Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
LPV321-N Single, LPV358-N Dual, and LPV324-N Quad General-Purpose, Low Voltage,
Low Power, Rail-to-Rail Output Operational Amplifiers
1
1 Features
1 Specified 2.7-V and 5-V Performance
No Crossover Distortion
Space-Saving Package
5-Pin SC70 2 × 2.1 × 1 mm
Industrial Temperature Range: 40°C to 85°C
Gain-Bandwidth Product: 152 kHz
Low Supply Current
LPV321-N: 9 µA
LPV358-N: 15 µA
LPV324-N: 28 µA
Rail-to-Rail Output Swing at 100 kΩLoad:
V+3.5 mV
V+ 90 mV
VCM,0.2 V to V+0.8 V
2 Applications
Active Filters
General-Purpose Low Voltage Applications
General-Purpose Portable Devices
3 Description
The LPV3xx-N are low power (9-µA per channel at
5 V) versions of the LMV3xx op amps. This is another
addition to the LMV family of commodity op amps.
The LPV3xx-N are the most cost effective solutions
for the applications where low voltage, low power
operation, space saving and low price are needed.
The LPV3xx-N have rail-to-rail output swing capability
and the input common-mode voltage range includes
ground. They all exhibit excellent speed-power ratio,
achieving 152 kHz of bandwidth with a supply current
of only 9 µA.
The LPV321-N is available in space saving 5-Pin
SC70, which is approximately half the size of 5-Pin
SOT-23. The small package saves space on PC
boards, and enables the design of small portable
electronic devices. It also allows the designer to place
the device closer to the signal source to reduce noise
pickup and increase signal integrity.
The chips are built with Texas Instruments's
advanced submicron silicon-gate BiCMOS process.
The LPV3xx-N have bipolar input and output stages
for improved noise performance and higher output
current drive.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LPV321-N SC70 (5) 2.00 mm × 1.25 mm
SOT-23 (5) 2.90 mm × 1.60 mm
LPV358-N SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
LPV324-N SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Micropower Supply Current Rail-to-Rail Output Swing
2
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 DC Electrical Characteristics 2.7 V........................ 5
6.6 AC Electrical Characteristics 2.7 V........................ 5
6.7 DC Electrical Characteristics 5 V........................... 5
6.8 AC Electrical Characteristics 5 V........................... 6
6.9 Typical Characteristics.............................................. 7
7 Detailed Description............................................ 13
7.1 Overview ................................................................ 13
7.2 Functional Block Diagram....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 14
8 Application and Implementation ........................ 16
8.1 Application Information .......................................... 16
8.2 Typical Applications ................................................ 16
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Example .................................................... 20
11 Device and Documentation Support................. 21
11.1 Device Support .................................................... 21
11.2 Documentation Support ....................................... 21
11.3 Related Links ........................................................ 21
11.4 Receiving Notification of Documentation Updates 21
11.5 Community Resources.......................................... 21
11.6 Trademarks........................................................... 21
11.7 Electrostatic Discharge Caution............................ 22
11.8 Glossary................................................................ 22
12 Mechanical, Packaging, and Orderable
Information........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E Page
Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Deleted Soldering temperature (235°C maximum)................................................................................................................. 4
Changed Thermal Resistance, RθJA, values From: 478 To: 296.7 (SC70), From: 265 To: 206.6 (SOT-23), From: 190
To: 130.1 (8-Pin SOIC), From: 235 To: 187.5 (VSSOP), From: 145 To: 103.9 (14-Pin SOIC), From: 155 To: 132.7
(TSSOP)................................................................................................................................................................................. 4
Changes from Revision C (March 2013) to Revision D Page
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1
1
2
3
4
14
13
12
11
OUTD
-IND
+IND
V-
OUTA
-INA
+INA
V+
5
6
7
10
9
8
+INC
-INC
OUTC
+INB
-INB
OUTB
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
1
2
3
5
4
V+
OUT
IN+
V-
IN-
3
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
(1) I = Input, O = Output, P = Power
5 Pin Configuration and Functions
DBV or DCK Package
5-Pin SC70 or SOT-23
Top View
D or DGK Package
8-Pin SOIC or VSSOP
Top View
D or PW Package
14-Pin SOIC or TSSOP
Top View
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME SC70 or
SOT-23 SOIC or
VSSOP SOIC or
TSSOP
+IN 1 I Noninverting input
IN A+ 3 3 I Noninverting input, channel A
IN B+ 5 5 I Noninverting input, channel B
IN C+ 10 I Noninverting input, channel C
IN D+ 12 I Noninverting input, channel D
–IN 3 I Inverting input
IN A– 2 2 I Inverting input, channel A
IN B– 6 6 I Inverting input, channel B
IN C– 9 I Inverting input, channel C
IN D– 13 I Inverting input, channel D
OUTPUT 4 O Output
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
OUT C 8 O Output, channel C
OUT D 14 O Output, channel D
V+ 5 8 4 P Positive (highest) power supply
V– 2 4 11 P Negative (lowest) power supply
4
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Shorting output to V+will adversely affect reliability.
