MLX90316KGO-BCG-000-RE - Melexis

MLX90316

Rotary Position Sensor IC

3901090316

Page 1 of 45 Mar/12

Rev08

Features and Benefits

 Absolute Rotary Position Sensor IC

 Simple & Robust Magnetic Design

 Tria⊗is® Hall Technology

 Programmable Angular Range up to 360 Degrees

 Programmable Linear Transfer Characteristic

 Selectable Analog (Ratiometric), PWM, Serial Protocol

 12 bit Angular Resolution - 10 bit Angular Thermal Accuracy

 40 bit ID Number

 Single Die – SO8 Package RoHS Compliant

 Dual Die (Full Redundant) – TSSOP16 Package RoHS Compliant

Applications

 Absolute Rotary Position Sensor

 Steering Wheel Position Sensor

 Pedal Position Sensor

 Motor-shaft Position Sensor

 Throttle Position Sensor

 Float-Level Sensor

 Ride Height Position Sensor

 Non-Contacting Potentiometer

Ordering Code

Product Code Temperature Code Package Code Option Code Packing Form Code

MLX90316 S DC BCG-000 RE

MLX90316 S DC BCG-000 TU

MLX90316 E DC BCG-000 RE

MLX90316 E DC BCG-000 TU

MLX90316 K DC BCG-000 RE

MLX90316 K DC BCG-000 TU

MLX90316 L DC BCG-000 RE

MLX90316 L DC BCG-000 TU

MLX90316 E GO BCG-000 RE

MLX90316 E GO BCG-000 TU

MLX90316 K GO BCG-000 RE

MLX90316 K GO BCG-000 TU

MLX90316 L GO BCG-000 RE

MLX90316 L GO BCG-000 TU

MLX90316 K DC BCG-200 RE

MLX90316 K DC BCG-200 TU

MLX90316 K GO BCG-200 RE

MLX90316 K GO BCG-200 TU

MLX90316 K DC BCG-300 RE

MLX90316 K DC BCG-300 TU

MLX90316 K GO BCG-300 RE

MLX90316 K GO BCG-300 TU

MLX90316 E DC BDG-100 RE

MLX90316 E DC BDG-100 TU

MLX90316

Rotary Position Sensor IC

3901090316

Page 2 of 45 Mar/12

Rev08

MLX90316 K DC BDG-100 RE

MLX90316 K DC BDG-100 TU

MLX90316 L DC BDG-100 TU

MLX90316 L DC BDG-100 RE

MLX90316 E GO BDG-100 TU

MLX90316 E GO BDG-100 RE

MLX90316 K GO BDG-100 TU

MLX90316 K GO BDG-100 RE

MLX90316 L GO BDG-100 TU

MLX90316 L GO BDG-100 RE

MLX90316 L DC BDG-102 TU

MLX90316 L DC BDG-102 RE

MLX90316 L DC BCS-000 TU

MLX90316 L DC BCS-000 RE

Legend:

Temperature Code: L for Temperature Range -40°C to 150°C

E for Temperature Range -40°C to 85°C

K for Temperature Range -40°C to 125°C

S for Temperature Range -20°C to 85°C

Package Code: DC for SOIC150

GO for TSSOP173

Option Code: AAA-xxx: die version

xxx-000: standard

xxx-100: SPI

xxx-102: SPI75AGC, see section 14.4.2

xxx-200: PPA (Pre-programmed Analog)

xxx-300: PPD (Pre-programmed Digital)

Packing Form: RE for Reel, TU for Tube

Ordering example: MLX90316KDC-BCG-000-TU

MLX90316

Rotary Position Sensor IC

3901090316

Page 3 of 45 Mar/12

Rev08

1. Functional Diagram

Figure 1 - Block Diagram (Analog & PWM)

Figure 2 - Block Diagram Analog (MLX90316BCS)

Figure 3 - Block Diagram (Serial Protocol)

DSP

V

SS

V

DD

3V3

Reg

MUX

µC

ROM - F/W

RAM

EEP

ROM

Vy

Vx

Tria







is

™

A

D

A

G

Rev.Pol.

&

OverVolt.

O

UT

(Analog/PWM)

x 1

S

WITCH

O

UT

14-15

12

DSP

V

SS

V

DD

3V3

Reg

MUX

µC

ROM - F/W

RAM

EEP

ROM

Vy

Vx

Tria







is

™

A

D

A

G

Rev.Pol.

&

OverVolt.

O

UT2

(Analog)

x 1

S

WITCH

O

UT

14-15

12

x 1

O

UT1

(Analog)

DSP

V

SS

V

DD

3V3

Reg

MUX

µC

ROM - F/W

RAM

EEP

ROM

Vy

Vx

Tria







is

™

A

D

G

Rev.Pol.

14-15

S

ERIAL

P

ROTOCOL

/SS

S

CLK

MOSI/MISO

MLX90316

Rotary Position Sensor IC

3901090316

Page 4 of 45 Mar/12

Rev08

2. Description

The MLX90316 is a monolithic sensor IC featuring the Tria⊗is® Hall technology. Conventional planar Hall

technology is only sensitive to the flux density applied orthogonally to the IC surface. The Tria⊗is® Hall

sensor is also sensitive to the flux density applied parallel to the IC surface. This is obtained through an

Integrated Magneto-Concentrator (IMC) which is deposited on the CMOS die (as an additional back-end

step).

The MLX90316 is only sensitive to the flux density coplanar with the IC surface. This allows the

MLX90316 with the correct magnetic circuit to decode the absolute rotary (angular) position from 0 to 360

Degrees. It enables the design of novel generation of non-contacting rotary position sensors that are

frequently required for both automotive and industrial applications.

In combination with the appropriate signal processing, the magnetic flux density of a small magnet

(diametral magnetization) rotating above the IC can be measured in a non-contacting way (Figure 4). The

angular information is computed from both vectorial components of the flux density (i.e. B

X

and B

Y

).

MLX90316 produces an output signal proportional to the decoded angle. The output is selectable between

Analog, PWM and Serial Protocol.

Figure 4 - Typical application of MLX90316

MLX90316

Rotary Position Sensor IC

3901090316

Page 5 of 45 Mar/12

Rev08

TABLE of CONTENTS

FEATURES AND BENEFITS ....................................................................................................................... 1

APPLICATIONS ............................................................................................................................................ 1

ORDERING

CODE………………………………………………………………………………………………………………....1

1.

FUNCTIONAL DIAGRAM ...................................................................................................................... 3

2.

DESCRIPTION ....................................................................................................................................... 5

3.

GLOSSARY OF TERMS −

−−

− ABBREVIATIONS −

−−

− ACRONYMS ............................................................ 8

4.

PINOUT .................................................................................................................................................. 8

5.

ABSOLUTE MAXIMUM RATINGS ....................................................................................................... 9

6.

DETAILED DESCRIPTION .................................................................................................................... 9

7.

MLX90316 ELECTRICAL SPECIFICATION ....................................................................................... 11

8.

MLX90316 ISOLATION SPECIFICATION .......................................................................................... 13

9.

MLX90316 TIMING SPECIFICATION ................................................................................................. 13

10.

MLX90316 ACCURACY SPECIFICATION ......................................................................................... 14

11.

MLX90316 MAGNETIC SPECIFICATION .......................................................................................... 15

12.

MLX90316 CPU & MEMORY SPECIFICATION ................................................................................. 15

13.

MLX90316 END-USER PROGRAMMABLE ITEMS ........................................................................... 16

14.

DESCRIPTION OF END-USER PROGRAMMABLE ITEMS .............................................................. 17

14.1.

O

UTPUT

M

ODE

.......................................................................................................................................... 17

14.1.1.

Analog Output Mode ............................................................................................................................ 17

14.1.2.

PWM Output Mode ............................................................................................................................... 17

14.1.3.

Serial Protocol Output Mode ............................................................................................................... 19

14.1.4.

Switch Out ............................................................................................................................................ 19

14.2.

O

UTPUT

T

RANSFER

C

HARACTERISTIC

....................................................................................................... 19

14.2.1.

CLOCKWISE Parameter ...................................................................................................................... 19

14.2.2.

Discontinuity Point (or Zero Degree Point) ......................................................................................... 19

14.2.3.

LNR Parameters ................................................................................................................................... 20

14.2.4.

CLAMPING Parameters ...................................................................................................................... 20

14.2.5.

DEADZONE Parameter ....................................................................................................................... 21

14.2.6.

MLX90316 xDC- BCS ONLY ............................................................................................................... 21

14.3.

I

DENTIFICATION

........................................................................................................................................ 21

14.4.

S

ENSOR

F

RONT

-E

ND

................................................................................................................................. 22

14.4.1.

HIGHSPEED Parameter ...................................................................................................................... 22

14.4.2.

ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters ........................................................ 22

14.4.3.

RGThresL, RGThresH Parameters ...................................................................................................... 23

14.5.

FILTER .................................................................................................................................................... 23

14.5.1.

Hysteresis Filter ................................................................................................................................... 23

14.5.2.

FIR Filters ............................................................................................................................................ 23

14.5.3.

IIR Filters ............................................................................................................................................. 26

14.6.

