Type
BSC160N10NS3 G
OptiMOSTM3 Power-Transistor
• Optimized for dc-dc conversion
• N-channel, normal level
• Excellent gate charge x RDS(on) product (FOM)
• Very low on-resistance RDS(on)
• 150 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
• Halogen-free according to IEC61249-2-21
Maximum ratings, at Tj=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current IDTC=25 °C 42 A
TC=100 °C 27
TA=25 °C,
RthJA=50 K/W2) 8.8
Pulsed drain current3) ID,pulse TC=25 °C 168
Avalanche energy, single pulse EAS ID=33 A, RGS=25 Ω50 mJ
Gate source voltage VGS ±20 V
Power dissipation Ptot TC=25 °C 60 W
Operating and storage temperature Tj, Tstg -55 ... 150 °C
IEC climatic category; DIN IEC 68-1 55/150/56
Value
VDS 100 V
RDS(on),max 16 mΩ
ID42 A
Product Summary
Type Package Marking
BSC160N10NS3 G PG-TDSON-8 160N10NS
PG-TDSON-8
Rev. 2.3 page 1 2009-10-30
BSC160N10NS3 G
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case RthJC - - 2.1 K/W
RthJA 6 cm2 cooling area2) --50
Electrical characteristics, at Tj=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS VGS=0 V, ID=1 mA 100 - - V
Gate threshold voltage VGS(th) VDS=VGS, ID=33 µA 2 2.7 3.5
Zero gate voltage drain current IDSS
VDS=100 V, VGS=0 V,
Tj=25 °C - 0.01 1 µA
VDS=100 V, VGS=0 V,
Tj=125 °C - 10 100
Gate-source leakage current IGSS VGS=20 V, VDS=0 V - 1 100 nA
Drain-source on-state resistance RDS(on) VGS=10 V, ID=33 A - 13.9 16 mΩ
VGS=6 V, ID=16 A - 17.6 33
Gate resistance RG- 1.4 - Ω
Transconductance gfs
|VDS|>2|ID|RDS(on)max,
ID=33 A 21 42 - S
Values
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Thermal resistance,
j
unction - ambient
3) see figure 3
1)J-STD20 and JESD22
Rev. 2.3 page 2 2009-10-30
BSC160N10NS3 G
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance Ciss - 1300 1700 pF
Output capacitance Coss - 240 320
Reverse transfer capacitance Crss -11-
Turn-on delay time td(on) -13-ns
Rise time tr-15-
Turn-off delay time td(off) -22-
Fall time tf-5-
Gate Char
g
e Characteristics4)
Gate to source charge Qgs -6-nC
Gate to drain charge Qgd -3-
Switching charge Qsw -5-
Gate charge total Qg-1925
Gate plateau voltage Vplateau - 4.4 - V
Output charge Qoss VDD=50 V, VGS=0 V -2533nC
Reverse Diode
Diode continous forward current IS- - 42 A
Diode pulse current IS,pulse - - 168
Diode forward voltage VSD
VGS=0 V, IF=33 A,
Tj=25 °C - 1 1.2 V
Reverse recovery time trr -53 ns
Reverse recovery charge Qrr -83-nC
4) See figure 16 for gate charge parameter definition
VR=50 V, IF=16A,
diF/dt=100 A/µs
TC=25 °C
Values
VGS=0 V, VDS=50 V,
f=1 MHz
VDD=50 V, VGS=10 V,
ID=16 A, RG=1.6 Ω
VDD=50 V, ID=16 A,
VGS=0 to 10 V
Rev. 2.3 page 3 2009-10-30
BSC160N10NS3 G
1 Power dissipation 2 Drain current
Ptot=f(TC)ID=f(TC); VGS≥10 V