(3) Shorting output to Vwill adversely affect reliability.
(4) The maximum power dissipation is a function of TJ(MAX) and RθJA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Differential input voltage ±Supply voltage
Supply voltage (V+ V ) 5.5 V
Output short circuit to V +See(2)
Output short circuit to V See(3)
Junction temperature, TJ(MAX)(4) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
6.2 ESD Ratings VALUE UNIT
LPV321-N in DBV and DCK Packages
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V
Machine model ±100
LPV358-N in D and DGK Packages
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V
Machine model ±100
LPV324-N in D and PW Packages
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model ±100
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Supply voltage 2.7 5 V
Operating temperature –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
LPV321-N LPV358-N LPV324-N
UNIT
DBV
(SOT-23) DCK
(SC70) DGK
(VSSOP) D
(SOIC) D
(SOIC) PW
(TSSOP)
5 PINS 5 PINS 8 PINS 8 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 206.6 296.7 187.5 130.1 103.9 132.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 167.2 128.1 77.7 74.3 61.6 59.1 °C/W
RθJB Junction-to-board thermal resistance 65.5 74.3 108 70.7 58.4 75.1 °C/W
ψJT Junction-to-top characterization parameter 50.2 6.5 15.2 23.1 21.2 10.8 °C/W
ψJB Junction-to-board characterization parameter 65.1 73.6 106.5 70.2 58.1 74.58 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
5
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
6.5 DC Electrical Characteristics 2.7 V
TJ= 25°C, V+= 2.7 V, V= 0 V, VCM = 1 V, VO= V+/2, and R L> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOS Input offset voltage 1.2 7 mV
TCVOS Input offset voltage average drift 2 µV/°C
IBInput bias current 1.7 50 nA
IOS Input offset current 0.6 40 nA
CMRR Common mode rejection ratio 0 V VCM 1.7 V 50 70 dB
PSRR Power supply rejection ratio 2.7 V V+5 V, VO= 1 V, VCM = 1 V 50 65 dB
VCM Input common-mode voltage For CMRR 50 dB 00.2 V
1.9 1.7
VOOutput swing RL= 100 kΩto 1.35 V V+100 V+3mV
80 180
ISSupply current LPV321-N 4 8 µALPV358-N, both amplifiers 8 16
LPV324-N, all four amplifiers 16 24
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
6.6 AC Electrical Characteristics 2.7 V
TJ= 25°C, V+= 2.7 V, V= 0 V, VCM = 1 V, VO= V+/2, and R L> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
GBWP Gain-bandwidth product CL= 22 pF 112 kHz
ΦmPhase margin 97 °
GmGain margin 35 dB
enInput-referred voltage noise f = 1 kHz 178 nV/Hz
inInput-referred current noise f = 1 kHz 0.5 pA/Hz
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
6.7 DC Electrical Characteristics 5 V
TJ= 25°C, V+= 5 V, V= 0 V, VCM = 2 V, VO= V+/2, and R L> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOS Input offset voltage TJ= 25°C 1.5 7 mV
TJ= –40°C to 85°C 10
TCVOS Input offset voltage average
drift 2 µV/°C
IBInput bias current TJ= 25°C 2 50 nA
TJ= –40°C to 85°C 60
IOS Input offset current TJ= 25°C 0.6 40 nA
TJ= –40°C to 85°C 50
CMRR Common mode rejection
ratio 0 V VCM 4 V 50 71 dB
PSRR Power supply rejection ratio 2.7 V V+5 V, VO= 1 V, VCM = 1 V 50 65 dB
6
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
DC Electrical Characteristics 5 V (continued)
TJ= 25°C, V+= 5 V, V= 0 V, VCM = 2 V, VO= V+/2, and R L> 1 MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
(3) RLis connected to V -. The output voltage is 0.5 V VO4.5 V.
VCM Input common-mode voltage For CMRR 50 dB 00.2 V
4.2 4
AVLarge signal voltage gain(3) RL= 100 kΩTJ= 25°C 15 100 V/mV
TJ= –40°C to 85°C 10
VOOutput swing
Sourcing
RL= 100 kΩto 2.5 V TJ= 25°C V+100 V+3.5
mV
TJ= –40°C to 85°C V+200
Sinking
RL= 100 kΩto 2.5 V TJ= 25°C 90 180
TJ= –40°C to 85°C 220
IO
Output short circuit current
sourcing LPV3xx-N, VO= 0 V 2 16 mA
Output short circuit current
sinking LPV321-N, VO= 5 V 20 60
LPV324-N and LPV358-N, VO= 5 V 11 16
ISSupply current
LPV321-N TJ= 25°C 9 12
µA
TJ= –40°C to 85°C 15
LPV358-N,
Both amplifiers TJ= 25°C 15 20
TJ= –40°C to 85°C 24
LPV324-N,
All four amplifiers TJ= 25°C 28 42
TJ= –40°C to 85°C 46
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) Connected as voltage follower with 3V step input. Number specified is the slower of the positive and negative slew rates.
6.8 AC Electrical Characteristics 5 V
TJ= 25°C, V+= 5 V, V= 0 V, VCM = 2 V, VO= V+/2, and R L> 1MΩ(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SR Slew rate(3) 0.1 V/µs
GBWP Gain-bandwidth product CL= 22 pF 152 kHz
ΦmPhase margin 87 °
GmGain margin 19 dB
enInput-referred voltage noise f = 1 kHz 146 nV/Hz
inInput-referred current noise f = 1 kHz 0.3 pA/Hz
7
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
6.9 Typical Characteristics
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 1. Supply Current vs Supply Voltage (LPV321-N) Figure 2. Input Current vs Temperature
Figure 3. Sourcing Current vs Output Voltage Figure 4. Sourcing Current vs Output Voltage
Figure 5. Sinking Current vs Output Voltage Figure 6. Sinking Current vs Output Voltage
8
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 7. Output Voltage Swing vs Supply Voltage Figure 8. Input Voltage Noise vs Frequency
Figure 9. Input Current Noise vs Frequency Figure 10. Input Current Noise vs Frequency
Figure 11. Crosstalk Rejection vs Frequency Figure 12. PSRR vs Frequency
9
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 13. CMRR vs Frequency Figure 14. CMRR vs Input Common Mode Voltage
Figure 15. CMRR vs Input Common Mode Voltage Figure 16. ΔVOS vs VCM
Figure 17. ΔVOS vs VCM Figure 18. Input Voltage vs Output Voltage
10
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 19. Input Voltage vs Output Voltage Figure 20. Open-Loop Frequency Response
Figure 21. Open-Loop Frequency Response Figure 22. Gain and Phase vs Capacitive Load
Figure 23. Gain and Phase vs Capacitive Load Figure 24. Slew Rate vs Supply Voltage
11
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 25. Noninverting Large Signal Pulse Response Figure 26. Noninverting Small Signal Pulse Response
Figure 27. Inverting Large Signal Pulse Response Figure 28. Inverting Small Signal Pulse Response
Figure 29. Stability vs Capacitive Load Figure 30. Stability vs Capacitive Load
12
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
VS= 5 V, single supply, and TA= 25°C (unless otherwise noted)
Figure 31. Stability vs Capacitive Load Figure 32. Stability vs Capacitive Load
Figure 33. THD vs Frequency Figure 34. Open-Loop Output Impedance vs Frequency
Figure 35. Short Circuit Current vs Temperature (Sinking) Figure 36. Short Circuit Current vs Temperature (Sourcing)
_
+
OUT
V+
V
IN
IN +
Copyright © 2016,
Texas Instruments Incorporated
13
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The LPV321-N, LPV358-N, and LPV324-N devices are micropower (10-µA) versions of the popular LMV3xx-N.
