74LVC04A Low-Voltage CMOS Hex Inverter With 5 V-Tolerant Inputs The 74LVC04A is a high performance hex inverter operating from a 1.2 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows 74LVC04A inputs to be safely driven from 5 V devices if VCC is less than 5.0 V. Current drive capability is 24 mA at the outputs. www.onsemi.com Features * * * * * * Designed for 1.2 V to 3.6 V VCC Operation 5.0 V Tolerant Inputs - Interface Capability With 5.0 V TTL Logic TSSOP-14 DT SUFFIX CASE 948G SOIC-14 NB D SUFFIX CASE 751A PIN ASSIGNMENT VCC A3 O3 A4 O4 A5 O5 24 mA Output Sink and Source Capability 14 13 12 11 10 9 8 Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements ESD Performance: Human Body Model >2000 V Machine Model >200 V These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND A0 A1 A2 A3 A4 A5 1 2 3 4 5 6 13 12 11 10 9 8 14-Lead (Top View) O0 MARKING DIAGRAMS O1 14 LVC04AG AWLYWW O2 O3 1 SOIC-14 NB O4 14 O5 LVC 04A ALYWG G Figure 1. Logic Diagram 1 TSSOP-14 A WL, L YY, Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2015 September, 2015 - Rev. 0 1 Publication Order Number: 74LVC04A/D 74LVC04A TRUTH TABLE PIN NAMES Pins Function An On Data Inputs Outputs An On L H H L MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Condition Unit -0.5 to +6.5 V -0.5 VI +6.5 V -0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1) V -50 VI < GND mA -50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range -65 to +150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TL = 260 C TJ Junction Temperature Under Bias TJ = 135 C qJA Thermal Resistance (Note 2) SOIC = 85 TSSOP = 100 C/W MSL Moisture Sensitivity Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min Supply Voltage Operating Functional Typ Max V 1.65 1.2 3.6 3.6 VI Input Voltage 0 5.5 VO Output Voltage HIGH or LOW State 3-State 0 0 VCC 5.5 IOH IOL Units V V HIGH Level Output Current VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V -24 -12 mA LOW Level Output Current VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V 24 12 mA TA Operating Free-Air Temperature -40 +125 Dt/DV Input Transition Rise or Fall Rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 3.6 V 0 0 20 10 C ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 74LVC04A DC ELECTRICAL CHARACTERISTICS -405C to +855C Symbol VIH VIL VOH VOL -405C to +1255C Parameter Conditions Min Typ (Note 3) Max Min Typ (Note 3) Max Unit HIGH-level input voltage VCC = 1.2 V 1.08 - - 1.08 - - V VCC = 1.65 V to 1.95 V 0.65 x VCC - - 0.65 x VCC - - VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - - VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - - VCC = 1.2 V - - 0.12 - - 0.12 VCC = 1.65 V to 1.95 V - - 0.35 x VCC - - 0.35 x VCC VCC = 2.3 V to 2.7 V - - 0.7 - - 0.7 VCC = 2.7 V to 3.6 V - - 0.8 - - 0.8 LOW-level input voltage HIGH-level output voltage LOW-level output voltage V V VI = VIH or VIL IO = -100 mA; VCC = 1.65 V to 3.6 V VCC - 0.2 - - VCC - 0.3 - - IO = -4 mA; VCC = 1.65 V 1.2 - - 1.05 - - IO = -8 mA; VCC = 2.3 V 1.8 - - 1.65 - - IO = -12 mA; VCC = 2.7 V 2.2 - - 2.05 - - IO = -18 mA; VCC = 3.0 V 2.4 - - 2.25 - - IO = -24 mA; VCC = 3.0 V 2.2 - - 2.0 - - V VI = VIH or VIL IO = 100 mA; VCC = 1.65 V to 3.6 V - - 0.2 - - 0.3 IO = 4 mA; VCC = 1.65 