February 2012 Doc ID 022075 Rev 1 1/10
10
ESDALY
Automotive dual Transil™ array for ESD protection
Features
■Dual unidirectional Transil functions
■Low leakage current: IR max. < 20 µA at VBR
■300 W peak pulse power (8/20 µs)
Benefits
■High ESD protection level: up to 25 kV
■High integration
■Suitable for high density boards
■AEC-Q101 qualified
Complies with the following standards
■ISO 10605: C = 150 pF, R = 330 Ω
– 30 kV (air discharge)
– 30 kV (contact discharge)
■ISO 10605: C = 330 pF, R = 330 Ω
– 30 kV (air discharge)
– 30 kV (contact discharge)
■ISO 7637-2(a)
– Pulse 1: VS = -100 V
– Pulse 2a: VS = +50 V
– Pulse 3a: VS = -150 V
– Pulse 3b: VS = +100 V
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
■Entertainment
■Signal communications
■Connectivity
■Comfort and convenience
Figure 1. Functional diagram
Description
The ESDALY is a monolithic array designed to
protect 1 line or 2 lines against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required. It can also be used as bidirectional
suppressor by connecting only pin 1 and 2.
TM: Transil is a trademark of STMicroelectronics.
a. Not applicable to parts with stand-off voltage lower
than the average battery voltage (13.5 V)
SOT23-3L
1
2
3
1
2
3
www.st.com
Characteristics ESDALY
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1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP Peak pulse voltage(1)
ISO 10605 (C = 330 pF, R = 330 Ω):
contact discharge
air discharge
ISO 10605: C = 150 pF, R = 330 Ω
contact discharge
air discharge
30
30
30
30
kV
PPP Peak pulse power (8/20µs) 300 W
IPP Peak pulse current (8/20µs)
ESDA5V3LY
ESDA6V1LY
ESDA14V2LY
ESDA25LY
25
18
14
7
A
TjOperating junction temperature range -40 to 150 °C
Tstg Storage temperature range -65 to +150 °C
TLMaximum lead temperature for soldering during 10 s at 5 mm from case 260 °C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Symbol Parameter
V = Breakdown voltage
I = Leakage current @ V
V = Stand-off voltage
I = Peak pulse current
I = Breakdown current
BR
RM RM
RM
PP
R
V = Clamping voltage
I = Forward current
R = Dynamic resistance
T = Voltage temperature coefficient
C = Line capacitance
CL
PP
d
line
α
I
V
VF
IF
IRM
IR
IPP
VRMVBR
VCL
Slope = 1/Rd
ESDALY Characteristics
Doc ID 022075 Rev 1 3/10
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Order code
VBR @ IRIRM @ VRM VCL@IPP(1) VF@ IFRd(2)
α
T(3) Cline
Min. Max. Max. Max. Max. Typ. Max. Typ.
V V mA µA V V A V mA mΩ10-4/°C pF
ESDA5V3LY 5.3 5.9 1 2 3 19 25 1.25 200 280 5 220
ESDA6V1LY 6.1 7.2 1 20 5.2 16 18 1.25 200 350 6 140
ESDA14V2LY 14.2 15.8 1 5 12 21 14 1.25 200 650 10 90
ESDA25LY 25 30 1 1 24 43 7 1.2 10 1000 10 50
1. 8/20 µs waveform
2. Square pulse, Ipp = 15 A, tp= 2.5 µs.
3. Δ VBR = αT* (Tamb - 25 °C) * VBR (25 °C)
Figure 3. Variation of peak pulse power
versus initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
(typical values)
0.0
200.0
400.0
600.0
0 25 50 75 100 125 150 175
Tj(°C)
Ppp (W)
10
100
1000
10000
1 10 100 1000
T
j
initial = 25 °C
tp(µs)
Ppp (W)
Figure 5. Variation of clamping voltage
versus peak pulse current (max.