The LPV321-N is the single-channel version. The LPV358-N is the dual, and the LPV324-N is the quad. The
LPV32x-N are the most cost effective solution for applications where low power and low voltage operation, space
efficiency, and low-price are important. The LPV3x-N have rail-to-rail output swing capability and the input
common-mode voltage range includes ground. They all exhibit excellent speed to power ratio, achieving 152 kHz
of bandwidth and 0.1-V/µs slew rate with 10 mA of supply current.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Size
The small footprints of the LPV3xx-N packages save space on printed circuit boards, and enable the design of
smaller electronic products (such as cellular phones, pagers, or other portable systems). The low profile of the
LPV3xx-N make them possible to use in PCMCIA type III cards.
7.3.2 Signal Integrity
Signals can pick up noise between the signal source and the amplifier. By using a physically smaller amplifier
package, the LPV3xx-N can be placed closer to the signal source, reducing noise pickup and increasing signal
integrity.
7.3.3 Simplified Board Layout
These products help avoid using long printed-circuit traces in the PCB. This means no additional components,
such as capacitors and resistors, are needed to filter out unwanted signals due to the interference between the
long printed-circuit traces.
7.3.4 Low Supply Current
These devices help maximize battery life. They are ideal for battery powered systems.
7.3.5 Low Supply Voltage
TI provides ensured performance at 2.7 V and 5 V. These specifications ensure operation throughout the battery
lifetime.
7.3.6 Rail-to-Rail Output
Rail-to-rail output swing provides maximum possible dynamic range at the output. This is particularly important
when operating on low-supply voltages.
14
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Feature Description (continued)
7.3.7 Input Includes Ground
Allows direct sensing near GND in single supply operation.
The differential input voltage may be larger than V+without damaging the device. Protection should be provided
to prevent the input voltages from going negative more than 0.3 V (at 25°C). An input clamp diode with a
resistor to the IC input terminal can be used.
7.4 Device Functional Modes
The LPV3xx-N can be operated as a single-supply or a dual-supply operational amplifier depending on the
application.
7.4.1 Capacitive Load Tolerance
The LPV3xx-N can directly drive 200 pF in unity-gain without oscillation. The unity-gain follower is the most
sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers.
The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in
either an underdamped pulse response or oscillation. To drive a heavier capacitive load, circuit in Figure 37 can
be used.
Figure 37. Indirectly Driving A Capacitive Load Using Resistive Isolation
In Figure 37, the isolation resistor (RISO) and the load capacitor (CL) form a pole to increase stability by adding
more phase margin to the overall system. The desired performance depends on the value of RISO. The bigger the
RISO resistor value, the more stable VOUT is. Figure 38 is an output waveform of Figure 37 using 100 kΩfor RISO
and 1000 pF for CL.
Figure 38. Pulse Response of the LPV324 Circuit in Figure 37
15
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Device Functional Modes (continued)
The circuit in Figure 39 is an improvement to the one in Figure 37 because it provides DC accuracy as well as
AC stability. If there were a load resistor in Figure 37, the output would be voltage divided by RISO and the load
resistor. Instead, in Figure 39, RFprovides the DC accuracy by using feed-forward techniques to connect VIN to
RL. Caution is needed in choosing the value of RFdue to the input bias current of the LPV3xx-N. CFand RISO
serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back
to the amplifier's inverting input, thereby preserving phase margin in the overall feedback loop. Increased
capacitive drive is possible by increasing the value of CF. This in turn slows down the pulse response.
