1
FEATURES
APPLICATIONS
DESCRIPTION/ORDERING INFORMATION
1 2 3
4
5
6
7
8
HSD–
HSD+
OE
D–
D+
N.C.
GND
VCC
RSEPACKAGE
(TOP VIEW)
1 2 3
4
5
6
7
8
RSEPACKAGE
(BOTTOMVIEW)
HSD+
N.C.
D+
D–
OE
GND
VCC
HSD–
N.C. Nointernalconnection-
TS3USB31HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008www.ti.com
•V
CC
Operation at 3 V and 4.3 V•1.8-V Compatible Control-Pin Inputs•I
OFF
Supports Partial Power-Down ModeOperation
•r
on
= 10 ΩMaximum•Δr
on
<0.35 ΩTypical•C
io(ON)
= 6 pF Typical•Low Power Consumption (1 µA Maximum)•ESD Performance Tested Per JESD 22– 6000-V Human-Body Model(A114-B, Class II)– 1000-V Charged-Device Model (C101)– 250-V Machine Model (A115-A)•Wide – 3-dB Bandwidth = 1220 MHz Typical•Packaged in 8-Pin TQFN (1.5 mm ×1.5 mm)
•Routes Signals for USB 1.0, 1.1, and 2.0
The TS3USB31 is a high-bandwidth switch speciallydesigned for the switching of high-speed USB 2.0signals in handset and consumer applications, suchas cell phones, digital cameras, and notebooks withhubs or controllers with limited USB I/Os. The widebandwidth (750 MHz) of this switch allows signals topass with minimum edge and phase distortion. Theswitch is bidirectional and offers little or noattenuation of the high-speed signals at the outputs. Itis designed for low bit-to-bit skew and highchannel-to-channel noise isolation, and is compatiblewith various standards, such as high-speed USB 2.0(480 Mbps).
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
– 40 °C to 85 °C QFN – RSE Tape and reel TS3USB31RSER L9
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
PIN DESCRIPTION
NAME DESCRIPTION
OE Bus-switch enableD+, D – ,
Data portsHSD+, HSD –NC No connect
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
BLOCK DIAGRAM
HSD1+
HSD1–
Control
D+
D–
OE
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE THERMAL IMPEDANCE
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
TRUTH TABLE
OE FUNCTION
H DisconnectL D+, D – = HSD+, HSD –
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range – 0.5 7 VV
IN
Control input voltage range
(2) (3)
– 0.5 7 VHSD+, HSD – – 0.5 V
CC
+ 0.3V
I/O
Switch I/O voltage range
(2) (3) (4)
D+, D – when V
CC
> 0 – 0.5 V
CC
+ 0.3 VD+, D – when V
CC
= 0 5.25I
IK
Control input clamp current V
IN
< 0 – 50 mAI
I/OK
I/O port clamp current V
I/O
< 0 – 50 mAI
I/O
ON-state switch current
(5)
± 64 mAContinuous current through V
CC
or GND ± 100 mAT
stg
Storage temperature range – 65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to ground, unless otherwise specified.(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(4) V
I
and V
O
are used to denote specific conditions for V
I/O
.(5) I
I
and I
O
are used to denote specific conditions for I
I/O
.
TYP UNIT
θ
JA
Package thermal impedance
(1)
RSE package 253 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
2Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
www.ti.com
RECOMMENDED OPERATING CONDITIONS
(1)
ELECTRICAL CHARACTERISTICS
(1)
DYNAMIC ELECTRICAL CHARACTERISTICS
TS3USB31HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
MIN MAX UNIT
V
CC
Supply voltage 3.0 4.3 VV
CC
= 3 V to 3.6 V 1.3V
IH
High-level control input voltage VV
CC
= 4.3 V 1.7V
CC
= 3 V to 3.6 V 0.5V
IL
Low-level control input voltage VV
CC
= 4.3 V 0.7V
I/O
Data input/output voltage 0 V
CC
VT
A
Operating free-air temperature – 40 85 °C
(1) All unused control inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
IK
V
CC
= 3 V, I
I
= – 18 mA – 1.2 VI
IN
Control inputs V
CC
= 4.3 V, V
IN
= 0 to 4.3 V, V
CC
= 0 V ± 1 µAI
OZ
(3)
V
CC
= 4.3 V, V
O
= 0 to 3.6 V, V
I
= 0, Switch OFF ± 1 µAI
OFF
D+ and D – V
CC
= 0 V, V
O
= 0 to 4.3 V, V
I
= 0, V
IN
= V
CC
or GND ± 2 µAI
CC
V
CC
= 4.3 V, I
I/O
= 0, Switch ON or OFF 1 µA
ΔI
CC
(4)
Control inputs V
CC
= 4.3 V, V
IN
= 2.6 V 10 µAC
in
Control inputs V
CC
= 0 V, V
IN
= V
CC
or GND 1 pFC
io(OFF)
V
CC
= 3.3 V, V
I/O
= 3.3 V or 0, Switch OFF 2 pFC
io(ON)
V
CC
= 3.3 V, V
I/O
= 3.3 V or 0, Switch ON 6 pFr
on
(5)
V
CC
= 3 V, V
I
= 0.4 V, I
O
= – 8 mA 6 10 Ω
Δr
on
V
CC
= 3 V, V
I
= 0.4 V, I
O
= – 8 mA 0.35 Ω
r
on(flat)
V
CC
= 3 V, V
I
= 0 V or 1 V, I
O
= – 8 mA 2 Ω
(1) V
IN
and I
IN
refer to control inputs. V
I
, V
O
, I
I
, and I
O
refer to data pins.(2) All typical values are at V
CC
= 3.3 V (unless otherwise noted), T
A
= 25 °C.(3) For I/O ports, the parameter I
OZ
includes the input leakage current.(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
CC
or GND.(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance isdetermined by the lower of the voltages of the two (A or B) terminals.
