA2/IO101PDB5V2

57 IO100NDB5V2

58 GEB2/IO100PDB5V2

59 IO99NDB5V2

60 GEC2/IO99PDB5V2

61 IO98PSB5V2

62 VCCIB5

63 IO96PSB5V2

64 IO94NDB5V1

65 GND

66 IO94PDB5V1

67 IO92NDB5V1

68 IO92PDB5V1

69 IO88NDB5V0

70 IO88PDB5V0

71 VCC

PQ208

Pin Number A3PE600 Fu nc tion

72 VCCIB5

73 IO85NPB5V0

74 IO84NPB5V0

75 IO85PPB5V0

76 IO84PPB5V0

77 IO83NPB5V0

78 IO82NPB5V0

79 IO83PPB5V0

80 IO82PPB5V0

81 GND

82 IO80NDB4V1

83 IO80PDB4V1

84 IO79NPB4V1

85 IO78NPB4V1

86 IO79PPB4V1

87 IO78PPB4V1

88 VCC

89 VCCIB4

90 IO76NDB4V1

91 IO76PDB4V1

92 IO72NDB4V0

93 IO72PDB4V0

94 IO70NDB4V0

95 GDC2/IO70PDB4V0

96 IO68NDB4V0

97 GND

98 GDA2/IO68PDB4V0

99 GDB2/IO69PSB4V0

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV4

105 GND

106 VPUMP

107 GNDQ

PQ208

Pin Number A3PE600 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-3

108 TDO

109 TRST

110 VJTAG

111 VMV3

112 GDA0/IO67NPB3V1

113 GDB0/IO66NPB3V1

114 GDA1/IO67PPB3V1

115 GDB1/IO66PPB3V1

116 GDC0/IO65NDB3V1

117 GDC1/IO65PDB3V1

118 IO62NDB3V1

119 IO62PDB3V1

120 IO58NDB3V0

121 IO58PDB3V0

122 GND

123 VCCIB3

124 GCC2/IO55PSB3V0

125 GCB2/IO54PSB3V0

126 NC

127 IO53NDB3V0

128 GCA2/IO53PDB3V0

129 GCA1/IO52PPB3V0

130 GND

131 VCCPLC

132 GCA0/IO52NPB3V0

133 VCOMPLC

134 GCB0/IO51NDB2V1

135 GCB1/IO51PDB2V1

136 GCC1/IO50PSB2V1

137 IO49NDB2V1

138 IO49PDB2V1

139 IO48PSB2V1

140 VCCIB2

141 GND

142 VCC

143 IO47NDB2V1

PQ208

Pin Number A3PE600 Function

144 IO47PDB2V1

145 IO44NDB2V1

146 IO44PDB2V1

147 IO43NDB2V0

148 IO43PDB2V0

149 IO40NDB2V0

150 IO40PDB2V0

151 GBC2/IO38PSB2V0

152 GBA2/IO36PSB2V0

153 GBB2/IO37PSB2V0

154 VMV2

155 GNDQ

156 GND

157 VMV1

158 GNDQ

159 GBA1/IO35PDB1V1

160 GBA0/IO35NDB1V1

161 GBB1/IO34PDB1V1

162 GND

163 GBB0/IO34NDB1V1

164 GBC1/IO33PDB1V1

165 GBC0/IO33NDB1V1

166 IO31PDB1V1

167 IO31NDB1V1

168 IO27PDB1V0

169 IO27NDB1V0

170 VCCIB1

171 VCC

172 IO23PPB1V0

173 IO22PSB1V0

174 IO23NPB1V0

175 IO21PDB1V0

176 IO21NDB1V0

177 IO19PPB0V2

178 GND

179 IO18PPB0V2

PQ208

Pin Number A3PE600 Fu nc tion

180 IO19NPB0V2

181 IO18NPB0V2

182 IO17PPB0V2

183 IO16PPB0V2

184 IO17NPB0V2

185 IO16NPB0V2

186 VCCIB0

187 VCC

188 IO15PDB0V2

189 IO15NDB0V2

190 IO13PDB0V2

191 IO13NDB0V2

192 IO11PSB0V1

193 IO09PDB0V1

194 IO09NDB0V1

195 GND

196 IO07PDB0V1

197 IO07NDB0V1

198 IO05PDB0V0

199 IO05NDB0V0

200 VCCIB0

201 GAC1/IO02PDB0V0

202 GAC0/IO02NDB0V0

203 GAB1/IO01PDB0V0

204 GAB0/IO01NDB0V0

205 GAA1/IO00PDB0V0

206 GAA0/IO00NDB0V0

207 GNDQ

208 VMV0

PQ208

Pin Number A3PE600 Function

Package Pin Assignments

4-4 Revision 10

PQ208

Pin Number A3PE1500 Function

1GND

2 GNDQ

3VMV7

4 GAB2/IO220PSB7V3

5 GAA2/IO221PDB7V3

6 IO221NDB7V3

7 GAC2/IO219PDB7V3

8 IO219NDB7V3

9 IO215PDB7V3

10 IO215NDB7V3

11 IO212PDB7V2

12 IO212NDB7V2

13 IO208PDB7V2

14 IO208NDB7V2

15 IO204PSB7V1

16 VCC

17 GND

18 VCCIB7

19 IO200PDB7V1

20 IO200NDB7V1

21 IO196PSB7V0

22 GFC1/IO192PSB7V0

23 GFB1/IO191PDB7V0

24 GFB0/IO191NDB7V0

25 VCOMPLF

26 GFA0/IO190NPB6V2

27 VCCPLF

28 GFA1/IO190PPB6V2

29 GND

30 GFA2/IO189PDB6V2

31 IO189NDB6V2

32 GFB2/IO188PPB6V2

33 GFC2/IO187PPB6V2

34 IO188NPB6V2

35 IO187NPB6V2

36 VCC

37 IO184PDB6V2

38 IO184NDB6V2

39 IO180PSB6V1

40 VCCIB6

41 GND

42 IO176PDB6V1

43 IO176NDB6V1

44 GEC1/IO169PDB6V0

45 GEC0/IO169NDB6V0

46 GEB1/IO168PPB6V0

47 GEA1/IO167PPB6V0

48 GEB0/IO168NPB6V0

49 GEA0/IO167NPB6V0

50 VMV6

51 GNDQ

52 GND

53 VMV5

54 GNDQ

55 IO166NDB5V3

56 GEA2/IO166PDB5V3

57 IO165NDB5V3

58 GEB2/IO165PDB5V3

59 IO164NDB5V3

60 GEC2/IO164PDB5V3

61 IO163PSB5V3

62 VCCIB5

63 IO161PSB5V3

64 IO157NDB5V2

65 GND

66 IO157PDB5V2

67 IO153NDB5V2

68 IO153PDB5V2

69 IO149NDB5V1

70 IO149PDB5V1

71 VCC

72 VCCIB5

PQ208

Pin Number A3PE1500 Function

73 IO145NDB5V1

74 IO145PDB5V1

75 IO143NDB5V1

76 IO143PDB5V1

77 IO137NDB5V0

78 IO137PDB5V0

79 IO135NDB5V0

80 IO135PDB5V0

81 GND

82 IO131NDB4V2

83 IO131PDB4V2

84 IO129NDB4V2

85 IO129PDB4V2

86 IO127NDB4V2

87 IO127PDB4V2

88 VCC

89 VCCIB4

90 IO121NDB4V1

91 IO121PDB4V1

92 IO119NDB4V1

93 IO119PDB4V1

94 IO113NDB4V0

95 GDC2/IO113PDB4V0

96 IO112NDB4V0

97 GND

98 GDB2/IO112PDB4V0

99 GDA2/IO111PSB4V0

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV4

105 GND

106 VPUMP

107 GNDQ

108 TDO

PQ208

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-5

109 TRST

110 VJTAG

111 VMV3

112 GDA0/IO110NPB3V2

113 GDB0/IO109NPB3V2

114 GDA1/IO110PPB3V2

115 GDB1/IO109PPB3V2

116 GDC0/IO108NDB3V2

117 GDC1/IO108PDB3V2

118 IO105NDB3V2

119 IO105PDB3V2

120 IO101NDB3V1

121 IO101PDB3V1

122 GND

123 VCCIB3

124 GCC2/IO90PSB3V0

125 GCB2/IO89PSB3V0

126 NC

127 IO88NDB3V0

128 GCA2/IO88PDB3V0

129 GCA1/IO87PPB3V0

130 GND

131 VCCPLC

132 GCA0/IO87NPB3V0

133 VCOMPLC

134 GCB0/IO86NDB2V3

135 GCB1/IO86PDB2V3

136 GCC1/IO85PSB2V3

137 IO83NDB2V3

138 IO83PDB2V3

139 IO81PSB2V3

140 VCCIB2

141 GND

142 VCC

143 IO73NDB2V2

144 IO73PDB2V2

PQ208

Pin Number A3PE1500 Function

145 IO71NDB2V2

146 IO71PDB2V2

147 IO67NDB2V1

148 IO67PDB2V1

149 IO65NDB2V1

150 IO65PDB2V1

151 GBC2/IO60PSB2V0

152 GBA2/IO58PSB2V0

153 GBB2/IO59PSB2V0

154 VMV2

155 GNDQ

156 GND

157 VMV1

158 GNDQ

159 GBA1/IO57PDB1V3

160 GBA0/IO57NDB1V3

161 GBB1/IO56PDB1V3

162 GND

163 GBB0/IO56NDB1V3

164 GBC1/IO55PDB1V3

165 GBC0/IO55NDB1V3

166 IO51PDB1V2

167 IO51NDB1V2

168 IO47PDB1V1

169 IO47NDB1V1

170 VCCIB1

171 VCC

172 IO43PSB1V1

173 IO41PDB1V1

174 IO41NDB1V1

175 IO35PDB1V0

176 IO35NDB1V0

177 IO31PDB0V3

178 GND

179 IO31NDB0V3

180 IO29PDB0V3

PQ208

Pin Number A3PE1500 Function

181 IO29NDB0V3

182 IO27PDB0V3

183 IO27NDB0V3

184 IO23PDB0V2

185 IO23NDB0V2

186 VCCIB0

187 VCC

188 IO18PDB0V2

189 IO18NDB0V2

190 IO15PDB0V1

191 IO15NDB0V1

192 IO12PSB0V1

193 IO11PDB0V1

194 IO11NDB0V1

195 GND

196 IO08PDB0V1

197 IO08NDB0V1

198 IO05PDB0V0

199 IO05NDB0V0

200 VCCIB0

201 GAC1/IO02PDB0V0

202 GAC0/IO02NDB0V0

203 GAB1/IO01PDB0V0

204 GAB0/IO01NDB0V0

205 GAA1/IO00PDB0V0

206 GAA0/IO00NDB0V0

207 GNDQ

208 VMV0

PQ208

Pin Number A3PE1500 Function

Package Pin Assignments

4-6 Revision 10

PQ208

Pin Number A3PE3000 Functio n

1GND

2 GNDQ

3VMV7

4 GAB2/IO308PSB7V4

5 GAA2/IO309PDB7V4

6 IO309NDB7V4

7 GAC2/IO307PDB7V4

8 IO307NDB7V4

9 IO303PDB7V3

10 IO303NDB7V3

11 IO299PDB7V3

12 IO299NDB7V3

13 IO295PDB7V2

14 IO295NDB7V2

15 IO291PSB7V2

16 VCC

17 GND

18 VCCIB7

19 IO285PDB7V1

20 IO285NDB7V1

21 IO279PSB7V0

22 GFC1/IO275PSB7V0

23 GFB1/IO274PDB7V0

24 GFB0/IO274NDB7V0

25 VCOMPLF

26 GFA0/IO273NPB6V4

27 VCCPLF

28 GFA1/IO273PPB6V4

29 GND

30 GFA2/IO272PDB6V4

31 IO272NDB6V4

32 GFB2/IO271PPB6V4

33 GFC2/IO270PPB6V4

34 IO271NPB6V4

35 IO270NPB6V4

36 VCC

37 IO252PDB6V2

38 IO252NDB6V2

39 IO248PSB6V1

40 VCCIB6

41 GND

42 IO244PDB6V1

43 IO244NDB6V1

44 GEC1/IO236PDB6V0

45 GEC0/IO236NDB6V0

46 GEB1/IO235PPB6V0

47 GEA1/IO234PPB6V0

48 GEB0/IO235NPB6V0

49 GEA0/IO234NPB6V0

50 VMV6

51 GNDQ

52 GND

53 VMV5

54 GNDQ

55 IO233NDB5V4

56 GEA2/IO233PDB5V4

57 IO232NDB5V4

58 GEB2/IO232PDB5V4

59 IO231NDB5V4

60 GEC2/IO231PDB5V4

61 IO230PSB5V4

62 VCCIB5

63 IO218NDB5V3

64 IO218PDB5V3

65 GND

66 IO214PSB5V2

67 IO212NDB5V2

68 IO212PDB5V2

69 IO208NDB5V1

70 IO208PDB5V1

71 VCC

72 VCCIB5

73 IO202NDB5V1

74 IO202PDB5V1

75 IO198NDB5V0

76 IO198PDB5V0

77 IO197NDB5V0

78 IO197PDB5V0

PQ208

Pin Number A3PE3000 Function

79 IO194NDB5V0

80 IO194PDB5V0

81 GND

82 IO184NDB4V3

83 IO184PDB4V3

84 IO180NDB4V3

85 IO180PDB4V3

86 IO176NDB4V2

87 IO176PDB4V2

88 VCC

89 VCCIB4

90 IO170NDB4V2

91 IO170PDB4V2

92 IO166NDB4V1

93 IO166PDB4V1

94 IO156NDB4V0

95 GDC2/IO156PDB4V0

96 IO154NPB4V0

97 GND

98 GDB2/IO155PSB4V0

99 GDA2/IO154PPB4V0

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV4

105 GND

106 VPUMP

107 GNDQ

108 TDO

109 TRST

110 VJTAG

111 VMV3

112 GDA0/IO153NPB3V4

113 GDB0/IO152NPB3V4

114 GDA1/IO153PPB3V4

115 GDB1/IO152PPB3V4

116 GDC0/IO151NDB3V4

117 GDC1/IO151PDB3V4

PQ208

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-7

118 IO134NDB3V2

119 IO134PDB3V2

120 IO132NDB3V2

121 IO132PDB3V2

122 GND

123 VCCIB3

124 GCC2/IO117PSB3V0

125 GCB2/IO116PSB3V0

126 NC

127 IO115NDB3V0

128 GCA2/IO115PDB3V0

129 GCA1/IO114PPB3V0

130 GND

131 VCCPLC

132 GCA0/IO114NPB3V0

133 VCOMPLC

134 GCB0/IO113NDB2V3

135 GCB1/IO113PDB2V3

136 GCC1/IO112PSB2V3

137 IO110NDB2V3

138 IO110PDB2V3

139 IO106PSB2V3

140 VCCIB2

141 GND

142 VCC

143 IO99NDB2V2

144 IO99PDB2V2

145 IO96NDB2V1

146 IO96PDB2V1

147 IO91NDB2V1

148 IO91PDB2V1

149 IO88NDB2V0

150 IO88PDB2V0

151 GBC2/IO84PSB2V0

152 GBA2/IO82PSB2V0

153 GBB2/IO83PSB2V0

154 VMV2

155 GNDQ

156 GND

PQ208

Pin Number A3PE3000 Functio n

157 VMV1

158 GNDQ

159 GBA1/IO81PDB1V4

160 GBA0/IO81NDB1V4

161 GBB1/IO80PDB1V4

162 GND

163 GBB0/IO80NDB1V4

164 GBC1/IO79PDB1V4

165 GBC0/IO79NDB1V4

166 IO74PDB1V4

167 IO74NDB1V4

168 IO70PDB1V3

169 IO70NDB1V3

170 VCCIB1

171 VCC

172 IO56PSB1V1

173 IO55PDB1V1

174 IO55NDB1V1

175 IO54PDB1V1

176 IO54NDB1V1

177 IO40PDB0V4

178 GND

179 IO40NDB0V4

180 IO37PDB0V4

181 IO37NDB0V4

182 IO35PDB0V4

183 IO35NDB0V4

184 IO32PDB0V3

185 IO32NDB0V3

186 VCCIB0

187 VCC

188 IO28PDB0V3

189 IO28NDB0V3

190 IO24PDB0V2

191 IO24NDB0V2

192 IO21PSB0V2

193 IO16PDB0V1

194 IO16NDB0V1

195 GND

PQ208

Pin Number A3PE3000 Function

196 IO11PDB0V1

197 IO11NDB0V1

198 IO08PDB0V0

199 IO08NDB0V0

200 VCCIB0

201 GAC1/IO02PDB0V0

202 GAC0/IO02NDB0V0

203 GAB1/IO01PDB0V0

204 GAB0/IO01NDB0V0

205 GAA1/IO00PDB0V0

206 GAA0/IO00NDB0V0

207 GNDQ

208 VMV0

PQ208

Pin Number A3PE3000 Function

Package Pin Assignments

4-8 Revision 10

FG256

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

13579111315 246810121416

A1 Ball Pad Corner

ProASIC3E Flash Family FPGAs

Revision 10 4-9

FG256

Pin Number A3PE600 Function

A1 GND

A2 GAA0/IO00NDB0V0

A3 GAA1/IO00PDB0V0

A4 GAB0/IO01NDB0V0

A5 IO05PDB0V0

A6 IO10PDB0V1

A7 IO12PDB0V2

A8 IO16NDB0V2

A9 IO23NDB1V0

A10 IO23PDB1V0

A11 IO28NDB1V1

A12 IO28PDB1V1

A13 GBB1/IO34PDB1V1

A14 GBA0/IO35NDB1V1

A15 GBA1/IO35PDB1V1

A16 GND

B1 GAB2/IO133PDB7V1

B2 GAA2/IO134PDB7V1

B3 GNDQ

B4 GAB1/IO01PDB0V0

B5 IO05NDB0V0

B6 IO10NDB0V1

B7 IO12NDB0V2

B8 IO16PDB0V2

B9 IO20NDB1V0

B10 IO24NDB1V0

B11 IO24PDB1V0

B12 GBC1/IO33PDB1V1

B13 GBB0/IO34NDB1V1

B14 GNDQ

B15 GBA2/IO36PDB2V0

B16 IO42NDB2V0

C1 IO133NDB7V1

C2 IO134NDB7V1

C3 VMV7

C4 VCCPLA

C5 GAC0/IO02NDB0V0

C6 GAC1/IO02PDB0V0

C7 IO15NDB0V2

C8 IO15PDB0V2

C9 IO20PDB1V0

C10 IO25NDB1V0

C11 IO27PDB1V0

C12 GBC0/IO33NDB1V1

C13 VCCPLB

C14 VMV2

C15 IO36NDB2V0

C16 IO42PDB2V0

D1 IO128PDB7V1

