VND600SP-E Double channel high-side driver Features Type RDS(on) Ilim VCC VND600SP-E 30 m 25 A 36 V ECOPACK(R): lead free and RoHS compliant Automotive Grade: compliance with AEC Guidelines Very low standby current CMOS compatible input Proportional load current sense Current sense disable Thermal shutdown protection and diagnosis Undervoltage shutdown Overvoltage clamp Load current limitation 10 1 PowerSO-10TM Description The VND600SP-E is a monolithic device made using STMicroelectronicsTM VIPowerTM M0-3 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). This device has two channels in high-side configuration; each channel has an analog sense output on which the sensing current is proportional (according to a known ratio) to the corresponding load current. Built-in thermal shutdown and outputs current limitation protect the chip from overtemperature and short circuit. Device turns-off in case of ground pin disconnections. Table 1. Device summary Order codes Package PowerSO-10TM February 2011 Tube Tape and reel VND600SP-E VND600SPTR-E Doc ID 10876 Rev 3 1/26 www.st.com 1 Contents VND600SP-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 4 6 2/26 3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16 3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 PowerSO-10 maximum demagnetization energy (VCC = 13.5 V) 18 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Doc ID 10876 Rev 3 VND600SP-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 VCC - output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Current sense 9 V VCC 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic input (channel 1, 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth table (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Doc ID 10876 Rev 3 3/26 List of figures VND600SP-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. 4/26 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching characteristics (resistive load RL= 2.6 ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Maximum turn- off current versus load inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PowerSO-10 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 19 PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 20 Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 20 PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 24 Tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Doc ID 10876 Rev 3 VND600SP-E 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC OVERVOLTAGE VCC CLAMP UNDERVOLTAGE PwCLAMP 1 DRIVER 1 Vdslim1 LOGIC IOUT1 INPUT 2 Ot1 CURRENT SENSE 1 OUTPUT 2 ILIM2 OVERTEMP. 1 OVERTEMP. 2 Ot1 K PwCLAMP 2 DRIVER 2 GND Figure 2. OUTPUT 1 ILIM1 INPUT 1 Vdslim2 IOUT2 Ot2 Ot2 CURRENT SENSE 2 K Configuration diagram (top view) GROUND INPUT 2 INPUT 1 C.SENSE1 C.SENSE2 6 7 8 9 5 4 3 10 1 OUTPUT 2 OUTPUT 2 N.C. OUTPUT 1 OUTPUT 1 2 11 VCC PowerSO-10 Table 2. Suggested connections for unused and not connected pins Connection / pin Current sense Floating To ground Through 1 K resistor N.C. Output Input X X X X Doc ID 10876 Rev 3 Through 10 K resistor 5/26 Electrical specifications 2 VND600SP-E Electrical specifications Figure 3. Current and voltage conventions IS VCC VF1 (1) VCC IOUT1 IIN1 INPUT1 VIN1 OUTPUT1 CURRENT SENSE 1 IIN2 INPUT2 VIN2 VOUT1 ISENSE1 OUTPUT2 CURRENT SENSE 2 GROUND IOUT2 VSENSE1 VOUT2 ISENSE2 VSENSE2 IGND 