over operating range, T
A
= – 40 °C to 85 °C, V
CC
= 3.3 V ± 10%, GND = 0 V
PARAMETER TEST CONDITIONS TYP
(1)
UNIT
X
TALK
Crosstalk R
L
= 50 Ω, f = 240 MHz, See Figure 9 – 53 dBO
IRR
OFF isolation R
L
= 50 Ω, f = 240 MHz, See Figure 8 – 30 dBBW Bandwidth ( – 3 dB) R
L
= 50 Ω, C
L
= 5 pF, See Figure 10 1220 MHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TS3USB31
www.ti.com
SWITCHING CHARACTERISTICS
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
over operating range, T
A
= – 40 °C to 85 °C, V
CC
= 3.3 V ± 10%, GND = 0 V
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
R
L
= 50 Ω, C
L
= 5 pF,t
pd
Propagation delay
(2) (3)
0.25 nsSee Figure 11R
L
= 50 Ω, C
L
= 5 pF,t
ON
Line enable time, OE to D, nD 30 nsSee Figure 7R
L
= 50 Ω, C
L
= 5 pF,t
OFF
Line disable time, OE to D, nD 25 nsSee Figure 7R
L
= 50 Ω, C
L
= 5 pF,t
SK(O)
Output skew between center port to any other port
(2)
50 psSee Figure 12Skew between opposite transitions of the same output R
L
= 50 Ω, C
L
= 5 pF,t
SK(P)
20 ps(t
PHL
– t
PLH
)
(2)
See Figure 12R
L
= 50 Ω, C
L
= 5 pF,t
J
Total jitter
(2)
t
R
= t
F
= 500 ps at 480 Mbps 200 ps(PRBS = 2
15
– 1)
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.(2) Specified by design(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/falltimes of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used ina system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
4Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
www.ti.com
APPLICATION INFORMATION
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency(Hz)
Attenuation(dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10
Frequency(Hz)
Magnitude (dB)
–100
–120
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
TS3USB31
VCC
USB
Connector
Base Band
Processor
or FS USB
Controller
HS USB
Controller
TS3USB31HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 1. Insertion Loss Figure 2. OFF Isolation
Figure 3. Crosstalk
Figure 4. Application Diagram
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TS3USB31
www.ti.com
Time ( 10 ) (s)X–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Time ( 10 ) (s)X–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 5. Eye Pattern: 480-Mbps USB Signal With No Figure 6. Eye Pattern: 480-Mbps USB Signal With SwitchSwitch (Through Path) NO Path
6Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
www.ti.com
PARAMETER MEASUREMENT INFORMATION
1D
2D D
VOUT1
VIN
Channel OFF: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
VCC
GND
50 W
50 W
Network Analyzer
Source
Signal
VSEL
+
VSEL = VCC
S
TS3USB31HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
Figure 7. Turn-On (t
ON
) and Turn-Off Time (t
OFF
)
Figure 8. OFF Isolation (O
IRR
)
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TS3USB31
www.ti.com
1D
2D
50 W
50 W
VOUT1 VIN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
VCC
GND
VOUT2
Source
Signal
Channel OFF: 2D to D
Network Analyzer
VSEL
+
VSEL = VCC
S
VCC
GND
1D
VSEL
2D
D
50 W
50 W
VOUT1
VIN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
VCTRL = GND
S
GND
400 mV
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 9. Crosstalk (X
TALK
)
Figure 10. Bandwidth (BW)
Figure 11. Propagation Delay
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Product Folder Link(s): TS3USB31
www.ti.com
Pulse Skew tSK(P)
Output Skew tSK(P)
VOL
VOH
VOH
VOL
VOH
VOL
TS3USB31HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 12. Skew Test
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TS3USB31
www.ti.com
VCC
IIN
ron +VIN *VOUT2 or VOUT1
IIN
W
GND
Channel ON
1D
VSEL
2D
DVIN
VSEL = VIH or VIL
VOUT2
VOUT1
+
+S
Channel OFF
OFF-State Leakage Current
VSEL = VIH or VIL
VCC
GND
1D
VSEL
2D DVIN
VOUT2
VOUT1
+
+
+
S
VCC
GND
VBIAS VSEL
VSEL = VCC or GND
VBIAS = VCC or GND
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
Capacitance
Meter
VIN
VOUT2
VOUT1
D
2D
1D
S
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCHWITH SINGLE ENABLE
SCDS242D – JULY 2007 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 13. ON-State Resistance (r
on
)
Figure 14. OFF-State Leakage Current
Figure 15. Capacitance
10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TS3USB31RSER ACTIVE UQFN RSE 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3USB31RSERG4 ACTIVE UQFN RSE 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS3USB31RSER UQFN RSE 8 3000 180.0 8.4 1.6 1.6 0.66 4.0 8.0 Q2
TS3USB31RSER UQFN RSE 8 3000 179.0 8.4 1.7 1.7 0.76 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Mar-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3USB31RSER UQFN RSE 8 3000 202.0 201.0 28.0
TS3USB31RSER UQFN RSE 8 3000 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Mar-2012
Pack Materials-Page 2
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