D2 IO129PDB7V1

D3 GAC2/IO132PDB7V1

D4 VCOMPLA

D5 GNDQ

D6 IO09NDB0V1

D7 IO09PDB0V1

D8 IO13PDB0V2

D9 IO21PDB1V0

D10 IO25PDB1V0

D11 IO27NDB1V0

D12 GNDQ

D13 VCOMPLB

D14 GBB2/IO37PDB2V0

D15 IO39PDB2V0

D16 IO39NDB2V0

E1 IO128NDB7V1

E2 IO129NDB7V1

E3 IO132NDB7V1

E4 IO130PDB7V1

E5 VMV0

E6 VCCIB0

E7 VCCIB0

E8 IO13NDB0V2

FG256

Pin Number A3PE600 Function

E9 IO21NDB1V0

E10 VCCIB1

E11 VCCIB1

E12 VMV1

E13 GBC2/IO38PDB2V0

E14 IO37NDB2V0

E15 IO41NDB2V0

E16 IO41PDB2V0

F1 IO124PDB7V0

F2 IO125PDB7V0

F3 IO126PDB7V0

F4 IO130NDB7V1

F5 VCCIB7

F6 GND

F7 VCC

F8 VCC

F9 VCC

F10 VCC

F11 GND

F12 VCCIB2

F13 IO38NDB2V0

F14 IO40NDB2V0

F15 IO40PDB2V0

F16 IO45PSB2V1

G1 IO124NDB7V0

G2 IO125NDB7V0

G3 IO126NDB7V0

G4 GFC1/IO120PPB7V0

G5 VCCIB7

G6 VCC

G7 GND

G8 GND

G9 GND

G10 GND

G11 VCC

G12 VCCIB2

FG256

Pin Number A3PE600 Function

Package Pin Assignments

4-10 Revision 10

G13 GCC1/IO50PPB2V1

G14 IO44NDB2V1

G15 IO44PDB2V1

G16 IO49NSB2V1

H1 GFB0/IO119NPB7V0

H2 GFA0/IO118NDB6V1

H3 GFB1/IO119PPB7V0

H4 VCOMPLF

H5 GFC0/IO120NPB7V0

H6 VCC

H7 GND

H8 GND

H9 GND

H10 GND

H11 VCC

H12 GCC0/IO50NPB2V1

H13 GCB1/IO51PPB2V1

H14 GCA0/IO52NPB3V0

H15 VCOMPLC

H16 GCB0/IO51NPB2V1

J1 GFA2/IO117PSB6V1

J2 GFA1/IO118PDB6V1

J3 VCCPLF

J4 IO116NDB6V1

J5 GFB2/IO116PDB6V1

J6 VCC

J7 GND

J8 GND

J9 GND

J10 GND

J11 VCC

J12 GCB2/IO54PPB3V0

J13 GCA1/IO52PPB3V0

J14 GCC2/IO55PPB3V0

J15 VCCPLC

J16 GCA2/IO53PSB3V0

FG256

Pin Number A3PE600 Function

K1 GFC2/IO115PSB6V1

K2 IO113PPB6V1

K3 IO112PDB6V1

K4 IO112NDB6V1

K5 VCCIB6

K6 VCC

K7 GND

K8 GND

K9 GND

K10 GND

K11 VCC

K12 VCCIB3

K13 IO54NPB3V0

K14 IO57NPB3V0

K15 IO55NPB3V0

K16 IO57PPB3V0

L1 IO113NPB6V1

L2 IO109PPB6V0

L3 IO108PDB6V0

L4 IO108NDB6V0

L5 VCCIB6

L6 GND

L7 VCC

L8 VCC

L9 VCC

L10 VCC

L11 GND

L12 VCCIB3

L13 GDB0/IO66NPB3V1

L14 IO60NDB3V1

L15 IO60PDB3V1

L16 IO61PDB3V1

M1 IO109NPB6V0

M2 IO106NDB6V0

M3 IO106PDB6V0

M4 GEC0/IO104NPB6V0

FG256

Pin Number A3PE600 Function

M5 VMV5

M6 VCCIB5

M7 VCCIB5

M8 IO84NDB5V0

M9 IO84PDB5V0

M10 VCCIB4

M11 VCCIB4

M12 VMV3

M13 VCCPLD

M14 GDB1/IO66PPB3V1

M15 GDC1/IO65PDB3V1

M16 IO61NDB3V1

N1 IO105PDB6V0

N2 IO105NDB6V0

N3 GEC1/IO104PPB6V0

N4 VCOMPLE

N5 GNDQ

N6 GEA2/IO101PPB5V2

N7 IO92NDB5V1

N8 IO90NDB5V1

N9 IO82NDB5V0

N10 IO74NDB4V1

N11 IO74PDB4V1

N12 GNDQ

N13 VCOMPLD

N14 VJTAG

N15 GDC0/IO65NDB3V1

N16 GDA1/IO67PDB3V1

P1 GEB1/IO103PDB6V0

P2 GEB0/IO103NDB6V0

P3 VMV6

P4 VCCPLE

P5 IO101NPB5V2

P6 IO95PPB5V1

P7 IO92PDB5V1

P8 IO90PDB5V1

FG256

Pin Number A3PE600 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-11

P9 IO82PDB5V0

P10 IO76NDB4V1

P11 IO76PDB4V1

P12 VMV4

P13 TCK

P14 VPUMP

P15 TRST

P16 GDA0/IO67NDB3V1

R1 GEA1/IO102PDB6V0

R2 GEA0/IO102NDB6V0

R3 GNDQ

R4 GEC2/IO99PDB5V2

R5 IO95NPB5V1

R6 IO91NDB5V1

R7 IO91PDB5V1

R8 IO83NDB5V0

R9 IO83PDB5V0

R10 IO77NDB4V1

R11 IO77PDB4V1

R12 IO69NDB4V0

R13 GDB2/IO69PDB4V0

R14 TDI

R15 GNDQ

R16 TDO

T1 GND

T2 IO100NDB5V2

T3 GEB2/IO100PDB5V2

T4 IO99NDB5V2

T5 IO88NDB5V0

T6 IO88PDB5V0

T7 IO89NSB5V0

T8 IO80NSB4V1

T9 IO81NDB4V1

T10 IO81PDB4V1

T11 IO70NDB4V0

T12 GDC2/IO70PDB4V0

FG256

Pin Number A3PE600 Function

T13 IO68NDB4V0

T14 GDA2/IO68PDB4V0

T15 TMS

T16 GND

FG256

Pin Number A3PE600 Function

Package Pin Assignments

4-12 Revision 10

FG324

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

791113

15 246

101214

A1 Ball Pad Corner

ProASIC3E Flash Family FPGAs

Revision 10 4-13

FG324

Pin Number A3PE3000 FBGA

A1 GND

A2 IO08NDB0V0

A3 IO08PDB0V0

A4 IO10NDB0V1

A5 IO10PDB0V1

A6 IO12PDB0V1

A7 GND

A8 IO32NDB0V3

A9 IO32PDB0V3

A10 IO42PPB1V0

A11 IO52NPB1V1

A12 GND

A13 IO66NDB1V3

A14 IO72NDB1V3

A15 IO72PDB1V3

A16 IO74NDB1V4

A17 IO74PDB1V4

A18 GND

B1 IO305PDB7V3

B2 GAB2/IO308PDB7V4

B3 GAA0/IO00NPB0V0

B4 VCCIB0

B5 GNDQ

B6 IO12NDB0V1

B7 IO18NDB0V2

B8 VCCIB0

B9 IO42NPB1V0

B10 IO44NDB1V0

B11 VCCIB1

B12 IO52PPB1V1

B13 IO66PDB1V3

B14 GNDQ

B15 VCCIB1

B16 GBA0/IO81NDB1V4

B17 GBA1/IO81PDB1V4

B18 IO88PDB2V0

C1 IO305NDB7V3

C2 IO308NDB7V4

C3 GAA2/IO309PPB7V4

C4 GAA1/IO00PPB0V0

C5 VMV0

C6 IO14NDB0V1

C7 IO18PDB0V2

C8 IO40NDB0V4

C9 IO40PDB0V4

C10 IO44PDB1V0

C11 IO56NDB1V1

C12 IO64NDB1V2

C13 IO64PDB1V2

C14 VMV1

C15 GBC0/IO79NDB1V4

C16 GBC1/IO79PDB1V4

C17 GBB2/IO83PPB2V0

C18 IO88NDB2V0

D1 IO303PDB7V3

D2 VCCIB7

D3 GAC2/IO307PPB7V4

D4 IO309NPB7V4

D5 GAB1/IO01PPB0V0

D6 IO14PDB0V1

D7 IO24NDB0V2

D8 IO24PDB0V2

D9 IO28PDB0V3

D10 IO48NDB1V0

D11 IO56PDB1V1

D12 IO60PPB1V2

D13 GBB0/IO80NDB1V4

D14 GBB1/IO80PDB1V4

D15 GBA2/IO82PDB2V0

D16 IO83NPB2V0

D17 VCCIB2

D18 IO90PDB2V1

FG324

Pin Number A3PE3000 FBGA

E1 IO303NDB7V3

E2 GNDQ

E3 VMV7

E4 IO307NPB7V4

E5 VCCPLA

E6 GAB0/IO01NPB0V0

E7 VCCIB0

E8 GND

E9 IO28NDB0V3

E10 IO48PDB1V0

E11 GND

E12 VCCIB1

E13 IO60NPB1V2

E14 VCCPLB

E15 IO82NDB2V0

E16 VMV2

E17 GNDQ

E18 IO90NDB2V1

F1 IO299NDB7V3

F2 IO299PDB7V3

F3 IO295PDB7V2

F4 IO295NDB7V2

F5 VCOMPLA

F6 IO291PPB7V2

F7 GAC0/IO02NDB0V0

F8 GAC1/IO02PDB0V0

F9 IO26PDB0V3

F10 IO34PDB0V4

F11 IO58NDB1V2

F12 IO58PDB1V2

F13 IO94PPB2V1

F14 VCOMPLB

F15 GBC2/IO84PDB2V0

F16 IO84NDB2V0

F17 IO92NDB2V1

F18 IO92PDB2V1

FG324

Pin Number A3PE3000 FBGA

Package Pin Assignments

4-14 Revision 10

G1 GND

G2 IO287PDB7V1

G3 IO287NDB7V1

G4 IO283PPB7V1

G5 VCCIB7

G6 IO279PDB7V0

G7 IO291NPB7V2

G8 VCC

G9 IO26NDB0V3

G10 IO34NDB0V4

G11 VCC

G12 IO94NPB2V1

G13 IO98PDB2V2

G14 VCCIB2

G15 GCC0/IO112NPB2V3

G16 IO104PDB2V2

G17 IO104NDB2V2

G18 GND

H1 IO267PDB6V4

H2 VCCIB7

H3 IO283NPB7V1

H4 GFB1/IO274PPB7V0

H5 GND

H6 IO279NDB7V0

H7 VCC

H8 VCC

H9 GND

H10 GND

H11 VCC

H12 VCC

H13 IO98NDB2V2

H14 GND

H15 GCB1/IO113PDB2V3

H16 GCC1/IO112PPB2V3

H17 VCCIB2

H18 IO108PDB2V3

FG324

Pin Number A3PE3000 FBGA

J1 IO267NDB6V4

J2 GFA0/IO273NDB6V4

J3 VCOMPLF

J4 GFA2/IO272PDB6V4

J5 GFB0/IO274NPB7V0

J6 GFC0/IO275NDB7V0

J7 GFC1/IO275PDB7V0

J8 GND

J9 GND

J10 GND

J11 GND

J12 GCA2/IO115PDB3V0

J13 GCA1/IO114PDB3V0

J14 GCA0/IO114NDB3V0

J15 GCB0/IO113NDB2V3

J16 VCOMPLC

J17 IO120NPB3V0

J18 IO108NDB2V3

K1 IO263PDB6V3

K2 GFA1/IO273PDB6V4

K3 VCCPLF

K4 IO272NDB6V4

K5 GFC2/IO270PPB6V4

K6 GFB2/IO271PDB6V4

K7 IO271NDB6V4

K8 GND

K9 GND

K10 GND

K11 GND

K12 IO115NDB3V0

K13 GCB2/IO116PDB3V0

K14 IO116NDB3V0

K15 GCC2/IO117PDB3V0

K16 VCCPLC

K17 IO124NPB3V1

K18 IO120PPB3V0

FG324

Pin Number A3PE3000 FBGA

L1 IO263NDB6V3

L2 VCCIB6

L3 IO259PDB6V3

L4 IO259NDB6V3

L5 GND

L6 IO270NPB6V4

L7 VCC

L8 VCC

L9 GND

L10 GND

L11 VCC

L12 VCC

L13 IO132PDB3V2

L14 GND

L15 IO117NDB3V0

L16 IO128NPB3V1

L17 VCCIB3

L18 IO124PPB3V1

M1 GND

M2 IO255PDB6V2

M3 IO255NDB6V2

M4 IO251PPB6V2

M5 VCCIB6

M6 GEB0/IO235NDB6V0

M7 GEB1/IO235PDB6V0

M8 VCC

M9 IO192PPB4V4

M10 IO154NPB4V0

M11 VCC

M12 GDA0/IO153NPB3V4

M13 IO132NDB3V2

M14 VCCIB3

M15 IO134NDB3V2

M16 IO134PDB3V2

M17 IO128PPB3V1

M18 GND

FG324

Pin Number A3PE3000 FBGA

ProASIC3E Flash Family FPGAs

Revision 10 4-15

N1 IO247NDB6V1

N2 IO247PDB6V1

N3 IO251NPB6V2

N4 GEC0/IO236NDB6V0

N5 VCOMPLE

N6 IO212NDB5V2

N7 IO212PDB5V2

N8 IO192NPB4V4

N9 IO174PDB4V2

N10 IO170PDB4V2

N11 GDA2/IO154PPB4V0

N12 GDB2/IO155PPB4V0

N13 GDA1/IO153PPB3V4

N14 VCOMPLD

N15 GDB0/IO152NDB3V4

N16 GDB1/IO152PDB3V4

N17 IO138NDB3V3

N18 IO138PDB3V3

P1 IO245PDB6V1

P2 GNDQ

P3 VMV6

P4 GEC1/IO236PDB6V0

P5 VCCPLE

P6 IO214PDB5V2

P7 VCCIB5

P8 GND

P9 IO174NDB4V2

P10 IO170NDB4V2

P11 GND

P12 VCCIB4

P13 IO155NPB4V0

P14 VCCPLD

P15 VJTAG

P16 GDC0/IO151NDB3V4

P17 GDC1/IO151PDB3V4

P18 IO142PDB3V3

FG324

Pin Number A3PE3000 FBGA

R1 IO245NDB6V1

R2 VCCIB6

R3 GEA1/IO234PPB6V0

R4 IO232NDB5V4

R5 GEB2/IO232PDB5V4

R6 IO214NDB5V2

R7 IO202PDB5V1

R8 IO194PDB5V0

R9 IO186PDB4V4

R10 IO178PDB4V3

R11 IO168NSB4V1

R12 IO164PDB4V1

R13 GDC2/IO156PDB4V0

R14 TCK

R15 VPUMP

R16 TRST

R17 VCCIB3

R18 IO142NDB3V3

T1 IO241PDB6V0

T2 GEA0/IO234NPB6V0

T3 IO233NPB5V4

T4 IO231NPB5V4

T5 VMV5

T6 IO208NDB5V1

T7 IO202NDB5V1

T8 IO194NDB5V0

T9 IO186NDB4V4

T10 IO178NDB4V3

T11 IO166NPB4V1

T12 IO164NDB4V1

T13 IO156NDB4V0

T14 VMV4

T15 TDI

T16 GNDQ

T17 TDO

T18 IO146PDB3V4

FG324

Pin Number A3PE3000 FBGA

U1 IO241NDB6V0

U2 GEA2/IO233PPB5V4

U3 GEC2/IO231PPB5V4

U4 VCCIB5

U5 GNDQ

U6 IO208PDB5V1

U7 IO198PPB5V0

U8 VCCIB5

U9 IO182NPB4V3

U10 IO180NPB4V3

U11 VCCIB4

U12 IO166PPB4V1

U13 IO162PDB4V1

U14 GNDQ

U15 VCCIB4

U16 TMS

U17 VMV3

U18 IO146NDB3V4

V1 GND

V2 IO218NDB5V3

V3 IO218PDB5V3

V4 IO206NDB5V1

V5 IO206PDB5V1

V6 IO198NPB5V0

V7 GND

V8 IO190NDB4V4

V9 IO190PDB4V4

V10 IO182PPB4V3

V11 IO180PPB4V3

V12 GND

V13 IO162NDB4V1

V14 IO160NDB4V0

V15 IO160PDB4V0

V16 IO158NDB4V0

V17 IO158PDB4V0

V18 GND

FG324

Pin Number A3PE3000 FBGA

Package Pin Assignments

4-16 Revision 10

FG484

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

12345678910111213141516171819202122 A1 Ball Pad Corner

ProASIC3E Flash Family FPGAs

Revision 10 4-17

FG484

Pin Number A3PE600 Function

A1 GND

A2 GND

A3 VCCIB0

A4 IO06NDB0V1

A5 IO06PDB0V1

A6 IO08NDB0V1

A7 IO08PDB0V1

A8 IO11PDB0V1

A9 IO17PDB0V2

A10 IO18NDB0V2

A11 IO18PDB0V2

A12 IO22PDB1V0

A13 IO26PDB1V0

A14 IO29NDB1V1

A15 IO29PDB1V1

A16 IO31NDB1V1

A17 IO31PDB1V1

A18 IO32NDB1V1

A19 NC

A20 VCCIB1

A21 GND

A22 GND

AA1 GND

AA2 VCCIB6

AA3 NC

AA4 IO98PDB5V2

AA5 IO96NDB5V2

AA6 IO96PDB5V2

AA7 IO86NDB5V0

AA8 IO86PDB5V0

AA9 IO85PDB5V0

AA10 IO85NDB5V0

AA11 IO78PPB4V1

AA12 IO79NDB4V1

AA13 IO79PDB4V1

AA14 NC

AA15 NC

AA16 IO71NDB4V0

AA17 IO71PDB4V0

AA18 NC

AA19 NC

AA20 NC

AA21 VCCIB3

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB5

AB4 IO97NDB5V2

AB5 IO97PDB5V2

AB6 IO93NDB5V1

AB7 IO93PDB5V1

AB8 IO87NDB5V0

AB9 IO87PDB5V0

AB10 NC

AB11 NC

AB12 IO75NDB4V1

AB13 IO75PDB4V1

AB14 IO72NDB4V0

AB15 IO72PDB4V0

AB16 IO73NDB4V0

AB17 IO73PDB4V0

AB18 NC

AB19 NC

AB20 VCCIB4

AB21 GND

AB22 GND

B1 GND

B2 VCCIB7

B3 NC

B4 IO03NDB0V0

B5 IO03PDB0V0

B6 IO07NDB0V1

FG484

Pin Number A3PE600 Function

B7 IO07PDB0V1

B8 IO11NDB0V1

B9 IO17NDB0V2

B10 IO14PDB0V2

B11 IO19PDB0V2

B12 IO22NDB1V0

B13 IO26NDB1V0

B14 NC

B15 NC

B16 IO30NDB1V1

B17 IO30PDB1V1

B18 IO32PDB1V1

B19 NC

B20 NC

B21 VCCIB2

B22 GND

C1 VCCIB7

C2 NC

C3 NC

C4 NC

C5 GND

C6 IO04NDB0V0

C7 IO04PDB0V0

C8 VCC

C9 VCC

C10 IO14NDB0V2

C11 IO19NDB0V2

C12 NC

C13 NC

C14 VCC

C15 VCC

C16 NC

C17 NC

C18 GND

C19 NC

C20 NC

FG484

Pin Number A3PE600 Func tio n

Package Pin Assignments

4-18 Revision 10

C21 NC

C22 VCCIB2

D1 NC

D2 NC

D3 NC

D4 GND

D5 GAA0/IO00NDB0V0

D6 GAA1/IO00PDB0V0