3 Safe operating area 4 Max. transient thermal impedance
ID=f(VDS); TC=25 °C; D=0 ZthJC=f(tp)
parameter: tpparameter: D=tp/T
single pulse
0.01
0.02
0.05
0.1
0.2
0.5
100
10-1
10-2
10-3
10-4
10-5
101
100
10-1
10-2
tp [s]
ZthJC [K/W]
0
10
20
30
40
50
60
70
0 40 80 120 160
TC [°C]
Ptot [W]
0
10
20
30
40
50
0 40 80 120 160
TC [°C]
ID [A]
100 ns
1 µs
10 µs
100 µs
1 ms
DC
103
102
101
100
10-1
103
102
101
100
10-1
VDS [V]
ID [A]
Rev. 2.3 page 4 2009-10-30
BSC160N10NS3 G
5 Typ. output characteristics 6 Typ. drain-source on resistance
ID=f(VDS); Tj=25 °C RDS(on)=f(ID); Tj=25 °C
parameter: VGS parameter: VGS
7 Typ. transfer characteristics 8 Typ. forward transconductance
ID=f(VGS); |VDS|>2|ID|RDS(on)max gfs=f(ID); Tj=25 °C
parameter: Tj
4.5 V
5 V
5.5 V
6 V
7 V
10 V
0
5
10
15
20
25
30
0 20406080100
ID [A]
RDS(on) [mΩ]
25 °C
150 °C
0
20
40
60
80
01234567
VGS [V]
ID [A]
0
20
40
60
80
0 20406080100
ID [A]
gfs [S]
4.5 V
5 V
5.5 V
6 V
7 V
10 V
0
20
40
60
80
100
120
0123
VDS [V]
ID [A]
Rev. 2.3 page 5 2009-10-30
BSC160N10NS3 G
9 Drain-source on-state resistance 10 Typ. gate threshold voltage
RDS(on)=f(Tj); ID=33 A; VGS=10 V VGS(th)=f(Tj); VGS=VDS
parameter: ID
11 Typ. capacitances 12 Forward characteristics of reverse diode
C=f(VDS); VGS=0 V; f=1 MHz IF=f(VSD)
parameter: Tj
typ
98 %
0
5
10
15
20
25
30
35
-60 -20 20 60 100 140 180
Tj [°C]
RDS(on) [mΩ]
33 µA
330 µA
0
0.5
1
1.5
2
2.5
3
3.5
4
-60 -20 20 60 100 140 180
Tj [°C]
VGS(th) [V]
Ciss
Coss
Crss
104
103
102
101
100
0 20406080
VDS [V]
C [pF]
25 °C
150 °C
25 °C, 98%
150 °C, 98%
1
10
100
1000
0 0.5 1 1.5 2
VSD [V]
IF [A]
Rev. 2.3 page 6 2009-10-30
BSC160N10NS3 G
13 Avalanche characteristics 14 Typ. gate charge
IAS=f(tAV); RGS=25 ΩVGS=f(Qgate); ID=16 A pulsed
parameter: Tj(start) parameter: VDD
15 Drain-source breakdown voltage 16 Gate charge waveforms
VBR(DSS)=f(Tj); ID=1 mA
20 V
50 V
80 V
0
2
4
6
8
10
0 5 10 15 20
Qgate [nC]
VGS [V]
90
95
100
105
110
-60 -20 20 60 100 140 180
Tj [°C]
VBR(DSS) [V]
V
GS
Q
gate
V
gs(th)
Q
g(th)
Q
gs
Q
gd
Q
sw
Q
g
25 °C
100 °C
125 °C
1
10
100
1 10 100 1000
tAV [µs]
IAS [A]
Rev. 2.3 page 7 2009-10-30
BSC160N10NS3 G
Package Outline: PG-TDSON-8
Rev. 2.3 page 8 2009-10-30
BSC160N10NS3 G
Dimensions in mm
Rev. 2.3 page 9 2009-10-30
BSC160N10NS3 G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
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conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
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For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
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on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
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Rev. 2.3 page 10 2009-10-30