P

ROGRAMMABLE

D

IAGNOSTIC

S

ETTINGS

................................................................................................. 27

14.6.1.

RESONFAULT Parameter ................................................................................................................... 26

14.6.2.

EEHAMHOLE Parameter .................................................................................................................... 26

14.7.

L

OCK

......................................................................................................................................................... 26

14.7.1.

MLXLOCK Parameter ......................................................................................................................... 27

14.7.2.

LOCK Parameter ................................................................................................................................. 27

MLX90316

Rotary Position Sensor IC

3901090316

Page 6 of 45 Mar/12

Rev08

15.

MLX90316 SELF DIAGNOSTIC .......................................................................................................... 28

16.

SERIAL PROTOCOL ........................................................................................................................... 30

16.1.

I

NTRODUCTION

......................................................................................................................................... 30

16.2.

SERIAL

PROTOCOL

M

ODE

................................................................................................................... 30

16.3.

MOSI

(M

ASTER

O

UT

S

LAVE

I

N

) ............................................................................................................... 30

16.4.

MISO

(M

ASTER

I

N

S

LAVE

O

UT

) ............................................................................................................... 30

16.5.

SS

(S

LAVE

S

ELECT

) .................................................................................................................................. 30

16.6.

M

ASTER

S

TART

-U

P

................................................................................................................................... 30

16.7.

S

LAVE

S

TART

-U

P

...................................................................................................................................... 30

16.8.

T

IMING

...................................................................................................................................................... 31

16.9.

S

LAVE

R

ESET

............................................................................................................................................ 32

16.10.

F

RAME

L

AYER

.......................................................................................................................................... 32

16.10.1.

Command Device Mechanism .......................................................................................................... 32

16.10.2.

Data Frame Structure ...................................................................................................................... 32

16.10.3.

Timing............................................................................................................................................... 32

16.10.4.

Data Structure .................................................................................................................................. 33

16.10.5.

Angle Calculation ............................................................................................................................. 33

16.10.6.

Error Handling ................................................................................................................................. 33

17.

RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 34

17.1.

A

NALOG

O

UTPUT

W

IRING WITH THE

MLX90316

IN

SOIC

P

ACKAGE

....................................................... 34

17.2.

A

NALOG

O

UTPUT

W

IRING WITH THE

MLX90316

IN

TSSOP

P

ACKAGE

.................................................... 35

17.3.

PWM

L

OW

S

IDE

O

UTPUT

W

IRING

............................................................................................................ 35

17.4.

S

ERIAL

P

ROTOCOL

.................................................................................................................................... 36

17.4.1.

SPI Version – Single Die ...................................................................................................................... 36

17.4.2.

SPI Version – Dual Die ........................................................................................................................ 37

17.4.3.

Non SPI Version (Standard Version).................................................................................................... 38

18.

STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS

WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 39

19.

ESD PRECAUTIONS ........................................................................................................................... 39

20.

PACKAGE INFORMATION .................................................................................................................. 40

20.1.

SOIC8

-

P

ACKAGE

D

IMENSIONS

............................................................................................................... 40

20.2.

SOIC8

-

P

INOUT AND

M

ARKING

............................................................................................................... 40

20.3.

SOIC8

-

IMC

P

OSITIONNING

..................................................................................................................... 41

20.4.

TSSOP16

-

P

ACKAGE

D

IMENSIONS

.......................................................................................................... 42

20.5.

TSSOP16

-

P

INOUT AND

M

ARKING

.......................................................................................................... 43

20.6.

TSSOP16

-

IMC

P

OSITIONNING

................................................................................................................ 43

21.DISCLAIMER………………………………………………………………………………………………........45

MLX90316

Rotary Position Sensor IC

3901090316

Page 7 of 45 Mar/12

Rev08

3. Glossary of Terms

−

−−

−

Abbreviations

−

−−

−

Acronyms

 Gauss (G), Tesla (T): Units for the magnetic flux density − 1 mT = 10 G

 TC: Temperature Coefficient (in ppm/Deg.C.)

 NC: Not Connected

 PWM: Pulse Width Modulation

 %

DC

: Duty Cycle of the output signal i.e. T

ON

/(T

ON

+ T

OFF

)

 ADC: Analog-to-Digital Converter

 DAC: Digital-to-Analog Converter

 LSB: Least Significant Bit

 MSB: Most Significant Bit

 DNL: Differential Non-Linearity

 INL: Integral Non-Linearity

 RISC: Reduced Instruction Set Computer

 ASP: Analog Signal Processing

 DSP: Digital Signal Processing

 ATAN: trigonometric function: arctangent (or inverse tangent)

 IMC: Integrated Magneto-Concentrator (IMC)

 CoRDiC: Coordinate Rotation Digital Computer (i.e. iterative rectangular-to-polar transform)

 EMC: Electro-Magnetic Compatibility

4. Pinout

Pin # SOIC-8 TSSOP-16

Analog / PWM Serial Protocol Analog / PWM Serial Protocol

1 V

DD

V

DD

V

DIG

1

V

DIG

1

2 Test 0 Test 0 V

SS

1

(Ground

1

) V

SS

1

(Ground

1

)

3 Switch Out /SS V

DD

1

V

DD

1

4 Not Used / Out 2

(1)

SCLK Test 0

1

Test 0

1

5 Out MOSI / MISO Switch Out

2

/SS

2

6 Test 1 Test 1 Not Used

2

SCLK

2

7 V

DIG

V

DIG

Out

2

MOSI

2

/ MISO

2

8 V

SS

(Ground) V

SS

(Ground) Test 1

2

Test 1

2

9 V

DIG

2

V

DIG

2

10 V

SS

2

(Ground

2

) V

SS

2

(Ground

2

)

11 V

DD

2

V

DD

2

12 Test 0

2

Test 0

2

13 Switch Out

1

/SS

1

14 Not Used

1

SCLK

1

15 Out

1

MOSI

1

/ MISO

1

16 Test 1

1

Test 1

1

For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the

Ground (see section 17).

1

MLX90316xDC-BCS includes a programmable second output

MLX90316

Rotary Position Sensor IC

3901090316

Page 8 of 45 Mar/12

Rev08

5. Absolute Maximum Ratings

Parameter Value

Supply Voltage, V

DD

(overvoltage) + 20 V

Reverse Voltage Protection − 10 V

Positive Output Voltage – Standard Version

(Analog or PWM)

+ 10 V

+ 14 V (200 s max − T

A

= + 25°C)

Positive Output Voltage – SPI Version V

DD

+ 0.3V

Positive Output Voltage (Switch Out) + 10 V

+ 14 V (200 s max − T

A

= + 25°C)

Output Current (I

OUT

) ± 30 mA

Reverse Output Voltage − 0.3 V

Reverse Output Current − 50 mA

Operating Ambient Temperature Range, T

A

− 40°C … + 150°C

Storage Temperature Range, T

S

− 40°C … + 150°C

Magnetic Flux Density ± 700 mT

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

6. Detailed Description

As described on the block diagram (Figure 1, Figure 2 and Figure 3), the magnetic flux density parallel to

the IC surface (i.e. B

//

) is sensed through the Tria⊗is® sensor front-end. This front-end consists into two

orthogonal pairs (for each of the two directions parallel with the IC surface i.e. X and Y) of conventional

planar Hall plates (blue area on Figure 5) and an Integrated Magneto-Concentrator (IMC yellow disk on

Figure 5).

Figure 5 - Tria⊗is® sensor front-end (4 Hall plates + IMC disk)

Hall Plates

MLX90316

Rotary Position Sensor IC

3901090316

Page 9 of 45 Mar/12

Rev08

Both components of the applied flux density B

//

are measured individually i.e. B

X//

and B

Y//

. Two orthogonal

components (respectively B

X⊥

and B

Y⊥

) proportional to the parallel components (respectively B

X//

and B

Y//

)

are induced through the IMC and can be measured by both respective pairs of conventional planar Hall

plates as those are sensitive to the flux density applied orthogonally to them and the IC surface.

While a magnet (diametrically magnetized) rotates above the IC as described on Figure 4, the sensing

stage provides two differential signals in quadrature (sine and cosine − Figure 6 and Figure 7)

Figure 6 – Magnetic Flux Density – B

X

∝ cos(α) & B

Y

∝ sin(α)

Figure 7 – Tria⊗is® sensor front-end − Output signals − V

X

∝ B

X

∝ cos(α) & V

Y

∝ B

Y

∝ sin(α)

-400

-300

-200

-100

0

100

200

300

400

0 90 180 270 360 450 540 630 720

Alpha (Degree)

B

X

& B

Y

(G)

BX

BY

-2000

-1500

-1000

-500

0

500

1000

1500

2000

0 90 180 270 360 450 540 630 720

Alpha (Degree)

V

X

& V

Y

(mV)

VX

VY

MLX90316

Rotary Position Sensor IC

3901090316

Page 10 of 45 Mar/12

Rev08

Those Hall signals are processed through a fully differential analog chain featuring the classic offset

cancellation technique (Hall plate quadrature spinning and chopper-stabilized amplifier).