D7 GAB0/IO01NDB0V0

D8 IO05PDB0V0

D9 IO10PDB0V1

D10 IO12PDB0V2

D11 IO16NDB0V2

D12 IO23NDB1V0

D13 IO23PDB1V0

D14 IO28NDB1V1

D15 IO28PDB1V1

D16 GBB1/IO34PDB1V1

D17 GBA0/IO35NDB1V1

D18 GBA1/IO35PDB1V1

D19 GND

D20 NC

D21 NC

D22 NC

E1 NC

E2 NC

E3 GND

E4 GAB2/IO133PDB7V1

E5 GAA2/IO134PDB7V1

E6 GNDQ

E7 GAB1/IO01PDB0V0

E8 IO05NDB0V0

E9 IO10NDB0V1

E10 IO12NDB0V2

E11 IO16PDB0V2

E12 IO20NDB1V0

FG484

Pin Number A3PE600 Function

E13 IO24NDB1V0

E14 IO24PDB1V0

E15 GBC1/IO33PDB1V1

E16 GBB0/IO34NDB1V1

E17 GNDQ

E18 GBA2/IO36PDB2V0

E19 IO42NDB2V0

E20 GND

E21 NC

E22 NC

F1 NC

F2 IO131NDB7V1

F3 IO131PDB7V1

F4 IO133NDB7V1

F5 IO134NDB7V1

F6 VMV7

F7 VCCPLA

F8 GAC0/IO02NDB0V0

F9 GAC1/IO02PDB0V0

F10 IO15NDB0V2

F11 IO15PDB0V2

F12 IO20PDB1V0

F13 IO25NDB1V0

F14 IO27PDB1V0

F15 GBC0/IO33NDB1V1

F16 VCCPLB

F17 VMV2

F18 IO36NDB2V0

F19 IO42PDB2V0

F20 NC

F21 NC

F22 NC

G1 IO127NDB7V1

G2 IO127PDB7V1

G3 NC

G4 IO128PDB7V1

FG484

Pin Number A3PE600 Function

G5 IO129PDB7V1

G6 GAC2/IO132PDB7V1

G7 VCOMPLA

G8 GNDQ

G9 IO09NDB0V1

G10 IO09PDB0V1

G11 IO13PDB0V2

G12 IO21PDB1V0

G13 IO25PDB1V0

G14 IO27NDB1V0

G15 GNDQ

G16 VCOMPLB

G17 GBB2/IO37PDB2V0

G18 IO39PDB2V0

G19 IO39NDB2V0

G20 IO43PDB2V0

G21 IO43NDB2V0

G22 NC

H1 NC

H2 NC

H3 VCC

H4 IO128NDB7V1

H5 IO129NDB7V1

H6 IO132NDB7V1

H7 IO130PDB7V1

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO13NDB0V2

H12 IO21NDB1V0

H13 VCCIB1

H14 VCCIB1

H15 VMV1

H16 GBC2/IO38PDB2V0

H17 IO37NDB2V0

H18 IO41NDB2V0

FG484

Pin Number A3PE600 Func tio n

ProASIC3E Flash Family FPGAs

Revision 10 4-19

H19 IO41PDB2V0

H20 VCC

H21 NC

H22 NC

J1 IO123NDB7V0

J2 IO123PDB7V0

J3 NC

J4 IO124PDB7V0

J5 IO125PDB7V0

J6 IO126PDB7V0

J7 IO130NDB7V1

J8 VCCIB7

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB2

J16 IO38NDB2V0

J17 IO40NDB2V0

J18 IO40PDB2V0

J19 IO45PPB2V1

J20 NC

J21 IO48PDB2V1

J22 IO46PDB2V1

K1 IO121NDB7V0

K2 IO121PDB7V0

K3 NC

K4 IO124NDB7V0

K5 IO125NDB7V0

K6 IO126NDB7V0

K7 GFC1/IO120PPB7V0

K8 VCCIB7

K9 VCC

K10 GND

FG484

Pin Number A3PE600 Function

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB2

K16 GCC1/IO50PPB2V1

K17 IO44NDB2V1

K18 IO44PDB2V1

K19 IO49NPB2V1

K20 IO45NPB2V1

K21 IO48NDB2V1

K22 IO46NDB2V1

L1 NC

L2 IO122PDB7V0

L3 IO122NDB7V0

L4 GFB0/IO119NPB7V0

L5 GFA0/IO118NDB6V1

L6 GFB1/IO119PPB7V0

L7 VCOMPLF

L8 GFC0/IO120NPB7V0

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO50NPB2V1

L16 GCB1/IO51PPB2V1

L17 GCA0/IO52NPB3V0

L18 VCOMPLC

L19 GCB0/IO51NPB2V1

L20 IO49PPB2V1

L21 IO47NDB2V1

L22 IO47PDB2V1

M1 NC

M2 IO114NPB6V1

FG484

Pin Number A3PE600 Function

M3 IO117NDB6V1

M4 GFA2/IO117PDB6V1

M5 GFA1/IO118PDB6V1

M6 VCCPLF

M7 IO116NDB6V1

M8 GFB2/IO116PDB6V1

M9 VCC

M10 GND

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO54PPB3V0

M16 GCA1/IO52PPB3V0

M17 GCC2/IO55PPB3V0

M18 VCCPLC

M19 GCA2/IO53PDB3V0

M20 IO53NDB3V0

M21 IO56PDB3V0

M22 NC

N1 IO114PPB6V1

N2 IO111NDB6V1

N3 NC

N4 GFC2/IO115PPB6V1

N5 IO113PPB6V1

N6 IO112PDB6V1

N7 IO112NDB6V1

N8 VCCIB6

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB3

N16 IO54NPB3V0

FG484

Pin Number A3PE600 Func tio n

Package Pin Assignments

4-20 Revision 10

N17 IO57NPB3V0

N18 IO55NPB3V0

N19 IO57PPB3V0

N20 NC

N21 IO56NDB3V0

N22 IO58PDB3V0

P1 NC

P2 IO111PDB6V1

P3 IO115NPB6V1

P4 IO113NPB6V1

P5 IO109PPB6V0

P6 IO108PDB6V0

P7 IO108NDB6V0

P8 VCCIB6

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB3

P16 GDB0/IO66NPB3V1

P17 IO60NDB3V1

P18 IO60PDB3V1

P19 IO61PDB3V1

P20 NC

P21 IO59PDB3V0

P22 IO58NDB3V0

R1 NC

R2 IO110PDB6V0

R3 VCC

R4 IO109NPB6V0

R5 IO106NDB6V0

R6 IO106PDB6V0

R7 GEC0/IO104NPB6V0

R8 VMV5

FG484

Pin Number A3PE600 Function

R9 VCCIB5

R10 VCCIB5

R11 IO84NDB5V0

R12 IO84PDB5V0

R13 VCCIB4

R14 VCCIB4

R15 VMV3

R16 VCCPLD

R17 GDB1/IO66PPB3V1

R18 GDC1/IO65PDB3V1

R19 IO61NDB3V1

R20 VCC

R21 IO59NDB3V0

R22 IO62PDB3V1

T1 NC

T2 IO110NDB6V0

T3 NC

T4 IO105PDB6V0

T5 IO105NDB6V0

T6 GEC1/IO104PPB6V0

T7 VCOMPLE

T8 GNDQ

T9 GEA2/IO101PPB5V2

T10 IO92NDB5V1

T11 IO90NDB5V1

T12 IO82NDB5V0

T13 IO74NDB4V1

T14 IO74PDB4V1

T15 GNDQ

T16 VCOMPLD

T17 VJTAG

T18 GDC0/IO65NDB3V1

T19 GDA1/IO67PDB3V1

T20 NC

T21 IO64PDB3V1

T22 IO62NDB3V1

FG484

Pin Number A3PE600 Function

U1 NC

U2 IO107PDB6V0

U3 IO107NDB6V0

U4 GEB1/IO103PDB6V0

U5 GEB0/IO103NDB6V0

U6 VMV6

U7 VCCPLE

U8 IO101NPB5V2

U9 IO95PPB5V1

U10 IO92PDB5V1

U11 IO90PDB5V1

U12 IO82PDB5V0

U13 IO76NDB4V1

U14 IO76PDB4V1

U15 VMV4

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO67NDB3V1

U20 NC

U21 IO64NDB3V1

U22 IO63PDB3V1

V1 NC

V2 NC

V3 GND

V4 GEA1/IO102PDB6V0

V5 GEA0/IO102NDB6V0

V6 GNDQ

V7 GEC2/IO99PDB5V2

V8 IO95NPB5V1

V9 IO91NDB5V1

V10 IO91PDB5V1

V11 IO83NDB5V0

V12 IO83PDB5V0

V13 IO77NDB4V1

V14 IO77PDB4V1

FG484

Pin Number A3PE600 Func tio n

ProASIC3E Flash Family FPGAs

Revision 10 4-21

V15 IO69NDB4V0

V16 GDB2/IO69PDB4V0

V17 TDI

V18 GNDQ

V19 TDO

V20 GND

V21 NC

V22 IO63NDB3V1

W1 NC

W2 NC

W3 NC

W4 GND

W5 IO100NDB5V2

W6 GEB2/IO100PDB5V2

W7 IO99NDB5V2

W8 IO88NDB5V0

W9 IO88PDB5V0

W10 IO89NDB5V0

W11 IO80NDB4V1

W12 IO81NDB4V1

W13 IO81PDB4V1

W14 IO70NDB4V0

W15 GDC2/IO70PDB4V0

W16 IO68NDB4V0

W17 GDA2/IO68PDB4V0

W18 TMS

W19 GND

W20 NC

W21 NC

W22 NC

Y1 VCCIB6

Y2 NC

Y3 NC

Y4 IO98NDB5V2

Y5 GND

Y6 IO94NDB5V1

FG484

Pin Number A3PE600 Function

Y7 IO94PDB5V1

Y8 VCC

Y9 VCC

Y10 IO89PDB5V0

Y11 IO80PDB4V1

Y12 IO78NPB4V1

Y13 NC

Y14 VCC

Y15 VCC

Y16 NC

Y17 NC

Y18 GND

Y19 NC

Y20 NC

Y21 NC

Y22 VCCIB3

FG484

Pin Number A3PE600 Function

Package Pin Assignments

4-22 Revision 10

FG484

Pin Number A3PE1500 Function

A1 GND

A2 GND

A3 VCCIB0

A4 IO05NDB0V0

A5 IO05PDB0V0

A6 IO11NDB0V1

A7 IO11PDB0V1

A8 IO15PDB0V1

A9 IO17PDB0V2

A10 IO27NDB0V3

A11 IO27PDB0V3

A12 IO32PDB1V0

A13 IO43PDB1V1

A14 IO47NDB1V1

A15 IO47PDB1V1

A16 IO51NDB1V2

A17 IO51PDB1V2

A18 IO54NDB1V3

A19 NC

A20 VCCIB1

A21 GND

A22 GND

AA1 GND

AA2 VCCIB6

AA3 NC

AA4 IO161PDB5V3

AA5 IO155NDB5V2

AA6 IO155PDB5V2

AA7 IO154NDB5V2

AA8 IO154PDB5V2

AA9 IO143PDB5V1

AA10 IO143NDB5V1

AA11 IO131PPB4V2

AA12 IO129NDB4V2

AA13 IO129PDB4V2

AA14 NC

AA15 NC

AA16 IO117NDB4V0

AA17 IO117PDB4V0

AA18 IO115NDB4V0

AA19 IO115PDB4V0

AA20 NC

AA21 VCCIB3

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB5

AB4 IO159NDB5V3

AB5 IO159PDB5V3

AB6 IO149NDB5V1

AB7 IO149PDB5V1

AB8 IO138NDB5V0

AB9 IO138PDB5V0

AB10 NC

AB11 NC

AB12 IO127NDB4V2

AB13 IO127PDB4V2

AB14 IO125NDB4V1

AB15 IO125PDB4V1

AB16 IO122NDB4V1

AB17 IO122PDB4V1

AB18 NC

AB19 NC

AB20 VCCIB4

AB21 GND

AB22 GND

B1 GND

B2 VCCIB7

B3 NC

B4 IO03NDB0V0

B5 IO03PDB0V0

B6 IO10NDB0V1

FG484

Pin Number A3PE1500 Function

B7 IO10PDB0V1

B8 IO15NDB0V1

B9 IO17NDB0V2

B10 IO20PDB0V2

B11 IO29PDB0V3

B12 IO32NDB1V0

B13 IO43NDB1V1

B14 NC

B15 NC

B16 IO53NDB1V2

B17 IO53PDB1V2

B18 IO54PDB1V3

B19 NC

B20 NC

B21 VCCIB2

B22 GND

C1 VCCIB7

C2 NC

C3 NC

C4 NC

C5 GND

C6 IO07NDB0V0

C7 IO07PDB0V0

C8 VCC

C9 VCC

C10 IO20NDB0V2

C11 IO29NDB0V3

C12 NC

C13 NC

C14 VCC

C15 VCC

C16 NC

C17 NC

C18 GND

C19 NC

C20 NC

FG484

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-23

C21 NC

C22 VCCIB2

D1 NC

D2 NC

D3 NC

D4 GND

D5 GAA0/IO00NDB0V0

D6 GAA1/IO00PDB0V0

D7 GAB0/IO01NDB0V0

D8 IO09PDB0V1

D9 IO13PDB0V1

D10 IO21PDB0V2

D11 IO31NDB0V3

D12 IO37NDB1V0

D13 IO37PDB1V0

D14 IO49NDB1V2

D15 IO49PDB1V2

D16 GBB1/IO56PDB1V3

D17 GBA0/IO57NDB1V3

D18 GBA1/IO57PDB1V3

D19 GND

D20 NC

D21 IO69PDB2V1

D22 NC

E1 NC

E2 IO218PPB7V3

E3 GND

E4 GAB2/IO220PDB7V3

E5 GAA2/IO221PDB7V3

E6 GNDQ

E7 GAB1/IO01PDB0V0

E8 IO09NDB0V1

E9 IO13NDB0V1

E10 IO21NDB0V2

E11 IO31PDB0V3

E12 IO35NDB1V0

FG484

Pin Number A3PE1500 Function

E13 IO41NDB1V1

E14 IO41PDB1V1

E15 GBC1/IO55PDB1V3

E16 GBB0/IO56NDB1V3

E17 GNDQ

E18 GBA2/IO58PDB2V0

E19 IO63NDB2V0

E20 GND

E21 IO69NDB2V1

E22 NC

F1 IO218NPB7V3

F2 IO216NDB7V3

F3 IO216PDB7V3

F4 IO220NDB7V3

F5 IO221NDB7V3

F6 VMV7

F7 VCCPLA

F8 GAC0/IO02NDB0V0

F9 GAC1/IO02PDB0V0

F10 IO23NDB0V2

F11 IO23PDB0V2

F12 IO35PDB1V0

F13 IO39NDB1V0

F14 IO45PDB1V1

F15 GBC0/IO55NDB1V3

F16 VCCPLB

F17 VMV2

F18 IO58NDB2V0

F19 IO63PDB2V0

F20 NC

F21 NC

F22 NC

G1 IO211NDB7V2

G2 IO211PDB7V2

G3 NC

G4 IO214PDB7V3

FG484

Pin Number A3PE1500 Function

G5 IO217PDB7V3

G6 GAC2/IO219PDB7V3

G7 VCOMPLA

G8 GNDQ

G9 IO19NDB0V2

G10 IO19PDB0V2

G11 IO25PDB0V3

G12 IO33PDB1V0

G13 IO39PDB1V0

G14 IO45NDB1V1

G15 GNDQ

G16 VCOMPLB

G17 GBB2/IO59PDB2V0

G18 IO62PDB2V0

G19 IO62NDB2V0

G20 IO71PDB2V2

G21 IO71NDB2V2

G22 NC

H1 IO209PSB7V2

H2 NC

H3 VCC

H4 IO214NDB7V3

H5 IO217NDB7V3

H6 IO219NDB7V3

H7 IO215PDB7V3

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO25NDB0V3

H12 IO33NDB1V0

H13 VCCIB1

H14 VCCIB1

H15 VMV1

H16 GBC2/IO60PDB2V0

H17 IO59NDB2V0

H18 IO67NDB2V1

FG484

Pin Number A3PE1500 Function

Package Pin Assignments

4-24 Revision 10

H19 IO67PDB2V1

H20 VCC

H21 VMV2

H22 IO74PSB2V2

J1 IO212NDB7V2

J2 IO212PDB7V2

J3 VMV7

J4 IO206PDB7V1

J5 IO204PDB7V1

J6 IO210PDB7V2

J7 IO215NDB7V3

J8 VCCIB7

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB2

J16 IO60NDB2V0

J17 IO65NDB2V1

J18 IO65PDB2V1

J19 IO75PPB2V2

J20 GNDQ

J21 IO77PDB2V2

J22 IO79PDB2V3

K1 IO200NDB7V1

K2 IO200PDB7V1

K3 GNDQ

K4 IO206NDB7V1

K5 IO204NDB7V1

K6 IO210NDB7V2

K7 GFC1/IO192PPB7V0

K8 VCCIB7

K9 VCC

K10 GND

FG484

Pin Number A3PE1500 Function

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB2

K16 GCC1/IO85PPB2V3

K17 IO73NDB2V2

K18 IO73PDB2V2

K19 IO81NPB2V3

K20 IO75NPB2V2

K21 IO77NDB2V2

K22 IO79NDB2V3

L1 NC

L2 IO196PDB7V0

L3 IO196NDB7V0

L4 GFB0/IO191NPB7V0

L5 GFA0/IO190NDB6V2

L6 GFB1/IO191PPB7V0

L7 VCOMPLF

L8 GFC0/IO192NPB7V0

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO85NPB2V3

L16 GCB1/IO86PPB2V3

L17 GCA0/IO87NPB3V0

L18 VCOMPLC

L19 GCB0/IO86NPB2V3

L20 IO81PPB2V3

L21 IO83NDB2V3

L22 IO83PDB2V3

M1 GNDQ

M2 IO185NPB6V2

FG484

Pin Number A3PE1500 Function

M3 IO189NDB6V2

M4 GFA2/IO189PDB6V2

M5 GFA1/IO190PDB6V2

M6 VCCPLF

M7 IO188NDB6V2

M8 GFB2/IO188PDB6V2

M9 VCC

M10 GND

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO89PPB3V0

M16 GCA1/IO87PPB3V0

M17 GCC2/IO90PPB3V0

M18 VCCPLC

M19 GCA2/IO88PDB3V0

M20 IO88NDB3V0

M21 IO93PDB3V0

M22 NC

N1 IO185PPB6V2

N2 IO183NDB6V2

N3 VMV6

N4 GFC2/IO187PPB6V2

N5 IO184PPB6V2

N6 IO186PDB6V2

N7 IO186NDB6V2

N8 VCCIB6

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB3

N16 IO89NPB3V0

FG484

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-25

N17 IO91NPB3V0

N18 IO90NPB3V0

