INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LDA200-R05 1
LDA200
e3
Pb
Dual Optocouplers, Bidirectional Input
Single-Transistor Output
Part Number Description
LDA200 8-Pin DIP (50/tube)
LDA200S 8-Pin Surface Mount (50/tube)
LDA200STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 30 VP
Current Transfer Ratio - CTR (Typ) 300 %
Saturation Voltage - VCE(sat) 0.5 V
Input Control Current - IF1mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Loop Detect
• Ringing Detect
• Current Sensing
• 100mA Continuous Load Rating
• 3750Vrms Input/Output Isolation
• Bidirectional Input
• 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Packaging Available
LDA200 is a dual optocoupler with bidirectional
inputs and single-transistor outputs. Current transfer
ratios range from 33% to 1000% with a typical value
of 300%.
Approvals
1
2
3
4
8
7
6
5
A/K
A/K
A/K
A/K
E
C
C
E
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R05
LDA200
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Breakdown Voltage 30 VP
Input Control Current 100 mA
Peak (10ms) 1 A
Power Dissipation
Input 1150 mW
Phototransistor 2150 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33mW / ºC
2 Derate linearly 2mW / ºC
Electrical Characteristics @ 25ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage IC = 10µA BVCEO 30 90 - V
Phototransistor Dark Current VCEO = 5V, IF = 0mA ICEO - 10 500 nA
Saturation Voltage IC = 2mA, IF = 1mA VCE(sat) - 0.3 0.5 V
Current Transfer Ratio IF = 1mA, VCE = 0.5V CTR 33 300 1000 %
Output Capacitance 25V, f =1MHz COUT -6-pF
Input Characteristics
Input Control Current IC = 0.33mA, VCE = 0.5V IF--1mA
Input Voltage Drop IF = 5mA VF0.9 1.2 1.4 V
Common Characteristics
Capacitance, Input to Output - CI/O -3-pF
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton VCC=5V, IF=2mA, RL=1K7s
Turn-Off Time toff 20
Switching Characteristics @ 25ºC
Switching Time Test Circuit
VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
ton toff
VCE
INTEGRATED CIRCUITS DIVISION
LDA200
www.ixysic.com 3
R05
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. Current (Linear)
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. Current (Log)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
IF=1mA
LED Forward Current (mA)
0 102030405060
Current Transfer Ratio (%)
100
200
300
400
500
600
700
Typical CTR vs. LED Forward Current
(VCE=5V)
-40ºC
85ºC
55ºC
25ºC
Collector Voltage (V)
0123456
Collector Current (mA)
0
20
40
60
80
100
Typical Collector Current vs.
Collector Voltage
IF=50mA
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=20mA
Temperature (ºC)
ICE Current (mA)
ICE Current vs. Temperature
(VCE=5V)
-40 -20 0 20 40 60 80 100 120
0
20
40
60
80
100
IF=20mA
IF=2mA
IF=5mA
IF=10mA
IF=15mA
IF=1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Saturation Voltage vs. Temperature
(IF=2mA, IC=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
87
88
89
90
91
92
93
94
95
96
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Collector Leakage Current
vs. Temperature
VCE=10V
VCE=3V
VCE=5V
Load Resistance (:)
100 1k 10k 100k 1M
Turn-On Time (Ps)
0
2
4
6
8
10
12
14
Turn-On Time vs. Load Resistance
(VCC=5V)
IF=1mA
IF=5mA
IF=2mA
Load Resistance (k:)
0 100 200 300 400 500 600
Turn-Off Time (ms)
0
2
4
6
8
10
Turn-Off Time vs. Load Resistance
(VCC=5V)
IF=1mA
IF=5mA
IF=2mA
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R05
LDA200
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LDA200 / LDA200S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LDA200 / LDA200S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
LDA200
www.ixysic.com 5
R05
LDA200
LDA200S
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
LDA200
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LDA200-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
LDA200STR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
