SPEC NO:DSAD1179 REV NO: V.1 DATE:MAR/28/2003 PAGE: 1 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: Y.H.LI
4.0X0.8 mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
Features
l4.0mmx0.8mm SMT LED, 1.4mm THICKNESS.
lLOW POWER CONSUMPTION.
lWIDE VIEWING ANGLE.
lIDEAL FOR BACKLIGHT AND INDICATOR.
lVARIOUS COLORS AND LENS TYPES AVAILABLE.
lPACKAGE : 2000PCS / REEL.
APJKA4008VGC GREEN
Description
The Green source color devices are made with
InGaN on SiC Light Emitting Diode.
SPEC NO:DSAD1179 REV NO: V.1 DATE:MAR/28/2003 PAGE: 2 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: Y.H.LI
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°°
°°
°C
Absolute Maximum Ratings at TA=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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SPEC NO:DSAD1179 REV NO: V.1 DATE:MAR/28/2003 PAGE: 3 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: Y.H.LI
Green APJKA4008VGC
SPEC NO:DSAD1179 REV NO: V.1 DATE:MAR/28/2003 PAGE: 4 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APJKA4008VGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
