SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DConvert TTL Voltage Levels to MOS Levels
DHigh Sink-Current Capability
DInput Clamping Diodes Simplify System
Design
DOpen-Collector Driver for Indicator Lamps
and Relays
DInputs Fully Compatible With Most TTL
Circuits
description/ordering information
These hex inverter buffers/drivers feature
high-voltage open-collector outputs to interface
with high-level circuits (such as MOS), or for
driving high-current loads, and also are
characterized for use as inverter buffers for driving
TTL inputs. The ’LS06 devices have a rated output
voltage of 30 V, and the SN74LS16 has a rated
output voltage of 15 V. The maximum sink current
for the SN54LS06 is 30 mA, and for the
SN74LS06 and SN74LS16 it is 40 mA.
These devices are compatible with most TTL
families. Inputs are diode-clamped to minimize
transmission effects, which simplifies design.
Typical power dissipation is 175 mW, and average
propagation delay time is 8 ns.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube SN74LS06N SN74LS06N
SOIC − D
Tube SN74LS06D
LS06
0°C to 70°CSOIC − D Tape and reel SN74LS06DR LS06
0C to 70 C
SOP − NS Tape and reel SN74LS06NSR 74LS06
SSOP − DB Tape and reel SN74LS06DBR LS06
CDIP − J
Tube SN54LS06J SN54LS06J
−55°C to 125°C
CDIP − J
Tube SNJ54LS06J SNJ54LS06J
−55 C to 125 C
LCCC − FK Tube SNJ54LS06FK SNJ54LS06FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
The SN74LS16 is obsolete
a
nd is no longer supplied
.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54LS06 . . . J PACKAGE
SN74LS06, SN74LS16 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4A 6A
3Y
GND
NC
NC − No internal connection
4Y V
SN54LS06 . . . FK PACKAGE
(TOP VIEW)
CC
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&'
'&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).*
&*'&4 "! %-- +%#%$*&*#'/
+#".)(&' ("$+-%& &" 5676 %-- +%#%$*&*#' %#* &*'&*.
)-*'' "&0*#2'* "&*./ %-- "&0*# +#".)(&' +#".)(&"
+#"(*''4 ."*' "& *(*''%#-3 (-).* &*'&4 "! %-- +%#%$*&*#'/
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
1
3
5
9
11
13
2
4
6
8
10
12
Pin numbers shown are for the D, DB, J, N, and NS packages.
schematic (each gate)
Input
VCC
Output
GND
9 kΩ1 kΩ
2 kΩ2 kΩ
2.5 kΩ
2.5 kΩ
15 kΩ
Resistor values shown are nominal.
The SN74LS16 is obsolete
a
nd is no longer supplied
.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO (see Notes 1 and 2): SN54LS06, SN74LS06 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74LS16 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4)
SN54LS06 SN74LS06
SN74LS16
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VOH
High-level output voltage
’LS06 30 30
V
VOH High-level output voltage SN74LS16 15 V
IOL Low-level output current 30 40 mA
TAOperating free-air temperature −55 125 0 70 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
‡SN54LS06 SN74LS06
SN74LS16
UNIT
PARAMETER
TEST CONDITIONS‡
MIN TYP§MAX MIN TYP§MAX
UNIT
VIK VCC = MIN, II = −12 mA −1.5 −1.5 V
IOH
VCC = MIN,
VIL = 0.8 V
’LS06, VOH = 30 V 0.25 0.25
mA
IOH VCC = MIN, VIL = 0.8 V SN74LS16, VOH = 15 V 0.25 mA
IOL = 16 mA 0.25 0.4 0.25 0.4
V
OL
V
CC
= MIN, V
IH
= 2 V IOL = 30 mA 0.7 V
VOL
VCC = MIN,
VIH = 2 V
IOL = 40 mA 0.7
V
IIVCC = MAX, VI = 7 V 1 1 mA
IIH VCC = MAX, VI = 2.4 V 20 20 µA
IIL VCC = MAX, VI = 0.4 V −0.2 −0.2 mA
ICCH VCC = MAX 18 18 mA
ICCL VCC = MAX 60 60 mA
‡For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§All typical values are at VCC = 5 V, and TA = 25°C.
The SN74LS16 is obsolete
a
nd is no longer supplied
.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER FROM
(INPUT) TO
(OUTPUT) TEST CONDITIONS MIN MAX UNIT
tPLH
A
Y
RL = 110 Ω,
CL = 15 pF
7 15
ns
tPHL
A
Y
R
L
= 110
Ω
,
C
L
= 15 pF
10 20
ns
The SN74LS16 is obsolete
a
nd is no longer supplied
.
SDLS020E − MAY 1990 − REVISED FEBRUARY 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
tPHL tPLH
tPLH tPHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
High-Level
Pulse
Low-Level
Pulse
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note D)
3 V
0 V
VOL
VOH
VOH
VOL
In-Phase
Output
(see Note D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC
RL
Test
Point
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
(see Note B)
VCC
RL
From Output
Under Test
CL
(see Note A)
Test
Point
(see Note B
)
V
CC RL
From Output
Under Test
CL
(see Note A)
Test
Point
5 kΩ
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL
.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns
.
G. The outputs are measured one at a time, with one input transition per measurement.
S1
S2
tPHZ
tPLZ
tPZL
tPZH
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
3 V
0 V
Output
Control
(low-level
enabling)
Waveform 1
(see Notes C
and D)
Waveform 2
(see Notes C
and D) ≈1.5 V
VOH − 0.5 V
VOL + 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V
tw
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
VOL
VOH
Figure 1. Load Circuits and Voltage Waveforms
The SN74LS16 is obsolete
a
nd is no longer supplied
.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9861701Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9861701QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54LS06J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74LS06D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LS06DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS06NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS06NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS06NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS16D OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74LS16DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74LS16N OBSOLETE PDIP N 14 TBD Call TI Call TI
SNJ54LS06FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS06J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS06DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS06DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS06NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS06DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LS06DR SOIC D 14 2500 346.0 346.0 33.0
SN74LS06NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated
