1 of 3 Creation Date : June 19, 2019 (GMT) Multilayer Ceramic Chip Capacitors CGA5L3X7R1H105K160AB TDK item description CGA5L3X7R1H105KT**** Applications Feature Automotive Grade General General (Up to 50V) AEC-Q200 AEC-Q200 Series CGA5(3216) [EIA 1206] Status Production Size Length(L) 3.20mm +0.30,-0.10mm Width(W) 1.60mm +0.30,-0.10mm Thickness(T) 1.60mm +0.30,-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 1F 10% Rated Voltage 50VDC Temperature Characteristic X7R(15%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 500M Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : June 19, 2019 (GMT) Multilayer Ceramic Chip Capacitors CGA5L3X7R1H105K160AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA5L3X7R1H105K160AB ESR CGA5L3X7R1H105K160AB Capacitance CGA5L3X7R1H105K160AB CGA5L3X7R1H105K160AB Temperature Characteristic CGA5L3X7R1H105K160AB(No Bias) DC Bias Characteristic CGA5L3X7R1H105K160AB(DC Bias = 25V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGA5L3X7R1H105K160AB(100kHz) CGA5L3X7R1H105K160AB(500kHz) CGA5L3X7R1H105K160AB(1MHz) Multilayer Ceramic Chip Capacitors CGA5L3X7R1H105K160AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : June 19, 2019 (GMT)