The conditioned analog signals are converted through an ADC (configurable − 14 or 15 bits) and provided

to a DSP block for further processing. The DSP stage is based on a 16 bit RISC micro-controller whose

primary function is the extraction of the angular position from the two raw signals (after so-called front-end

compensation steps) through the following operation:













=

X

Y

V

ATAN

α

The DSP functionality is governed by the micro-code (firmware − F/W) of the micro-controller which is

stored into the ROM (mask programmable). In addition to the ″ATAN″ function, the F/W controls the whole

analog chain, the output transfer characteristic, the output protocol, the programming/calibration and also

the self-diagnostic modes.

In the MLX90316, the ″ATAN″ function is computed via a look-up table (i.e. it is not obtained through a

CoRDiC algorithm).

Due to the fact that the ″ATAN″ operation is performed on the ratio ″V

Y

/V

X

″, the angular information is

intrinsically self-compensated vs. flux density variations (due to airgap change, thermal or ageing effects)

affecting both signals. This feature allows therefore an improved thermal accuracy vs. rotary position

sensor based on conventional linear Hall sensors.

In addition to the improved thermal accuracy, the realized rotary position sensor is capable of measuring a

complete revolution (360 Degrees) and the linearity performances are excellent taking into account typical

manufacturing tolerances (e.g. relative placement between the Hall IC and the magnet).

Once the angular information is computed (over 360 degrees), it is further conditioned (mapped) vs. the

target transfer characteristic and it is provided at the output(s) as:

• an analog output level through a 12 bit DAC followed by a buffer

• a digital PWM signal with 12 bit depth (programmable frequency 100 Hz … 1 kHz)

• a digital Serial Protocol (SP − 14 bits computed angular information available)

For instance, the analog output can be programmed for offset, gain and clamping to meet any rotary

position sensor output transfer characteristic:

Vout(α) = ClampLo for α ≤ αmin

Vout(α) = Voffset + Gain × α for αmin ≤ α ≤ αmax

Vout(α) = ClampHi for α ≥ αmax

where Voffset, Gain, ClampLo and ClampHi are the main adjustable parameters for the end-user.

The linear part of the transfer curve can be adjusted through either a 2 point or a 3 point calibration

depending on the linearity requirement.

A digital output is also available and used as a programmable angular switch.

The calibration parameters are stored in EEPROM featuring a Hamming Error Correction Coding (ECC).

The programming steps do not require any dedicated pins. The operation is done using the supply and

output nodes of the IC. The programming of the MLX90316 is handled at both engineering lab and

production line levels by the Melexis Programming Unit PTC-04 with the dedicated MLX90316

daughterboard and software tools (DLL − User Interface).

MLX90316

Rotary Position Sensor IC

3901090316

Page 11 of 45 Mar/12

Rev08

7. MLX90316 Electrical Specification

DC Operating Parameters at V

DD

= 5V (unless otherwise specified) and for T

A

as specified by the

Temperature suffix (S, E, K or L).

Parameter Symbol

Test Conditions Min Typ Max Units

Nominal Supply Voltage V

DD

4.5 5 5.5 V

Supply Current

(2)

Idd Slow mode

(3)

Fast mode

(3)

8.5

13.5

11

16

mA

POR Level V

DD

POR Supply Under Voltage 2 2.7 3 V

Output Current Iout Analog Output mode

PWM Output mode

-8

-20

8

20

mA

Output Short Circuit Current I

short

Vout = 0 V

Vout = 5 V

Vout = 14 V (T

A

= 25°C)

12

24

15

45

mA

Output Load R

L

Pull-down to Ground

Pull-up to 5V

(4)

1

10

∞

(5)

∞

(5)

kΩ

Analog Saturation Output Level Vsat_lo Pull-up load R

L

≥ 10 kΩ 3 %V

DD

Vsat_hi Pull-down load R

L

≥ 10 kΩ

96 %V

DD

Digital Saturation Output Level VsatD_lo Pull-up Low Side R

L

≥ 10 kΩ

Push-Pull (I

OUT

= -20mA) 1.5 %V

DD

VsatD_hi Push-Pull (I

OUT

= 20mA) 97 %V

DD

Active Diagnostic Output Level

Diag_lo Pull-down load R

L

≥ 10 kΩ

Pull-up load R

L

≥ 10 kΩ

1

1.5 %V

DD

Diag_hi Pull-down load R

L

≥ 10 kΩ

Pull-up load R

L

≥ 10 kΩ

97

98

%V

DD

Passive Diagnostic Output Level

(Broken Track Diagnostic)

(6)

BV

SS

PD Broken V

SS

(7)

&

Pull-down load R

L

≤ 10 kΩ 4

(6)

%V

DD

BV

SS

PU Broken V

SS

(7)

&

Pull-up load R

L

≥ 1kΩ 99 100 %V

DD

BV

DD

PD Broken V

DD

(7)

&

Pull-down load R

L

≥ 1kΩ 0 1 %V

DD

BV

DD

PU Broken V

DD

&

Pull-up load to 5V No Broken Track diagnostic %V

DD

MLX 90316 Electrical Specification continues…

…MLX 90316 Electrical Specification

2

For the dual version, the supply current is multiplied by 2

3

See section 14.4.1 for details concerning Slow and Fast mode

4

Applicable for output in Analog and PWM (Open-Drain) modes

5

RL < ∞ for output in PWM mode

6

For detailed information, see also section 15

7

Not Valid for the SPI Version

MLX90316

Rotary Position Sensor IC

3901090316

Page 12 of 45 Mar/12

Rev08

Clamped Output Level Clamp_lo Programmable 0 100 %V

DD

(8)

Clamp_hi Programmable 0 100 %V

DD

(8)

Switch Out

(9)

Sw_lo Pull-up Load 1.5k to 5V 0.55 1.1 V

Sw_hi Pull-up Load 1.5k to 5V 3.65 4.35 V

As an illustration of the previous table, the MLX90316 fits the typical classification of the output span

described on the Figure 8.

Figure 8 - Output Span Classification

8

Clamping levels need to be considered vs the saturation of the output stage (see Vsat_lo and Vsat_hi)

9

See section 14.1.4 for the application diagram

Diagnostic Band (High)

Linear Range

Diagnostic Band (Low)

Clamping High

Clamping Low

0 %

10 %

20 %

30 %

40 %

50 %

60 %

70 %

80 %

90 %

100 %

96 %

4 %

Output Level

92 %

88 %

12 %

8 %

MLX90316

Rotary Position Sensor IC

3901090316

Page 13 of 45 Mar/12

Rev08

8. MLX90316 Isolation Specification

DC Operating Parameters at V

DD

= 5V (unless otherwise specified) and for T

A

as specified by the

Temperature suffix (S, E, K or L). Only valid for the package code GO i.e. dual die version.

Parameter Symbol

Test Conditions Min Typ Max Units

Isolation Resistance Between 2 dies 4 MΩ

9. MLX90316 Timing Specification

DC Operating Parameters at V

DD

= 5V (unless otherwise specified) and for T

A

as specified by the

Temperature suffix (S, E, K or L).

Parameter Symbol

Test Conditions Min Typ Max Units

Main Clock Frequency Ck Slow mode

(10)

Fast mode

(10)

7

20

MHz

Sampling Rate Slow mode

(11)

Fast mode

(11)

600

200

µs

Step Response Time Ts Slow mode

(10)

, Filter=5

(11)

Fast mode

(10)

, Filter=0

(11)

400

4

600

ms

µs

Watchdog Wd See Section 15 5 ms

Start-up Cycle Tsu Slow and Fast mode

(10)

15 ms

Analog Output Slew Rate C

OUT

= 42 nF

C

OUT

= 100 nF

200

100

V/ms

PWM Frequency F

PWM

PWM Output Enabled 100 1000 Hz

Digital Output Rise Time Mode 5 – 10nF, R

L

= 10 kΩ

Mode 7 – 10nF, R

L

= 10 kΩ

120

2.2

µs

Digital Output Fall Time Mode 5 – 10nF, R

L

= 10 kΩ

Mode 7 – 10nF, R

L

= 10 kΩ

1.8

1.9

µs

10

See section 14.4.1 for details concerning Slow and Fast mode

11

See section 14.5 for details concerning Filter parameter

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10. MLX90316 Accuracy Specification

DC Operating Parameters at V

DD

= 5V (unless otherwise specified) and for T

A

as specified by the

Temperature suffix (S, E, K or L).

