PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Bidirectional TVS Array
for Protection of Five Lines
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Small SO-8 surface mount package
Protects five I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Description Features
Schematic and PIN Configuration
Revision 08/15/06
Applications
Mechanical Characteristics
The SMDAxxC-5 series of transient voltage suppres-
sors are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD), electri-
cal fast transients (EFT), and lightning.
TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDAxxC-5 is designed to provide
transient suppression on multiple data lines and I/O
ports. The low profile SO-8 design allows the user to
protect up to five data and I/O lines with one package.
The SMDAxxC-5 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
SO-8 (Top View)
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
RS-232 and RS-422 Data Lines
Microprocessor Based Equipment
LAN/WAN Equipment
Notebooks, Desktops, and Servers
Instrumentation
Peripherals
Set Top Box
Serial and Parallel Ports
2 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Absolute Maximum Rating
Electrical Characteristics
gnitaRlobmySeulaVstinU
)sµ02/8=pt(rewoPesluPkaePP
kp
003sttaW
erutarepmeTgniredloSdaeLT
L
).ces01(062C°
erutarepmeTgnitarepOT
J
521+ot55-C°
erutarepmeTegarotST
GTS
051+ot55-C°
5-C50ADMS
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
5V
egatloVnwodkaerBesreveRV
RB
I
t
Am1=6 V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V5=02Aµ
egatloVgnipmalCV
C
I
PP
sµ02/8=pt,A1=8.9V
tnerruCesluPkaePmumixaMI
PP
sµ02/8=pt71A
ecnaticapaCnoitcnuJC
j
dnasniPO/IneewteB
dnuorG
V
R
zHM1=f,V0=
053Fp
5-C21ADMS
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
21V
egatloVnwodkaerBesreveRV
RB
I
t
Am1=7.61V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V21=1Aµ
egatloVgnipmalCV
C
I
PP
sµ02/8=pt,A1=91V
tnerruCesluPkaePmumixaMI
PP
sµ02/8=pt21A
ecnaticapaCnoitcnuJC
j
dnasniPO/IneewteB
dnuorG
V
R
zHM1=f,V0=
021Fp
3 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Electrical Characteristics
5-C51ADMS
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
51V
egatloVnwodkaerBesreveRV
RB
I
t
Am1=7.61V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V51=1Aµ
egatloVgnipmalCV
C
I
PP
sµ02/8=pt,A1=42V
tnerruCesluPkaePmumixaMI
PP
sµ02/8=pt01A
ecnaticapaCnoitcnuJC
j
dnasniPO/IneewteB
dnuorG
V
R
zHM1=f,V0=
57Fp
5-C42ADMS
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
42V
egatloVnwodkaerBesreveRV
RB
I
t
Am1=7.62V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V42=1Aµ
egatloVgnipmalCV
C
I
PP
sµ02/8=pt,A1=34V
tnerruCesluPkaePmumixaMI
PP
sµ02/8=pt5A
ecnaticapaCnoitcnuJC
j
dnasniPO/IneewteB
dnuorG
V
R
zHM1=f,V0=
05Fp
4 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve
Pulse Waveform
ESD Pulse Waveform (Per IEC 61000-4-2)
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - PPk (kW)
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or I
PP
IEC 61000-4-2 Discharge Parameters
leveLtsriF
kaeP
tnerruC
)A(
kaeP
tnerruC
sn03ta
)A(
kaeP
tnerruC
sn06ta
)A(
tseT
egatloV
tcatnoC(
)egrahcsiD
)Vk(
tseT
egatloV
riA(
)egrahcsiD
)Vk(
15.748 2 2
25184 4 4
35.222166 8
403618 8 51
0
10
20
30
40
50
60
70
80
90
100
110
0 5 10 15 20 25 30
Time (µs)
Percent of I PP
e-t
td = IPP/2
Waveform
Parameters:
tr = 8µs
td = 20µs
5 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Circuit Diagram
Connection Diagram
Device Connection for Protection of Five Data Lines
The SMDAxxC-5 is designed to protect up to 5 data or
I/O lines. They are bidirectional devices and may be
used on lines where the signal polarities are above and
below ground.
The SMDAxxC-5 TVS arrays employ a monolithic struc-
ture. Therefore, the working voltage (VRWM) and break-
down voltage (VBR) specifications apply to the differen-
tial voltage between any two data line pins. For ex-
ample, the SMDA24C-5 is designed for a maximum
voltage excursion of ±12V between any two data lines.
The device is connected as follows:
zPins 1, 2, 3, 4, and 5 are connected to the lines
that are to be protected. Pin 8 is connected to
ground. The ground connections should be made
directly to the ground plane for best results. The
path length is kept as short as possible to reduce
the effects of parasitic inductance in the board
traces. Pins 6 and 7 are not connected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
123
4
5
678
DATA IN DATA OUT
DATA IN DATA OUT
Applications Information
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
6 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Land Pattern - SO-8
Outline Drawing - SO-8
bxN
2X N/2 TIPS
SEATING
aaa C
E/2
2X
12
N
A
D
A1
E1
bbb C A-B D
ccc C
e/2
A2 SEE DETAIL A
SIDE VIEW
A
B
C
D
e
DETAIL A
c
L
(L1) 01
0.25
GAGE
PLANE
h
h
H
PLANE
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
REFERENCE JEDEC STD MS-012, VARIATION AA.
4.
.050 BSC
.236 BSC
8
.010
.150
.189
.154
.193
.012 -
8
0.25
1.27 BSC
6.00 BSC
3.90
4.90
-
.157
.197
3.80
4.80
.020 0.31
4.00
5.00
0.51
(.041)
.004
.008
-
.028
-
-
-
-
0°
.016
.007
.049
.004
.053
8° 0°
0.20
0.10
-8°
0.40
0.17
1.25
0.10
.041
.010
.069
.065
.010
1.35
(1.04)
0.72
-
1.04
0.25
-
-
-1.75
1.65
0.25
0.25
-
.010 .020 0.50
-
L1
N
01
bbb
aaa
ccc
A
b
A2
A1
D
E
E1
L
h
e
c
DIM MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
E
(.205) (5.20)
Z
G
Y
P
(C) 3.00
.118
1.27
.050
0.60.024
2.20.087
7.40.291
X
INCHES
DIMENSIONS
Z
P
Y
X
DIM
C
G
MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.
2.
7 2004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Ordering Information
Note: Lead-free devices are RoHS/WEEE Compliant
rebmuNtraP daeL
hsiniF leeRrepytQeziSleeR
BT.5-C50ADMSbPnS005hcnI7
BT.5-C21ADMSbPnS005hcnI7
BT.5-C51ADMSbPnS005hcnI7
BT.5-C42ADMSbPnS005hcnI7
TBT.5-C50ADMSeerFbP005hcnI7
TBT.5-C21ADMSeerFbP005hcnI7
TBT.5-C51ADMSeerFbP005hcnI7
TBT.5-C42ADMSeerFbP005hcnI7
5-C50ADMSbPnSebuT/59A/N
5-C21ADMSbPnSebuT/59A/N
5-C51ADMSbPnSebuT/59A/N
5-C42ADMSbPnSebuT/59A/N
T.5-C50ADMSeerFbPebuT/59A/N
T.5-C21ADMSeerFbPebuT/59A/N
T.5-C51ADMSeerFbPebuT/59A/N
T.5-C42ADMSeerFbPebuT/59A/N