1) VFn = VCCn - VOUTn during reverse battery condition 2.1 Absolute maximum ratings Stressing the device above the rating listed in Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document. Table 3. Absolute maximum ratings Symbol Value Unit 41 V VCC DC supply voltage -VCC Reverse supply voltage -0.3 V - IGND DC reverse ground pin current -200 mA Internally limited A -21 A +/- 10 mA -3 +15 V V IOUT Output current IR Reverse output current IIN Input current VCSENSE 6/26 Parameter Current sense maximum voltage Doc ID 10876 Rev 3 VND600SP-E Electrical specifications Table 3. Symbol Parameter Value Unit VESD Electrostatic discharge (Human Body Model: R = 1.5 K; C = 100 pF) - INPUT - CURRENT SENSE - OUTPUT - VCC 4000 2000 5000 5000 V V V V EMAX Maximum switching energy (L = 0.13 mH; RL = 0 ; Vbat= 13.5 V; Tjstart = 150 C; IL = 40 A) 145 mJ Ptot Power dissipation at Tc = 25 C 96.1 W Tj Junction operating temperature Internally limited C Tc Case operating temperature -40 to 150 C Storage temperature -55 to 150 C TSTG 2.2 Absolute maximum ratings (continued) Thermal data Table 4. Symbol Rthj-case Rthj-amb Thermal data Parameter Value Thermal resistance junction-case (max) Thermal resistance junction-ambient (max) Unit 1.3 51.3(1) C/W 37(2) 1. When mounted on a standard single sided FR-4 board with 0.5 cm2 of Cu (at least 35 m thick). 2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 m thick). Doc ID 10876 Rev 3 C/W 7/26 Electrical specifications 2.3 VND600SP-E Electrical characteristics Values specified in this section are for 8 V < VCC < 36 V; -40 C < Tj < 150 C, unless otherwise stated. (Per each channel). Table 5. Power Symbol VCC (1) Parameter Test conditions Operating supply voltage VUSD (1) Undervoltage shutdown VOV (1)(2) RON Vclamp IS (1) Overvoltage shutdown On-state resistance Clamp voltage Typ. Max. Unit 5.5 13 36 V 3 4 5.5 V 36 V IOUT = 5 A; Tj = 25 C 30 m IOUT = 5 A; Tj = 150 C 60 m IOUT = 3 A; VCC = 6 V 100 m 48 55 V Off-state; VCC = 13 V; VIN = VOUT = 0 V 12 40 A Off-state; VCC=13V; VIN = VOUT = 0 V; Tj = 25 C 12 25 mA 6 mA 0 50 A -75 0 A ICC = 20 Supply current Min. mA(2) 41 On-state; VIN = 5 V; VCC = 13 V; IOUT = 0 A; RSENSE = 3.9 k IL(off1) Off-state output current VIN = VOUT = 0 V IL(off2) Off-state output current VIN = 0 V; VOUT = 3.5 V IL(off3) Off-state output current VIN = VOUT = 0 V; VCC = 13 V; Tj = 125 C 5 A IL(off4) Off-state output current VIN = VOUT = 0 V; VCC = 13 V; Tj = 25 C 3 A 1. Per device. 2. Vclamp and VOV are correlated. Typical difference is 5 V. Table 6. Symbol Ilim TTSD TR THYST 8/26 Protection(1) Parameter Test conditions DC short circuit current VCC = 13 V Min. Typ. 25 40 5.5 V < VCC <3 6 V Thermal shutdown temperature 150 Thermal reset temperature 135 Thermal hysteresis 7 Doc ID 10876 Rev 3 175 Max. Unit 70 A 70 A 200 C C 15 C VND600SP-E Electrical specifications Protection(1) (continued) Table 6. Symbol Vdemag VON Parameter Test conditions Turn-off output voltage clamp IOUT = 2 A; VIN = 0 V; L = 6 mH Output voltage drop limitation IOUT = 0.5 A Tj = -40 C...