N19 IO91PPB3V0

N20 GNDQ

N21 IO93NDB3V0

N22 IO95PDB3V1

P1 NC

P2 IO183PDB6V2

P3 IO187NPB6V2

P4 IO184NPB6V2

P5 IO176PPB6V1

P6 IO182PDB6V1

P7 IO182NDB6V1

P8 VCCIB6

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB3

P16 GDB0/IO109NPB3V2

P17 IO97NDB3V1

P18 IO97PDB3V1

P19 IO99PDB3V1

P20 VMV3

P21 IO98PDB3V1

P22 IO95NDB3V1

R1 NC

R2 IO177PDB6V1

R3 VCC

R4 IO176NPB6V1

R5 IO174NDB6V0

R6 IO174PDB6V0

R7 GEC0/IO169NPB6V0

R8 VMV5

FG484

Pin Number A3PE1500 Function

R9 VCCIB5

R10 VCCIB5

R11 IO135NDB5V0

R12 IO135PDB5V0

R13 VCCIB4

R14 VCCIB4

R15 VMV3

R16 VCCPLD

R17 GDB1/IO109PPB3V2

R18 GDC1/IO108PDB3V2

R19 IO99NDB3V1

R20 VCC

R21 IO98NDB3V1

R22 IO101PDB3V1

T1 NC

T2 IO177NDB6V1

T3 NC

T4 IO171PDB6V0

T5 IO171NDB6V0

T6 GEC1/IO169PPB6V0

T7 VCOMPLE

T8 GNDQ

T9 GEA2/IO166PPB5V3

T10 IO145NDB5V1

T11 IO141NDB5V0

T12 IO139NDB5V0

T13 IO119NDB4V1

T14 IO119PDB4V1

T15 GNDQ

T16 VCOMPLD

T17 VJTAG

T18 GDC0/IO108NDB3V2

T19 GDA1/IO110PDB3V2

T20 NC

T21 IO103PDB3V2

T22 IO101NDB3V1

FG484

Pin Number A3PE1500 Function

U1 IO175PPB6V1

U2 IO173PDB6V0

U3 IO173NDB6V0

U4 GEB1/IO168PDB6V0

U5 GEB0/IO168NDB6V0

U6 VMV6

U7 VCCPLE

U8 IO166NPB5V3

U9 IO157PPB5V2

U10 IO145PDB5V1

U11 IO141PDB5V0

U12 IO139PDB5V0

U13 IO121NDB4V1

U14 IO121PDB4V1

U15 VMV4

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO110NDB3V2

U20 NC

U21 IO103NDB3V2

U22 IO105PDB3V2

V1 NC

V2 IO175NPB6V1

V3 GND

V4 GEA1/IO167PDB6V0

V5 GEA0/IO167NDB6V0

V6 GNDQ

V7 GEC2/IO164PDB5V3

V8 IO157NPB5V2

V9 IO151NDB5V2

V10 IO151PDB5V2

V11 IO137NDB5V0

V12 IO137PDB5V0

V13 IO123NDB4V1

V14 IO123PDB4V1

FG484

Pin Number A3PE1500 Function

Package Pin Assignments

4-26 Revision 10

V15 IO112NDB4V0

V16 GDB2/IO112PDB4V0

V17 TDI

V18 GNDQ

V19 TDO

V20 GND

V21 NC

V22 IO105NDB3V2

W1 NC

W2 NC

W3 NC

W4 GND

W5 IO165NDB5V3

W6 GEB2/IO165PDB5V3

W7 IO164NDB5V3

W8 IO153NDB5V2

W9 IO153PDB5V2

W10 IO147NDB5V1

W11 IO133NDB4V2

W12 IO130NDB4V2

W13 IO130PDB4V2

W14 IO113NDB4V0

W15 GDC2/IO113PDB4V0

W16 IO111NDB4V0

W17 GDA2/IO111PDB4V0

W18 TMS

W19 GND

W20 NC

W21 NC

W22 NC

Y1 VCCIB6

Y2 NC

Y3 NC

Y4 IO161NDB5V3

Y5 GND

Y6 IO163NDB5V3

FG484

Pin Number A3PE1500 Function

Y7 IO163PDB5V3

Y8 VCC

Y9 VCC

Y10 IO147PDB5V1

Y11 IO133PDB4V2

Y12 IO131NPB4V2

Y13 NC

Y14 VCC

Y15 VCC

Y16 NC

Y17 NC

Y18 GND

Y19 NC

Y20 NC

Y21 NC

Y22 VCCIB3

FG484

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-27

FG484

Pin Number A3PE3000 Function

A1 GND

A2 GND

A3 VCCIB0

A4 IO10NDB0V1

A5 IO10PDB0V1

A6 IO16NDB0V1

A7 IO16PDB0V1

A8 IO18PDB0V2

A9 IO24PDB0V2

A10 IO28NDB0V3

A11 IO28PDB0V3

A12 IO46PDB1V0

A13 IO54PDB1V1

A14 IO56NDB1V1

A15 IO56PDB1V1

A16 IO64NDB1V2

A17 IO64PDB1V2

A18 IO72NDB1V3

A19 IO74NDB1V4

A20 VCCIB1

A21 GND

A22 GND

AA1 GND

AA2 VCCIB6

AA3 IO228PDB5V4

AA4 IO224PDB5V3

AA5 IO218NDB5V3

AA6 IO218PDB5V3

AA7 IO212NDB5V2

AA8 IO212PDB5V2

AA9 IO198PDB5V0

AA10 IO198NDB5V0

AA11 IO188PPB4V4

AA12 IO180NDB4V3

AA13 IO180PDB4V3

AA14 IO170NDB4V2

AA15 IO170PDB4V2

AA16 IO166NDB4V1

AA17 IO166PDB4V1

AA18 IO160NDB4V0

AA19 IO160PDB4V0

AA20 IO158NPB4V0

AA21 VCCIB3

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB5

AB4 IO216NDB5V2

AB5 IO216PDB5V2

AB6 IO210NDB5V2

AB7 IO210PDB5V2

AB8 IO208NDB5V1

AB9 IO208PDB5V1

AB10 IO197NDB5V0

AB11 IO197PDB5V0

AB12 IO174NDB4V2

AB13 IO174PDB4V2

AB14 IO172NDB4V2

AB15 IO172PDB4V2

AB16 IO168NDB4V1

AB17 IO168PDB4V1

AB18 IO162NDB4V1

AB19 IO162PDB4V1

AB20 VCCIB4

AB21 GND

AB22 GND

B1 GND

B2 VCCIB7

B3 IO06PPB0V0

B4 IO08NDB0V0

B5 IO08PDB0V0

B6 IO14NDB0V1

FG484

Pin Number A3PE3000 Function

B7 IO14PDB0V1

B8 IO18NDB0V2

B9 IO24NDB0V2

B10 IO34PDB0V4

B11 IO40PDB0V4

B12 IO46NDB1V0

B13 IO54NDB1V1

B14 IO62NDB1V2

B15 IO62PDB1V2

B16 IO68NDB1V3

B17 IO68PDB1V3

B18 IO72PDB1V3

B19 IO74PDB1V4

B20 IO76NPB1V4

B21 VCCIB2

B22 GND

C1 VCCIB7

C2 IO303PDB7V3

C3 IO305PDB7V3

C4 IO06NPB0V0

C5 GND

C6 IO12NDB0V1

C7 IO12PDB0V1

C8 VCC

C9 VCC

C10 IO34NDB0V4

C11 IO40NDB0V4

C12 IO48NDB1V0

C13 IO48PDB1V0

C14 VCC

C15 VCC

C16 IO70NDB1V3

C17 IO70PDB1V3

C18 GND

C19 IO76PPB1V4

C20 IO88NDB2V0

FG484

Pin Number A3PE3000 Function

Package Pin Assignments

4-28 Revision 10

C21 IO94PPB2V1

C22 VCCIB2

D1 IO293PDB7V2

D2 IO303NDB7V3

D3 IO305NDB7V3

D4 GND

D5 GAA0/IO00NDB0V0

D6 GAA1/IO00PDB0V0

D7 GAB0/IO01NDB0V0

D8 IO20PDB0V2

D9 IO22PDB0V2

D10 IO30PDB0V3

D11 IO38NDB0V4

D12 IO52NDB1V1

D13 IO52PDB1V1

D14 IO66NDB1V3

D15 IO66PDB1V3

D16 GBB1/IO80PDB1V4

D17 GBA0/IO81NDB1V4

D18 GBA1/IO81PDB1V4

D19 GND

D20 IO88PDB2V0

D21 IO90PDB2V1

D22 IO94NPB2V1

E1 IO293NDB7V2

E2 IO299PPB7V3

E3 GND

E4 GAB2/IO308PDB7V4

E5 GAA2/IO309PDB7V4

E6 GNDQ

E7 GAB1/IO01PDB0V0

E8 IO20NDB0V2

E9 IO22NDB0V2

E10 IO30NDB0V3

E11 IO38PDB0V4

E12 IO44NDB1V0

FG484

Pin Number A3PE3000 Function

E13 IO58NDB1V2

E14 IO58PDB1V2

E15 GBC1/IO79PDB1V4

E16 GBB0/IO80NDB1V4

E17 GNDQ

E18 GBA2/IO82PDB2V0

E19 IO86NDB2V0

E20 GND

E21 IO90NDB2V1

E22 IO98PDB2V2

F1 IO299NPB7V3

F2 IO301NDB7V3

F3 IO301PDB7V3

F4 IO308NDB7V4

F5 IO309NDB7V4

F6 VMV7

F7 VCCPLA

F8 GAC0/IO02NDB0V0

F9 GAC1/IO02PDB0V0

F10 IO32NDB0V3

F11 IO32PDB0V3

F12 IO44PDB1V0

F13 IO50NDB1V1

F14 IO60PDB1V2

F15 GBC0/IO79NDB1V4

F16 VCCPLB

F17 VMV2

F18 IO82NDB2V0

F19 IO86PDB2V0

F20 IO96PDB2V1

F21 IO96NDB2V1

F22 IO98NDB2V2

G1 IO289NDB7V1

G2 IO289PDB7V1

G3 IO291PPB7V2

G4 IO295PDB7V2

FG484

Pin Number A3PE3000 Function

G5 IO297PDB7V2

G6 GAC2/IO307PDB7V4

G7 VCOMPLA

G8 GNDQ

G9 IO26NDB0V3

G10 IO26PDB0V3

G11 IO36PDB0V4

G12 IO42PDB1V0

G13 IO50PDB1V1

G14 IO60NDB1V2

G15 GNDQ

G16 VCOMPLB

G17 GBB2/IO83PDB2V0

G18 IO92PDB2V1

G19 IO92NDB2V1

G20 IO102PDB2V2

G21 IO102NDB2V2

G22 IO105NDB2V2

H1 IO286PSB7V1

H2 IO291NPB7V2

H3 VCC

H4 IO295NDB7V2

H5 IO297NDB7V2

H6 IO307NDB7V4

H7 IO287PDB7V1

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO36NDB0V4

H12 IO42NDB1V0

H13 VCCIB1

H14 VCCIB1

H15 VMV1

H16 GBC2/IO84PDB2V0

H17 IO83NDB2V0

H18 IO100NDB2V2

FG484

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-29

H19 IO100PDB2V2

H20 VCC

H21 VMV2

H22 IO105PDB2V2

J1 IO285NDB7V1

J2 IO285PDB7V1

J3 VMV7

J4 IO279PDB7V0

J5 IO283PDB7V1

J6 IO281PDB7V0

J7 IO287NDB7V1

J8 VCCIB7

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB2

J16 IO84NDB2V0

J17 IO104NDB2V2

J18 IO104PDB2V2

J19 IO106PPB2V3

J20 GNDQ

J21 IO109PDB2V3

J22 IO107PDB2V3

K1 IO277NDB7V0

K2 IO277PDB7V0

K3 GNDQ

K4 IO279NDB7V0

K5 IO283NDB7V1

K6 IO281NDB7V0

K7 GFC1/IO275PPB7V0

K8 VCCIB7

K9 VCC

K10 GND

FG484

Pin Number A3PE3000 Function

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB2

K16 GCC1/IO112PPB2V3

K17 IO108NDB2V3

K18 IO108PDB2V3

K19 IO110NPB2V3

K20 IO106NPB2V3

K21 IO109NDB2V3

K22 IO107NDB2V3

L1 IO257PSB6V2

L2 IO276PDB7V0

L3 IO276NDB7V0

L4 GFB0/IO274NPB7V0

L5 GFA0/IO273NDB6V4

L6 GFB1/IO274PPB7V0

L7 VCOMPLF

L8 GFC0/IO275NPB7V0

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO112NPB2V3

L16 GCB1/IO113PPB2V3

L17 GCA0/IO114NPB3V0

L18 VCOMPLC

L19 GCB0/IO113NPB2V3

L20 IO110PPB2V3

L21 IO111NDB2V3

L22 IO111PDB2V3

M1 GNDQ

M2 IO255NPB6V2

FG484

Pin Number A3PE3000 Function

M3 IO272NDB6V4

M4 GFA2/IO272PDB6V4

M5 GFA1/IO273PDB6V4

M6 VCCPLF

M7 IO271NDB6V4

M8 GFB2/IO271PDB6V4

M9 VCC

M10 GND

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO116PPB3V0

M16 GCA1/IO114PPB3V0

M17 GCC2/IO117PPB3V0

M18 VCCPLC

M19 GCA2/IO115PDB3V0

M20 IO115NDB3V0

M21 IO126PDB3V1

M22 IO124PSB3V1

N1 IO255PPB6V2

N2 IO253NDB6V2

N3 VMV6

N4 GFC2/IO270PPB6V4

N5 IO261PPB6V3

N6 IO263PDB6V3

N7 IO263NDB6V3

N8 VCCIB6

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB3

N16 IO116NPB3V0

FG484

Pin Number A3PE3000 Function

Package Pin Assignments

4-30 Revision 10

N17 IO132NPB3V2

N18 IO117NPB3V0

N19 IO132PPB3V2

N20 GNDQ

N21 IO126NDB3V1

N22 IO128PDB3V1

P1 IO247PDB6V1

P2 IO253PDB6V2

P3 IO270NPB6V4

P4 IO261NPB6V3

P5 IO249PPB6V1

P6 IO259PDB6V3

P7 IO259NDB6V3

P8 VCCIB6

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB3

P16 GDB0/IO152NPB3V4

P17 IO136NDB3V2

P18 IO136PDB3V2

P19 IO138PDB3V3

P20 VMV3

P21 IO130PDB3V2

P22 IO128NDB3V1

R1 IO247NDB6V1

R2 IO245PDB6V1

R3 VCC

R4 IO249NPB6V1

R5 IO251NDB6V2

R6 IO251PDB6V2

R7 GEC0/IO236NPB6V0

R8 VMV5

FG484

Pin Number A3PE3000 Function

R9 VCCIB5

R10 VCCIB5

R11 IO196NDB5V0

R12 IO196PDB5V0

R13 VCCIB4

R14 VCCIB4

R15 VMV3

R16 VCCPLD

R17 GDB1/IO152PPB3V4

R18 GDC1/IO151PDB3V4

R19 IO138NDB3V3

R20 VCC

R21 IO130NDB3V2

R22 IO134PDB3V2

T1 IO243PPB6V1

T2 IO245NDB6V1

T3 IO243NPB6V1

T4 IO241PDB6V0

T5 IO241NDB6V0

T6 GEC1/IO236PPB6V0

T7 VCOMPLE

T8 GNDQ

T9 GEA2/IO233PPB5V4

T10 IO206NDB5V1

T11 IO202NDB5V1

T12 IO194NDB5V0

T13 IO186NDB4V4

T14 IO186PDB4V4

T15 GNDQ

T16 VCOMPLD

T17 VJTAG

T18 GDC0/IO151NDB3V4

T19 GDA1/IO153PDB3V4

T20 IO144PDB3V3

T21 IO140PDB3V3

T22 IO134NDB3V2

FG484

Pin Number A3PE3000 Function

U1 IO240PPB6V0

U2 IO238PDB6V0

U3 IO238NDB6V0

U4 GEB1/IO235PDB6V0

U5 GEB0/IO235NDB6V0

U6 VMV6

U7 VCCPLE

U8 IO233NPB5V4

U9 IO222PPB5V3

U10 IO206PDB5V1

U11 IO202PDB5V1

U12 IO194PDB5V0

U13 IO176NDB4V2

U14 IO176PDB4V2

U15 VMV4

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO153NDB3V4

U20 IO144NDB3V3

U21 IO140NDB3V3

U22 IO142PDB3V3

V1 IO239PDB6V0

V2 IO240NPB6V0

V3 GND

V4 GEA1/IO234PDB6V0

V5 GEA0/IO234NDB6V0

V6 GNDQ

V7 GEC2/IO231PDB5V4

V8 IO222NPB5V3

V9 IO204NDB5V1

V10 IO204PDB5V1

V11 IO195NDB5V0

V12 IO195PDB5V0

V13 IO178NDB4V3

V14 IO178PDB4V3

FG484

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-31

V15 IO155NDB4V0

V16 GDB2/IO155PDB4V0

V17 TDI

V18 GNDQ

V19 TDO

V20 GND

V21 IO146PDB3V4

V22 IO142NDB3V3

W1 IO239NDB6V0

W2 IO237PDB6V0

W3 IO230PSB5V4

W4 GND

W5 IO232NDB5V4

W6 GEB2/IO232PDB5V4

W7 IO231NDB5V4

W8 IO214NDB5V2

W9 IO214PDB5V2

W10 IO200NDB5V0

W11 IO192NDB4V4

W12 IO184NDB4V3

W13 IO184PDB4V3

W14 IO156NDB4V0

W15 GDC2/IO156PDB4V0

W16 IO154NDB4V0

W17 GDA2/IO154PDB4V0

W18 TMS

W19 GND

W20 IO150NDB3V4

W21 IO146NDB3V4

W22 IO148PPB3V4

Y1 VCCIB6

Y2 IO237NDB6V0

Y3 IO228NDB5V4

Y4 IO224NDB5V3

Y5 GND

Y6 IO220NDB5V3

FG484

Pin Number A3PE3000 Function

Y7 IO220PDB5V3

Y8 VCC

Y9 VCC

Y10 IO200PDB5V0

Y11 IO192PDB4V4

Y12 IO188NPB4V4

Y13 IO187PSB4V4

Y14 VCC

Y15 VCC

Y16 IO164NDB4V1

Y17 IO164PDB4V1

Y18 GND

Y19 IO158PPB4V0

Y20 IO150PDB3V4

Y21 IO148NPB3V4

Y22 VCCIB3

FG484

Pin Number A3PE3000 Function

Package Pin Assignments

4-32 Revision 10

FG676

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

A1 Ball Pad Corner

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ProASIC3E Flash Family FPGAs