Figure 39. Indirectly Driving A Capacitive Load With DC Accuracy
7.4.2 Input Bias Current Cancellation
The LPV3xx-N family has a bipolar input stage. The typical input bias current of LPV3xx-N is 1.5 nA with 5-V
supply. Thus a 100-kΩinput resistor causes 0.15 mV of error voltage. By balancing the resistor values at both
inverting and noninverting inputs, the error caused by the amplifier's input bias current is reduced. The circuit in
Figure 40 shows how to cancel the error caused by input bias current.
Figure 40. Cancelling the Error Caused by Input Bias Current
3
L1
c3 1
2 1 3
R
AR
1
f2 R C
R R II R
S
16
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LPV3xx-N family of amplifiers is specified for operation from 2.7 V to 5 V (±1.35 V to ±2.5 V). Many of the
specifications apply from –40°C to 125°C. They provide ground-sensing inputs as well as rail-to-rail output swing.
Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in
the Typical Characteristics.
8.2 Typical Applications
8.2.1 Simple Low-Pass Active Filter
A simple low-pass filter is shown in Figure 41.
Figure 41. Simple Low-Pass Active Filter Schematic
8.2.1.1 Design Requirements
The low-pass filter is shown in Figure 41 passes low frequencies and attenuate frequencies above corner
frequency (fc) at a roll-off rate of 20 dB/Decade.
8.2.1.2 Detailed Design Procedure
The low-frequency gain (ωo) is defined by R3/R1. This allows low-frequency gains other than unity to be
obtained. The filter has a 20 dB/decade roll-off after its corner frequency fc. R2must be chosen equal to the
parallel combination of R1and R3to minimize errors due to bais current. The frequency response of the filter is
shown in Figure 42.
(1)
17
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Typical Applications (continued)
Note that the single op amp active filters are used in to the applications that require low quality factor, Q (10),
low frequency (5 kHz), and low gain (10), or a small value for the product of gain times Q (100). The op
amp must have an open loop voltage gain at the highest frequency of interest at least 50 times larger than the
gain of the filter at this frequency. In addition, the selected op amp must have a slew rate that meets the
requirements in Equation 2.
Slew Rate 0.5 × (ωHVOPP) × 106V/µsec
where
ωHis the highest frequency of interest
VOPP is the output peak-to-peak voltage (2)
8.2.1.3 Application Curve
Figure 42. Frequency Response of Simple Low-pass Active Filter
8.2.2 Difference Amplifier
The difference amplifier allows the subtraction of two voltages or, as a special case, the cancellation of a signal
common to two inputs. It is useful as a computational amplifier in making a differential to single-ended conversion
or in rejecting a common mode signal.
Figure 43. Difference Amplifier Schematic
(3)
8.2.3 Instrumentation Circuits
The input impedance of the previous difference amplifier is set by the resistor R1, R2, R3, and R4. To eliminate
the problems of low input impedance, one way is to use a voltage follower ahead of each input as shown in the
following two instrumentation amplifiers.
O 2 1
O 2 1
R4
V 1 V V ,where R1 R4 and R2 R3
R3
As shown: V 2 V V
§ ·
¨ ¸
© ¹
18
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Typical Applications (continued)
8.2.3.1 Three Operating Amplifier Instrumentation
The quad LPV324 can be used to build a three-op-amp instrumentation amplifier as shown in Figure 44
Figure 44. Three-op-amp Instrumentation Amplifier Schematic
The first stage of this instrumentation amplifier is a differential-input, differential-output amplifier, with two voltage
followers. These two voltage followers assure that the input impedance is over 100 MΩ. The gain of this
instrumentation amplifier is set by the ratio of R2/R1. R3should equal R1and R4equal R2. Matching of R3to R1
and R4to R2affects the CMRR. For good CMRR over temperature, low drift resistors should be used. Making R4
Slightly smaller than R 2and adding a trim pot equal to twice the difference between R 2and R4will allow the
CMRR to be adjusted for optimum.
8.2.3.2 Two Operating Amplifier Instrumentation
A two-op-amp instrumentation amplifier can also be used to make a high-input-impedance DC differential
amplifier (Figure 45). As in the three-op-amp circuit, this instrumentation amplifier requires precise resistor
matching for good CMRR. R4should equal to R1and R3must equal R2.