+150 C Min. Typ. Max. Unit VCC-41 VCC48 VCC55 50 V mV 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles Table 7. Table 8. Symbol K1 dK1/K1 K2 dK2/K2 K3 dK3/K3 VCC - output diode Symbol Parameter VF Forward on voltage Min Typ Max Unit - - 0.6 V -IOUT = 2.6 A; Tj = 150 C Current sense 9 V VCC 16 V Parameter Test conditions Min Typ Max 4400 6000 Unit IOUT/ISENSE IOUT1 or IOUT2 = 0.5 A; VSENSE = 0.5 V; other channels open; Tj = -40 C...150 C 3300 Current sense ratio drift IOUT1 or IOUT2 = 0.5 A; VSENSE = 0.5 V; other channels open; Tj = -40 C...150 C -10 IOUT/ISENSE IOUT1 or IOUT2 = 5 A; VSENSE = 4 V; other channels open; Tj = -40 C Tj = 25 C...150 C Current sense ratio drift IOUT1 or IOUT2 = 5 A; VSENSE = 4 V; other channels open; Tj = - 40 C...150 C IOUT/ISENSE IOUT1 or IOUT2 = 15 A; VSENSE = 4 V; other channels open; Tj =- 40 C Tj = 25 C...150 C Current sense ratio drift IOUT1 or IOUT2 = 15 A; VSENSE = 4 V; other channels open; Tj = -40 C...150 C -6 VCC = 5.5 V; IOUT1,2 = 2.5 A; RSENSE = 10 k 2 V VCC > 8 V, IOUT1,2 = 5 A; RSENSE = 10 k 4 V Max analog sense output VSENSE1,2 voltage VSENSEH Test conditions Analog sense output voltage in overtemperature VCC = 13 V; RSENSE = 3.9 k condition Doc ID 10876 Rev 3 4200 4400 +10 4900 4900 -6 4200 4400 6000 5750 +6 4900 4900 % 5500 5250 +6 5.5 % % V 9/26 Electrical specifications Table 8. VND600SP-E Current sense 9 V VCC 16 V (continued) Symbol Parameter Test conditions Min Typ Analog sense output VCC = 13 V; Tj > TTSD; RVSENSEH impedance in All channels open overtemperature condition tDSENSE Current sense delay response Max Unit 400 to 90% ISENSE (1) 500 s 1. Current sense signal delay after positive input slope. Table 9. Symbol Parameter Test conditions Min Typ Max Unit td(on) Turn-on delay time RL = 2.6 (seeFigure 4) - 30 - s td(off) Turn-on delay time RL = 2.6 (seeFigure 4) - 30 - s (dVOUT/dt)on Turn-on voltage slope RL = 2.6 (see Figure 4) - Figure 15 - V/s (dVOUT/dt)off Turn-off voltage slope RL = 2.6 (see Figure 4) - Figure 16 - V/s Max Unit 1.25 V Table 10. Symbol Logic input (channel 1, 2) Parameter Test conditions VIL Input low level voltage IIL Low level input current VIH Input high level voltage IIH High level input current VI(hyst) Input hysteresis voltage VICL 10/26 Switching (VCC = 13 V) Input clamp voltage VIN = 1.25 V Min Typ 1 A 3.25 V VIN = 3.25 V 10 0.5 IIN = 1 mA IIN = -1 mA Doc ID 10876 Rev 3 6 A V 6.8 -0.7 8 V V VND600SP-E Electrical specifications Figure 4. Switching characteristics (resistive load RL= 2.6 ) VOUT 90% 80% dVOUT/dt(off) dVOUT/dt(on) 10% tr tf t ISENSE 90% INPUT t tDSENSE td(on) td(off) t Figure 5. IOUT/ISENSE versus IOUT IOUT/ISENSE 6500 6000 max.Tj=-40C 5500 max.Tj=25...150C 5000 typical value min.Tj=25...150C 4500 4000 min.Tj=-40C 3500 3000 0 2 4 6 8 10 12 14 16 IOUT (A) Doc ID 10876 Rev 3 11/26 Electrical specifications Table 11. Truth table (per each channel) Conditions 12/26 VND600SP-E Input Output Sense Normal operation L H L H 0 Nominal Overtemperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 Overvoltage L H L L 0 0 Short circuit to GND L H H L L L Short circuit to VCC L H H H 0 < Nominal Negative output voltage clamp L L 0 Doc ID 10876 Rev 3 (Tj<TTSD) (Tj>TTSD) 0 0 VSENSEH VND600SP-E Electrical specifications Table 12. Electrical transient requirements on VCC pin (part 1) Test levels ISO T/R 7637/1 test pulse I II III IV Delays and impedance 1 -25 V -50 V -75 V -100 V 2 ms, 10 2 +25 V +50 V +75 V +100 V 0.2 ms, 10 3a -25 V -50 V -100 V -150 V 0.1 s, 50 3b +25 V +50 V +75 V +100 V 0.1 s, 50 4 -4 V -5 V -6 V -7 V 100 ms, 0.01 5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Table 13. Electrical transient requirements on VCC pin (part 