Low-Profile Shielded Drum Inductors HALOGEN HF Pb FREE SD7030 Series Applications SMD Device * * * * * Notebook computers TFT LCD Bias supplies Handheld instruments Battery power, Li-lon, 2-cell White LED driver * * * * * Wireless handsets GPS Receivers ADSL/DSL/Cable modems Digital still camera Buck and boost inductor Environmental Data Description * * * * * * 125C maximum total operating temperature Low profile 7.0 x 7.0 x 3.0mm maximum surface mount package Ferrite material shielded drum core Inductance range from 1.5H to 680H Current range from 0.21 to 5.5 Amps Frequency range up to 1MHz Part Number5 SD7030-1R5-R SD7030-3R3-R SD7030-3R9-R SD7030-5R0-R SD7030-6R0-R SD7030-7R3-R SD7030-8R0-R SD7030-100-R SD7030-120-R SD7030-150-R SD7030-180-R SD7030-220-R SD7030-260-R SD7030-300-R SD7030-390-R SD7030-440-R SD7030-560-R SD7030-680-R SD7030-820-R SD7030-101-R SD7030-121-R SD7030-151-R SD7030-181-R SD7030-221-R SD7030-271-R SD7030-331-R SD7030-391-R SD7030-471-R SD7030-561-R SD7030-681-R OCL1 H 30% 1.5 3.3 4.1 4.9 5.8 7.0 7.8 10.0 11.5 14.6 17.3 21.0 24.9 30.0 39.7 43.4 54.4 66.6 81.4 95.5 115.2 145 174 211 264 317 381 460 561.0 677.2 Isat3 Amps 4.5 3.00 2.60 2.40 2.25 2.10 1.85 1.70 1.55 1.40 1.32 1.20 1.05 0.97 0.86 0.80 0.73 0.65 0.60 0.54 0.50 0.44 0.40 0.36 0.33 0.30 0.27 0.25 0.23 0.21 2 Irms: DC current for an approximate T of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 1011 BU-SB111167 Packaging * Supplied in tape and reel packaging, 1500 parts per 13" diameter. reel Product Specifications Irms2 Amps 5.5 3.7 3.4 3.2 2.8 2.3 2.2 2.1 1.9 1.7 1.7 1.4 1.3 1.2 1.1 1.1 0.99 0.85 0.82 0.70 0.67 0.57 0.54 0.51 0.44 0.38 0.36 0.34 0.29 0.28 1 Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc. 3 Isat Amps peak for approximately 35% rolloff (@25C) * Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020D compliant Typ. DCR m @ 25C 10 20 22 26 29 45 48 54 58 70 79 107 118 138 175 198 231 253 325 446 629 715 805 1102 1259 1438 1857 2150 2857 3206 Max DCR m @ 25C 12 24 27 31 35 54 58 65 70 84 95 128 142 165 210 238 277 304 390 535 755 858 966 1322 1475 1725 2228 2581 3428 3847 K-factor 4 32 22 19 17 16 13 12 11 10 9.3 8.8 7.6 6.9 6.4 5.7 5.3 4.9 4.3 4.0 3.6 3.3 2.9 2.7 2.4 2.2 2.0 1.8 1.7 1.5 1.4 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*I, Bp-p(mT), K: (K factor from table), L: (Inductance in H), I (Peak-to-peak ripple current in Amps). 5 Part Number Definition: SD7030-xxx-R SD7030 = Product code and size; -xxx = Inductance value in H; R = decimal point; If no R is present, third character = # of zeros. -R suffix = RoHS compliant Page 1 of 4 Data Sheet: 4330 Dimensions - mm Top View Bottom View Front View Recommended Pad Layout Schematic Left View Part Marking: Coiltronics Logo xxx = inductance value in H. R = decimal point. If no "R" is present, third character = # of zeros. wwlly or wwllyy = date code. R = revision level Packaging Information - mm Supplied in tape-and-reel packaging, 1500 parts per reel, 13" diameter reel. Core Loss 1MHz 500kHz 300kHz 200kHz 100kHz 1011 BU-SB111167 Page 2 of 4 Data Sheet: 4330 Temperature Rise vs. Loss Inductance Characteristics -40C +25C +85C 1011 BU-SB111167 Page 3 of 4 Data Sheet: 4330 Solder Reflow Profile TP TC -5C Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s t Volume mm3 <350 235C 220C Volume mm3 _350 > 220C 220C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm ts 25C Time 25C to Peak Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak * Temperature min. (Tsmin) Standard SnPb Solder 100C Lead (Pb) Free Solder 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature 60-120 Seconds 60-120 Seconds 3C/ Second Max. 3C/ Second Max. 183C 60-150 Seconds 217C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6C/ Second Max. 6C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. (c) 2011 Cooper Bussmann w w w. c o o p e r bu s s m a n n . c o m 1011 BU-SB111167 Page 4 of 4 Data Sheet: 4330