Figure 45. Two-op-amp Instrumentation Amplifier Schematic
(4)
8.2.3.3 Single-Supply Inverting Amplifier
There may be cases where the input signal going into the amplifier is negative. Because the amplifier is
operating in single supply voltage, a voltage divider using R3and R4is implemented to bias the amplifier so the
input signal is within the input common-common voltage range of the amplifier. The capacitor C1is placed
between the inverting input and resistor R1to block the DC signal going into the AC signal source, VIN. The
values of R1and C1affect the cutoff frequency in Equation 5.
fc = 1/2πR1C1(5)
OUT IN
R2
V V
R1
19
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
Typical Applications (continued)
As a result, the output signal is centered around mid-supply (if the voltage divider provides V+/2 at the non-
inverting input). The output can swing to both rails, maximizing the signal-to-noise ratio in a low voltage system.
Figure 46. Single-Supply Inverting Amplifier
(6)
9 Power Supply Recommendations
The LPV3xx-N is specified for operation from 2.7 V to 5.5 V; many specifications apply from –40°C to 125°C.
Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in
the Typical Characteristics.
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, see Layout Guidelines
section.
20
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
For best operational performance, use good PCB layout practices including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational
amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power
sources local to the analog circuitry.
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply
applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current. For more detailed information, see
Circuit Board Layout Techniques (SLOA089).
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Figure 47.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
Figure 47. Operational Amplifier Board Layout for Noninverting Configuration
21
LPV321-N
,
LPV324-N
,
LPV358-N
www.ti.com
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
LPV321-N PSPICE Model (SNOM026)
LPV358-N PSPICE Model (SNOM022)
LPV324-N PSPICE Model (SNOM027)
TINA-TI SPICE-Based Analog Simulation Program
DIP Adapter Evaluation Module
TI Universal Operational Amplifier Evaluation Module
TI Filterpro Software
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
Handbook of Operational Amplifier Applications (SBOA092)
Compensate Transimpedance Amplifiers Intuitively (SBOA055)
Circuit Board Layout Techniques (SLOA089)
AN-1803 Design Considerations for a Transimpedance Amplifier (SNOA515)
11.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LPV321-N Click here Click here Click here Click here Click here
LPV324-N Click here Click here Click here Click here Click here
LPV358-N Click here Click here Click here Click here Click here
11.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.6 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
22
LPV321-N
,
LPV324-N
,
LPV358-N
SNOS413E AUGUST 2000REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: LPV321-N LPV324-N LPV358-N
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
11.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.8 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LPV321M5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A27A
LPV321M5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A27A
LPV321M7 NRND SC70 DCK 5 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 A19
LPV321M7/NOPB ACTIVE SC70 DCK 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A19
LPV321M7X/NOPB ACTIVE SC70 DCK 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A19
LPV324M/NOPB ACTIVE SOIC D 14 55 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LPV324M
LPV324MT/NOPB ACTIVE TSSOP PW 14 94 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LPV324
MT
LPV324MTX NRND TSSOP PW 14 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LPV324
MT
LPV324MTX/NOPB ACTIVE TSSOP PW 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LPV324
MT
LPV324MX NRND SOIC D 14 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LPV324M
LPV324MX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LPV324M
LPV358M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM LPV
358M
LPV358MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 P358
LPV358MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 P358
LPV358MX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LPV
358M
LPV358MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LPV
358M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LPV321M5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LPV321M5X/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LPV321M7 SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LPV321M7/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LPV321M7X/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LPV324MTX TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
LPV324MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
LPV324MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LPV324MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LPV358MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LPV358MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LPV358MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LPV358MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LPV321M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LPV321M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LPV321M7 SC70 DCK 5 1000 210.0 185.0 35.0
LPV321M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LPV321M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LPV324MTX TSSOP PW 14 2500 367.0 367.0 35.0
LPV324MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
LPV324MX SOIC D 14 2500 367.0 367.0 35.0
LPV324MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LPV358MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LPV358MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LPV358MX SOIC D 8 2500 367.0 367.0 35.0
LPV358MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated