CREAT BY ART
◇Designed for mounting on small surface
◇Extremely thin/leadless package
◇High mounting capability, strong surage with stand,
high reliability
◇Pb free version and RoHS compliant
◇Halogen free
◇Case:0805 standard package, molded plastic
◇Terminal:Gold plated, solderable per
MIL-STD-750, method 2026 guaranteed
◇High temperature soldering guaranteed:260℃/10S
◇Polarity:Indicated by cathode band
◇Weight:0.006 g (approximately)
Maxi mum Ratings and Electrical Characteristics
Ratin
at 25
o
C ambient tem
erature unless otherwise s
ecified.
Symbol Units
PD mW
V
RSM
V
V
RRM
V
I
FRM
mA
I
O
mA
R
thjA
℃/W
T
J
, T
STG O
C
Characteristics at T
=25
o
C
Symbol Units
V
(BR)
V
V
F
V
nA
μA
C
J
pF
Trr nS
Document Number:S1308002 Version:J13
1
-25
Forward Voltage I
F
=100mA
Reverse Leakage Current V
R
=20V
V
R
=75V I
R
75
-
375
Non-Repetitive Peak Reverse Voltage
Reverse Recovery Time (Note 3)
Thermal Resistance form Junction Ambient (Note 1)
-5
-4
Note: 1 Valid provided that electrodes are kept at ambient temperature
-4
Junction Capacitance V
R
=0, f=1.0MHz
Note: 2 Test Condition:I
R
=100μA
Note: 3 Test Condition:I
F
=10mA, I
R
=1mA, R
L
=100Ω
Junction and Storage Temperature Range - 65 to + 175
Parameter Min
Value
500Power Dissipation
Parameter
TS4148 RYG
Features
0805
Mechanical Data
Small Signal Product
500mW High Speed SMD Switching Diode
A0.5
2.0
Mean Forward Current 150
Non-Repetitive Peak Forward Surge Current
Tp = 1sec square waveform
Tp = 8.3ms single half sine waveform
Max
-
I
FSM
Repetitive Peak Forward Current 300
Repetitive Peak Reverse Voltage 75
Reverse Breakdown Voltage (Note 2)
100