Revision 10 4-33

FG676

Pin Number A3PE1500 Function

A1 GND

A2 GND

A3 GAA0/IO00NDB0V0

A4 GAA1/IO00PDB0V0

A5 IO06NDB0V0

A6 IO09NDB0V1

A7 IO09PDB0V1

A8 IO14NDB0V1

A9 IO14PDB0V1

A10 IO22NDB0V2

A11 IO22PDB0V2

A12 IO26NDB0V3

A13 IO26PDB0V3

A14 IO30NDB0V3

A15 IO30PDB0V3

A16 IO34NDB1V0

A17 IO34PDB1V0

A18 IO38NDB1V0

A19 IO38PDB1V0

A20 IO41PDB1V1

A21 IO44PDB1V1

A22 IO49PDB1V2

A23 IO50PDB1V2

A24 GBC1/IO55PDB1V3

A25 GND

A26 GND

AA1 IO174PDB6V0

AA2 IO171PDB6V0

AA3 GEA1/IO167PPB6V0

AA4 GEC0/IO169NPB6V0

AA5 VCOMPLE

AA6 GND

AA7 IO165NDB5V3

AA8 GEB2/IO165PDB5V3

AA9 IO163PDB5V3

AA10 IO159NDB5V3

AA11 IO153NDB5V2

AA12 IO147NDB5V1

AA13 IO139NDB5V0

AA14 IO137NDB5V0

AA15 IO123NDB4V1

AA16 IO123PDB4V1

AA17 IO117NDB4V0

AA18 IO117PDB4V0

AA19 GDB2/IO112PDB4V0

AA20 GNDQ

AA21 TDO

AA22 GND

AA23 GND

AA24 IO102NDB3V1

AA25 IO102PDB3V1

AA26 IO98NDB3V1

AB1 IO174NDB6V0

AB2 IO171NDB6V0

AB3 GEB1/IO168PPB6V0

AB4 GEA0/IO167NPB6V0

AB5 VCCPLE

AB6 GND

AB7 GND

AB8 IO156NDB5V2

AB9 IO156PDB5V2

AB10 IO150PDB5V1

AB11 IO155PDB5V2

AB12 IO142PDB5V0

AB13 IO135NDB5V0

AB14 IO135PDB5V0

AB15 IO132PDB4V2

AB16 IO129PDB4V2

AB17 IO121PDB4V1

AB18 IO119NDB4V1

AB19 IO112NDB4V0

AB20 VMV4

FG676

Pin Number A3PE1500 Function

AB21 TCK

AB22 TRST

AB23 GDC0/IO108NDB3V2

AB24 GDC1/IO108PDB3V2

AB25 IO104NDB3V2

AB26 IO104PDB3V2

AC1 IO170PDB6V0

AC2 GEB0/IO168NPB6V0

AC3 IO166NPB5V3

AC4 GNDQ

AC5 GND

AC6 IO160PDB5V3

AC7 IO161PDB5V3

AC8 IO154PDB5V2

AC9 GND

AC10 IO150NDB5V1

AC11 IO155NDB5V2

AC12 IO142NDB5V0

AC13 IO138NDB5V0

AC14 IO138PDB5V0

AC15 IO132NDB4V2

AC16 IO129NDB4V2

AC17 IO121NDB4V1

AC18 IO119PDB4V1

AC19 IO118NDB4V0

AC20 IO118PDB4V0

AC21 IO114PPB4V0

AC22 TMS

AC23 VJTAG

AC24 VMV3

AC25 IO106NDB3V2

AC26 IO106PDB3V2

AD1 IO170NDB6V0

AD2 GEA2/IO166PPB5V3

AD3 VMV5

AD4 GEC2/IO164PDB5V3

FG676

Pin Number A3PE1500 Function

Package Pin Assignments

4-34 Revision 10

AD5 IO162PDB5V3

AD6 IO160NDB5V3

AD7 IO161NDB5V3

AD8 IO154NDB5V2

AD9 IO148PDB5V1

AD10 IO151PDB5V2

AD11 IO144PDB5V1

AD12 IO140PDB5V0

AD13 IO143PDB5V1

AD14 IO141PDB5V0

AD15 IO134PDB4V2

AD16 IO133PDB4V2

AD17 IO127PDB4V2

AD18 IO130PDB4V2

AD19 IO126PDB4V1

AD20 IO124PDB4V1

AD21 IO120PDB4V1

AD22 IO114NPB4V0

AD23 TDI

AD24 GNDQ

AD25 GDA0/IO110NDB3V2

AD26 GDA1/IO110PDB3V2

AE1 GND

AE2 GND

AE3 GND

AE4 IO164NDB5V3

AE5 IO162NDB5V3

AE6 IO158PPB5V2

AE7 IO157PPB5V2

AE8 IO152PPB5V2

AE9 IO148NDB5V1

AE10 IO151NDB5V2

AE11 IO144NDB5V1

AE12 IO140NDB5V0

AE13 IO143NDB5V1

AE14 IO141NDB5V0

FG676

Pin Number A3PE1500 Function

AE15 IO134NDB4V2

AE16 IO133NDB4V2

AE17 IO127NDB4V2

AE18 IO130NDB4V2

AE19 IO126NDB4V1

AE20 IO124NDB4V1

AE21 IO120NDB4V1

AE22 IO116PDB4V0

AE23 GDC2/IO113PDB4V0

AE24 GDA2/IO111PDB4V0

AE25 GND

AE26 GND

AF1 GND

AF2 GND

AF3 GND

AF4 GND

AF5 IO158NPB5V2

AF6 IO157NPB5V2

AF7 IO152NPB5V2

AF8 IO146NDB5V1

AF9 IO146PDB5V1

AF10 IO149NDB5V1

AF11 IO149PDB5V1

AF12 IO145NDB5V1

AF13 IO145PDB5V1

AF14 IO136NDB5V0

AF15 IO136PDB5V0

AF16 IO131NDB4V2

AF17 IO131PDB4V2

AF18 IO128NDB4V2

AF19 IO128PDB4V2

AF20 IO122NDB4V1

AF21 IO122PDB4V1

AF22 IO116NDB4V0

AF23 IO113NDB4V0

AF24 IO111NDB4V0

FG676

Pin Number A3PE1500 Function

AF25 GND

AF26 GND

B1 GND

B2 GND

B3 GND

B4 GND

B5 IO06PDB0V0

B6 IO04NDB0V0

B7 IO07NDB0V0

B8 IO11NDB0V1

B9 IO10NDB0V1

B10 IO16NDB0V2

B11 IO20NDB0V2

B12 IO24NDB0V3

B13 IO23NDB0V2

B14 IO28NDB0V3

B15 IO31NDB0V3

B16 IO32PDB1V0

B17 IO36PDB1V0

B18 IO37PDB1V0

B19 IO42NPB1V1

B20 IO41NDB1V1

B21 IO44NDB1V1

B22 IO49NDB1V2

B23 IO50NDB1V2

B24 GBC0/IO55NDB1V3

B25 GND

B26 GND

C1 GND

C2 GND

C3 GND

C4 GND

C5 GAA2/IO221PDB7V3

C6 IO04PDB0V0

C7 IO07PDB0V0

C8 IO11PDB0V1

FG676

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-35

C9 IO10PDB0V1

C10 IO16PDB0V2

C11 IO20PDB0V2

C12 IO24PDB0V3

C13 IO23PDB0V2

C14 IO28PDB0V3

C15 IO31PDB0V3

C16 IO32NDB1V0

C17 IO36NDB1V0

C18 IO37NDB1V0

C19 IO45NDB1V1

C20 IO42PPB1V1

C21 IO46NPB1V1

C22 IO48NPB1V2

C23 GBB0/IO56NPB1V3

C24 VMV1

C25 GBC2/IO60PDB2V0

C26 IO60NDB2V0

D1 IO218NDB7V3

D2 IO218PDB7V3

D3 GND

D4 VMV7

D5 IO221NDB7V3

D6 GAC0/IO02NDB0V0

D7 GAC1/IO02PDB0V0

D8 IO05NDB0V0

D9 IO08PDB0V1

D10 IO12NDB0V1

D11 IO18NDB0V2

D12 IO17NDB0V2

D13 IO25NDB0V3

D14 IO29NDB0V3

D15 IO33NDB1V0

D16 IO40PDB1V1

D17 IO43NDB1V1

D18 IO47PDB1V1

FG676

Pin Number A3PE1500 Function

D19 IO45PDB1V1

D20 IO46PPB1V1

D21 IO48PPB1V2

D22 GBA0/IO57NPB1V3

D23 GNDQ

D24 GBB1/IO56PPB1V3

D25 GBB2/IO59PDB2V0

D26 IO59NDB2V0

E1 IO212PDB7V2

E2 IO211NDB7V2

E3 IO211PDB7V2

E4 IO220NPB7V3

E5 GNDQ

E6 GAB2/IO220PPB7V3

E7 GAB1/IO01PDB0V0

E8 IO05PDB0V0

E9 IO08NDB0V1

E10 IO12PDB0V1

E11 IO18PDB0V2

E12 IO17PDB0V2

E13 IO25PDB0V3

E14 IO29PDB0V3

E15 IO33PDB1V0

E16 IO40NDB1V1

E17 IO43PDB1V1

E18 IO47NDB1V1

E19 IO54NDB1V3

E20 IO52NDB1V2

E21 IO52PDB1V2

E22 VCCPLB

E23 GBA1/IO57PPB1V3

E24 IO63PDB2V0

E25 IO63NDB2V0

E26 IO68PDB2V1

F1 IO212NDB7V2

F2 IO203PPB7V1

FG676

Pin Number A3PE1500 Function

F3 IO213NDB7V2

F4 IO213PDB7V2

F5 GND

F6 VCCPLA

F7 GAB0/IO01NDB0V0

F8 GNDQ

F9 IO03PDB0V0

F10 IO13PDB0V1

F11 IO15PDB0V1

F12 IO19PDB0V2

F13 IO21PDB0V2

F14 IO27NDB0V3

F15 IO35PDB1V0

F16 IO39NDB1V0

F17 IO51PDB1V2

F18 IO53PDB1V2

F19 IO54PDB1V3

F20 VMV2

F21 VCOMPLB

F22 IO61PDB2V0

F23 IO61NDB2V0

F24 IO66PDB2V1

F25 IO66NDB2V1

F26 IO68NDB2V1

G1 IO203NPB7V1

G2 IO207NDB7V2

G3 IO207PDB7V2

G4 IO216NDB7V3

G5 IO216PDB7V3

G6 VCOMPLA

G7 VMV0

G8 VCC

G9 IO03NDB0V0

G10 IO13NDB0V1

G11 IO15NDB0V1

G12 IO19NDB0V2

FG676

Pin Number A3PE1500 Function

Package Pin Assignments

4-36 Revision 10

G13 IO21NDB0V2

G14 IO27PDB0V3

G15 IO35NDB1V0

G16 IO39PDB1V0

G17 IO51NDB1V2

G18 IO53NDB1V2

G19 VCCIB1

G20 GBA2/IO58PPB2V0

G21 GNDQ

G22 IO64NDB2V1

G23 IO64PDB2V1

G24 IO72PDB2V2

G25 IO72NDB2V2

G26 IO78PDB2V2

H1 IO208NDB7V2

H2 IO208PDB7V2

H3 IO209NDB7V2

H4 IO209PDB7V2

H5 IO219NDB7V3

H6 GAC2/IO219PDB7V3

H7 VCCIB7

H8 VCC

H9 VCCIB0

H10 VCCIB0

H11 VCCIB0

H12 VCCIB0

H13 VCCIB0

H14 VCCIB1

H15 VCCIB1

H16 VCCIB1

H17 VCCIB1

H18 VCCIB1

H19 VCC

H20 VCC

H21 IO58NPB2V0

H22 IO70PDB2V1

FG676

Pin Number A3PE1500 Function

H23 IO69PDB2V1

H24 IO76PDB2V2

H25 IO76NDB2V2

H26 IO78NDB2V2

J1 IO197NDB7V0

J2 IO197PDB7V0

J3 VMV7

J4 IO215NDB7V3

J5 IO215PDB7V3

J6 IO214PDB7V3

J7 IO214NDB7V3

J8 VCCIB7

J9 VCC

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 VCC

J15 VCC

J16 VCC

J17 VCC

J18 VCC

J19 VCCIB2

J20 IO62PDB2V0

J21 IO62NDB2V0

J22 IO70NDB2V1

J23 IO69NDB2V1

J24 VMV2

J25 IO80PDB2V3

J26 IO80NDB2V3

K1 IO195PDB7V0

K2 IO199NDB7V1

K3 IO199PDB7V1

K4 IO205NDB7V1

K5 IO205PDB7V1

K6 IO217PDB7V3

FG676

Pin Number A3PE1500 Function

K7 IO217NDB7V3

K8 VCCIB7

K9 VCC

K10 GND

K11 GND

K12 GND

K13 GND

K14 GND

K15 GND

K16 GND

K17 GND

K18 VCC

K19 VCCIB2

K20 IO65PDB2V1

K21 IO65NDB2V1

K22 IO74PDB2V2

K23 IO74NDB2V2

K24 IO75PDB2V2

K25 IO75NDB2V2

K26 IO84PDB2V3

L1 IO195NDB7V0

L2 IO198PPB7V0

L3 GNDQ

L4 IO201PDB7V1

L5 IO201NDB7V1

L6 IO210NDB7V2

L7 IO210PDB7V2

L8 VCCIB7

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 GND

L15 GND

L16 GND

FG676

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-37

L17 GND

L18 VCC

L19 VCCIB2

L20 IO67PDB2V1

L21 IO67NDB2V1

L22 IO71PDB2V2

L23 IO71NDB2V2

L24 GNDQ

L25 IO82PDB2V3

L26 IO84NDB2V3

M1 IO198NPB7V0

M2 IO202PDB7V1

M3 IO202NDB7V1

M4 IO206NDB7V1

M5 IO206PDB7V1

M6 IO204NDB7V1

M7 IO204PDB7V1

M8 VCCIB7

M9 VCC

M10 GND

M11 GND

M12 GND

M13 GND

M14 GND

M15 GND

M16 GND

M17 GND

M18 VCC

M19 VCCIB2

M20 IO73NDB2V2

M21 IO73PDB2V2

M22 IO81PPB2V3

M23 IO77PDB2V2

M24 IO77NDB2V2

M25 IO82NDB2V3

M26 IO83PDB2V3

FG676

Pin Number A3PE1500 Function

N1 GFB0/IO191NPB7V0

N2 VCOMPLF

N3 GFB1/IO191PPB7V0

N4 IO196PDB7V0

N5 GFA0/IO190NDB6V2

N6 IO200PDB7V1

N7 IO200NDB7V1

N8 VCCIB7

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 GND

N15 GND

N16 GND

N17 GND

N18 VCC

N19 VCCIB2

N20 IO79PDB2V3

N21 IO79NDB2V3

N22 GCA2/IO88PPB3V0

N23 IO81NPB2V3

N24 GCA0/IO87NDB3V0

N25 GCB0/IO86NPB2V3

N26 IO83NDB2V3

P1 GFA2/IO189PDB6V2

P2 VCCPLF

P3 IO193PPB7V0

P4 IO196NDB7V0

P5 GFA1/IO190PDB6V2

P6 IO194PDB7V0

P7 IO194NDB7V0

P8 VCCIB6

P9 VCC

P10 GND

FG676

Pin Number A3PE1500 Function

P11 GND

P12 GND

P13 GND

P14 GND

P15 GND

P16 GND

P17 GND

P18 VCC

P19 VCCIB3

P20 GCC0/IO85NDB2V3

P21 GCC1/IO85PDB2V3

P22 GCB1/IO86PPB2V3

P23 IO88NPB3V0

P24 GCA1/IO87PDB3V0

P25 VCCPLC

P26 VCOMPLC

R1 IO189NDB6V2

R2 IO185PDB6V2

R3 IO187NPB6V2

R4 IO193NPB7V0

R5 GFC2/IO187PPB6V2

R6 GFC1/IO192PDB7V0

R7 GFC0/IO192NDB7V0

R8 VCCIB6

R9 VCC

R10 GND

R11 GND

R12 GND

R13 GND

R14 GND

R15 GND

R16 GND

R17 GND

R18 VCC

R19 VCCIB3

R20 NC

FG676

Pin Number A3PE1500 Function

Package Pin Assignments

4-38 Revision 10

R21 IO89NDB3V0

R22 GCB2/IO89PDB3V0

R23 IO90NDB3V0

R24 GCC2/IO90PDB3V0

R25 IO91PDB3V0

R26 IO91NDB3V0

T1 IO186PDB6V2

T2 IO185NDB6V2

T3 GNDQ

T4 IO180PDB6V1

T5 IO180NDB6V1

T6 IO188NDB6V2

T7 GFB2/IO188PDB6V2

T8 VCCIB6

T9 VCC

T10 GND

T11 GND

T12 GND

T13 GND

T14 GND

T15 GND

T16 GND

T17 GND

T18 VCC

T19 VCCIB3

T20 IO99PDB3V1

T21 IO99NDB3V1

T22 IO97PDB3V1

T23 IO97NDB3V1

T24 GNDQ

T25 IO93PPB3V0

T26 NC

U1 IO186NDB6V2

U2 IO184NDB6V2

U3 IO184PDB6V2

U4 IO182NDB6V1

FG676

Pin Number A3PE1500 Function

U5 IO182PDB6V1

U6 IO178PDB6V1

U7 IO178NDB6V1

U8 VCCIB6

U9 VCC

U10 GND

U11 GND

U12 GND

U13 GND

U14 GND

U15 GND

U16 GND