Parameter Symbol

Test Conditions Min Typ Max Units

ADC Resolution on the raw

signals sine and cosine

R

ADC

Slow Mode

(12)

Fast Mode

(12)

15

14

bits

Thermal Offset Drift #1

(13)

Thermal Offset Drift at the DSP

input (excl. DAC and output stage)

Temperature suffix S, E and K

Temperature suffix L

-60

-90

+60

+90

LSB

15

LSB

15

Thermal Offset Drift #2

(to be considered only for the

analog output mode)

Thermal Offset Drift of the DAC

and Output Stage

Temperature suffix S, E and K

Temperature suffix L

- 0.3

- 0.4

+ 0.3

+ 0.4

%V

DD

%V

DD

Thermal Drift of Sensitivity

Mismatch

(14)

Temperature suffix S, E and K

Temperature suffix L

- 0.3

- 0.5

+ 0.3

+ 0.5

%

Intrinsic Linearity Error

(15)

Le T

A

= 25°C -1 1 Deg

Analog Output Resolution R

DAC

12 bits DAC

(Theoretical – Noise free)

INL

DNL

-4

-2

0.025

+4

+2

%V

DD

/LSB

LSB

Output stage Noise Clamped Output 0.05 %V

DD

Noise pk-pk

(16)

RG = 9, Slow mode, Filter=5

RG = 9, Fast mode, Filter=0

0.03

0.1

0.06

0.2

Deg

Ratiometry Error -0.1 0 0.1 %V

DD

PWM Output Resolution R

PWM

12 bits

(Theoretical – Jitter free)

0.025

%

DC

/LSB

PWM Jitter

(17)

J

PWM

RG = 6, F

PWM

= 250 Hz – 800Hz 0.2 %

DC

Serial Protocol Output

Resolution

R

SP

14 bits – 360 Deg.

Mapping(Theoretical – Jitter free)

0.022 Deg/LSB

12

15 bits corresponds to 14 bits + sign and 14 bits corresponds to 13 bits + sign. After angular calculation, this corresponds to

0.005Deg/LSB

15

in Low Speed Mode and 0.01Deg/LSB

14

in High Speed.

13

For instance, Thermal Offset Drift #1 equal ± 60LSB

15

yields to max. ± 0.3 Deg. angular error for the computed angular

information (output of the DSP). See Front End Application Note for more details. This is only valid if automatic gain is set (See

Section 14.4.2)

14

For instance, Thermal Drift of Sensitivity Mismatch equal ± 0.4% yields to max. ± 0.1 Deg. angular error for the computed

angular information (output of the DSP). See Front End Application Note for more details.

15

The Intrinsic Linearity Error refers to the IC itself (offset, sensitivity mismatch, orthogonality) taking into account an ideal

rotating field. Once associated to a practical magnetic construction and the associated mechanical and magnetic tolerances, the

output linearity error increases. However, it can be improved with the multi point end-user calibration that is available on the

MLX90316.

16

The application diagram used is described in the recommended wiring. For detailed information, refer to section Filter in

application mode (Section 14.5).

17

Jitter is defined by ± 3 σ for 1000 successive acquisitions and the slope of the transfer curve is 100%

DC

/360 Deg.

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11. MLX90316 Magnetic Specification

DC Operating Parameters at V

DD

= 5V (unless otherwise specified) and for T

A

as specified by the

Temperature suffix (S, E, K or L).

Parameter Symbol

Test Conditions Min Typ Max Units

Magnetic Flux Density B 20 50 70

(18)

mT

Magnet Temperature Coefficient

TCm -2400 0 ppm/°C

12. MLX90316 CPU & Memory Specification

The DSP is based on a 16 bit RISC µController. This CPU provides 5 Mips while running at 20 MHz.

Parameter Symbol

Test Conditions Min Typ Max Units

ROM 10 kB

RAM 256 B

EEPROM 128 B

18

Above 70 mT, the IMC starts saturating yielding to an increase of the linearity error.

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13. MLX90316 End-User Programmable Items

Parameter Comments

Default Values

STANDARD

SPI /

SPI75AGC

PPA PPD # bit

Output Mode Define the output stage mode 4 N/A 4 7 3

MLX90316BCS 2 N/A 2 N/A 3

PWMPOL1 PWM Polarity 0 N/A N/A 1 1

PWMT PWM Frequency 1000h N/A N/A 1kHz 16

CLOCKWISE 0 0 0 1 1

DP Discontinuity Point 0h 0h 0h 0h 15

LNR_S0 Initial Slope 0h N/A N/A N/A 16

LNR_A_X AX Coordinate 8000h 0 0 0 16

LNR_A_Y AY Coordinate 0h 0% 10% 10% 16

LNR_A_S AS Coordinate 0h 100%/360d

80%/360d

16

LNR_B_X BX Coordinate FFFFh FFFFh FFFFh FFFFh 16

LNR_B_Y BY Coordinate 0h FFFFh FFFFh FFFFh 16

LNR_B_S BS Coordinate 0h N/A N/A N/A 16

LNR_C_X CX Coordinate FFFFh FFFFh FFFFh FFFFh 16

LNR_C_Y CY Coordinate FFFFh FFFFh FFFFh FFFFh 16

LNR_C_S CS Coordinate 0h N/A N/A N/A 16

CLAMP_HIGH Clamping High 8% 0% 10% 10% 16

CLAMP_LOW Clamping Low 8% 100% 90% 90% 16

KD Switch Out FFFFh FFFFh FFFFh FFFFh 16

MLX90316BCS 0 N/A FFFFh N/A 16

KDHYST Hysteresis on the Switch Out N/A N/A N/A N/A 8

DEADZONE 0 0 0 0 8

FHYST 4 0 0 0 8

MLX90316BCS 0 N/A 0 N/A 8

MLXID1 / MLXID2 / MLXID3 MLX MLX MLX MLX 16

CUSTID1 1 1 1 1 8

CUSTID2

(20)

6

(19)

19 / 36 16 20 16

CUSTID3 MLX MLX MLX MLX 16

FREE2 0 0 0 0 8

MLX90316BCS 0 N/A 2Ah N/A 16

FILTER 5 0 2 5 16

FILTER A1

(20)

Filter coefficient A1 for FILTER=6 6600h N/A N/A N/A 16

FILTER A2

(20)

Filter coefficient A2 for FILTER=6 2A00h N/A N/A N/A 16

ARGC Auto Gain at Start Up 0 1 1 1 1

MLX90316BCS 0 N/A 1 N/A 1

HIGHSPEED 0 1 0 1 1

End-User Programmable Items continues...

19

For MLX90316SDC–BCG–STANDARD, the CUSTUMERID2 parameter might differ from the given value (28d instead of 6d)

20

Not available in MLX90316xDC -BCS

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… End-User Programmable Items

FSWAP 1 1 0 1 1

FORCECRA75 Radius Adjustment to 75% 0 0 / 1 0 0 1

AUTO_RG Automatic Rough Gain Selection 0 1 1 1 1

RoughGain 9 0 3 0 8

MLX90316BCS 6 N/A 3 N/A 8

RGThresL 0 0 0 0 4

RGThresH 15 15 15 15 4

EEHAMHOLE 3131h 0 0 0 16

RESONFAULT 0 1 1 1 2

MLXLOCK 0 1 1 1 1

LOCK 0 1 1 1 1

MLX90316BCS 0 N/A 0 N/A 1

Parameter for MLX90316xDC-BCS only

OUT2EN 1 N/A 1 N/A 1

OUT2 SLOPE RATIO Was CUSTUMERID2 N/A N/A -1 N/A 8

OUT2 OFFSET MLX N/A 100% N/A 8

CLAMP_LOW OUT2 8% N/A 10% N/A 16

CLAMP_HIGH OUT2 8% N/A 90% N/A 16

14. Description of End-User Programmable Items

14.1. Output Mode

The MLX90316 output type is defined by the Output Mode parameter.

Parameter Value Description

Analog Output Mode 2, 4 Analog Rail-to-Rail

PWM Output Mode 5

7

Low Side (NMOS)

Push-Pull

Serial N/A Low Side (NMOS)

14.1.1. Analog Output Mode

The Analog Output Mode is a rail-to-rail and ratiometric output with a push-pull output stage configuration

allows the use of a pull-up or pull-down resistor.

14.1.2. PWM Output Mode

If one of the PWM Output modes is selected, the output signal is a digital signal with Pulse Width

Modulation (PWM).

In mode 5, the output stage is an open drain NMOS transistor (low side), to be used with a pull-up resistor

to V

DD

.

In mode 7, the output stage is a push-pull stage for which Melexis recommends the use of a pull-up

resistor to V

DD

.

The PWM polarity is selected by the PWMPOL1 parameter:

• PWMPOL1 = 0 for a low level at 100%

• PWMPOL1 = 1 for a high level at 100%

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The PWM frequency is selected by the PWMT parameter.

PWM Frequency Code (based on typical main clock frequency)

Oscillator Mode Pulse-Width Modulation Frequency (Hz)

100 200 500 1000

Low Speed ~35000 ~17500 ~7000 ~3500

High Speed - ~50000 ~20000 ~10000

For instance, in Low Speed Mode, set PWMT=7000 (decimal) to set the PWM frequency around

500Hz

(21)

.

14.1.3. Serial Protocol Output Mode

The MLX90316 features a digital Serial Protocol mode. The MLX90316 is considered as a Slave node.

See the dedicated Serial Protocol section for a full description (Section 16).

14.1.4. Switch Out

Parameter Value Unit

KD 0…359.9999 deg

KDHYST 0 … 1.4 deg

The switch is activated (Sw_lo) when the digital angle is greater than the value stored in the KD

parameter. This angle refers to the internal angular reference linked to the parameter DP and not to the

absolute physical 0° angle.

The KDHYST defines the hysteresis amplitude around the Switch point. The switch is actually activated if

the digital angle is greater than KD+KDHYST. It is deactivated if the digital angle is less than

KD-KDHYST.

The mandatory application diagram to use this feature is depicted in the Figure 9. See section 7 for the

electrical characteristic.

If the Switch feature is not used in the application, the output pin needs to be connected to the ground.

Figure 9 – Application Diagram for the Switch Out

21

In order to compensate the lot to lot variation of the main clock frequency (Ck), Melexis strongly recommends trimming the

PWM frequency during EOL programming (see the PTC-04 documentation).

SWITCH

OUT

1k5

5 V

ECU

to uC

I/O

Port

125 Ω

Ω

175 Ω

ΩΩ

Ω

6kΩ

Ω

100 nF

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3901090316

Page 19 of 45 Mar/12

Rev08

14.2. Output Transfer Characteristic

Parameter Value Unit

CLOCKWISE 0  CCW

1  CW

DP 0 … 359.9999 deg

LNR_A_X

LNR_B_X

LNR_C_X

0 … 359.9999 deg

LNR_A_Y

LNR_B_Y

LNR_C_Y

0 … 100 %

LNR_S0

LNR_A_S

LNR_B_S

0 … 17 %/deg

LNR_C_S -17 … 0 … 17 %/deg

CLAMP_LOW 0 … 100 %

CLAMP_HIGH 0 … 100 %

DEADZONE 0 … 359.9999 deg

MLX90316 xDC – BCS only

OUT2 SLOPE RATIO -8 … 0 … 8 -

OUT2 OFFSET -400 … 400 %

CLAMP_LOW OUT2 0 … 100 %

CLAMP_HIGH OUT2 0 … 100 %

14.2.1. CLOCKWISE Parameter

The CLOCKWISE parameter defines the magnet rotation direction.

• CCW is the defined by the 1-4-5-8 pin order direction for the SOIC8 package and 1-8-9-16 pin

order direction for the TSSOP16 package.

• CW is defined by the reverse direction: 8-5-4-1 pin order direction for the SOIC8 and 16-9-8-1 pin

order direction for the TSSOP16 package.

Refer to the drawing in the IMC positioning sections (Section 20.3 and 20.6).

14.2.2. Discontinuity Point (or Zero Degree Point)

The Discontinuity Point defines the 0° point on the circle. The discontinuity point places the origin at any

location of the trigonometric circle. The DP is used as reference for all the angular measurements.

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Rev08

Figure 10 - Discontinuity Point Positioning

14.2.3. LNR Parameters

The LNR parameters, together with the clamping values, fully define the relation (the transfer function)

between the digital angle and the output signal.

The shape of the MLX90316 transfer function from the digital angle value to the output voltage is

described by the drawing below. Six segments can be programmed but the clamping levels are

necessarily flat.

Two, three, or even five calibration points are then available, reducing the overall non-linearity of the IC by

almost an order of magnitude each time. Three or five point calibration will be preferred by customers

looking for excellent non-linearity figures. Two-point calibrations will be preferred by customers looking for

a cheaper calibration set-up and shorter calibration time.

A

Slope LNR_A_S

B

C

Slope LNR_B_S

Slope LNR_C_S

Slope LNR_S0

360

(Deg.)

Clamping Low

Clamping High

LNR_A_X

LNR_A_Y

LNR_B_Y

LNR_C_Y

CLAMPHIGH

CLAMPLOW

0 %

100 %

0

LNR_B_X LNR_C_X

14.2.4. CLAMPING Parameters

The clamping levels are two independent values to limit the output voltage range. The CLAMP_LOW

parameter adjusts the minimum output voltage level. The CLAMP_HIGH parameter sets the maximum

output voltage level. Both parameters have 16 bits of adjustment. In analog mode, the resolution will be

limited by the D/A converter (12 bits) to 0.024%V

DD

. In PWM mode, the resolution will be 0.024%

DC

. In

SPI mode, the resolution is 14bits or 0.022deg over 360deg.

0°

360°

The placement of the discontinuity

point (0 point) is programmable.

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14.2.5. DEADZONE Parameter

The dead zone is defined as the angle window between 0 and 359.9999.

When the digital angle lies in this zone, the IC is in fault mode (RESONFAULT must be set to “1” – See

14.6.1).

14.2.6. MLX90316 xDC- BCS ONLY

The MLX90316 BCS firmware offers the possibility to program a second output transfer characteristic of

the single die version.

The following formula is used in the 90316BxS:

O

UT

2 = O

UT

2SlopeRatio * O

UT

1 + O

UT

2Offset

Range O

UT

2 = [ Clamp_Low O

UT

2..Clamp_High O

UT

2 ]

O

UT

2 SLOPE RATIO Controls the slope ratio O

UT

1 vs O

UT

2. The ratio can be positive or negative.

The example of MLX90316LDC-BCS-PPA is given in the figure below (slope = -1, O

UT2

= -1 x slope O

UT1

+ 100 %).

14.3. Identification

Parameter Value Unit

MELEXSID1

MELEXSID2

MELEXSID3

0 … 65535

CUSTUMERID1

CUSTUMERID2

CUSTUMERID3

0 … 255

0 … 65535

Identification number: 40 bits freely useable by Customer for traceability purpose.

360 (Deg.)

0

O

UT

1

O

UT

2

Output Level (%V

DD

)

0%

100%

10%

90%

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14.4. Sensor Front-End

Parameter Value Unit

HIGHSPEED 0 = Slow mode

1 = Fast mode

ARGC 0 = disable

1 = enable

AUTO_RG 0 = disable

1 = enable

RoughGain 0 … 15

RGThresL 0 … 15

RGThresH 0 … 15

14.4.1. HIGHSPEED Parameter

The HIGHSPEED parameter defines the main frequency for the DSP.

• HIGHSPEED = 0 selects the Slow mode with a 7 MHz master clock.

• HIGHSPEED = 1 selects the Fast mode with a 20 MHz master clock.

For better noise performance, the Slow Mode must be enabled.

14.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters

AUTO_RG and ARGC parameters enable the automatic gain control (AGC) of the analog chain. The AGC

loop is based on

(V

X

)²+ (V

Y

)² = (Amplitude)² = (Radius)²

and it targets an amplitude of 90% of the ADC input span.

At Start-Up phase, the gain stored in the parameter RoughGain is always used. Depending of the

AUTO_RG and ARGC settings, the AGC regulation acts as follow:

• If ARGC is set, the regulation proceeds by jump to reach the target gain. Note that this regulation

is only valid if the starting gain does not saturate the ADC. Melexis recommendation is to use

RoughGain ≤ 3 if ARGC=1.

• If ARGC is “0” and AUTO_RG is set to “1”, the regulation adapts every cycle by one gain code the

current gain to reach the 90% ADC span target. Note that if the value of RoughGain is too far

from the actual gain, the chip will enter the normal operating mode (after the Start-Up phase) with

an incorrect gain which will cause the device to go in diagnostic low (field too low/field too high –

See section 15).

• If ARGC and AUTO_RG are “0”, the AGC regulation is off and the gain used is the value stored in

the parameter RoughGain. Melexis does not advise the use of this mode.

The parameter AUTO_RG activates the automatic regulation during normal operation of the device as

background task.

The parameter FORCECRA75 modifies the target of the AGC algorithm to 75% - instead of 90% - of the

ADC span (at start-up and in normal operation).

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Rev08

Melexis strongly recommend to set ARGC = “1”, AUTO_RG = “1” and RoughGain ≤ 3 for all types of

application. If the magnetic specifications of the application are well known and under control, the

appropriate RoughGain can also be programmed with ARGC set to “0” and AUTO_RG to “1”.

Please note that the angular errors listed in the section 10 are only valid if the AUTO_RG is activated.

AUTO_RG avoids also the saturation of the analog chain and the associated linearity error.

The current gain (RG) can be read out with the PTC-04 and gives a rough indication of the applied

magnetic flux density (Amplitude).

14.4.3. RGThresL, RGThresH Parameters

RGThresL & RGThresH define the boundaries within the gain setting (Rough Gain) is allowed to vary.

Outside this range, the output is set in diagnostic low.

14.5. FILTER

Parameter Value Unit

FHYST 0 … 11 ; step 0.04 deg

FILTER 0… 6

FSWAP 0

1

The MLX90316 includes 3 types of filters:

• Hysteresis Filter: programmable by the FHYST parameter

• Low Pass FIR Filters controlled with the Filter parameter

• Low Pass IIR Filter controlled with the Filter parameter and the coefficients FILTER A1 and

FILTER A2

Note: if the parameter FSWAP is set to “1”, the filtering is active on the digital angle. If set to “0”, the

filtering is active on the output transfer function.

14.5.1. Hysteresis Filter

The FHYST parameter is a hysteresis filter. The output value of the IC is not updated when the digital step

is smaller than the programmed FHYST parameter value. The output value is modified when the

increment is bigger than the hysteresis. The hysteresis filter reduces therefore the resolution to a level

compatible with the internal noise of the IC. The hysteresis must be programmed to a value close to the

noise level.

Please note that for the programmable version, the FHYST parameter is set to 4 by default. If you do not

wish this feature, please set it to “0”.