V - - 0.45 - - 0.65 IO = 8 mA; VCC = 2.3 V - - 0.6 - - 0.8 IO = 12 mA; VCC = 2.7 V - - 0.4 - - 0.6 IO = -24 mA; VCC = 3.0 V - - 0.55 - - 0.8 Input leakage current VI = 5.5V or GND VCC = 3.6 V - 0.1 5 - 0.1 20 mA IOFF Power-off leakage current VI or VO = 5.5 V; VCC = 0.0 V - 0.1 10 - 0.1 20 mA ICC Supply current VI = VCC or GND; IO = 0 A; VCC = 3.6 V - 0.1 10 - 0.1 40 mA Additional supply current per input pin; VI = VCC - 0.6 V; IO = 0 A; VCC = 2.7 V to 3.6 V - 5 500 - 5 5000 mA II DICC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. All typical values are measured at TA = 25C and VCC = 3.3 V, unless stated otherwise. www.onsemi.com 3 74LVC04A AC ELECTRICAL CHARACTERISTICS (tR = tF = 2.5 ns) -405C to +855C Symbol tpd tsk(0) Parameter Propagation Delay (Note 5) Output Skew Time (Note 6) -405C to +1255C Conditions Min Typ1 Max Min Typ1 Max Unit VCC = 1.2 V - 14.0 - - - - ns VCC = 1.65 V to 1.95 V 0.5 3.7 8.8 0.5 - 10.2 ns VCC = 2.3 V to 2.7 V 0.5 2.2 5.0 0.5 - 5.8 VCC = 2.7 V 0.5 2.1 5.5 0.5 - 7.0 VCC = 3.0 V to 3.6 V 0.5 2.0 4.5 0.5 - 6.0 VCC = 3.0 V to 3.6 V - - 1.0 - - 1.5 ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Typical values are measured at TA = 25C and VCC = 3.3 V, unless stated otherwise. 5. tpd is the same as tPLH and tPHL. 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 7) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 7) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V -0.8 -0.6 V 7. Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH-to-LOW or LOW-to-HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Parameter Condition Typical Unit Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 4.0 pF Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 5.0 pF Power Dissipation Capacitance (Note 8) pF Per input; VI = GND or VCC VCC = 1.65 V to 1.95 V 3.9 VCC = 2.3 V to 2.7 V 7.1 VCC = 3.0 V to 3.6 V 9.9 8. CPD is used to determine the dynamic power dissipation (PD in mW). PD = CPD x VCC2 x fi x N + S (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of outputs switching S(CL x VCC2 x fo) = sum of the outputs. www.onsemi.com 4 74LVC04A VCC An Vmi Vmi 0V tPHL tPLH VOH Vmo On Vmo VOL WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc Symbol 3.3 V + 0.3 V 2.7 V VCC < 2.7 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 2. AC Waveforms VCC VI VO PULSE GENERATOR DUT RT CL RL CL includes jig and probe capacitance RT = ZOUT of pulse generator (typically 50 W) Supply Voltage Input Load VCC (V) VI tr, tf CL RL 1.2 VCC 2 ns 30 pF 1 kW 1.65 - 1.95 VCC 2 ns 30 pF 1 kW 2.3 - 2.7 VCC 2 ns 30 pF 500 W 2.7 2.7 V 2.5 ns 50 pF 500 W 3 - 3.6 2.7 V 2.5 ns 50 pF 500 W Figure 3. Test Circuit ORDERING INFORMATION Device 74LVC04ADR2G 74LVC04ADTR2G Package Shipping SOIC-14 NB (Pb-Free) 2500 / Tape & Reel TSSOP-14 (Pb-Free) 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 74LVC04A PACKAGE DIMENSIONS TSSOP-14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. EEE CCC CCC EEE K1 J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 --- 1.20 --- 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 74LVC04A PACKAGE DIMENSIONS SOIC-14 NB CASE 751A-03 ISSUE K D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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