U17 GND

U18 VCC

U19 VCCIB3

U20 NC

U21 IO101NDB3V1

U22 IO101PDB3V1

U23 IO92NDB3V0

U24 IO92PDB3V0

U25 IO95PDB3V1

U26 IO93NPB3V0

V1 IO183PDB6V2

V2 IO183NDB6V2

V3 VMV6

V4 IO181PDB6V1

V5 IO181NDB6V1

V6 IO176PDB6V1

V7 IO176NDB6V1

V8 VCCIB6

V9 VCC

V10 VCC

V11 VCC

V12 VCC

V13 VCC

V14 VCC

FG676

Pin Number A3PE1500 Function

V15 VCC

V16 VCC

V17 VCC

V18 VCC

V19 VCCIB3

V20 IO107PDB3V2

V21 IO107NDB3V2

V22 IO103NDB3V2

V23 IO103PDB3V2

V24 VMV3

V25 IO95NDB3V1

V26 IO94PDB3V0

W1 IO179NDB6V1

W2 IO179PDB6V1

W3 IO177NDB6V1

W4 IO177PDB6V1

W5 IO172PDB6V0

W6 IO172NDB6V0

W7 VCC

W8 VCC

W9 VCCIB5

W10 VCCIB5

W11 VCCIB5

W12 VCCIB5

W13 VCCIB5

W14 VCCIB4

W15 VCCIB4

W16 VCCIB4

W17 VCCIB4

W18 VCCIB4

W19 VCC

W20 VCCIB3

W21 GDB0/IO109NDB3V2

W22 GDB1/IO109PDB3V2

W23 IO105NDB3V2

W24 IO105PDB3V2

FG676

Pin Number A3PE1500 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-39

W25 IO96PDB3V1

W26 IO94NDB3V0

Y1 IO175NDB6V1

Y2 IO175PDB6V1

Y3 IO173NDB6V0

Y4 IO173PDB6V0

Y5 GEC1/IO169PPB6V0

Y6 GNDQ

Y7 VMV6

Y8 VCCIB5

Y9 IO163NDB5V3

Y10 IO159PDB5V3

Y11 IO153PDB5V2

Y12 IO147PDB5V1

Y13 IO139PDB5V0

Y14 IO137PDB5V0

Y15 IO125NDB4V1

Y16 IO125PDB4V1

Y17 IO115NDB4V0

Y18 IO115PDB4V0

Y19 VCC

Y20 VPUMP

Y21 VCOMPLD

Y22 VCCPLD

Y23 IO100NDB3V1

Y24 IO100PDB3V1

Y25 IO96NDB3V1

Y26 IO98PDB3V1

FG676

Pin Number A3PE1500 Function

Package Pin Assignments

4-40 Revision 10

FG896

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

A1 Ball Pad Corner

123456789101112131415161718192021222324252627282930

ProASIC3E Flash Family FPGAs

Revision 10 4-41

FG896

Pin Number A3PE3000 Function

A2 GND

A3 GND

A4 IO14NPB0V1

A5 GND

A6 IO07NPB0V0

A7 GND

A8 IO09NDB0V1

A9 IO17NDB0V2

A10 IO17PDB0V2

A11 IO21NDB0V2

A12 IO21PDB0V2

A13 IO33NDB0V4

A14 IO33PDB0V4

A15 IO35NDB0V4

A16 IO35PDB0V4

A17 IO41NDB1V0

A18 IO43NDB1V0

A19 IO43PDB1V0

A20 IO45NDB1V0

A21 IO45PDB1V0

A22 IO57NDB1V2

A23 IO57PDB1V2

A24 GND

A25 IO69PPB1V3

A26 GND

A27 GBC1/IO79PPB1V4

A28 GND

A29 GND

AA1 IO256PDB6V2

AA2 IO248PDB6V1

AA3 IO248NDB6V1

AA4 IO246NDB6V1

AA5 GEA1/IO234PDB6V0

AA6 GEA0/IO234NDB6V0

AA7 IO243PPB6V1

AA8 IO245NDB6V1

AA9 GEB1/IO235PPB6V0

AA10 VCC

AA11 IO226PPB5V4

AA12 VCCIB5

AA13 VCCIB5

AA14 VCCIB5

AA15 VCCIB5

AA16 VCCIB4

AA17 VCCIB4

AA18 VCCIB4

AA19 VCCIB4

AA20 IO174PDB4V2

AA21 VCC

AA22 IO142NPB3V3

AA23 IO144NDB3V3

AA24 IO144PDB3V3

AA25 IO146NDB3V4

AA26 IO146PDB3V4

AA27 IO147PDB3V4

AA28 IO139NDB3V3

AA29 IO139PDB3V3

AA30 IO133NDB3V2

AB1 IO256NDB6V2

AB2 IO244PDB6V1

AB3 IO244NDB6V1

AB4 IO241PDB6V0

AB5 IO241NDB6V0

AB6 IO243NPB6V1

AB7 VCCIB6

AB8 VCCPLE

AB9 VCC

AB10 IO222PDB5V3

AB11 IO218PPB5V3

AB12 IO206NDB5V1

AB13 IO206PDB5V1

AB14 IO198NDB5V0

FG896

Pin Number A3PE3000 Function

AB15 IO198PDB5V0

AB16 IO192NDB4V4

AB17 IO192PDB4V4

AB18 IO178NDB4V3

AB19 IO178PDB4V3

AB20 IO174NDB4V2

AB21 IO162NPB4V1

AB22 VCC

AB23 VCCPLD

AB24 VCCIB3

AB25 IO150PDB3V4

AB26 IO148PDB3V4

AB27 IO147NDB3V4

AB28 IO145PDB3V3

AB29 IO143PDB3V3

AB30 IO137PDB3V2

AC1 IO254PDB6V2

AC2 IO254NDB6V2

AC3 IO240PDB6V0

AC4 GEC1/IO236PDB6V0

AC5 IO237PDB6V0

AC6 IO237NDB6V0

AC7 VCOMPLE

AC8 GND

AC9 IO226NPB5V4

AC10 IO222NDB5V3

AC11 IO216NPB5V2

AC12 IO210NPB5V2

AC13 IO204NDB5V1

AC14 IO204PDB5V1

AC15 IO194NDB5V0

AC16 IO188NDB4V4

AC17 IO188PDB4V4

AC18 IO182PPB4V3

AC19 IO170NPB4V2

AC20 IO164NDB4V1

FG896

Pin Number A3PE3000 Function

Package Pin Assignments

4-42 Revision 10

AC21 IO164PDB4V1

AC22 IO162PPB4V1

AC23 GND

AC24 VCOMPLD

AC25 IO150NDB3V4

AC26 IO148NDB3V4

AC27 GDA1/IO153PDB3V4

AC28 IO145NDB3V3

AC29 IO143NDB3V3

AC30 IO137NDB3V2

AD1 GND

AD2 IO242NPB6V1

AD3 IO240NDB6V0

AD4 GEC0/IO236NDB6V0

AD5 VCCIB6

AD6 GNDQ

AD7 VCC

AD8 VMV5

AD9 VCCIB5

AD10 IO224PPB5V3

AD11 IO218NPB5V3

AD12 IO216PPB5V2

AD13 IO210PPB5V2

AD14 IO202PPB5V1

AD15 IO194PDB5V0

AD16 IO190PDB4V4

AD17 IO182NPB4V3

AD18 IO176NDB4V2

AD19 IO176PDB4V2

AD20 IO170PPB4V2

AD21 IO166PDB4V1

AD22 VCCIB4

AD23 TCK

AD24 VCC

AD25 TRST

AD26 VCCIB3

FG896

Pin Number A3PE3000 Function

AD27 GDA0/IO153NDB3V4

AD28 GDC0/IO151NDB3V4

AD29 GDC1/IO151PDB3V4

AD30 GND

AE1 IO242PPB6V1

AE2 VCC

AE3 IO239PDB6V0

AE4 IO239NDB6V0

AE5 VMV6

AE6 GND

AE7 GNDQ

AE8 IO230NDB5V4

AE9 IO224NPB5V3

AE10 IO214NPB5V2

AE11 IO212NDB5V2

AE12 IO212PDB5V2

AE13 IO202NPB5V1

AE14 IO200NDB5V0

AE15 IO196PDB5V0

AE16 IO190NDB4V4

AE17 IO184PDB4V3

AE18 IO184NDB4V3

AE19 IO172PDB4V2

AE20 IO172NDB4V2

AE21 IO166NDB4V1

AE22 IO160PDB4V0

AE23 GNDQ

AE24 VMV4

AE25 GND

AE26 GDB0/IO152NDB3V4

AE27 GDB1/IO152PDB3V4

AE28 VMV3

AE29 VCC

AE30 IO149PDB3V4

AF1 GND

AF2 IO238PPB6V0

FG896

Pin Number A3PE3000 Function

AF3 VCCIB6

AF4 IO220NPB5V3

AF5 VCC

AF6 IO228NDB5V4

AF7 VCCIB5

AF8 IO230PDB5V4

AF9 IO229NDB5V4

AF10 IO229PDB5V4

AF11 IO214PPB5V2

AF12 IO208NDB5V1

AF13 IO208PDB5V1

AF14 IO200PDB5V0

AF15 IO196NDB5V0

AF16 IO186NDB4V4

AF17 IO186PDB4V4

AF18 IO180NDB4V3

AF19 IO180PDB4V3

AF20 IO168NDB4V1

AF21 IO168PDB4V1

AF22 IO160NDB4V0

AF23 IO158NPB4V0

AF24 VCCIB4

AF25 IO154NPB4V0

AF26 VCC

AF27 TDO

AF28 VCCIB3

AF29 GNDQ

AF30 GND

AG1 IO238NPB6V0

AG2 VCC

AG3 IO232NPB5V4

AG4 GND

AG5 IO220PPB5V3

AG6 IO228PDB5V4

AG7 IO231NDB5V4

AG8 GEC2/IO231PDB5V4

FG896

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-43

AG9 IO225NPB5V3

AG10 IO223NPB5V3

AG11 IO221PDB5V3

AG12 IO221NDB5V3

AG13 IO205NPB5V1

AG14 IO199NDB5V0

AG15 IO199PDB5V0

AG16 IO187NDB4V4

AG17 IO187PDB4V4

AG18 IO181NDB4V3

AG19 IO171PPB4V2

AG20 IO165NPB4V1

AG21 IO161NPB4V0

AG22 IO159NDB4V0

AG23 IO159PDB4V0

AG24 IO158PPB4V0

AG25 GDB2/IO155PDB4V0

AG26 GDA2/IO154PPB4V0

AG27 GND

AG28 VJTAG

AG29 VCC

AG30 IO149NDB3V4

AH1 GND

AH2 IO233NPB5V4

AH3 VCC

AH4 GEB2/IO232PPB5V4

AH5 VCCIB5

AH6 IO219NDB5V3

AH7 IO219PDB5V3

AH8 IO227NDB5V4

AH9 IO227PDB5V4

AH10 IO225PPB5V3

AH11 IO223PPB5V3

AH12 IO211NDB5V2

AH13 IO211PDB5V2

AH14 IO205PPB5V1

FG896

Pin Number A3PE3000 Function

AH15 IO195NDB5V0

AH16 IO185NDB4V3

AH17 IO185PDB4V3

AH18 IO181PDB4V3

AH19 IO177NDB4V2

AH20 IO171NPB4V2

AH21 IO165PPB4V1

AH22 IO161PPB4V0

AH23 IO157NDB4V0

AH24 IO157PDB4V0

AH25 IO155NDB4V0

AH26 VCCIB4

AH27 TDI

AH28 VCC

AH29 VPUMP

AH30 GND

AJ1 GND

AJ2 GND

AJ3 GEA2/IO233PPB5V4

AJ4 VCC

AJ5 IO217NPB5V2

AJ6 VCC

AJ7 IO215NPB5V2

AJ8 IO213NDB5V2

AJ9 IO213PDB5V2

AJ10 IO209NDB5V1

AJ11 IO209PDB5V1

AJ12 IO203NDB5V1

AJ13 IO203PDB5V1

AJ14 IO197NDB5V0

AJ15 IO195PDB5V0

AJ16 IO183NDB4V3

AJ17 IO183PDB4V3

AJ18 IO179NPB4V3

AJ19 IO177PDB4V2

AJ20 IO173NDB4V2

FG896

Pin Number A3PE3000 Function

AJ21 IO173PDB4V2

AJ22 IO163NDB4V1

AJ23 IO163PDB4V1

AJ24 IO167NPB4V1

AJ25 VCC

AJ26 IO156NPB4V0

AJ27 VCC

AJ28 TMS

AJ29 GND

AJ30 GND

AK2 GND

AK3 GND

AK4 IO217PPB5V2

AK5 GND

AK6 IO215PPB5V2

AK7 GND

AK8 IO207NDB5V1

AK9 IO207PDB5V1

AK10 IO201NDB5V0

AK11 IO201PDB5V0

AK12 IO193NDB4V4

AK13 IO193PDB4V4

AK14 IO197PDB5V0

AK15 IO191NDB4V4

AK16 IO191PDB4V4

AK17 IO189NDB4V4

AK18 IO189PDB4V4

AK19 IO179PPB4V3

AK20 IO175NDB4V2

AK21 IO175PDB4V2

AK22 IO169NDB4V1

AK23 IO169PDB4V1

AK24 GND

AK25 IO167PPB4V1

AK26 GND

AK27 GDC2/IO156PPB4V0

FG896

Pin Number A3PE3000 Function

Package Pin Assignments

4-44 Revision 10

AK28 GND

AK29 GND

B1 GND

B2 GND

B3 GAA2/IO309PPB7V4

B4 VCC

B5 IO14PPB0V1

B6 VCC

B7 IO07PPB0V0

B8 IO09PDB0V1

B9 IO15PPB0V1

B10 IO19NDB0V2

B11 IO19PDB0V2

B12 IO29NDB0V3

B13 IO29PDB0V3

B14 IO31PPB0V3

B15 IO37NDB0V4

B16 IO37PDB0V4

B17 IO41PDB1V0

B18 IO51NDB1V1

B19 IO59PDB1V2

B20 IO53PDB1V1

B21 IO53NDB1V1

B22 IO61NDB1V2

B23 IO61PDB1V2

B24 IO69NPB1V3

B25 VCC

B26 GBC0/IO79NPB1V4

B27 VCC

B28 IO64NPB1V2

B29 GND

B30 GND

C1 GND

C2 IO309NPB7V4

C3 VCC

C4 GAA0/IO00NPB0V0

FG896

Pin Number A3PE3000 Function

C5 VCCIB0

C6 IO03PDB0V0

C7 IO03NDB0V0

C8 GAB1/IO01PDB0V0

C9 IO05PDB0V0

C10 IO15NPB0V1

C11 IO25NDB0V3

C12 IO25PDB0V3

C13 IO31NPB0V3

C14 IO27NDB0V3

C15 IO39NDB0V4

C16 IO39PDB0V4

C17 IO55PPB1V1

C18 IO51PDB1V1

C19 IO59NDB1V2

C20 IO63NDB1V2

C21 IO63PDB1V2

C22 IO67NDB1V3

C23 IO67PDB1V3

C24 IO75NDB1V4

C25 IO75PDB1V4

C26 VCCIB1

C27 IO64PPB1V2

C28 VCC

C29 GBA1/IO81PPB1V4

C30 GND

D1 IO303PPB7V3

D2 VCC

D3 IO305NPB7V3

D4 GND

D5 GAA1/IO00PPB0V0

D6 GAC1/IO02PDB0V0

D7 IO06NPB0V0

D8 GAB0/IO01NDB0V0

D9 IO05NDB0V0

D10 IO11NDB0V1

FG896

Pin Number A3PE3000 Function

D11 IO11PDB0V1

D12 IO23NDB0V2

D13 IO23PDB0V2

D14 IO27PDB0V3

D15 IO40PDB0V4

D16 IO47NDB1V0

D17 IO47PDB1V0

D18 IO55NPB1V1

D19 IO65NDB1V3

D20 IO65PDB1V3

D21 IO71NDB1V3

D22 IO71PDB1V3

D23 IO73NDB1V4

D24 IO73PDB1V4

D25 IO74NDB1V4

D26 GBB0/IO80NPB1V4

D27 GND

D28 GBA0/IO81NPB1V4

D29 VCC

D30 GBA2/IO82PPB2V0

E1 GND

E2 IO303NPB7V3

E3 VCCIB7

E4 IO305PPB7V3

E5 VCC

E6 GAC0/IO02NDB0V0

E7 VCCIB0

E8 IO06PPB0V0

E9 IO24NDB0V2

E10 IO24PDB0V2

E11 IO13NDB0V1

E12 IO13PDB0V1

E13 IO34NDB0V4

E14 IO34PDB0V4

E15 IO40NDB0V4

E16 IO49NDB1V1

FG896

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-45

E17 IO49PDB1V1

E18 IO50PDB1V1

E19 IO58PDB1V2

E20 IO60NDB1V2

E21 IO77PDB1V4

E22 IO68NDB1V3

E23 IO68PDB1V3

E24 VCCIB1

E25 IO74PDB1V4

E26 VCC

E27 GBB1/IO80PPB1V4

E28 VCCIB2

E29 IO82NPB2V0

E30 GND

F1 IO296PPB7V2

F2 VCC

F3 IO306PDB7V4

F4 IO297PDB7V2

F5 VMV7

F6 GND

F7 GNDQ

F8 IO12NDB0V1

F9 IO12PDB0V1

F10 IO10PDB0V1

F11 IO16PDB0V1

F12 IO22NDB0V2

F13 IO30NDB0V3

F14 IO30PDB0V3

F15 IO36PDB0V4

F16 IO48NDB1V0

F17 IO48PDB1V0

F18 IO50NDB1V1

F19 IO58NDB1V2