14.5.2. FIR Filters

The MLX90316 features 6 FIR filter modes controlled with Filter = 0…5. The transfer function is described

below:

in

j

i

j

i

n

xa

a

y

−

=

∑

=

0

1

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The characteristics of the filters no 0 to 5 is given in the Table 1.

Filter No (j) 0 1 2 3 4 5

Type Disable Finite Impulse Response

Coefficients a

0

… a

5

N/A 110000 121000 133100 111100 122210

Title No Filter Extra Light Light

90% Response Time 1 2 3 4 4 5

99% Response Time 1 2 3 4 4 5

Efficiency RMS (dB) 0 2.9 4.0 4.7 5.6 6.2

Efficiency P2P (dB) 0 2.9 3.6 5.0 6.1 7.0

Table 1 - FIR Filters Selection Table

Figure 11 - Step Response and Noise Response for FIR (No 3) and FHYST=10

FIR and HYST Filters : Step response Comparative Plot

30000

32000

34000

36000

38000

40000

0 5 10 15 20 25 30

Milliseconds

[0..65535] Scale

x(n)

fir(n)

hyst(n)

FIR and HYST Filter : Gaussian white noise response

39800

39850

39900

39950

40000

40050

40100

40150

40200

0 50 100 150

Milliseconds

[0..65535] Scale

x(n)

fir(n)

hyst(n)

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14.5.3. IIR Filters

The IIR Filter is enabled with Filter = 6. The diagram of the IIR Filter implemented in the MLX90316 is

given in Figure 12. Only the parameter A1 and A2 are configurable (See Table 2).

Figure 12 - IIR Diagram

Filter No 6

Type 2

nd

Order Infinite Impulse Response (IIR)

Title Medium & Strong

90% Response Time 11 16 26 40 52 100

Efficiency RMS (dB) 9.9 11.4 13.6 15.3 16.2 >20

Efficiency P2P (dB) 12.9 14.6 17.1 18.8 20 >20

Coefficient A1 26112 28160 29120 30208 31296 31784

Coefficient A2 10752 12288 12992 13952 14976 15412

Table 2 - IIR Filter Selection Table

The Figure 13 shows the response of the filter to a Gaussian noise with default coefficient A1 and A2.

Z

-1

x(n)

Z

-1

Z

-1

Z

-1

y(n)

b

0

= 1

b

1

= 2

b

2

= 1

-a

1

-a

2

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Figure 13 - Noise Response for the IIR Filter

14.6. Programmable Diagnostic Settings

Parameter Value Unit

RESONFAULT 0

1

EEHAMHOLE 0

3131h

14.6.1. RESONFAULT Parameter

This RESONFAULT parameter enables the soft reset when a fault is detected by the CPU when the

parameter is set to 1. By default, the parameter is set to “0” but it is recommended to set it to “1” to

activate the self diagnostic modes (See section 15).

Note that in the User Interface (MLX90316UI), the RESONFAULT is split in two bits:

• DRESONFAULT: disable the reset in case of a fault.

• DOUTINFAULT: disable output in diagnostic low in case of fault.

14.6.2. EEHAMHOLE Parameter

The EEHAMHOLE parameter disables the CRC check and the memory recovery (Hamming code) when it

is equal to 3131h. Melexis strongly recommends to set the parameter to 0 (enable memory recovery).

This is done automatically when using the MEMLOCK function.

14.7. Lock

Parameter Value Unit

MLXLOCK 0

1

LOCK 0

1

IIR Filter - Gaussian White Noise Response

39800

39850

39900

39950

40000

40050

40100

40150

40200

0 50 100 150

Time

[0…65535] Scale

x(n)

y(n)

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14.7.1. MLXLOCK Parameter

MLXLOCK locks all the parameters set by Melexis.

14.7.2. LOCK Parameter

LOCK locks all the parameters set by the user. Once the lock is enabled, it is not possible to change the

EEPROM values anymore.

Note that the lock bit should be set by the solver function “MemLock”.

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15. MLX90316 Self Diagnostic

The MLX90316 provides numerous self-diagnostic features. Those features increase the robustness of the IC

functionality as it will prevent the IC to provide erroneous output signal in case of internal or external failure

modes (“fail-safe”).

Action Effect on Outputs Remark

ROM CRC Error at start up

(64 words including Intelligent

Watch Dog - IWD)

CPU Reset

(22)

Diagnostic low

(23)

All the outputs are already

in Diagnostic low - (start-up)

ROM CRC Er

ror (Operation

-

Background task)

Enter Endless Loop:

- Progress (watchdog

Acknowledge)

- Set Outputs in Diagnostic low

Immediate

Diagnostic low

RAM Test Fail (Start up)

CPU Reset

Diagnostic low

All the outputs are already

in Diagnostic low (start-up)

Calibration Data CRC Error

(Start-Up)

Hamming Code Recovery

Start

-

Up Time is increased

by 3 ms if successful

recovery

Hamming Code Recovery Erro

r

(Start-Up)

CPU Reset

Immediate

Diagnostic low

See

14.6.2

Calibration Data CRC Error

(Operation - Background)

CPU Reset

Immediate

Diagnostic low

Dead Zone

Set

Outputs in Diagnostic low

.

Normal Operation until the “dead

zone” is left.

Immediate

Diagnostic low

Immediate recovery if the

“dead zone” is left

ADC Clipping

(ADC Output is 0000h or

7FFFh)

Set

Outputs in Diagnostic low

Normal mode and CPU Reset If

recovery

Immediate

Diagnostic low

Radius Overflow ( > 100% )

or

Radius Underflow

( < 50 % )

Set

Outputs in Diagnostic low

Normal mode and CPU Reset If

recovery

Immediate

Diagnostic low

(50 %

-

100 %)

No magnet / field too high

See also 14.4.2

DAC Monitor (Digital to Analog

converter)

Set Outputs in Diagnostic low.

Normal Mode with immediate

recovery without CPU Reset

Immediate

Diagnostic low

MLX90316 Fault Mode

continues

…

22

CPU reset means

1. Core Reset (same as Power-On-Reset). It induces a typical start up time.

2. Periphery Reset (same as Power-On-Reset)

3. Fault Flag/Status Lost

4. The reset can be disabled by clearing the RESONFAULT bit (See 14.6.1)

23

Refer to section 7 for the Diagnostic Output Level specifications

MLX90316

Rotary Position Sensor IC

3901090316

Page 29 of 45 Mar/12

Rev08

…MLX90316 Fault Mode

Fault Mode Action Effect on Outputs Remark

ADC Monitor (Analog to Digital

Converter)

Set Outputs in Diagnostic low.

Normal Mode with immediate

recovery without CPU Reset

Immediate

Diagnostic low

ADC Inputs are Shorted

Undervoltage Mode At Start-Up, wait Until V

DD

> 3V.

During operation, CPU Reset after

3 ms debouncing

-

V

DD

<

POR level

=>

Outputs high impedance

- POR level < V

DD

< 3 V =>

Outputs in Diagnostic low.

Firmware Flow Error

CPU Reset

Immediate

Diagnostic low

Intelligent Watchdog

(Observer)

Read/Write Access out of

physical memory

CPU Reset

Immediate

Diagnostic low

100% Hardware detection

Write Access to p

rotected

area

(IO and RAM Words)

CPU Reset

Immediate

Diagnostic low

100% Hardware detection

Unauthorized entry in

“SYSTEM” Mode

CPU Reset

Immediate

Diagnostic low

100% Hardware detection

V

DD

> 7 V Set Output High Impedance

(Analog)

Pull down resistive load =>

Diag. Low

Pull up resistive load =>

Diag. High

(23)

100% Hardware detection

V

DD

> 9.4 V IC is switched off (internal supply)

CPU Reset on recovery

Pull down resistive load =>

Diag. Low

Pull up resistive load =>

Diag. High

100% Hardware detection

Broken

V

SS

(24)

CPU Reset

on recovery

Pull down resistive load =>

Diag. Low

Pull up resistive load =>

Diag. High

100% Hardware detection.

Pull down load ≤ 10 kΩ to

meet Diag Low spec:

- < 2% V

DD

(temperature

suffix S and E)

- < 4% V

DD

( temperature

suffix K)

- contact Melexis for

temperature suffix L

Broken V

DD

(24)

CPU Reset

on recovery

Pull down resistive load =>

Diag. Low

Pull up resistive load =>

Diag. High

No valid

diagnostic for

V

PULLUP

= V

DD

.

Pull up load (≤ 10kΩ) to

V

PULLUP

> 8 V to meet Diag

Hi spec > 96% Vdd.

24

Not Valid for SPI Version

MLX90316

Rotary Position Sensor IC

3901090316

Page 30 of 45 Mar/12

Rev08

16. Serial Protocol

16.1. Introduction

The MLX90316 features a digital Serial Protocol mode. The MLX90316 is considered as a Slave node.

The serial protocol of the MLX90316 is a three wires protocol (/SS, SCLK, MOSI-MISO):

• /SS pin is a 5 V tolerant digital input

• SCLK pin is a 5 V tolerant digital input

• MOSI-MISO pin is a 5 V tolerant open drain digital input/output

The basic knowledge of the standard SPI specification is required for the good understanding of the

present section.