2) Test levels results ISO T/R 7637/1 Test pulse I II III IV 1 C C C C 2 C C C C 3a C C C C 3b C C C C 4 C C C C 5 C E E E Table 14. Electrical transient requirements on VCC pin (part 3) Class Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 10876 Rev 3 13/26 Electrical specifications Figure 6. VND600SP-E Waveforms NORMAL OPERATION INPUTn LOAD CURRENTn SENSEn UNDERVOLTAGE VCC VUSDhyst VUSD INPUTn LOAD CURRENTn SENSEn OVERVOLTAGE VOV VCC INPUTn LOAD CURRENTn SENSEn VCC < VOV VCC > VOV SHORT TO GROUND INPUTn LOAD CURRENTn LOAD VOLTAGEn SENSEn SHORT TO VCC INPUTn LOAD VOLTAGEn LOAD CURRENTn SENSEn Tj TTSD TR <Nominal <Nominal OVERTEMPERATURE INPUTn LOAD CURRENTn SENSEn 14/26 ISENSE= Doc ID 10876 Rev 3 VSENSEH RSENSE VND600SP-E Electrical specifications 2.4 Electrical characteristics curves Figure 7. Off-state output current Figure 8. High level input current Iih (uA) IL(off1) (uA) 5 5 4.5 4.5 Off state Vcc=36V Vin=Vout=0V 4 3.5 Vin=3.25V 4 3.5 3 3 2.5 2.5 2 2 1.5 1.5 1 1 0.5 0.5 0 0 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 9. 50 75 100 125 150 175 Tc (C) Tc (C) Input low level Figure 10. Input high level Vih (V) Vil (V) 3.6 2.6 3.4 2.4 3.2 2.2 3 2 2.8 1.8 2.6 1.6 2.4 1.4 2.2 1.2 2 1 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 11. 50 75 100 125 150 175 Tc (C) Tc (C) Input clamp voltage Figure 12. Input hysteresis voltage Vhyst (V) Vicl (V) 1.5 8 1.4 7.8 Iin=1mA 7.6 1.3 7.4 1.2 7.2 1.1 7 1 6.8 0.9 6.6 0.8 6.4 0.7 6.2 0.6 6 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 10876 Rev 3 15/26 Electrical specifications VND600SP-E Figure 13. Overvoltage shutdown Figure 14. ILIM vs Tcase Vov (V) Ilim (A) 50 80 48 70 Vcc=13V 46 60 44 42 50 40 40 38 30 36 20 34 10 32 30 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 Tc (C) Figure 15. Turn-on voltage slope Figure 16. Turn-off voltage slope dVout/dt(on) (V/ms) dVout/dt(off) (V/ms) 750 500 450 700 Vcc=13V Rl=2.6Ohm 650 Vcc=13V Rl=2.6Ohm 400 600 350 550 300 500 250 450 200 400 150 350 100 300 50 0 250 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 17. On-state resistance vs Tcase Figure 18. On-state resistance vs VCC Ron (mOhm) Ron (mOhm) 100 80 90 70 Iout=5A Vcc=8V & 36V 80 Iout=5A Tc= 150C 60 70 50 60 50 40 40 30 30 Tc= 25C 20 20 Tc= - 40C 10 10 0 0 -75 -50 -25 0 25 50 75 100 125 150 175 10 15 20 25 Vcc (V) Tc (C) 16/26 5 Doc ID 10876 Rev 3 30 35 40 VND600SP-E 3 Application information Application information Figure 19. Application schematic +5V Rprot VCC INPUT1 Dld C Rprot CURRENT SENSE1 Rprot INPUT2 Rprot CURRENT SENSE2 OUTPUT1 GND RSENSE1 RSENSE2 VGND RGND OUTPUT2 DGND 3.1 GND protection network against reverse battery 3.1.1 Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1. RGND 600 mV / IS(on)max 2. RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device's datasheet. Power dissipation in RGND (when VCC < 0: during reverse battery situations) is: PD= (-VCC)2/ RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in the case of several high-side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2). Doc ID 10876 Rev 3 17/26 Application information 3.1.2 VND600SP-E Solution 2: diode (DGND) in the ground line A resistor (RGND = 1 k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected, while unused SENSE pin has to be connected to ground pin. 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in Table 12. 