F20 IO60PDB1V2

F21 IO77NDB1V4

F22 IO72NDB1V3

FG896

Pin Number A3PE3000 Function

F23 IO72PDB1V3

F24 GNDQ

F25 GND

F26 VMV2

F27 IO86PDB2V0

F28 IO92PDB2V1

F29 VCC

F30 IO100NPB2V2

G1 GND

G2 IO296NPB7V2

G3 IO306NDB7V4

G4 IO297NDB7V2

G5 VCCIB7

G6 GNDQ

G7 VCC

G8 VMV0

G9 VCCIB0

G10 IO10NDB0V1

G11 IO16NDB0V1

G12 IO22PDB0V2

G13 IO26PPB0V3

G14 IO38NPB0V4

G15 IO36NDB0V4

G16 IO46NDB1V0

G17 IO46PDB1V0

G18 IO56NDB1V1

G19 IO56PDB1V1

G20 IO66NDB1V3

G21 IO66PDB1V3

G22 VCCIB1

G23 VMV1

G24 VCC

G25 GNDQ

G26 VCCIB2

G27 IO86NDB2V0

G28 IO92NDB2V1

FG896

Pin Number A3PE3000 Function

G29 IO100PPB2V2

G30 GND

H1 IO294PDB7V2

H2 IO294NDB7V2

H3 IO300NDB7V3

H4 IO300PDB7V3

H5 IO295PDB7V2

H6 IO299PDB7V3

H7 VCOMPLA

H8 GND

H9 IO08NDB0V0

H10 IO08PDB0V0

H11 IO18PDB0V2

H12 IO26NPB0V3

H13 IO28NDB0V3

H14 IO28PDB0V3

H15 IO38PPB0V4

H16 IO42NDB1V0

H17 IO52NDB1V1

H18 IO52PDB1V1

H19 IO62NDB1V2

H20 IO62PDB1V2

H21 IO70NDB1V3

H22 IO70PDB1V3

H23 GND

H24 VCOMPLB

H25 GBC2/IO84PDB2V0

H26 IO84NDB2V0

H27 IO96PDB2V1

H28 IO96NDB2V1

H29 IO89PDB2V0

H30 IO89NDB2V0

J1 IO290NDB7V2

J2 IO290PDB7V2

J3 IO302NDB7V3

J4 IO302PDB7V3

FG896

Pin Number A3PE3000 Function

Package Pin Assignments

4-46 Revision 10

J5 IO295NDB7V2

J6 IO299NDB7V3

J7 VCCIB7

J8 VCCPLA

J9 VCC

J10 IO04NPB0V0

J11 IO18NDB0V2

J12 IO20NDB0V2

J13 IO20PDB0V2

J14 IO32NDB0V3

J15 IO32PDB0V3

J16 IO42PDB1V0

J17 IO44NDB1V0

J18 IO44PDB1V0

J19 IO54NDB1V1

J20 IO54PDB1V1

J21 IO76NPB1V4

J22 VCC

J23 VCCPLB

J24 VCCIB2

J25 IO90PDB2V1

J26 IO90NDB2V1

J27 GBB2/IO83PDB2V0

J28 IO83NDB2V0

J29 IO91PDB2V1

J30 IO91NDB2V1

K1 IO288NDB7V1

K2 IO288PDB7V1

K3 IO304NDB7V3

K4 IO304PDB7V3

K5 GAB2/IO308PDB7V4

K6 IO308NDB7V4

K7 IO301PDB7V3

K8 IO301NDB7V3

K9 GAC2/IO307PPB7V4

K10 VCC

FG896

Pin Number A3PE3000 Function

K11 IO04PPB0V0

K12 VCCIB0

K13 VCCIB0

K14 VCCIB0

K15 VCCIB0

K16 VCCIB1

K17 VCCIB1

K18 VCCIB1

K19 VCCIB1

K20 IO76PPB1V4

K21 VCC

K22 IO78PPB1V4

K23 IO88NDB2V0

K24 IO88PDB2V0

K25 IO94PDB2V1

K26 IO94NDB2V1

K27 IO85PDB2V0

K28 IO85NDB2V0

K29 IO93PDB2V1

K30 IO93NDB2V1

L1 IO286NDB7V1

L2 IO286PDB7V1

L3 IO298NDB7V3

L4 IO298PDB7V3

L5 IO283PDB7V1

L6 IO291NDB7V2

L7 IO291PDB7V2

L8 IO293PDB7V2

L9 IO293NDB7V2

L10 IO307NPB7V4

L11 VCC

L12 VCC

L13 VCC

L14 VCC

L15 VCC

L16 VCC

FG896

Pin Number A3PE3000 Function

L17 VCC

L18 VCC

L19 VCC

L20 VCC

L21 IO78NPB1V4

L22 IO104NPB2V2

L23 IO98NDB2V2

L24 IO98PDB2V2

L25 IO87PDB2V0

L26 IO87NDB2V0

L27 IO97PDB2V1

L28 IO101PDB2V2

L29 IO103PDB2V2

L30 IO119NDB3V0

M1 IO282NDB7V1

M2 IO282PDB7V1

M3 IO292NDB7V2

M4 IO292PDB7V2

M5 IO283NDB7V1

M6 IO285PDB7V1

M7 IO287PDB7V1

M8 IO289PDB7V1

M9 IO289NDB7V1

M10 VCCIB7

M11 VCC

M12 GND

M13 GND

M14 GND

M15 GND

M16 GND

M17 GND

M18 GND

M19 GND

M20 VCC

M21 VCCIB2

M22 NC

FG896

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-47

M23 IO104PPB2V2

M24 IO102PDB2V2

M25 IO102NDB2V2

M26 IO95PDB2V1

M27 IO97NDB2V1

M28 IO101NDB2V2

M29 IO103NDB2V2

M30 IO119PDB3V0

N1 IO276PDB7V0

N2 IO278PDB7V0

N3 IO280PDB7V0

N4 IO284PDB7V1

N5 IO279PDB7V0

N6 IO285NDB7V1

N7 IO287NDB7V1

N8 IO281NDB7V0

N9 IO281PDB7V0

N10 VCCIB7

N11 VCC

N12 GND

N13 GND

N14 GND

N15 GND

N16 GND

N17 GND

N18 GND

N19 GND

N20 VCC

N21 VCCIB2

N22 IO106NDB2V3

N23 IO106PDB2V3

N24 IO108PDB2V3

N25 IO108NDB2V3

N26 IO95NDB2V1

N27 IO99NDB2V2

N28 IO99PDB2V2

FG896

Pin Number A3PE3000 Function

N29 IO107PDB2V3

N30 IO107NDB2V3

P1 IO276NDB7V0

P2 IO278NDB7V0

P3 IO280NDB7V0

P4 IO284NDB7V1

P5 IO279NDB7V0

P6 GFC1/IO275PDB7V0

P7 GFC0/IO275NDB7V0

P8 IO277PDB7V0

P9 IO277NDB7V0

P10 VCCIB7

P11 VCC

P12 GND

P13 GND

P14 GND

P15 GND

P16 GND

P17 GND

P18 GND

P19 GND

P20 VCC

P21 VCCIB2

P22 GCC1/IO112PDB2V3

P23 IO110PDB2V3

P24 IO110NDB2V3

P25 IO109PPB2V3

P26 IO111NPB2V3

P27 IO105PDB2V2

P28 IO105NDB2V2

P29 GCC2/IO117PDB3V0

P30 IO117NDB3V0

R1 GFC2/IO270PDB6V4

R2 GFB1/IO274PPB7V0

R3 VCOMPLF

R4 GFA0/IO273NDB6V4

FG896

Pin Number A3PE3000 Function

R5 GFB0/IO274NPB7V0

R6 IO271NDB6V4

R7 GFB2/IO271PDB6V4

R8 IO269PDB6V4

R9 IO269NDB6V4

R10 VCCIB7

R11 VCC

R12 GND

R13 GND

R14 GND

R15 GND

R16 GND

R17 GND

R18 GND

R19 GND

R20 VCC

R21 VCCIB2

R22 GCC0/IO112NDB2V3

R23 GCB2/IO116PDB3V0

R24 IO118PDB3V0

R25 IO111PPB2V3

R26 IO122PPB3V1

R27 GCA0/IO114NPB3V0

R28 VCOMPLC

R29 GCB1/IO113PPB2V3

R30 IO115NPB3V0

T1 IO270NDB6V4

T2 VCCPLF

T3 GFA2/IO272PPB6V4

T4 GFA1/IO273PDB6V4

T5 IO272NPB6V4

T6 IO267NDB6V4

T7 IO267PDB6V4

T8 IO265PDB6V3

T9 IO263PDB6V3

T10 VCCIB6

FG896

Pin Number A3PE3000 Function

Package Pin Assignments

4-48 Revision 10

T11 VCC

T12 GND

T13 GND

T14 GND

T15 GND

T16 GND

T17 GND

T18 GND

T19 GND

T20 VCC

T21 VCCIB3

T22 IO109NPB2V3

T23 IO116NDB3V0

T24 IO118NDB3V0

T25 IO122NPB3V1

T26 GCA1/IO114PPB3V0

T27 GCB0/IO113NPB2V3

T28 GCA2/IO115PPB3V0

T29 VCCPLC

T30 IO121PDB3V0

U1 IO268PDB6V4

U2 IO264NDB6V3

U3 IO264PDB6V3

U4 IO258PDB6V3

U5 IO258NDB6V3

U6 IO257PPB6V2

U7 IO261PPB6V3

U8 IO265NDB6V3

U9 IO263NDB6V3

U10 VCCIB6

U11 VCC

U12 GND

U13 GND

U14 GND

U15 GND

U16 GND

FG896

Pin Number A3PE3000 Function

U17 GND

U18 GND

U19 GND

U20 VCC

U21 VCCIB3

U22 IO120PDB3V0

U23 IO128PDB3V1

U24 IO124PDB3V1

U25 IO124NDB3V1

U26 IO126PDB3V1

U27 IO129PDB3V1

U28 IO127PDB3V1

U29 IO125PDB3V1

U30 IO121NDB3V0

V1 IO268NDB6V4

V2 IO262PDB6V3

V3 IO260PDB6V3

V4 IO252PDB6V2

V5 IO257NPB6V2

V6 IO261NPB6V3

V7 IO255PDB6V2

V8 IO259PDB6V3

V9 IO259NDB6V3

V10 VCCIB6

V11 VCC

V12 GND

V13 GND

V14 GND

V15 GND

V16 GND

V17 GND

V18 GND

V19 GND

V20 VCC

V21 VCCIB3

V22 IO120NDB3V0

FG896

Pin Number A3PE3000 Function

V23 IO128NDB3V1

V24 IO132PDB3V2

V25 IO130PPB3V2

V26 IO126NDB3V1

V27 IO129NDB3V1

V28 IO127NDB3V1

V29 IO125NDB3V1

V30 IO123PDB3V1

W1 IO266NDB6V4

W2 IO262NDB6V3

W3 IO260NDB6V3

W4 IO252NDB6V2

W5 IO251NDB6V2

W6 IO251PDB6V2

W7 IO255NDB6V2

W8 IO249PPB6V1

W9 IO253PDB6V2

W10 VCCIB6

W11 VCC

W12 GND

W13 GND

W14 GND

W15 GND

W16 GND

W17 GND

W18 GND

W19 GND

W20 VCC

W21 VCCIB3

W22 IO134PDB3V2

W23 IO138PDB3V3

W24 IO132NDB3V2

W25 IO136NPB3V2

W26 IO130NPB3V2

W27 IO141PDB3V3

W28 IO135PDB3V2

FG896

Pin Number A3PE3000 Function

ProASIC3E Flash Family FPGAs

Revision 10 4-49

W29 IO131PDB3V2

W30 IO123NDB3V1

Y1 IO266PDB6V4

Y2 IO250PDB6V2

Y3 IO250NDB6V2

Y4 IO246PDB6V1

Y5 IO247NDB6V1

Y6 IO247PDB6V1

Y7 IO249NPB6V1

Y8 IO245PDB6V1

Y9 IO253NDB6V2

Y10 GEB0/IO235NPB6V0

Y11 VCC

Y12 VCC

Y13 VCC

Y14 VCC

Y15 VCC

Y16 VCC

Y17 VCC

Y18 VCC

Y19 VCC

Y20 VCC

Y21 IO142PPB3V3

Y22 IO134NDB3V2

Y23 IO138NDB3V3

Y24 IO140NDB3V3

Y25 IO140PDB3V3

Y26 IO136PPB3V2

Y27 IO141NDB3V3

Y28 IO135NDB3V2

Y29 IO131NDB3V2

Y30 IO133PDB3V2

FG896

Pin Number A3PE3000 Function

Revision 10 5-1

5 – Dat asheet Information

List of Changes

The following table lists critical changes that were made in each revision of the ProASIC3E datasheet.

Revision Changes Page

Revision 10

(March 2012) The "In-System Programming (ISP) and Security" section and "Security" section

were revised to clarify that although no existing security measures can give an

absolute guarantee, Microsemi FPGAs implement the best security available in

the industry (SAR 34669).

I, 1-1

The Y security option and Licensed DPA Logo were added to the "ProASIC3E

Ordering Information" section. The trademarked Licensed DPA Logo identifies

that a product is covered by a DPA counter-measures license from Cryptog raphy

Research (SAR 34727).

III

The following sentence was removed from the "Advanced Architecture" section:

"In addition, extensive on-chip programming circuitry allows for rapid, single-

voltage (3.3 V) programming of IGLOOe devices via an IEEE 1532 JTAG

interface" (SAR 34689).

1-3

The "Specifying I/O States During Programming" section is new (SAR 34699). 1-6

VCCPLL in Table 2-2 • Recommended Operating Conditions 1 was corrected

from "1.4 to 1.6 V" to "1.425 to 1.575 V" (SAR 33851).

The TJ symbol was added to the table and notes regarding TA and TJ were

removed. The second of two parameters in the VCCI and VMV row, called "3.3 V

DC supply voltage," was corrected to "3.0 V DC supply voltage" (SAR 37227).

2-2

The reference to guidelines for global spines and VersaTile rows, given in the

"Global Clock Contribution—PCLOCK" section, was corrected to the "Spine

Architecture" section of the Global Resources chapter in the ProASIC3E

FPGA Fabric User's Guide (SAR 34735).

2-10

tDOUT was corrected to tDIN in Figure 2 -3 • Input Buffer Timing Model and Delays

(example) (SAR 37109). 2-14

The typo related to the values for 3.3 V LVCMOS Wide Range in Table 2-17

• Summary of I/O Timing Characteristics—Software Default Settings was

corrected (SAR 37227).

2-20

The notes regarding drive strength in the "Summary of I/O Timing Characteristics

– Default I/O Software Settings" section and "3.3 V LVCMOS Wide Range"

section and tables were revised for clarification. They now state that the minimum

drive strength for the default software configuration when run in wide range is

±100 µA. The drive strength displayed in software is supported in normal range

only. For a detailed I/V curve, refer to the IBIS models (SAR 34763).

2-19, 2-27

"TBD" for 3.3 V LVCMOS Wide Range in Table 2-19 • I/O Output Buffer Maximum

Resistances1 and Table 2-21 • I/O Short Currents IOSH/IOSL was replaced by

"Same as regular 3.3 V LVCMOS" (SAR 33853).