16.2. SERIAL PROTOCOL Mode

• CPHA = 1  even clock changes are used to sample the data

• CPOL = 0  active-Hi clock

The positive going edge shifts a bit to the Slave’s output stage and the negative going edge samples the

bit at the Master’s input stage.

16.3. MOSI (Master Out Slave In)

The Master sends a command to the Slave to get the angle information.

16.4. MISO (Master In Slave Out)

The MISO of the slave is an open-collector stage. Due to the capacitive load (TBD) a >1 kΩ pull-up is

used for the recessive high level (in fast mode). Note that MOSI and MISO use the same physical pin of

the MLX90316.

16.5. /SS (Slave Select)

The /SS pin enables a frame transfer (if CPHA = 1). It allows a re-synchronization between Slave and

Master in case of communication error.

16.6. Master Start-Up

/SS, SCLK, MISO can be undefined during the Master start-up as long as the Slave is re-synchronized

before the first frame transfer.

16.7. Slave Start-Up

The slave start-up (after power-up or an internal failure) takes 16 ms. Within this time /SS and SCLK is

ignored by the Slave. The first frame can therefore be sent after 16 ms. MISO is Hi-Z (i.e. Hi-Impedance)

until the Slave is selected by its /SS input. MLX90316 will cope with any signal from the Master while

starting up.

MLX90316

Rotary Position Sensor IC

3901090316

Page 31 of 45 Mar/12

Rev08

16.8. Timing

To synchronize communication, the Master deactivates /SS high for at least t5 (1.5 ms). In this case, the

Slave will be ready to receive a new frame. The Master can re-synchronize at any time, even in the middle

of a byte transfer.

Note: Any time shorter than t5 leads to an undefined frame state, because the Slave may or may not

have seen /SS inactive.

Timings Min

(25)

Max Remarks

t1 2.3 µs / 6.9 µs -

No capacitive load on MISO

.

t1 is the minimum clock period for any

bits within a byte.

t2 12.5 µs / 37.5 µs -

t2 the minimum time between any other

byte

t4 2.3 µs / 6.9 µs -

Time between last clock and

/SS=high=chip de-selection

t5 300 µs / 1500 µs -

Minimum /SS

=

Hi

time where it’s

guaranteed that a frame re-

synchronizations will be started.

t5 0µs

-

Maximum /SS

=

Hi

time where it’s

guaranteed that NO frame re-

synchronizations will be started.

t6 2.3 µs / 6.9 µs -

The time t6 defi

nes the minimum time

between /SS = Lo and the first clock edge

t7 15 µs / 45 µs -

t7 is the minimum time between the

StartByte and the Byte0

t9 - <1 µs

Maximum time between /SS

=

Hi

and

MISO Bus High-Impedance

T

StartUp

- < 10 ms / 16 ms

Minimum time bet

ween reset

-

inactiv

e

and any master signal change

25

Timings shown for oscillator base frequency of 20MHz (Fast Mode) / 7 MHz (Slow Mode)

SCLK

MOSI/

MISO

/SS

t6 t1 t7 t2 t4 t9 t5

2 Startbytes Byte 0 Byte 1 Byte 2 Byte 7

t1 t1 t1 t1

MLX90316

Rotary Position Sensor IC

3901090316

Page 32 of 45 Mar/12

Rev08

16.9. Slave Reset

On internal soft failures the Slave resets after 1 second or after an (error) frame is sent. On internal hard

failures the Slave resets itself. In that case, the Serial Protocol will not come up. The serial protocol link is

enabled only after the completion of the first synchronization (the Master deactivates /SS for at least t5).

16.10. Frame Layer

16.10.1. Command Device Mechanism

Before each transmission of a data frame, the Master should send a byte AAh to enable a frame transfer.

The latch point for the angle measurement is at the last clock before the first data frame byte.

16.10.2. Data Frame Structure

A data frame consists of 10 bytes:

• 2 start bytes (AAh followed by FFh)

• 2 data bytes (DATA16 – most significant byte first)

• 2 inverted data bytes (/DATA16 - most significant byte first)

• 4 all-Hi bytes

The Master should send AAh (55h in case of inverting transistor) followed by 9 bytes FFh. The Slave will

answer with two bytes FFh followed by 4 data bytes and 4 bytes FFh.

16.10.3. Timing

There are no timing limits for frames: a frame transmission could be initiated at any time. There is no inter-

frame time defined.

/SS

SCLK

A

F

A

F

FD A T A F

F

MOSI

MISO

Timing diagram

F

FD

Latch point

MLX90316

Rotary Position Sensor IC

3901090316

Page 33 of 45 Mar/12

Rev08

16.10.4. Data Structure

The DATA16 could be a valid angle, or an error condition. The two meanings are distinguished by the

LSB.

DATA16: Angle A[13:0] with (Angle Span)/2

14

Most Significant Byte Less Significant Byte

MSB

LSB

MSB

LSB

A13 A12

A11

A10

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 0 1

DATA16: Error

Most Significant Byte Less Significant Byte

MSB

LSB

MSB

LSB

E15 E14

E13

E12

E11

E10

E9

E8 E7 E6

E5

E4

E3

E2

E1

E0

BIT

NAME

E0 0

E1 1

E2 F_ADCMONITOR ADC Failure

E3 F_ADCSATURA ADC Saturation (Electrical failure or field too strong)

E4 F_RGTOOLOW Analog Gain Below Trimmed Threshold

(Likely reason : field too weak)

E5 F_MAGTOOLOW Magnetic Field Too Weak

E6 F_MAGTOOHIGH Magnetic Field Too Strong

E7 F_RGTOOHIGH

Analog Gain Above Trimmed Threshold

(Likely reason : field too strong)

E8 F_FGCLAMP Never occurring in serial protocol

E9 F_ROCLAMP Analog Chain Rough Offset Compensation : Clipping

E10 F_MT7V Device Supply V

DD

Greater than 7V

E11 -

E12 -

E13 -

E14 F_DACMONITOR Never occurring in serial protocol

E15 -

16.10.5. Angle Calculation

All communication timing is independent (asynchronous) of the angle data processing. The angle is

calculated continuously by the Slave:

•

Slow Mode: every 1.5 ms at most.

•

Fast Mode: every 350

µ

s at most.

The last angle calculated is hold to be read by the Master at any time. Only valid angles are transferred by

the Slave, because any internal failure of the Slave will lead to a soft reset.

16.10.6. Error Handling

In case of any errors listed in section 16.10.4, the Serial protocol will be initialized and the error condition

can be read by the master. The slave will perform a soft reset once the error frame is sent.

In case of any other errors (ROM CRC error, EEPROM CRC error, RAM check error, intelligent watchdog

error…) the Slave’s serial protocol is not initialized. The MOSI/MISO pin will stay Hi-impedant (no error

frames are sent).

MLX90316

Rotary Position Sensor IC

3901090316

Page 34 of 45 Mar/12

Rev08

17. Recommended Application Diagrams

17.1. Analog Output Wiring with the MLX90316 in SOIC Package

Figure 14 – Recommended wiring for the MLX90316 in SOIC8 package

(26)

.

Figure 15 – Recommended wiring for the MLX90316 in SOIC8 package – “BCS” Version.

26

See section 14.1.4 if the Switch Output feature is used.

C2

100nF

MLX90316

Vdd

NotUsed

Test 2

Vss

1

Test 1 Vdig

Switch Out

Out1

8

4

5

C1

100nF

C3

100nF

Vdd

GND

Output

5 V

ECU

R1

10K C4

4.7nF

ADC

C2

MLX90316

V

DD

O

UT2

T

EST2

V

SS

1

T

EST1

V

DIG

Switch Out

O

UT1

8

4

5

C1

C3

V

DD

GND

O

UT1

5 V

ECU

ADC

O

UT2

C4

C1, C2, C3, C4: 100nF

BCS

MLX90316

Rotary Position Sensor IC

3901090316

Page 35 of 45 Mar/12

Rev08

17.2. Analog Output Wiring with the MLX90316 in TSSOP Package

Figure 16 – Recommended wiring for the MLX90316 in TSSOP16 package (dual die).

17.3. PWM Low Side Output Wiring

Figure 17 – Recommended wiring for a PWM Low Side Output configuration

(27)

.

27

See section 14.1.4 if the Switch Output feature is used.

ECU

VDD1

VDD2

GND1

GND2

Vdd1

Vss1

1

Out2

Vdig1

Out1

Vss2

16

8

9

MLX90316

Vdd2

Vdig2

C1

100nF

C2

100nF C3

100nF

C6

100nF

C4

100nF

C5

100nF

Vdd1

GND1

Output1

Vdd2

GND2

Output2

ADC

R1

10K

C7

4.7nF

R2

10K

C8

4.7nF

GND2

C2

100nF

MLX90316

Vdd

NotUsed

Test 2

Vss

1

Test 1 Vdig

Switch Out

PWM

8

4

5

C1

100nF

C3

4.7nF

Vdd

GND

Output

5 V

ECU

R1

1K

C4

4.7nF

TIMER

5 V

MLX90316

Rotary Position Sensor IC

3901090316

Page 36 of 45 Mar/12

Rev08

17.4. Serial Protocol

Generic schematics for single slave and dual slave applications are described.