3.3 MCU I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = -100 V and Ilatchup 20 mA; VOHC 4.5 V 5 k Rprot 65 k. Recommended values: Rprot =10 k. 18/26 Doc ID 10876 Rev 3 VND600SP-E 3.4 Application information PowerSO-10 maximum demagnetization energy (VCC = 13.5 V) Figure 20. Maximum turn- off current versus load inductance(1) A: A single pulse at Tjstart = 150 C B: Repetitive pulse at Tjstart = 100 C C: Repetitive pulse at Tjstart = 125 C Condition: VCC = 13.5 V VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL = 0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. Doc ID 10876 Rev 3 19/26 Package and PCB thermal data VND600SP-E 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 21. PowerSO-10 PC board(1) 1. Layout condition of Rth and Zth measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness = 35 m, Copper areas: from minimum pad lay-out to 8 cm2). Figure 22. Rthj-amb vs PCB copper area in open box free air condition RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 PCB Cu heatsink area (cm^2) 20/26 Doc ID 10876 Rev 3 8 10 VND600SP-E Package and PCB thermal data Figure 23. PowerSO-10 thermal impedance junction ambient single pulse Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 C1 C2 R1 R2 Pd2 T_amb Doc ID 10876 Rev 3 21/26 Package and PCB thermal data Table 15. 22/26 VND600SP-E Thermal parameter Area/island (cm2) Footprint R1 (C/ W) 0.05 R2 (C/ W) 0.3 R3 (C/ W) 0.3 R4 (C/ W) 0.8 R5 (C/ W) 12 R6 (C/ W) 37 C1 (W.s/ C) 0.001 C2 (W.s /C) 5.00E-03 C3 (W.s/ C) 0.02 C4 (W.s/ C) 0.3 C5 (W.s/ C) 0.75 C6 (W.s/ C) 3 Doc ID 10876 Rev 3 6 22 5 VND600SP-E Package and packing information 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 PowerSO-10 mechanical data Figure 25. PowerSO-10 package dimensions B 0.10 A B 10 H E E E2 1 SEATING PLANE e B DETAIL "A" A C 0.25 h E4 D = D1 = = = SEATING PLANE A F A1 A1 L DETAIL "A" Doc ID 10876 Rev 3 23/26 Package and packing information Table 16. VND600SP-E PowerSO-10 mechanical data Millimeters Dim. Min. Max. A 3.35 3.65 A(1) 3.4 3.6 A1 0 0.10 B 0.40 0.60 B(1) 0.37 0.53 C 0.35 0.55 C(1) 0.23 0.32 D 9.40 9.60 D1 7.40 7.60 E 9.30 9.50 E2 7.20 7.60 E2(1) 7.30 7.50 E4 5.90 6.10 E4(1) 5.90 6.30 e 1.27 F 1.25 1.35 F(1) 1.20 1.40 H 13.80 14.40 H(1) 13.85 14.35 h 0.50 L 1.20 1.80 L(1) 0.80 1.10 a 0 8 (1) 2 8 1. Muar only POA P013P. 24/26 Typ. Doc ID 10876 Rev 3 VND600SP-E 5.3 Package and packing information PowerSO-10 packing information Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix) 14.6 - 14.9 B 10.8 - 11 C 6.30 A 0.67 - 0.73 1 9.5 2 3 4 5 10 9 8 0.54 - 0.6 7 1.27 6 All dimensions are in mm. Casablanca Muar Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) 50 1000 532 10.4 16.4 0.8 50 1000 532 4.9 17.2 0.8 Figure 27. Tape and reel shipment (suffix "TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2 All dimensions are in mm. End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed Doc ID 10876 Rev 3 25/26 Revision history 6 VND600SP-E Revision history Table 17. Document revision history Date Revision 01-Oct-2004 1 Initial release. 28-Jun-2010 2 Changed Features list. Reformatted entire document. No content change. 3 Updated Features list. Updated following tables: - Table 5: Power - Table 8: Current sense 9 V VCC 16 V 11-Feb-2011 26/26 Changes Doc ID 10876 Rev 3 VND600SP-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 26/26 Doc ID 10876 Rev 3