3.3 V LVCMOS Wide Range information was separated from regular 3.3 V

LVCMOS and placed into its own new section, "3.3 V LVCMOS Wide Range".

Values of IOSH and IOSL were added in Table 2-29 • Minimum and Maximum DC

Input and Output Levels (SAR 33853).

2-21,

2-23

Datasheet Information

5-2 Revision 10

Revision 10

(continued) The formulas in the table notes for Table 2-20 • I/O Weak Pull-Up/Pull-Down

Resistances were corrected (SAR 34755). 2-22

The AC Loading figures in the "Single-Ended I/O Characteristics" section were

updated to match tables in the "Summary of I/O Timing Characteristics – Default

I/O Software Settings" section (SAR 34889).

2-25

The titles and subtitles for Table 2-31 • 3.3 V LVCMOS Wide Range High Slew

and Table 2-32 • 3.3 V LVCMOS Wide Range Low Slew were corrected (SAR

37227).

2-28, 2-29

The following notes were removed from Table 2-78 • LVDS Minimum and

Maximum DC Input and Output Levels (SAR 34812):

±5%

Differential input voltage = ±350 mV

2-50

Minimum pulse width High and Low values were added to the tables in the

"Global Tree Timing Characteristics" section. The maximum frequency for global

clock parameter was removed from these tables because a frequency on the

global is only an indication of what the global network can do. There are other

limiters such as the SRAM, I/Os, and PLL. SmartTime sof tware should be used to

determine the design frequency (SAR 36957).

2-68

A note was added to Table 2-98 • ProASIC3E CCC/PLL Specification indicating

that when the CCC/PLL core is generated by Microsemi core generator software,

not all delay values of the specified del ay increments are available (SAR 34824).

2-70

The following figures were deleted. Reference was made to a new application

note, Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-Based

cSoCs and FPGAs, which covers these cases in detail (SAR 34872).

Figure 2-44 • Write Access after Write onto Same Address

Figure 2-45 • Read Access after Write onto Same Address

Figure 2-46 • Write Access after Read onto Same Address

The port names in the SRAM "Timing Waveforms", SRAM "Timing

Characteristics" tables, Figure 2-47 • FIFO Reset, and the FIFO "Timing

Characteristics" tables were revised to ensure consistency with the software

names (SAR 35750).

2-73,

2-76,

2-79,

2-81

The "Pin Descriptions and Packaging" chapter is new (SAR 34771). 3-1

Package names used in the "Package Pin Assignments" section were revised to

match standards given in Package Mechanical Drawings (SAR 34771). 4-1

Pin E6 for the FG256 package was corrected from VvB0 to VCCIB0 (SARs

30364, 31597, 26243). 4-9

July 2010 The versioning system for datasheets has been changed. Datasheets are

assigned a revision number that increments each time the datasheet is revised.

The "ProASIC3E Device Status" table on page II indicates the status for each

device in the device family.

N/A

Revision Changes Page

ProASIC3E Flash Family FPGAs

Revision 10 5-3

Revision Changes Page

Revision 9 (Aug 2009)

Product Brief v1.2 All references to speed grade –F have been removed from this document. N/A

The "Pro I/Os with Advanced I/O Standards" section was revised to add

definitions of hot-swap and cold-sparing. 1-6

DC and Switching

Characteristics v1.3 3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the

datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V

LVCMOS data.

N/A

IIL and IIH input leakage current information was added to all "Minimum and

Maximum DC Input and Output Levels" tables. N/A

–F was removed from the datasheet. The speed grade is no longer supported. N/A

In the Table 2-2 • Recommended Operating Conditions 1 "3.0 V DC supply

voltage" and note 4 are new. 2-2

The Table 2-4 • Overshoot and Unde rshoot Limits 1 table was updated. 2-3

The Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays

table was updated. 2-5

There are new parameters and data was updated in the Table 2-99 • RAM4K9

table. 2-76

There are new parameters and data was updated in the Table 2-100

• RAM512X18 ta bl e. 2-77

Revision 8 (Feb 2008)

Product Brief v1.1 Table 1-2 • ProASIC3E FPGAs Package Sizes Dimensions is new. 1-II

Revision 7 (Jun 2008)

DC and Switching

Characteristics v1.2

The title of Table 2-4 • Overshoot and Undershoot Limits 1 was modified to

remove "as measured on quiet I/Os." Table note 2 was revised to remove

"estimated SSO density over cycles." Table note 3 was deleted.

2-3

Table 2-78 • LVDS Minimum and Maximum DC Input and Output Levels was

updated. 2-50

Revision 6 (Jun 2008) The A3PE600 "FG484" table was missing G22. The pin and its function were

added to the table. 4-17

Revision 5 (Jun 2008)

Packaging v1.4 The naming conventions changed for the following pins in the "FG484" for the

A3PE600:

Pin Number New Function Name

J19 IO45PPB2V1

K20 IO45NPB2V1

M2 IO114NPB6V1

N1 IO114PPB6V1

N4 GFC2/IO115PPB6V1

P3 IO115NPB6V1

4-17

Revision 4 (Apr 2008)

Product Brief v1.0 The product brief portion of the datasheet was divided into two sections and given

a version number, starting at v1.0. The first section of the document includes

features, benefits, ordering information, and temperature and speed grade

offerings. The second section is a device family overview.

N/A

Packaging v1.3 The "FG324" package di a gr am w as repl a ce d. 4-12

Datasheet Information

5-4 Revision 10

Revision 3 (Apr 2008)

Packaging v1.2 The following pins had duplicates and the extra pins were deleted from the

"PQ208" A3PE3000 table:

36, 62, 171

Note: There were no pin function changes in this update.

4-6

The following pins had duplicates and the extra pins were deleted from the

"FG324" table:

E2, E3, E16, E17, P2, P3, T16, U17

Note: There were no pin function changes in this update.

4-12

The "FG256" pin table was updated for the A3PE600 device because the old PAT

were based on the IFX die, and this is the final UMC die version. 4-9

The "FG484" was updated for the A3PE600 device because the old PAT were

based on the IFX die, and this is the final UMC die version. 4-17

The following pins had duplicates and the extra pins were deleted from the

"FG896" table:

AD6, AE5, AE28, AF29, F5, F26, G6, G25

Note: There were no pin function changes in this update.

4-41

Revision 2 (Mar 2008)

Product Brief rev. 1 The FG324 package was added to the "ProASIC3E Product Family" table, the

"I/Os Per Package1" table, and the "Temperature Grade Offerings" table for

A3PE3000.

I, II, IV

Revision 1 (Feb 2008)

DC and Switching

Characteristics v1.1

In Table 2-3 • Flash Programming Limits – Retention, Storage and Operating

Temperature 1, Maximum Operating Junction Temperature was changed from

110°C to 100°C for both commercial and industrial grades.

2-2

The "PLL Behavior at Brownout Condition" section is new. 2-4

In the "PLL Contribution—PPLL" section, the following was deleted:

FCLKIN is the input clock frequency. 2-11

In Table 2-14 • Summary of Maximum and Minimum DC Input Levels, the note

was incorrect. It previously said TJ and it was corrected and changed to TA.2-18

In Table 2-98 • ProASIC3E CCC/PLL S pecification, the SCLK parameter and note

1 are new. 2-70

Tab le 2-103 • JTAG 1532 was populated with the parameter data, w hich was not

in the previous version of the document. 2-82

Revision 1 (cont’d)

Packaging v1.1 The "PQ208" pin table for A3PE3000 was updated. 4-6

The "FG324" pin table for A3PE3000 is new. 4-13

The "FG484" pin table for A3PE3000 is new. 4-27

The "FG896" pin table for A3PE3000 is new. 4-41

Revision 0 (Jan 2008) This document was previously in datasheet v2.1. As a result of moving to the

handbook format, Actel has restarted the version numbers. The new version

number is 51700098-001-0.

N/A

v2.1

(July 2007) Core MP7 information was removed from the "Features and Benefits" secti on. i

The M1 device part numbers have been updated in Table 4 • ProASIC3E

Product Family, "Packaging Tables", "Temperature Grade Offerings", "Speed

Grade and Temperature Grade Matrix", and "Speed Grade and Temperature

Grade Matrix".

ii, iii,

iv, iv

Revision Changes Page

ProASIC3E Flash Family FPGAs

Revision 10 5-5

v2.1

(continued) The words "ambient temperature" were added to the temperature range in the

"Temperature Grade Offerings", "Speed Grade and Temperature Grade Matrix",

and "Speed Grade and Temperature Grade Matrix" sections.

iii, iv, iv

The "Clock Conditioning Circuit (CCC) and PLL" section was updated. i

The caption "Main (chip)" in Figure 2-9 • Overview of Automotive ProASIC3

VersaNet Global Network was changed to "Chip (main)." 2-9

The TJ parameter in Table 3-2 • Recommended Operating Conditions was

changed to TA, ambient temperature, and table notes 4–6 were added. 3-2

The "PLL Macro" section was updated to add information on the VCO and PLL

outputs during power-up. 2-15

v2.0

(April 2007) In th e "Temperature Grade Offerings" section, Ambient was deleted. iii

Ambient was deleted from "Temperature Grade Offerings". iii

Ambient was deleted from the "Speed Grade and Temperature Grade Ma trix". iv

The "PLL Macro" section was updated to include power-up information. 2-15

Table 2-13 • ProASIC3E CCC/PLL Specification was updated. 2-30

Figure 2-19 • Peak-to-Peak Jitter Definition is new. 2-18

The "SRAM and FIFO" section was updated with operation and timing

requirement information. 2-21

The "RESET" section was updated with read and write information. 2-25

The "Introduction" in the "Advanced I/Os" section was updated to include

information on input and output buffers being disabled. 2-28

In the Table 2-15 • Levels of Hot-Swap Support, the ProASIC3 compliance

descriptions were updated for level s 3 an d 4. 2-34

Table 2-45 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in ProASIC3E

Devices was updated. 2-64

Notes 3, 4, and 5 were added to Table 2-17 • Comparison Table for 5 V–

Compliant Receiver Scheme. 5 x 52.72 was changed to 52.7 and the Maximum

current was updated from 4 x 52.7 to 5 x 52.7.

2-40

The "VCCPLF PLL Supply Voltage" section was updated. 2-50

The "VPUMP Programming Supply Voltage" section was updated. 2-50

The "GL Globals" section was updated to include information about direct input

into quadrant clocks. 2-51

VJTAG was deleted from the "TCK Test Clock" section. 2-51

In Ta ble 2-22 • Recommended Tie-Off Values fo r the TCK and TRST Pin s, TSK

was changed to TCK in note 2. Note 3 was also updated . 2-51

Ambient was deleted from Table 3-2 • Recommended Operating Conditions.

VPUMP programming mode was changed from "3.0 to 3.6" to "3.15 to 3.45". 3-2

Note 3 is new in Tab le 3-4 • Overshoot and Undershoot Limits (as measured on

quiet I/Os). 3-2

In EQ 3-2, 150 was changed to 110 and the result changed to 5.88. 3-5

Revision Changes Page

Datasheet Information

5-6 Revision 10

v2.0

(continued) Table 3-6 • Temperature and Voltage Derating Factors for Timing Delays was

updated. 3-5

Table 3-5 • Package Thermal Resistivities was updated. 3-5

Table 3-10 • Different Components Contributing to the Dynamic Power

Consumption in ProASIC3E Devices was updated. 3-8

tWRO and tCCKH were added to Table 3-94 • RAM4K9 and Table

3-95 • RAM512X18. 3-74 to

3-74

The note in Table 3-24 • I/O Input Rise Time, Fall Time, and Related I/O

Reliability was updated. 3-23

Figure 3-43 • Write Access After Write onto Same Address, Figure 3-44 • Read

Access After Write onto Same Address, and Figure 3-45 • Write Access After

Read onto Same Address are new.

3-71 to 3-

Figure 3-53 • Timing Diagram was updated. 3-80

Notes were added to the package diagrams identifying if they were to p or bottom

view. N/A

The A3PE1500 "208-Pin PQFP " table is new. 4-4

The A3PE1500 "484-Pin FBGA" table is new. 4-18

The A3PE1500 "A3PE1500 Function" table is new. 4-24

Advance v0.6

(January 2007) In the "Packaging Tables" table, the number of I/Os for the A3PE1500 was

changed for the FG484 and FG676 packages. ii

Advance v0.5

(April 2006) B-LV DS and M-LDVS are new I/O standards added to the datasheet. N/A

The term flow-through was changed to pass-through. N/A

Figure 2-8 • Very-Long-Line Resources was updated. 2-8

The footnotes in Figure 2-27 • CCC/PLL Macro were updated. 2-28

The Delay Increments in the Programmable Del ay Blocks specification in Figure

2-24 • ProASIC3E CCC Options. 2-24

The "SRAM and FIFO" section was updated. 2-21

The "RESET" section was updated. 2-25

The "WCLK and RCLK" section was updated. 2-25

The "RESET" section was updated. 2-25

The "RESET" section was updated. 2-27

B-LVDS and M-LDVS are new I/O standards added to the datasheet. N/A

The term flow-through was changed to pass-through. N/A

Figure 2-8 • Very-Long-Line Resources was updated. 2-8

The footnotes in Figure 2-27 • CCC/PLL Macro were updated. 2-28

The Delay Increments in the Programmable Del ay Blocks specification in Figure

2-24 • ProASIC3E CCC Options. 2-24

The "SRAM and FIFO" section was updated. 2-21

The "RESET" section was updated. 2-25

The "WCLK and RCLK" section was updated. 2-25

Revision Changes Page

ProASIC3E Flash Family FPGAs

Revision 10 5-7

Advance v0.5

(continued) The "RESET" section was updated. 2-25

The "RESET" section was updated. 2-27

The "Introduction" of the "Introduction" section was updated. 2-28

PCI-X 3.3 V was added to the Compatible Standards for 3.3 V in Table 2-

11 • VCCI Voltages and Compatible Standards 2-29

Table 2-35 • ProASIC3E I/O Features was updated. 2-54

The "Double Data Rate (DDR) Support" section was updated to include

information concerning implementation of the feature. 2-32

The "Electrostatic Discharge (ESD) Protection" section was updated to include

testing information. 2-35

Level 3 and 4 descriptions were updated in Table 2-43 • I/O Hot-Swap and 5 V

Input Tolerance Capabilities in ProASIC3 Devices. 2-64

The notes in Table 2-45 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in

ProASIC3E Devices were updated. 2-64

The "Simultaneous Switching Outputs (SSOs) and Printed Circuit Board Layout"

section is new. 2-41

A footnote was added to Table 2-37 • Maximum I/O Frequency for Single-End ed

and Differential I/Os in All Banks in ProASIC3E Devices (maximum drive strength

and high slew selected).

2-55

Tab le 2-48 • ProASIC3 E I/O Attribute s vs. I/O Standard Applications 2-81

Table 2-55 • ProASIC3 I/O Standards—SLEW and Output Drive (OUT_DRIVE)

Settings 2-85

The "x" was updated in the "Pin Descriptions" section. 2-50

The "VCC Core Supply Voltage" pin description was updated. 2-50

The "VMVx I/O Supply Voltage (quiet)" pin description was updated to include

information concerning leaving the pin unconnected. 2-50

EXTFB was removed from Figure 2-24 • ProASIC3E CCC Options. 2-24

The CCC Output Peak-to-Peak Period Jitter FCCC_OUT was updated in Table

2-13 • ProASIC3E CCC/PLL Specificatio n. 2-30

EXTFB was removed from Figure 2-27 • CCC/PLL Macro. 2-28

The LVPECL specification in Table 2-45 • I/O Hot-Swap and 5 V Input Tole rance

Capabilities in ProASIC3E Devices was updated. 2-64

Tab le 2-15 • Levels of Hot-Swap Support was updated. 2-34

The "Cold-Sparing Support" section was updated. 2-34

"Electrostatic Discharge (ESD) Protection" section was updated. 2-35

The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"

section. 2-50

The "VJTAG JTAG Supply Voltage" pin description was updated. 2-50

The "VPUMP Programming Supply Voltage" pin description was updated to

include information on what happens when the pin is tied to ground. 2-50

Revision Changes Page

Datasheet Information

5-8 Revision 10

Advance v0.5

(continued) The "I/O User Input/Output" pin description was updated to include information on

what happens when the pin is unused. 2-50

The "JTAG Pins" section was updated to include information on what happens

when the pin is unused. 2-51

The "Programming" section was updated to include information concerning

serialization. 2-53

The "JTAG 1532" section was updated to include SAMPLE/PRELOAD

information. 2-54

The "DC and Switching Characteristics" chapter was updated with new

information. Starting

on page

3-1

Tab le 3-6 was updated. 3-5

In Table 3-1 0, PA C4 was updated. 3-8

Table 3-19 was updated. 3-20

The note in Table 3-24 was updated. 3-23

All Timing Characteristics tables were updated from LVTTL to Register Delays 3-26 to

3-64

The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated. 3-74 to

3-79

FTCKMAX was updated in Table 3-98. 3-80

Advance v0.4

(October 2005) The "Packaging Tables" table was updated. ii

Advance v0.3 Figure 2-11 was updated. 2-9

The "Clock Resources (VersaNets)" section was updated. 2-9

The "VersaNet Global Networks and Spine Access" secti on was updated. 2-9

The "PLL Macro" section was updated. 2-15

Figure 2-27 was updated. 2-28

Figure 2-20 was updated. 2-19

Tab le 2-5 was updated. 2-25

Tab le 2-6 was updated. 2-25

The "FIFO Flag Usage Considerations" section was updated. 2-27

Table 2-33 was updated. 2-51

Figure 2-24 was updated. 2-31

The "Cold-Sparing Support" section is new. 2-34

Table 2-45 was updated. 2-64

Table 2-48 was updated. 2-81

Pin descriptions in the "JTAG Pins" section were updated. 2-51

The "Pin Descriptions" section wa s updated. 2-50

Tab le 3-7 was updated. 3-6

Revision Changes Page

ProASIC3E Flash Family FPGAs

Revision 10 5-9

Advance v0.3

(continued) The "Methodology" section was updated. 3-9

The A3PE3000 "208-Pin PQF P " pin table was up dated. 4-6

Revision Changes Page

Datasheet Information

5-10 Revision 10

Datasheet Categories