17.4.1. SPI Version – Single Die

Figure 18 – MLX90316 SPI Version – Single Die – Application Diagram

C2

100nF

MLX90316

Vdd

SCLK

Test 1

Vss

1

Test 0 Vdig

/SS

MOSI

8

4

5

C1

100nF

3.3V/5V

SPI Master

5 V

R2

1K

MISO

MOSI

SCLK

_SS

GND

Vdd

_SS

SCLK

MOSI

MLX90316

Rotary Position Sensor IC

3901090316

Page 37 of 45 Mar/12

Rev08

17.4.2. SPI Version – Dual Die

Figure 19 – MLX90316 SPI Version – Dual Die – Application Diagram

C2

100nF

MLX90316

Vdd

SCLK

Test 1

Vss

1

Test 0 Vdig

/SS

MOSI

8

4

5

C1

100nF

3.3V/5V

SPI Master

5 V

R2

1K

MISO

MOSI

SCLK1

_SS1

GND

Vdd

_SS1

SCLK1

MOSI

C2

100nF

MLX90316

Vdd

SCLK

Test 1

Vss

1

Test 0 Vdig

/SS

MOSI

8

4

5

C1

100nF

SCLK2

_SS2

SCLK2

#1

#2

MLX90316

Rotary Position Sensor IC

3901090316

Page 38 of 45 Mar/12

Rev08

17.4.3. Non SPI Version (Standard Version)

Figure 20 – MLX90316

−

Single Die

−

Serial Protocol Mode

Application Type

µCtrl

Supply

(V)

Pull

-

up

Supply

(V)

90316

Supply

(V)

R1 (Ω) R2 (Ω) R3 (Ω) R4 (Ω) R5 (Ω)

MOS

Type

5V

µ

Ctrl w/o O.D. w/o 3.3V

5V

100

1000

20,000

1000

20,000

BS170

5V

µ

Ctrl w/o O.D. w/ 3.3V

5V

3.3V

5V

150

1000

N/A

1000

20,000

BS170

3.3V

µ

Ctrl w/o

O.D.

(28)

3.3V

5V

150

1000

N/A

BS170

5V

µ

Ctrl w/ O.D. w/o 3.3V

(29)

5V

100

1000

20,000

1000

20,000

N/A

3.3V µCtrl w/ O.D.

3.3V

5V

150

1000

N/A

Table 3 - Resistor Values for Common Specific Applications

28

µCtrl w/ O.D. : Micro-controller with open-drain capability (for instance NEC V850ES series)

29

µCtrl w/o O.D. : Micro-controller without open-drain capability (like TI TMS320 series or ATMEL AVR )

C2

100nF

MLX90316

Vdd

SCLK

Test 1

Vss

1

Test 0 Vdig

/SS

MOSI

8

4

5

C1

100nF

3.3V/5V

SPI Master

5 V

R1

MISO

MOSI

SCLK

_SS

GND

Vdd

_SS

MOSI

R2

R3

R5

R4

MLX90316

Rotary Position Sensor IC

3901090316

Page 39 of 45 Mar/12

Rev08

18. Standard information regarding manufacturability of Melexis

products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture

sensitivity level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

•

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

•

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)

•

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak

temperature, temperature gradient, temperature profile etc) additional classification and qualification tests

have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance

of adhesive strength between device and board.

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more

information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction

Of the use of certain Hazardous Substances) please visit the quality page on our website:

http://www.melexis.com/quality.aspx

19. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

MLX90316

Rotary Position Sensor IC

3901090316

Page 40 of 45 Mar/12

Rev08

20. Package Information

20.1. SOIC8 - Package Dimensions

20.2. SOIC8 - Pinout and Marking

0.19

0.25

NOTES:

All dimensions are in millimeters (anlges in degrees).

* Dimension does not include mold flash, protrusions or

gate burrs (shall not exceed 0.15 per side).

** Dimension does not include interleads flash or protrusion

(shall not exceed 0.25 per side).

*** Dimension does not include dambar protrusion.

Allowable dambar protrusion shall be 0.08 mm total in

excess of the dimension at maximum material condition.

Dambar cannot be located on the lower radius of the foot.

5.80

6.20**

1.27 TYP

4.80

4.98*

1.52

1.72

0.100

0.250

1.37

1.57

0.36

0.46***

3.81

3.99**

0°

8°

0.41

1.27

Marking :

Part Number MLX90316 (3 digits)

316

Die Version (3 digits)

123456 Lot number (6 digits)

Week Date code (2 digits)

Year Date code (2 digits)

YY WW

BCG

Out2

SCLK

1

8

4

5

316Bxx

123456

\SS

Switch

Test 0

Vdd

Out

MOSI/MISO

Test 1

Vdig

Vss

TOP

Bottom

BDG

Standard

SPI Version

BCS BCS Version

MLX90316

Rotary Position Sensor IC

3901090316

Page 41 of 45 Mar/12

Rev08

20.3. SOIC8 - IMC Positionning

0.46 +/- 0.06

1.25

1.65

1.96

2.26

1 2 3 4

8 7 6 5

CCW

CW

COS

SIN

The MLX90316 is an absolute angular position sensor but the linearity error (Le – See Section 10) does

not include the error linked to the absolute reference 0 Deg (which can be fixed in the application through

the discontinuity point – See 14.2.2).

Angle detection MLX90316 SOIC8

1 2 3 4

8765

~ 0 Deg.*

S

N

1234

8 7 6 5

S

N

~ 90 Deg.*

1234

8 7 6 5

S

N

~ 270 Deg.*

1 2 3 4

8765

S

N

~ 180 Deg.*

* No absolute reference for the angular information.

MLX90316

Rotary Position Sensor IC

3901090316

Page 42 of 45 Mar/12

Rev08

20.4. TSSOP16 - Package Dimensions

0.09

0.20

1.0 DIA

NOTES:

All dimensions are in millimeters (anlges in degrees).

* Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side).

** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side).

*** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at

maximum material condition. Dambar cannot be located on the lower radius of the foot.

0.20 TYP

12

O

TYP

0.09 MIN

0.50

0.75

1.0 TYP

12

O

TYP

0

O

8

O

4.90

5.10*

1.1 MAX

0.05

0.15

0.85

0.95

0.19

0.30***

6.4 TYP

4.30

4.50**

0.65 TYP

1.0

MLX90316

Rotary Position Sensor IC

3901090316

Page 43 of 45 Mar/12

Rev08

20.5. TSSOP16 - Pinout and Marking

20.6. TSSOP16 - IMC Positionning

0.30 +/- 0.06

1.95

2.45

1.84

2.04

2.76

2.96

1 8

916

CCW

CW

COS 2

COS 1

SIN 2 SIN 1

Die 2Die 1

Marking :

Part Number MLX90316 (3 digits)

316

Die Version (3 digits)

123456

Lot number (6 digits)

Week Date code (2 digits)

Year Date code (2 digits)

YY WW

BCG

Vdd_1 SCLK_1

Test1_1

Vss_1

1

Test0_1

Out_2/MOSI/MISO_2

Vdig_1

_SS_1/ Switch_1

Out_1/MOSI/MISO_1

Vss_2

16

8

9

316BxG

123456

Test0_2

Vdd_2

_SS_2/Switch_2

SCLK_2

Vdig_2Test1_2

BDG

Standard

SPI Version

Top

Bottom

MLX90316

Rotary Position Sensor IC

3901090316

Page 44 of 45 Mar/12

Rev08

The MLX90316 is an absolute angular position sensor but the linearity error (Le – See Section 10) does

not include the error linked to the absolute reference 0 Deg (which can be fixed in the application through

the discontinuity point – See 14.2.2).

Angle detection MLX90316 TSSOP16

~ 270 Deg.* ~ 90 Deg.*

1 8

916

Die 2Die 1

S

N

~ 180 Deg.* ~ 0 Deg.*

1 8

916

Die 2Die 1

S

N

~ 0 Deg.* ~ 180 Deg.*

1 8

916

Die 2Die 1

S

N

1 8

916

Die 2Die 1

S

N

~ 90 Deg.* ~ 270 Deg.*

* No absolute reference for the angular information.

MLX90316

Rotary Position Sensor IC

3901090316

Page 45 of 45 Mar/12

Rev08

21. Disclaimer

Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in

its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the

information set forth herein or regarding the freedom of the described devices from patent infringement.

Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,

prior to designing this product into a system, it is necessary to check with Melexis for current information.

This product is intended for use in normal commercial applications. Applications requiring extended

temperature range, unusual environmental requirements, or high reliability applications, such as military,

medical life-support or life-sustaining equipment are specifically not recommended without additional

processing by Melexis for each application.

The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not

be liable to recipient or any third party for any damages, including but not limited to personal injury,

property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or

consequential damages, of any kind, in connection with or arising out of the furnishing, performance or

use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow

out of Melexis’ rendering of technical or other services.

For the latest version of this document, go to our website at

www.melexis.com

Or for additional information contact Melexis Direct:

Europe, Africa, Asia: America:

Phone: +32 1367 0495 Phone: +1 248 306 5400

E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com

ISO/TS 16949 and ISO14001 Certified