values, 8/20 µs waveform)
Figure 6. Relative variation of leakage
current versus junction
temperature (typical values)
0.1
1.0
10.0
100.0
0 4 8 12 16 20 24 28 32 36 40 44
8/20µs
Tjinitial = 25 °C
ESDA5V3LY
ESDA6V1LY
ESDA14V2LY
ESDA25LY
Ipp (A)
VCL (V)
0.0
0.1
1.0
10.0
100.0
1000.0
10000.0
25 50 75 100 125 150
ESDA5V3LY (VR=VRM=3V)
ESDA6V1LY (VR=VRM=5.2V)
ESDA14V2LY (VR=VRM=12V)
ESDA25LY (VR=VRM=24V)
Tj(°C)
IR(nA)
Characteristics ESDALY
4/10 Doc ID 022075 Rev 1
Note: ISO7637-2 pulse responses are not applicable for products with a breakdown voltage lower
than the average battery voltage (13.5 V) like ESDA5V3LY and ESDA6V1LY.
Figure 7. ISO 7637-2 pulse 1 response
(VS = -100 V)
Figure 8. ISO 7637-2 pulse 2a response
(VS = 50 V)
Figure 9. ISO 7637-2 pulse 3a response
(VS = -150 V)
Figure 10. ISO 7637-2 pulse 3b response
(VS = 100 V)
ESDALY Application and design guidelines
Doc ID 022075 Rev 1 5/10
2 Application and design guidelines
More information is available in the application note:
AN2689, “Protection of automotive electronics from electrical hazards, guidelines for design
and component selection”.
3 Ordering information scheme
Figure 11. Ordering information scheme
ESDA XXX LY
ESD array
Minimum breakdown voltage
Package
L = SOT23-3L
Y = Automotive grade
Package information ESDALY
6/10 Doc ID 022075 Rev 1
4 Package information
●Epoxy meets UL94, V0
●Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. Footprint (dimensions in mm)
Table 3. SOT23-3L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 0.89 1.4 0.035 0.055
A1 0 0.1 0 0.004
B 0.3 0.51 0.012 0.02
c 0.085 0.18 0.003 0.007
D 2.75 3.04 0.108 0.12
e 0.85 1.05 0.033 0.041
e1 1.7 2.1 0.067 0.083
E 1.2 1.6 0.047 0.063
H 2.1 2.75 0.083 0.108
L 0.6 typ. 0.024 typ.
S 0.35 0.65 0.014 0.026
A1
A
L
H
B
E
D
e
e1
S
c
0.95 0.61
1.26
3.25
0.73
ESDALY Recommendation on PCB assembly
Doc ID 022075 Rev 1 7/10
Figure 13. Tape and reel specifications
5 Recommendation on PCB assembly
5.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 µm.
5.2 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
User direction of unreeling
All dimensions are typical values in mm
4.0
4.0
2.0
8.0
1.75
3.5
Ø 1.55
1.24
3.1
0.21
2.1
2.9
Recommendation on PCB assembly ESDALY
8/10 Doc ID 022075 Rev 1
5.3 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
5.4 Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
60 sec
(90 max)
250
0
50
100
150
200
240210180150120906030 300
270
-2 °C/s to
-3 °C/s
-6 °C/s max
240-245 °C
2 - 3 °C/s
0.9 °C/s
Temperature (°C)
Time (s)
ESDALY Ordering information
Doc ID 022075 Rev 1 9/10
6 Ordering information
7 Revision history
Table 4. Ordering information
Order code Marking(1)
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Package Weight Base qty Delivery mode
ESDA5V3LY EL5Y
SOT23-3L 8.7 mg 3000 Tape and reel
ESDA6V1LY EL6Y
ESDA14V2LY EL1Y
ESDA25LY EL2Y
Table 5. Document revision history
Date Revision Changes
16-Feb-2012 1 Initial version. This document merges and updates the
content of the datasheet ESDA25LY Revision 1, 01-Feb-2010.
ESDALY
10/10 Doc ID 022075 Rev 1
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